CN217064085U - High-thermal-conductivity multilayer circuit board - Google Patents
High-thermal-conductivity multilayer circuit board Download PDFInfo
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- CN217064085U CN217064085U CN202220310974.XU CN202220310974U CN217064085U CN 217064085 U CN217064085 U CN 217064085U CN 202220310974 U CN202220310974 U CN 202220310974U CN 217064085 U CN217064085 U CN 217064085U
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- circuit board
- heat conduction
- heat
- multilayer circuit
- copper foil
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Abstract
The utility model provides a pair of multilayer circuit board of high heat conductivity, multilayer circuit board includes top plate, first PP intermediate layer, inner plating, second PP intermediate layer, the lower floor's board that from the top down set gradually, the multilayer circuit board left and right sides is overlapped respectively and is equipped with first heat conduction frame, second heat conduction frame, top plate lower extreme edge is formed with the first groove of dodging, the first groove of dodging lean on to first heat conduction frame one side sets up, the first inslot of dodging is fixed with first conducting strip, first conducting strip one end with first heat conduction frame offsets, lower floor's board upper end edge is formed with the second groove of dodging, the second dodge the groove lean on to second heat conduction frame one side sets up, the second dodges the inslot and is fixed with the second conducting strip, second conducting strip one end with the second heat conduction frame offsets. The utility model discloses a multilayer circuit board can improve multilayer circuit board's heat conductivility.
Description
Technical Field
The utility model relates to a circuit board technical field, concretely relates to multilayer circuit board of high heat conductivity.
Background
Circuit boards are providers of electrical connections for electronic components, and a major advantage of circuit boards is that wiring and assembly errors are greatly reduced. The circuit board in the prior art generally has the phenomenon of insufficient heat dissipation performance.
SUMMERY OF THE UTILITY MODEL
To above problem, the utility model provides a multilayer circuit board of high heat conductivity can improve multilayer circuit board's heat conductivility.
In order to achieve the above purpose, the utility model discloses a following technical scheme solves:
the utility model provides a multilayer circuit board of high heat conductivity, multilayer circuit board includes top plate, first PP intermediate layer, inner plating, second PP intermediate layer, the lower floor board that from the top down set gradually, the multilayer circuit board left and right sides is overlapped respectively and is equipped with first heat conduction frame, second heat conduction frame, top plate lower extreme edge is formed with the first groove of dodging, the first groove of dodging by to first heat conduction frame one side sets up, the first inslot of dodging is fixed with first conducting strip, first conducting strip one end with first heat conduction frame is inconsistent, lower floor board upper end edge is formed with the second groove of dodging, the second dodge the groove by to second heat conduction frame one side sets up, the second dodges the inslot and is fixed with the second conducting strip, second conducting strip one end with second heat conduction frame is inconsistent.
Specifically, the outer side surfaces of the first heat conduction frame and the second heat conduction frame are frosted surfaces.
Specifically, the inner sides of the first heat conduction frame and the second heat conduction frame are provided with elastic cushion layers.
Specifically, the first heat conduction frame and the second heat conduction frame are fixedly connected with the multilayer circuit board through screws.
Specifically, the upper end of the upper plate is covered with a first copper foil circuit layer, the upper end and the lower end of the inner plate are respectively covered with a second copper foil circuit layer and a third copper foil circuit layer, the lower end of the lower plate is covered with a fourth copper foil circuit layer, the first copper foil circuit layer is connected with a first conductive hole between the second copper foil circuit layers, the second copper foil circuit layer is connected with a second conductive hole between the third copper foil circuit layers, and the third copper foil circuit layer is connected with a third conductive hole between the fourth copper foil circuit layers.
The beneficial effects of the utility model are that:
the utility model discloses a multilayer circuit board, it is equipped with first heat conduction frame, second heat conduction frame to overlap respectively in the multilayer circuit board left and right sides to inside is provided with first conducting strip, second conducting strip, and through the heat conduction effect of first conducting strip, second conducting strip, can conduct the heat of the inside production of multilayer circuit board fast to first heat conduction frame, second heat conduction frame, dispel the heat fast through first heat conduction frame, second heat conduction frame, thereby avoid the overheated condition to appear in multilayer circuit board.
Drawings
Fig. 1 is a schematic structural diagram of a multilayer circuit board with high thermal conductivity according to the present invention.
The reference signs are: the laminated board comprises an upper board 1, a first PP interlayer 2, an inner board 3, a second PP interlayer 4, a lower board 5, a first heat conduction frame 6, a second heat conduction frame 7, a first heat conduction sheet 8, a second heat conduction sheet 9, an elastic cushion layer 10, screws 11, a first copper foil circuit layer 12, a second copper foil circuit layer 13, a third copper foil circuit layer 14, a fourth copper foil circuit layer 15, a first conductive hole 16, a second conductive hole 17 and a third conductive hole 18.
Detailed Description
The present invention will be described in further detail with reference to the following examples and drawings, but the present invention is not limited thereto.
