CN113613382A - 5G high-frequency high-speed circuit board and preparation process thereof - Google Patents
5G high-frequency high-speed circuit board and preparation process thereof Download PDFInfo
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- CN113613382A CN113613382A CN202110870522.7A CN202110870522A CN113613382A CN 113613382 A CN113613382 A CN 113613382A CN 202110870522 A CN202110870522 A CN 202110870522A CN 113613382 A CN113613382 A CN 113613382A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The invention discloses a 5G high-frequency and high-speed circuit board and a preparation process thereof, and belongs to the technical field of materials for 5G communication. The circuit board comprises a substrate for the circuit board, wherein heat dissipation unit layers are fixedly arranged on two side faces of a heat insulation plate of the substrate, and copper foil layers are fixedly arranged on the outer side faces of the heat dissipation unit layers; the heat dissipation unit layer comprises a heat dissipation aluminum plate layer, an insulating heat conduction layer and a hot pressing base plate layer which are sequentially stacked from inside to outside, wherein a plurality of heat dissipation blocks which are fixedly bonded with the side face of the heat insulation plate are formed on the heat dissipation aluminum plate layer, and heat conduction columns are embedded on the hot pressing base plate layer at intervals. The circuit board formed by the process of the invention is electrified by a circuit formed by the copper foil layer through the etching process to generate heat, the heat is conducted to the insulating heat conduction layer through the heat conduction column and then conducted to the heat dissipation aluminum plate layer, the heat dissipation blocks on the circuit board can effectively increase the heat dissipation area, and the heat dissipation gap between the heat dissipation blocks and the heat insulation insulating plate can greatly improve the heat dissipation efficiency, thereby improving the surface cooling speed of the whole circuit board.
Description
Technical Field
The invention relates to a circuit board and a preparation process thereof, in particular to a 5G high-frequency and high-speed circuit board and a preparation process thereof, and belongs to the technical field of materials for 5G communication.
Background
The circuit board is a basic material in the electronic industry and is widely applied to electronic products such as televisions, radios, computers, mobile communication and the like. The substrate of the circuit board is usually formed by using glass fiber cloth as a reinforcing material, impregnating resin into the glass fiber cloth to form a prepreg, covering copper foil on one side or two sides of the prepreg, and performing hot pressing.
The heat dissipation of the existing circuit board mostly utilizes the characteristics of the heat dissipation material and the heat dissipation element additionally arranged on the circuit board to dissipate heat, the heat dissipation means is single, and the heat dissipation efficiency cannot be greatly improved. When the circuit board is applied to the field of 5G high frequency and high speed, the transmission frequency and the transmission strength of a 5G electric signal are greatly improved, so that the heating rate of the circuit board is increased, and the traditional circuit board cannot meet the application of the 5G high frequency and high speed circuit board.
Disclosure of Invention
In order to solve the technical problems, the invention provides a 5G high-frequency high-speed circuit board and a preparation process thereof, and the circuit board prepared by the process has a good heat dissipation effect and is suitable for the technical field of 5G high-frequency high-speed.
The technical scheme of the invention is as follows:
the invention discloses a 5G high-frequency high-speed circuit board, which comprises a substrate for the circuit board, wherein the substrate comprises a heat-insulating plate, two side surfaces of the heat-insulating plate are respectively and fixedly provided with a heat dissipation unit layer, and one side surface of the two heat dissipation unit layers, which is far away from the heat-insulating plate, is respectively and fixedly provided with a copper foil layer; the heat dissipation unit layer comprises a heat dissipation aluminum plate layer, an insulation heat conduction layer and a hot pressing substrate layer which are sequentially arranged from the side of the heat insulation plate to the side of the copper foil layer in a laminated and connected mode; a plurality of radiating blocks protruding outwards are formed on one side surface of the radiating aluminum plate layer facing the heat insulation plate at uniform intervals, and the top surface of each radiating block is fixedly bonded with the corresponding heat insulation plate side; wherein a plurality of heat conduction columns penetrating through the hot-pressing substrate layer are embedded on the hot-pressing substrate layer at intervals.
