CN209767915U - PCB board with rapid heat dissipation - Google Patents
PCB board with rapid heat dissipation Download PDFInfo
- Publication number
- CN209767915U CN209767915U CN201920243172.XU CN201920243172U CN209767915U CN 209767915 U CN209767915 U CN 209767915U CN 201920243172 U CN201920243172 U CN 201920243172U CN 209767915 U CN209767915 U CN 209767915U
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- Prior art keywords
- heat dissipation
- layer
- heat
- conducting layer
- pcb board
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Abstract
The utility model discloses a quick PCB board dispels heat, including conducting layer, insulating layer, heat-conducting layer, heat dissipation layer and base plate, the base plate upper end is equipped with the heat dissipation layer, heat dissipation layer upper end is equipped with the heat-conducting layer, the heat-conducting layer upper end is equipped with the insulating layer, the insulating layer upper end is equipped with the conducting layer, conducting layer both sides wall is equipped with the fin respectively, be connected with the same heat dissipation core assembly of a plurality of structures between heat-conducting layer and the heat dissipation layer, heat dissipation layer bottom is equipped with a plurality of heat dissipation orifices that set up side by side, be connected with the heat dissipation passageway between each adjacent heat dissipation orifice, be equipped with the nanometer. The heat dissipation core assembly is connected between the heat conduction layer and the heat dissipation layer, the heat dissipation cavity hole connected with the heat dissipation channel is arranged at the bottom of the heat dissipation layer, and the heat dissipation speed of the PCB is improved jointly by combining a plurality of heat dissipation structures; the heat dissipation device has the advantages of being rapid in heat dissipation, long in service life, simple in structure, low in manufacturing cost and the like.
Description
Technical Field
The utility model relates to a PCB board technical field especially relates to a PCB board that dispels heat fast.
Background
A PCB, i.e., a printed circuit board, also called a printed circuit board, is an important electronic component, which is a support for electronic components and is a provider for electrical connection of electronic components. Almost every electronic device that we commonly use in life, such as electronic watches, calculators, computers, electronic communications, etc., requires a PCB board.
Among the prior art, the PCB board all adopts multilayer structure design, layer upon layer stack suppression forms, because the effect of PCB board is used for providing circuit structure only usefulness, a large amount of electronic component will be set up on the PCB board, electronic component and PCB board during operation can produce a large amount of heats, because the PCB board adopts multilayer structure suppression to form, the heat dissipation problem of PCB board will be influenced like this, prior art generally improves to the material of PCB board, in order to improve the radiating effect, but such design effect is still not good, along with the continuous development of integrated circuit on the PCB board, also more and more urgent needs a PCB board that the radiating effect is superior in the market.
Accordingly, the prior art is deficient and needs improvement.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem that will solve is: the PCB board has the advantages of rapid heat dissipation, long service life, simple structure and low manufacturing cost.
The technical scheme of the utility model as follows: the utility model provides a PCB board that heat dissipation is quick, includes conducting layer, insulating layer, heat-conducting layer, heat dissipation layer and base plate, the base plate upper end is equipped with the heat dissipation layer, heat dissipation layer upper end is equipped with the heat-conducting layer, the heat-conducting layer upper end is equipped with the insulating layer, the insulating layer both sides wall is equipped with the fin respectively, be connected with the same heat dissipation core subassembly of a plurality of structures between heat-conducting layer and the heat dissipation layer, heat dissipation core subassembly includes roof, core bar and core branch, the roof is established in the heat-conducting layer, the core branch is established in the heat dissipation layer, the roof passes through the core bar and is connected with the core branch, heat dissipation layer bottom is equipped with a plurality of heat dissipation orifices that set up side by side, be connected with the heat dissipation passageway between.
By adopting the technical scheme, in the PCB with rapid heat dissipation, the conductive layer is a copper foil conductive layer.
Adopt above-mentioned each technical scheme, the quick PCB board of heat dissipation in, heat dissipation core subassembly's material is copper.
By adopting the technical scheme, in the PCB with rapid heat dissipation, the heat dissipation layer is made of aluminum alloy.
By adopting the technical scheme, in the PCB with rapid heat dissipation, the heat conduction layer is formed by pressing carbon materials.
By adopting the technical scheme, in the PCB with rapid heat dissipation, the substrate is prepared by mixing copper-clad resin glass substrates.
