CN208247651U - A kind of high-heat-conductionaluminum aluminum base copper clad board - Google Patents
A kind of high-heat-conductionaluminum aluminum base copper clad board Download PDFInfo
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- CN208247651U CN208247651U CN201820779530.4U CN201820779530U CN208247651U CN 208247651 U CN208247651 U CN 208247651U CN 201820779530 U CN201820779530 U CN 201820779530U CN 208247651 U CN208247651 U CN 208247651U
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Abstract
The utility model discloses a kind of high-heat-conductionaluminum aluminum base copper clad board, including copper foil layer, prepreg, heat-conducting layer, aluminum substrate, it is characterized in that: the prepreg is between copper foil layer and heat-conducting layer, the prepreg is epoxy glass fiber cloth, and its bottom surface is provided with multiple protrusions, it is arranged at the heat-conducting layer respective protrusions fluted, the heat-conducting layer is made of heat-conducting silica gel sheet, the upper and lower surface of the prepreg is impregnated with phenolic resin, heat filling is filled in the phenolic resin, the lower section of heat-conducting layer is arranged in the aluminum substrate, the bottom surface of the aluminum substrate is provided with several radiating areas, the radiating area is made of multiple half slots, the radiating area and the raised Relative distribution.The utility model has good heat-resisting, thermally conductive, heat dissipation performance, and the machining property of copper-clad plate is good.
Description
Technical field
The utility model discloses a kind of high-heat-conductionaluminum aluminum base copper clad board, belongs to wiring board manufacturing technology field.
Background technique
Aluminum-based copper-clad plate, that is, aluminum substrate is one kind of raw material, it be with electronic glass-fiber cloth or other reinforcing materials leaching with
Resin, single resin etc. are insulation adhesive layer, on one side or two-sided a kind of manufactured board-like material, quilt coated with copper foil and through hot pressing
Referred to as copper foil covered jewelling substrate, referred to as aluminum-based copper-clad plate.Aluminum-based copper-clad plate is as the substrate material in printed circuit board manufacture
Material, mainly plays interconnection, insulation and support to printed circuit board, damages to the transmission speed of signal, energy in circuit
Characteristic impedance etc. of becoming estranged has a great impact；Currently, as long as existing aluminum-based copper-clad plate is for the base in printed circuit board manufacture
Plate material, therefore, heating conduction and proof voltage for aluminum-based copper-clad plate can just have higher requirement, but traditional aluminium base is covered
The heating conduction and proof voltage of copper sheet can not reach requirement generally, can not cater to the demand of the electronic products such as circuit board.
Utility model content
In view of the deficienciess of the prior art, the purpose of this utility model, which is to provide for a kind of high thermal conductivity aluminum matrix, covers copper
Plate, to solve the problems mentioned in the above background technology.
To achieve the above object, the utility model provides following technical solution to realize:
A kind of high-heat-conductionaluminum aluminum base copper clad board, including copper foil layer, prepreg, heat-conducting layer, aluminum substrate, it is characterized in that: described
Prepreg between copper foil layer and heat-conducting layer, the prepreg be epoxy glass fiber cloth, and its bottom surface be provided with it is more
A protrusion, setting is fluted at the heat-conducting layer respective protrusions, and the heat-conducting layer is made of heat-conducting silica gel sheet, the prepreg
Upper and lower surface be impregnated with phenolic resin, heat filling is filled in the phenolic resin, the aluminum substrate is arranged thermally conductive
The lower section of layer, the bottom surface of the aluminum substrate are provided with several radiating areas, and the radiating area is made of multiple half slots, described to dissipate
Hot-zone and the raised Relative distribution, the surface of the copper foil layer is provided with PET protection film.
As preferred: the heat filling is aluminum oxide or aluminium nitride.
As preferred: being provided with graphite flake in the groove.
As preferred: 2 times of the thickness with a thickness of heat-conducting layer of the aluminum substrate.
As preferred: the aluminum substrate is made of 5050 magnesium alloys.
As preferred: the copper foil layer, prepreg, heat-conducting layer, aluminum substrate overlapping with a thickness of 3-5mm.