The further technical scheme is as follows:
the radiating blocks are arranged in a matrix mode, and a nano-carbon radiating film for radiating is fixedly arranged on the side face of the radiating aluminum plate layer between every two adjacent radiating blocks.
The further technical scheme is as follows:
the paving thickness of the nano carbon heat dissipation film is 0.08-0.1 mm.
The further technical scheme is as follows:
the radiating block is a regular quadrangular frustum pyramid structure with a narrow top and a wide bottom, and the heights of the regular quadrangular frustum pyramid structures are consistent.
The further technical scheme is as follows:
and a bonding glue is fixedly arranged between the narrow part at the top end of the heat dissipation block and the heat insulation plate, and the heat dissipation blocks are bonded and fixed on the corresponding side surfaces of the heat insulation plate through the bonding glue.
The further technical scheme is as follows:
the adhesive is a high-temperature-resistant epoxy resin adhesive layer.
The further technical scheme is as follows:
the insulating heat conduction layer is a heat conduction double-sided adhesive layer, and the laying thickness of the insulating heat conduction layer is 0.2-0.4 mm.
The further technical scheme is as follows:
a plurality of heat conduction posts on the hot pressing substrate layer are arranged in a matrix mode, and two ends of the heat conduction posts are flush with two side faces of the hot pressing substrate layer.
The further technical scheme is as follows:
the heat insulation board is a glass fiber cloth soaked epoxy resin board.
The invention also discloses a preparation method of the 5G high-frequency high-speed circuit board, which mainly comprises the following steps:
s1, hot-press forming: hot-pressing the copper foil layer on one side of the hot-pressed substrate layer by using a hot press;
s2, pre-bonding and forming: bonding a nano-carbon heat dissipation film between two adjacent heat dissipation blocks on a heat dissipation aluminum plate layer, removing protective films on two sides of an insulating heat conduction layer, bonding two sides of the insulating heat conduction layer on the flat surface of the heat dissipation aluminum plate layer and a hot pressing substrate layer in sequence, applying pressure and maintaining the pressure for 20-30min after the bonding of the two surfaces is completed, so that the heat dissipation aluminum plate layer and the hot pressing substrate layer are connected together;
s3, fixing a finished product: coating adhesive glue on the narrow part of the top end of the radiating block of the radiating aluminum plate layer, adhering the radiating block of one radiating aluminum plate layer and one side surface of the heat-insulating plate, applying pressure and maintaining the pressure for 15-20min, adhering the radiating block of one radiating aluminum plate layer and the other side surface of the heat-insulating plate, applying pressure and maintaining the pressure for 15-20min, and fixing a finished product;
s4, cutting the plate: and according to specific use requirements, cutting the finished product which is fixed in the step S3 to a specific size.
The beneficial technical effects of the invention are as follows:
when the circuit board prepared by the process is used, a circuit formed by the copper foil layer through the etching process is electrified to generate heat, the heat is conducted to the insulating heat conduction layer through the heat conduction columns, and then the heat on the heat conduction columns is conducted to the heat dissipation aluminum plate layer through the insulating heat conduction layer, the heat dissipation blocks on the heat dissipation aluminum plate layer can effectively increase the heat dissipation area, meanwhile, heat dissipation gaps convenient for air circulation are formed between the heat dissipation blocks and the heat insulation plate, the heat dissipation efficiency can be greatly improved, and the cooling speed of the surface of the whole circuit board is improved, so that the use requirement of 5G high frequency and high speed is met.
Drawings
FIG. 1 is a schematic view of the overall structure of a circuit board substrate according to the present invention;
FIG. 2 is an enlarged schematic view of the structure at A in FIG. 1;
FIG. 3 is a schematic diagram illustrating the distribution of the positions of heat dissipation blocks in the circuit board substrate according to the present invention;
FIG. 4 is a schematic view of a hot-pressed substrate according to the present invention;
wherein:
1. a heat insulating panel;
2. a heat dissipation unit layer;
21. a heat-dissipating aluminum plate layer; 211. a heat dissipating block; 212. a nanocarbon heat dissipation film; 213. bonding glue;
22. an insulating heat-conducting layer;
23. hot-pressing the substrate layer; 231. a heat-conducting column;
3. and a copper foil layer.
