CN208247631U - A kind of novel aluminum-based copper-clad plate - Google Patents
A kind of novel aluminum-based copper-clad plate Download PDFInfo
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- CN208247631U CN208247631U CN201820746619.0U CN201820746619U CN208247631U CN 208247631 U CN208247631 U CN 208247631U CN 201820746619 U CN201820746619 U CN 201820746619U CN 208247631 U CN208247631 U CN 208247631U
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Abstract
The utility model discloses a kind of novel aluminum-based copper-clad plate, including copper sheet ontology, it is characterized in that: the copper sheet ontology is by substrate, copper foil layer and heat-conducting layer composition, the copper foil layer is located at the top of substrate, the heat-conducting layer is located at the top of copper foil layer, the substrate includes aluminum base layer, insulating layer and ink layer, the aluminum base layer is located at the lower section of insulating layer, the ink layer is located at the top of insulating layer, the heat-conducting layer includes heat-conducting glue layer and PP solidification film layers, the PP solidifies the thickness of film layers and being of uniform thickness for heat-conducting glue layer, the PP solidifies the top that film layers are located at heat-conducting glue layer, several heat sink strips are provided with above the heat-conducting layer, the heat sink strip is fish fin structure.The electric conductivity, thermal conductivity and service life of aluminum-based copper-clad plate can be improved in the utility model.
Description
Technical field
The utility model discloses a kind of novel aluminum-based copper-clad plate, belongs to technical field of copper clad laminate.
Background technique
Aluminum-based copper-clad plate, that is, aluminum substrate is one kind of raw material, it be with electronic glass-fiber cloth or other reinforcing materials leaching with
Resin, single resin etc. are insulation adhesive layer, on one side or two-sided a kind of manufactured board-like material, quilt coated with copper foil and through hot pressing
Referred to as copper foil covered jewelling substrate, referred to as aluminum-based copper-clad plate.Existing aluminum-based copper-clad plate is easy to appear to be aoxidized with air
With the effect of corrosion, this greatly reduces the service life of aluminum-based copper-clad plate, and in the effect of electric conductivity and thermal conductivity
It is not good enough.
Utility model content
In view of the deficienciess of the prior art, the purpose of this utility model is to provide for a kind of novel aluminum-based copper-clad plate,
To solve the problems mentioned in the above background technology.
To achieve the above object, the utility model provides following technical solution to realize:
A kind of novel aluminum-based copper-clad plate, including copper sheet ontology, it is characterized in that: the copper sheet ontology by substrate, copper foil layer and
Heat-conducting layer composition, the copper foil layer are located at the top of substrate, and the heat-conducting layer is located at the lower section of copper foil layer, and the substrate includes aluminium
Base, insulating layer and ink layer, the aluminum base layer are located at the lower section of insulating layer, and the ink layer is located at the top of insulating layer, institute
Stating heat-conducting layer includes heat-conducting glue layer and PP solidification film layers, and the PP solidifies the thickness of film layers and the thickness one of heat-conducting glue layer
Sample, the PP solidify above and below the insulating layer that film layers and heat-conducting glue layer are located at, and set below the aluminum base layer
Several heat sink strips are equipped with, the heat sink strip is fish fin structure, and the surface of the copper sheet ontology is disposed with outward by interior
Erosion resistant coating, damp-proof layer and protective film, the erosion resistant coating are made of polyethylene coating, and the damp-proof layer is made of aerogel material.
As preferred: the protective film is release protective film.
As preferred: the copper foil layer is made of several copper foils.
As preferred: the substrate is laminated structure, and it is hot-forming with copper foil layer and heat-conducting layer.
As preferred: being provided with several heat release holes on the inside of the aluminum base layer.
As preferred: the thickness of the copper foil layer is greater than the thickness of heat-conducting glue layer.