As shown in fig. 1:
a high-thermal-conductivity multilayer circuit board comprises an upper layer board 1, a first PP interlayer 2, an inner layer board 3, a second PP interlayer 4 and a lower layer board 5 which are sequentially arranged from top to bottom, wherein the left side and the right side of the multilayer circuit board are respectively sleeved with a first heat conduction frame 6 and a second heat conduction frame 7, a first avoidance groove is formed at the edge of the lower end of the upper layer board 1 and is arranged close to one side of the first heat conduction frame 6, a first heat conduction sheet 8 is fixed in the first avoidance groove, one end of the first heat conduction sheet 8 is abutted against the first heat conduction frame 6, the first heat conduction sheet 8 is arranged at the inner side of the first avoidance groove, the first heat conduction sheet 8 can be prevented from influencing the whole thickness of the multilayer circuit board, the first heat conduction sheet 8 has good heat conduction characteristics, the left heat in the multilayer circuit board can be quickly conducted to the first heat conduction frame 6 and then is quickly radiated by the first heat conduction frame 6, a second avoidance groove is formed at the edge of the upper end of the lower layer board 5, the second dodges the groove and leans on to second heat conduction frame 7 one side setting, the second dodges the inslot and is fixed with second conducting strip 9, 9 one end of second conducting strip are inconsistent with second heat conduction frame 7, dodge the inslot side with second conducting strip 9 setting at the second, can avoid second conducting strip 9 to influence the whole thickness of multilayer circuit board, second conducting strip 9 has good heat conduction characteristic, can be fast with heat conduction to second heat conduction frame 7 on the inside right side of multilayer circuit board, rethread second heat conduction frame 7 dispels the heat fast.
Preferably, in order to increase the surface area of the outer side surfaces of the first heat conduction frame 6 and the second heat conduction frame 7 and improve the heat dissipation efficiency of the first heat conduction frame 6 and the second heat conduction frame 7, the outer side surfaces of the first heat conduction frame 6 and the second heat conduction frame 7 are frosted surfaces.
Preferably, in order to improve the anti-collision capability of the edge of the multilayer circuit board, the elastic cushion layer 10 is arranged on the inner sides of the first heat conduction frame 6 and the second heat conduction frame 7.
Preferably, the first heat conduction frame 6 and the second heat conduction frame 7 are fixedly connected with the multilayer circuit board through screws 11.
Preferably, the upper end of the upper plate 1 is covered with a first copper foil circuit layer 12, the upper end and the lower end of the inner plate 3 are respectively covered with a second copper foil circuit layer 13 and a third copper foil circuit layer 14, the lower end of the lower plate 5 is covered with a fourth copper foil circuit layer 15, a first conductive hole 16 is connected between the first copper foil circuit layer 12 and the second copper foil circuit layer 13, a second conductive hole 17 is connected between the second copper foil circuit layer 13 and the third copper foil circuit layer 14, and a third conductive hole 18 is connected between the third copper foil circuit layer 14 and the fourth copper foil circuit layer 15.
The above embodiments only express 1 implementation manner of the present invention, and the description thereof is more specific and detailed, but not to be understood as the limitation of the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the concept of the present invention, several variations and modifications can be made, which all fall within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (5)
1. A high-thermal-conductivity multilayer circuit board comprises an upper plate (1), a first PP interlayer (2), an inner plate (3), a second PP interlayer (4) and a lower plate (5) which are sequentially arranged from top to bottom, and is characterized in that the left side and the right side of the multilayer circuit board are respectively sleeved with a first heat-conducting frame (6) and a second heat-conducting frame (7), a first avoidance groove is formed in the edge of the lower end of the upper plate (1), the first avoidance groove is arranged close to one side of the first heat-conducting frame (6), a first heat-conducting fin (8) is fixed in the first avoidance groove, one end of the first heat-conducting fin (8) is abutted against the first heat-conducting frame (6), a second avoidance groove is formed in the edge of the upper end of the lower plate (5), the second avoidance groove is arranged close to one side of the second heat-conducting frame (7), and a second heat-conducting fin (9) is fixed in the second avoidance groove, one end of the second heat conducting fin (9) is abutted against the second heat conducting frame (7).
2. The multilayer circuit board with high thermal conductivity according to claim 1, wherein the outer side surfaces of the first heat conducting frame (6) and the second heat conducting frame (7) are frosted surfaces.
3. The multilayer circuit board with high thermal conductivity according to claim 1, wherein the inner sides of the first heat conducting frame (6) and the second heat conducting frame (7) are provided with elastic cushion layers (10).
4. The multilayer circuit board with high thermal conductivity according to claim 1, wherein the first heat conducting frame (6) and the second heat conducting frame (7) are fixedly connected with the multilayer circuit board through screws (11).
5. The multilayer circuit board with high thermal conductivity according to claim 1, wherein the upper end of the upper plate (1) is covered with a first copper foil circuit layer (12), the upper and lower ends of the inner plate (3) are respectively covered with a second copper foil circuit layer (13) and a third copper foil circuit layer (14), the lower end of the lower plate (5) is covered with a fourth copper foil circuit layer (15), a first conductive hole (16) is connected between the first copper foil circuit layer (12) and the second copper foil circuit layer (13), a second conductive hole (17) is connected between the second copper foil circuit layer (13) and the third copper foil circuit layer (14), and a third conductive hole (18) is connected between the third copper foil circuit layer (14) and the fourth copper foil circuit layer (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220310974.XU CN217064085U (en) | 2022-02-16 | 2022-02-16 | High-thermal-conductivity multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220310974.XU CN217064085U (en) | 2022-02-16 | 2022-02-16 | High-thermal-conductivity multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217064085U true CN217064085U (en) | 2022-07-26 |
Family
ID=82485878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220310974.XU Active CN217064085U (en) | 2022-02-16 | 2022-02-16 | High-thermal-conductivity multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217064085U (en) |
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2022
- 2022-02-16 CN CN202220310974.XU patent/CN217064085U/en active Active
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