Detailed Description
In order to make the technical means of the present invention clearer and to make the technical means of the present invention capable of being implemented according to the content of the specification, the following detailed description of the embodiments of the present invention is made with reference to the accompanying drawings and examples, which are provided for illustrating the present invention and are not intended to limit the scope of the present invention.
The following embodiments describe in detail a 5G high frequency and high speed circuit board, which includes a substrate for a circuit board, the substrate includes an insulating board 1, two heat dissipation unit layers 2 and two copper foil layers 3, wherein the insulating board 1 is located at the center, the two heat dissipation unit layers 2 are respectively fixed on two sides of the insulating board 1, and the two copper foil layers 3 are respectively fixed on one side of the corresponding heat dissipation unit layers 2 facing outwards, so as to form a structure of copper foil layer-heat dissipation unit layer-insulating board-heat dissipation unit layer-copper foil layer.
The glass fiber cloth-soaked epoxy resin plate is preferably selected as the heat-insulating and insulating plate 1, the heat-insulating and insulating plate made of the material is excellent in heat resistance and insulating property, and electric signals and heat of copper foil layers on two sides of the heat-insulating and insulating plate can be effectively prevented from interfering with each other.
Each heat dissipation unit layer 2 comprises a heat dissipation aluminum plate layer 21, an insulation heat conduction layer 22 and a hot pressing substrate layer 23, wherein the heat dissipation aluminum plate layer 21, the insulation heat conduction layer 22 and the hot pressing substrate layer 23 are sequentially arranged from the side of the heat insulation plate to the side of the copper foil layer in a stacking and connecting mode and are used for heat dissipation, and the insulation heat conduction layer 22 is used for insulation and heat conduction.
Wherein the heat dissipation aluminium sheet layer 21 is formed with the outside bellied radiating block 211 of a plurality of on the side of thermal-insulated insulation board 1 of even interval, and the top surface of every radiating block all bonds fixedly with the thermal-insulated insulation board side that corresponds, and this a plurality of radiating block can increase the heat radiating area of heat dissipation aluminium sheet layer to increase radiating efficiency.
Specifically, the plurality of heat dissipation blocks 211 are arranged on the surface of the heat dissipation aluminum plate layer in a matrix manner, a nano-carbon heat dissipation film 212 for heat dissipation is fixedly arranged on the surface of the heat dissipation aluminum plate layer 21 between every two adjacent heat dissipation blocks, and the laying thickness of the nano-carbon heat dissipation film 212 is 0.08-0.1 mm. The radiating blocks are arranged at intervals in a matrix mode, a gap for air circulation can be formed between the adjacent radiating blocks, and the air flowing in the gap can increase the emission of heat on the board surface. In addition, the nano-carbon heat dissipation film is formed by adopting a nano-carbon material, mature products on the market can be directly selected, the nano-carbon heat dissipation film has good heat conduction capability under a thinner thickness, and the heat dissipation of the circuit board in the use process can be ensured, so that the heat dissipation efficiency is effectively improved.
In addition, the heat dissipation block 211 is a regular quadrangular frustum pyramid structure with a narrow top and a wide bottom, and the heights of the regular quadrangular frustum pyramid structures are consistent. The periphery of the radiating block of the regular quadrangular frustum pyramid-shaped structure is of an inclined surface-shaped structure, and the radiating area of the radiating block can be obviously increased on the premise of ensuring the connection strength of the radiating block.
The insulating heat conduction layer 22 is a heat conduction double-sided adhesive layer, and the laying thickness of the insulating heat conduction layer is 0.2-0.4 mm. The heat-conducting double-sided adhesive is formed by mixing a resin polymer and heat-conducting ceramic powder to form an adhesive layer and then compounding the adhesive layer with an organic silicon adhesive, can select a common heat-conducting insulating double-sided adhesive layer on the market according to the requirement of heat conductivity coefficient, has good flexibility, compressibility, conformability and strong viscosity, has a large adaptive temperature range, can fill up uneven surfaces, and can conduct heat quickly. The thickness of the present embodiment is set to have a sufficient amount of compressive deformation, so as to minimize a heat conduction gap between the heat conduction column 231 and the heat dissipation aluminum plate layer 21.