The utility model has the beneficial effects that
This copper-clad plate increases PET protection film in copper foil layer surface, can protect the surface of copper foil layer, prevents plowing to covering copper
The conductive capability of plate has an impact, and can be torn when using copper-clad plate, and copper foil layer is made of cathode copper, thus
The high copper foil of copper content is obtained, the conductive capability of copper-clad plate is improved, prepreg made of epoxy glass fiber cloth not only has
Good fire-retardant, electrical insulation capability, and the resistance to warping of copper-clad plate can also be improved, it can be by copper foil using phenolic resin
Layer, prepreg, heat-conducting layer are firmly bonded, and protrusion is provided on prepreg, can be with increasing heat radiation area, and can also be made
Prepreg is Nian Jie with heat-conducting layer securely, and cooperates heat filling and heat-conducting layer that can quickly transfer heat to aluminum substrate
On, by the radiating area of aluminum substrate bottom surface, the contact area of itself and air can be increased, and protrusion is corresponding with radiating area, it can
To reduce heat transfer distance, to realize rapid cooling, graphite flake has good heat conductivity, and the heat of copper-clad plate can be improved
Conductive performance, half slot can reduce the concentrated stress of aluminum substrate, improve the integral strength of copper-clad plate, and magnesium alloy can make
Obtaining copper-clad plate has good machining property.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of high-heat-conductionaluminum aluminum base copper clad board of the utility model.
Appended drawing reference: 1, PET protection film；2, heat-conducting layer；3, radiating area；4, copper foil layer；5, prepreg；6, raised；7,
Aluminum substrate；8, graphite flake.
Specific embodiment
A kind of high-heat-conductionaluminum aluminum base copper clad board of the utility model is described further referring to Fig.1.
A kind of high-heat-conductionaluminum aluminum base copper clad board, including copper foil layer 4, prepreg 5, heat-conducting layer 2, aluminum substrate 7, it is characterized in that:
For the prepreg 5 between copper foil layer 4 and heat-conducting layer 2, the prepreg 5 is epoxy glass fiber cloth, and its bottom surface
Multiple raised 6 are provided with, setting is fluted at 2 respective protrusions 6 of heat-conducting layer, and the heat-conducting layer 2 is made of heat-conducting silica gel sheet,
The upper and lower surface of the prepreg 5 is impregnated with phenolic resin, is filled with heat filling, the aluminium base in the phenolic resin
Plate 7 is arranged in the lower section of heat-conducting layer 2, and the bottom surface of the aluminum substrate 7 is provided with several radiating areas 3, and the radiating area 3 is by multiple
Half slot composition, the radiating area 3 and two neighboring raised 6 Relative distribution, the surface of the copper foil layer 4 is provided with PET
Protective film 1；The heat filling is aluminum oxide or aluminium nitride, is provided with graphite flake 8, the aluminum substrate 7 in the groove
2 times of the thickness with a thickness of heat-conducting layer 2, the aluminum substrate 7 is made of 5050 magnesium alloys, the copper foil layer 4, semi-solid preparation
Piece 5, heat-conducting layer 2, aluminum substrate 7 overlap with a thickness of 3-5mm.
This copper-clad plate increases PET protection film 1 on 4 surface of copper foil layer, can protect the surface of copper foil layer 4, prevents plowing from pair
The conductive capability of copper-clad plate has an impact, and can be torn when using copper-clad plate, and copper foil layer 4 is using electrolysis copper
At to obtain the high copper foil of copper content, improving the conductive capability of copper-clad plate, prepreg 5 made of epoxy glass fiber cloth
Not only there is good fire-retardant, electrical insulation capability, and the resistance to warping of copper-clad plate can also be improved, it can be with using phenolic resin
Copper foil layer 4, prepreg 5, heat-conducting layer 2 are firmly bonded, and are provided with protrusion 6 on prepreg 5, radiating surface can be increased
Product, and it is be bonded with heat-conducting layer 2 securely to make prepreg 5, and cooperates heat filling and heat-conducting layer 2 can be quickly by heat
Be transmitted on aluminum substrate 7, by the radiating area 3 of 7 bottom surface of aluminum substrate, the contact area of itself and air can be increased, and protrusion 6 with
Radiating area 3 is corresponding, it is possible to reduce and heat transfer distance, to realize rapid cooling, graphite flake 8 has good heat conductivity,
The heat-conductive characteristic of copper-clad plate can be improved, half slot can reduce the concentrated stress of aluminum substrate 7, improve the whole strong of copper-clad plate
Degree, and magnesium alloy can make copper-clad plate have good machining property.