By adopting the technical proposal, the radiating fins are arranged on the two sides of the conducting layer, so as to primarily radiate the elements of the conducting layer; the heat-radiating core assembly is connected between the heat-conducting layer and the heat-radiating layer, so that the heat-radiating efficiency of the heat-radiating layer is improved; meanwhile, a heat dissipation cavity hole connected with the heat dissipation channel is formed in the bottom of the heat dissipation layer, and a nano carbon heat dissipation film is arranged between the heat dissipation layer and the substrate, so that the heat dissipation speed of the heat dissipation layer is further improved; the PCB is provided with a plurality of heat dissipation structures, so that the heat dissipation efficiency of the PCB is greatly improved, the burning loss probability of the PCB is reduced, and the service life is also prolonged; the whole structure is simple, the manufacturing cost is low, and the device can be popularized and used.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
As shown in FIG. 1, a PCB board with rapid heat dissipation comprises a conductive layer 1, an insulating layer 2, a heat conduction layer 3, a heat dissipation layer 4 and a substrate 5, wherein the upper end of the substrate 5 is provided with the heat dissipation layer 4, the upper end of the heat dissipation layer 4 is provided with the heat conduction layer 3, the upper end of the heat conduction layer 3 is provided with the insulating layer 2, the upper end of the insulating layer 2 is provided with the conductive layer 1, two side walls of the conductive layer 1 are respectively provided with a heat dissipation fin 6, a plurality of heat dissipation core assemblies with the same structure are connected between the heat conduction layer 3 and the heat dissipation layer 4, each heat dissipation core assembly comprises a top plate 7, a core rod 8 and a core branch 9, the top plate 7 is arranged in the heat conduction layer 3, the core branch 9 is arranged in the heat dissipation layer 4, the top plate 7 is connected with the core branch 9 through the core rod 8, the, and a nano-carbon heat dissipation film 10 is arranged between the heat dissipation layer 4 and the substrate 5.
As shown in fig. 1, can set up components and parts on the conducting layer 1, in the use, components and parts on the conducting layer 1 can produce the heat, and for giving off the heat that produces on the conducting layer 1, the both sides wall of conducting layer 1 is equipped with fin 6 respectively, and fin 6 adopts high heat conduction material to make, and part heat on the conducting layer 1 passes through fin 6 and transmits to the air in, reduces the heat gathering on the conducting layer 1. Preferably, the conductive layer 1 is a copper foil conductive layer in order to reduce heat generation. The copper foil conducting layer has small resistance and good conductivity, can reduce the generation of heat to a certain extent, and also has good electromagnetic shielding property, thereby preventing components from being subjected to electromagnetic interference.
As shown in fig. 1, an insulating layer 2 is disposed at a lower end of the conductive layer 1, and the insulating layer 2 isolates components on the conductive layer 1, so as to prevent the components from being interfered by electromagnetic radiation. The lower extreme of insulating layer 2 is equipped with heat-conducting layer 3, and the during operation, the heat that components and parts produced on the conducting layer 1, heat-conducting layer 3 for insulating layer 2 lower extreme through the heat transfer, but heat-conducting layer 3 efficient transfer heat. Preferably, the heat conductive layer 3 is formed by pressing a carbon material. The carbon material has high thermal conductivity, can conduct heat rapidly, and prevents heat accumulation from causing high temperature rise.
As shown in fig. 1, a heat dissipation layer 4 is disposed at a lower end of the heat conduction layer 3, a heat dissipation core assembly is connected between the heat conduction layer 3 and the heat dissipation layer 4, and the heat dissipation assembly and the heat dissipation layer 4 can dissipate heat quickly. The radiator core assembly comprises a top plate 7, a core rod 8 and a core branch 9. The top plate 7 is arranged in the heat conduction layer 3, the core branches 9 are arranged in the heat dissipation layer 4, and the top plate 7 is connected with the core branches 9 through the core rods 8. Roof 7 and heat-conducting layer 3 direct contact, through the transmission effect of core pole 8, directly with the heat transfer in the heat-conducting layer 3 to core branch 9, so set up, reducible heat transfer's stroke reaches quick radiating effect. Preferably, in order to increase the heat transfer speed of the heat dissipation core assembly, the heat dissipation core assembly is made of copper. The copper has high heat conductivity coefficient, fast heat absorption and small thermal resistance, and can fast transfer the heat in the heat conduction layer 3 to the heat dissipation layer 4 for heat dissipation. The bottom of the heat dissipation layer 4 is provided with a plurality of heat dissipation cavities 11 arranged side by side, and a heat dissipation channel 12 is connected between every two adjacent heat dissipation cavities 11. Through the arrangement of the heat dissipation cavity hole 11 and the heat dissipation channel 12, heat can be fully contacted with the outside air, and the heat dissipation speed of the heat dissipation layer 4 is improved. Preferably, the heat dissipation layer 4 is made of an aluminum alloy to increase the heat dissipation efficiency of the heat dissipation layer 4. The aluminum alloy has superior thermal diffusivity, and weight is lighter, possesses good corrosion resistance moreover, even with the air contact, also is difficult to corroded the oxidation, can improve to a certain extent the utility model discloses a life.