The hot-pressing substrate layer 23 is formed by laminating, bonding and hot-pressing a plurality of layers of prepregs, and each layer of prepreg is composed of a glass fiber cloth soaked epoxy resin plate, so that the formed hot-pressing substrate layer has excellent heat resistance and insulating property. In addition, a plurality of heat conduction columns 231 penetrating through the hot-pressing substrate layer are embedded at intervals on the hot-pressing substrate layer 23, and the heat conduction columns are mainly used for conducting heat; the plurality of heat conductive posts 231 are arranged in a matrix form, and both ends thereof are flush with both side surfaces of the hot-pressing substrate layer.
The invention also describes a preparation method of the 5G high-frequency high-speed circuit board in detail, which mainly comprises the following steps:
s1, hot-press forming: hot-pressing the copper foil layer 3 on one side of the hot-pressed substrate layer 23 using a hot press;
s2, pre-bonding and forming: bonding a nano-carbon heat dissipation film 212 between two adjacent heat dissipation blocks 211 on a heat dissipation aluminum plate layer 21, removing protective films on two sides of an insulating heat conduction layer 22, sequentially bonding two sides of the insulating heat conduction layer 22 to the flat surface of the heat dissipation aluminum plate layer 21 and a hot pressing substrate layer 23 respectively, applying pressure and maintaining the pressure for 20-30min after the bonding of the two surfaces is completed, so that the heat dissipation aluminum plate layer 21 and the hot pressing substrate layer 23 are connected together;
s3, fixing a finished product: coating adhesive 213 on the narrow part of the top end of the radiating block 211 of the radiating aluminum plate layer 21, adhering the radiating block of one radiating aluminum plate layer to one side surface of the heat-insulating plate 1, applying pressure and maintaining the pressure for 15-20min, adhering the radiating block of one radiating aluminum plate layer to the other side surface of the heat-insulating plate 1, applying pressure and maintaining the pressure for 15-20min, and fixing the finished product;
s4, cutting the plate: and according to specific use requirements, cutting the finished product which is fixed in the step S3 to a specific size.
When the circuit board prepared by the process is used, a circuit formed by the copper foil layer through the etching process is electrified to generate heat, the heat is conducted to the insulating heat conduction layer through the heat conduction columns, and then the heat on the heat conduction columns is conducted to the heat dissipation aluminum plate layer through the insulating heat conduction layer, the heat dissipation areas of the heat dissipation blocks on the heat dissipation aluminum plate layer can be effectively increased, meanwhile, heat dissipation gaps convenient for air circulation are formed between the heat dissipation blocks and the heat insulation plate 1, the heat dissipation efficiency can be greatly improved, and the cooling speed of the surface of the whole circuit board is improved, so that the use requirement of 5G high frequency and high speed is met.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, it should be noted that, for those skilled in the art, many modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (10)
1. A5G high-frequency high-speed circuit board comprises a substrate for a circuit board, and is characterized in that: the substrate comprises a heat insulation board (1), two side faces of the heat insulation board are respectively and fixedly provided with a heat dissipation unit layer (2), and one side face, far away from the heat insulation board, of the two heat dissipation unit layers is respectively and fixedly provided with a copper foil layer (3); the heat dissipation unit layer (2) comprises a heat dissipation aluminum plate layer (21), an insulating heat conduction layer (22) and a hot pressing substrate layer (23) which are sequentially stacked and connected from the side of the heat insulation plate to the side of the copper foil layer; a plurality of radiating blocks (211) protruding outwards are formed on one side surface of the radiating aluminum plate layer (21) facing the heat insulation plate at uniform intervals, and the top surface of each radiating block is fixedly bonded with the corresponding heat insulation plate side; wherein a plurality of heat conduction columns (231) penetrating through the hot-pressing substrate layer are embedded on the hot-pressing substrate layer (23) at intervals.
2. The 5G high-frequency high-speed circuit board according to claim 1, wherein: a plurality of radiating blocks (211) are arranged in a matrix manner, and a nano-carbon radiating film (212) for radiating is fixedly arranged on the side surface of the radiating aluminum plate layer (21) between every two adjacent radiating blocks.