The above is only the preferred embodiment of the utility model, and the protection scope of the utility model is not limited merely to
Above-described embodiment, technical solution belonging to the idea of the present invention belong to the protection scope of the utility model.It should refer to
Out, for those skilled in the art, it is without departing from the principle of the utility model it is several improvement and
Retouching, these improvements and modifications also should be regarded as the protection scope of the utility model.
Claims (6)
1. a kind of high-heat-conductionaluminum aluminum base copper clad board, including copper foil layer, prepreg, heat-conducting layer, aluminum substrate, it is characterized in that: described half
Cured sheets between copper foil layer and heat-conducting layer, the prepreg be epoxy glass fiber cloth, and its bottom surface be provided with it is multiple
Protrusion, setting is fluted at the heat-conducting layer respective protrusions, and the heat-conducting layer is made of heat-conducting silica gel sheet, the prepreg
Upper and lower surface is impregnated with phenolic resin, and heat filling is filled in the phenolic resin, and the aluminum substrate is arranged in heat-conducting layer
Lower section, the bottom surface of the aluminum substrate is provided with several radiating areas, and the radiating area is made of multiple half slots, the heat dissipation
Area and the raised Relative distribution, the surface of the copper foil layer is provided with PET protection film.
2. a kind of high-heat-conductionaluminum aluminum base copper clad board according to claim 1, it is characterized in that: the heat filling is three oxidations two
Aluminium or aluminium nitride.
3. a kind of high-heat-conductionaluminum aluminum base copper clad board according to claim 1, it is characterized in that: being provided with graphite in the groove
Piece.
4. a kind of high-heat-conductionaluminum aluminum base copper clad board according to claim 1, it is characterized in that: the aluminum substrate with a thickness of thermally conductive
2 times of the thickness of layer.
5. a kind of high-heat-conductionaluminum aluminum base copper clad board according to claim 1, it is characterized in that: the aluminum substrate uses 5050 magnaliums
Alloy is made.
6. a kind of high-heat-conductionaluminum aluminum base copper clad board according to claim 1, it is characterized in that: the copper foil layer, prepreg, leading
Thermosphere, aluminum substrate overlapping with a thickness of 3-5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820779530.4U CN208247651U (en) | 2018-05-19 | 2018-05-19 | A kind of high-heat-conductionaluminum aluminum base copper clad board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820779530.4U CN208247651U (en) | 2018-05-19 | 2018-05-19 | A kind of high-heat-conductionaluminum aluminum base copper clad board |
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| Publication Number | Publication Date |
|---|---|
| CN208247651U true CN208247651U (en) | 2018-12-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820779530.4U Active CN208247651U (en) | 2018-05-19 | 2018-05-19 | A kind of high-heat-conductionaluminum aluminum base copper clad board |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020232761A1 (en) * | 2019-05-22 | 2020-11-26 | 昆山欧贝达电子科技有限公司 | Circuit board substrate having high thermal conductivity |
| CN113613382A (en) * | 2021-07-30 | 2021-11-05 | 定颖电子（昆山）有限公司 | 5G high-frequency high-speed circuit board and preparation process thereof |
| CN113973424A (en) * | 2021-10-29 | 2022-01-25 | 深圳市亿方电子有限公司 | Double-sided aluminum substrate embedded with high-thermal-conductivity graphite flakes and manufacturing method thereof |
-
2018
- 2018-05-19 CN CN201820779530.4U patent/CN208247651U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020232761A1 (en) * | 2019-05-22 | 2020-11-26 | 昆山欧贝达电子科技有限公司 | Circuit board substrate having high thermal conductivity |
| CN113613382A (en) * | 2021-07-30 | 2021-11-05 | 定颖电子（昆山）有限公司 | 5G high-frequency high-speed circuit board and preparation process thereof |
| CN113613382B (en) * | 2021-07-30 | 2022-05-13 | 定颖电子（昆山）有限公司 | 5G high-frequency high-speed circuit board and preparation process thereof |
| CN113973424A (en) * | 2021-10-29 | 2022-01-25 | 深圳市亿方电子有限公司 | Double-sided aluminum substrate embedded with high-thermal-conductivity graphite flakes and manufacturing method thereof |
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