As shown in fig. 1, a substrate 5 is disposed at the lower end of the heat dissipation layer 4. Preferably, the substrate 5 is made of a copper-clad resin glass substrate mixed together to improve the heat dissipation of the entire structure. Traditional resin material heat conductivity is relatively poor, and copper has good heat conductivity, and both combine, can improve the utility model discloses a thermal diffusivity. In order to further improve the heat dissipation performance of the substrate 5, a nano-carbon heat dissipation film 10 is disposed between the heat dissipation layer 4 and the substrate 5. The nano carbon heat dissipation film 10 has excellent heat dissipation performance, and can prevent heat from being transferred to the substrate 5, thereby greatly improving the heat dissipation performance of the utility model.
By adopting the technical proposal, the radiating fins are arranged on the two sides of the conducting layer, so as to primarily radiate the elements of the conducting layer; the heat-radiating core assembly is connected between the heat-conducting layer and the heat-radiating layer, so that the heat-radiating efficiency of the heat-radiating layer is improved; meanwhile, a heat dissipation cavity hole connected with the heat dissipation channel is formed in the bottom of the heat dissipation layer, and a nano carbon heat dissipation film is arranged between the heat dissipation layer and the substrate, so that the heat dissipation speed of the heat dissipation layer is further improved; the PCB is provided with a plurality of heat dissipation structures, so that the heat dissipation efficiency of the PCB is greatly improved, the burning loss probability of the PCB is reduced, and the service life is also prolonged; the whole structure is simple, the manufacturing cost is low, and the device can be popularized and used.
The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (6)
1. The utility model provides a PCB board that heat dissipation is quick which characterized in that: including conducting layer, insulating layer, heat-conducting layer, heat dissipation layer and base plate, the base plate upper end is equipped with the heat dissipation layer, heat dissipation layer upper end is equipped with the heat-conducting layer, the heat-conducting layer upper end is equipped with the insulating layer, the insulating layer upper end is equipped with the conducting layer, conducting layer both sides wall is equipped with the fin respectively, be connected with the heat dissipation core subassembly that a plurality of structures are the same between heat-conducting layer and the heat dissipation layer, heat dissipation core subassembly includes roof, core bar and core branch, the roof is established in the heat-conducting layer, the core branch is established in the heat dissipation layer, the roof passes through the core bar and is connected with the core branch, the heat dissipation layer bottom is equipped with a plurality of heat dissipation orifices that set up side by side.
2. The PCB board with rapid heat dissipation of claim 1, wherein: the conducting layer is a copper foil conducting layer.
3. The PCB board with rapid heat dissipation of claim 1, wherein: the material of heat dissipation core subassembly is copper.
4. The PCB board with rapid heat dissipation of claim 1, wherein: the heat dissipation layer is made of aluminum alloy.
5. The PCB board with rapid heat dissipation of claim 1, wherein: the heat conduction layer is formed by pressing carbon materials.
6. The PCB board with rapid heat dissipation of claim 1, wherein: the substrate is made by mixing copper-clad resin glass base materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920243172.XU CN209767915U (en) | 2019-02-25 | 2019-02-25 | PCB board with rapid heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920243172.XU CN209767915U (en) | 2019-02-25 | 2019-02-25 | PCB board with rapid heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209767915U true CN209767915U (en) | 2019-12-10 |
Family
ID=68752732
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920243172.XU Expired - Fee Related CN209767915U (en) | 2019-02-25 | 2019-02-25 | PCB board with rapid heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209767915U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112837898A (en) * | 2020-12-31 | 2021-05-25 | 安徽山巅电力科技有限公司 | Weight-increasing type adjusting, supporting and heat-dissipating assembly of low-voltage transformer |
| CN113613382A (en) * | 2021-07-30 | 2021-11-05 | 定颖电子（昆山）有限公司 | 5G high-frequency high-speed circuit board and preparation process thereof |
-
2019
- 2019-02-25 CN CN201920243172.XU patent/CN209767915U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112837898A (en) * | 2020-12-31 | 2021-05-25 | 安徽山巅电力科技有限公司 | Weight-increasing type adjusting, supporting and heat-dissipating assembly of low-voltage transformer |
| CN113613382A (en) * | 2021-07-30 | 2021-11-05 | 定颖电子（昆山）有限公司 | 5G high-frequency high-speed circuit board and preparation process thereof |
| CN113613382B (en) * | 2021-07-30 | 2022-05-13 | 定颖电子（昆山）有限公司 | 5G high-frequency high-speed circuit board and preparation process thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191210 |