3. The 5G high-frequency high-speed circuit board according to claim 2, wherein: the paving thickness of the nano carbon heat dissipation film (212) is 0.08-0.1 mm.
4. The 5G high-frequency high-speed circuit board according to claim 1, wherein: the radiating block (211) is of a regular quadrangular frustum pyramid structure with a narrow top and a wide bottom, and the heights of the regular quadrangular frustum pyramid structures are consistent.
5. The 5G high-frequency high-speed circuit board according to claim 4, wherein: the heat dissipation block is characterized in that bonding glue (213) is fixedly arranged between the narrow part of the top end of the heat dissipation block (211) and the heat insulation plate, and the heat dissipation blocks are fixedly bonded on the corresponding side faces of the heat insulation plate through the bonding glue.
6. The 5G high-frequency high-speed circuit board according to claim 5, wherein: the bonding glue (213) is a high-temperature-resistant epoxy resin adhesive layer.
7. The 5G high-frequency high-speed circuit board according to claim 1, wherein: the insulating heat conduction layer (22) is a heat conduction double-sided adhesive layer, and the laying thickness of the insulating heat conduction layer is 0.2-0.4 mm.
8. The 5G high-frequency high-speed circuit board according to claim 1, wherein: a plurality of heat conduction posts (231) on the hot-pressing substrate layer (23) are arranged in a matrix form, and two ends of the heat conduction posts are flush with two side faces of the hot-pressing substrate layer.
9. The 5G high-frequency high-speed circuit board according to claim 1, wherein: the heat insulation and insulation plate (1) is a glass fiber cloth soaked epoxy resin plate.
10. A method for preparing a 5G high-frequency high-speed circuit board according to any one of claims 1 to 9, which mainly comprises the following steps:
s1, hot-press forming: hot-pressing the copper foil layer on one side of the hot-pressed substrate layer by using a hot press;
s2, pre-bonding and forming: bonding a nano-carbon heat dissipation film between two adjacent heat dissipation blocks on a heat dissipation aluminum plate layer, removing protective films on two sides of an insulating heat conduction layer, bonding two sides of the insulating heat conduction layer on the flat surface of the heat dissipation aluminum plate layer and a hot pressing substrate layer in sequence, applying pressure and maintaining the pressure for 20-30min after the bonding of the two surfaces is completed, so that the heat dissipation aluminum plate layer and the hot pressing substrate layer are connected together;
s3, fixing a finished product: coating adhesive glue on the narrow part of the top end of the radiating block of the radiating aluminum plate layer, adhering the radiating block of one radiating aluminum plate layer and one side surface of the heat-insulating plate, applying pressure and maintaining the pressure for 15-20min, adhering the radiating block of one radiating aluminum plate layer and the other side surface of the heat-insulating plate, applying pressure and maintaining the pressure for 15-20min, and fixing a finished product;
s4, cutting the plate: and according to specific use requirements, cutting the finished product which is fixed in the step S3 to a specific size.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110870522.7A CN113613382B (en) | 2021-07-30 | 2021-07-30 | 5G high-frequency high-speed circuit board and preparation process thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110870522.7A CN113613382B (en) | 2021-07-30 | 2021-07-30 | 5G high-frequency high-speed circuit board and preparation process thereof |
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| CN113613382A true CN113613382A (en) | 2021-11-05 |
| CN113613382B CN113613382B (en) | 2022-05-13 |
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| CN212499279U (en) * | 2019-07-01 | 2021-02-09 | 林州市诚雨电子材料有限公司 | Copper-clad plate with good air permeability |
| CN213261501U (en) * | 2020-09-23 | 2021-05-25 | 惠州市俊兴发工艺品有限公司 | Plastic sheet |
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2021
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Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR20130084745A (en) * | 2012-01-18 | 2013-07-26 | 한국생산기술연구원 | Anodic aluminum oxide having aluminum heat spreading layer having adhesion groove and its manufacturing method |
| CN206042510U (en) * | 2016-08-23 | 2017-03-22 | 凯普金业电子科技（昆山）有限公司 | Double -deck flexible line way board of HDI with better radiating effect |
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| CN213261501U (en) * | 2020-09-23 | 2021-05-25 | 惠州市俊兴发工艺品有限公司 | Plastic sheet |
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