The utility model has the beneficial effects that
By the way that substrate, copper foil layer and heat-conducting layer is hot-forming, the stripper-resistance of aluminum-based copper-clad plate is improved, setting is passed through
There are heat-conducting glue layer, PP solidification film layers and heat release hole, improve the thermal conductivity of aluminum-based copper-clad plate, by being provided with erosion resistant coating, preventing
Damp layer and protective film play anticorrosion, moisture proof and the function of protection to aluminum-based copper-clad plate, improve making for aluminum-based copper-clad plate
Use the service life；By being provided with copper foil layer, and the copper foil layer is electrolyte copper foil layer, reduces the impurity on the inside of copper foil layer, improves
The electric conductivity of entire copper-clad plate.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of novel aluminum-based copper-clad plate of the utility model.
Appended drawing reference: 1, heat-conducting layer；11, PP solidifies film layers；12, heat-conducting glue layer；2, copper foil layer；3, substrate；31, ink
Layer；32, insulating layer；33, aluminum base layer；4, heat sink strip；5, heat release hole；6, protective film；7, damp-proof layer；8, erosion resistant coating.
Specific embodiment
Novel aluminum-based copper-clad plate a kind of to the utility model is described further referring to Fig.1.
A kind of novel aluminum-based copper-clad plate, including copper sheet ontology, it is characterized in that: the copper sheet ontology is by substrate 3, copper foil layer 2
It is formed with heat-conducting layer 1, the copper foil layer 2 is located at the top of substrate 3, and the heat-conducting layer 1 is located at the lower section of copper foil layer 2, the base
Plate 3 includes aluminum base layer 33, insulating layer 32 and ink layer 31, and the aluminum base layer 33 is located at the lower section of insulating layer 32, the ink layer
31 are located at the top of insulating layer 32, and the heat-conducting layer 1 includes heat-conducting glue layer 12 and PP solidifies film layers 11, and the PP solidifies film
The thickness of layer 11 is of uniform thickness with heat-conducting glue layer 12, and the PP solidifies the insulation that film layers 11 and heat-conducting glue layer 12 are located at
Above and below layer 32, the lower section of the aluminum base layer 33 is provided with several heat sink strips 4, and the heat sink strip 4 is fin shape knot
Structure, the surface of the copper sheet ontology are disposed with erosion resistant coating 8, damp-proof layer 7 and protective film 6 by interior outward, the erosion resistant coating 8 by
Polyethylene coating is made, and the damp-proof layer 7 is made of aerogel material, and the protective film 6 is release protective film, the copper foil layer
2 are made of several copper foils, and the substrate 3 is laminated structure, and it is hot-forming with copper foil layer 2 and heat-conducting layer 1, the aluminium
The inside of base 33 is provided with several heat release holes 5, and the thickness of the copper foil layer 2 is greater than the thickness of heat-conducting glue layer 12.
By the way that substrate 3, copper foil layer 2 and heat-conducting layer 1 is hot-forming, the stripper-resistance of aluminum-based copper-clad plate is improved, is passed through
It is provided with heat-conducting glue layer 12, PP solidification film layers 11 and heat release hole 5, the thermal conductivity of aluminum-based copper-clad plate is improved, by being provided with
Erosion resistant coating 8, damp-proof layer 7 and protective film 6 play anticorrosion, moisture proof and the function of protection to aluminum-based copper-clad plate, improve aluminium
The service life of base copper-clad plate；By being provided with copper foil layer 2, and the copper foil layer 2 is electrolyte copper foil layer, is reduced in copper foil layer 2
The impurity of side improves the electric conductivity of entire copper-clad plate.
The above is only the preferred embodiment of the utility model, and the protection scope of the utility model is not limited merely to
Above-described embodiment, technical solution belonging to the idea of the present invention belong to the protection scope of the utility model.It should refer to
Out, for those skilled in the art, it is without departing from the principle of the utility model it is several improvement and
Retouching, these improvements and modifications also should be regarded as the protection scope of the utility model.
Claims (6)
1. a kind of novel aluminum-based copper-clad plate, including copper sheet ontology, it is characterized in that: the copper sheet ontology is by substrate, copper foil layer and leads
Thermosphere composition, the copper foil layer are located at the top of substrate, and the heat-conducting layer is located at the lower section of copper foil layer, and the substrate includes aluminium base
Layer, insulating layer and ink layer, the aluminum base layer are located at the lower section of insulating layer, and the ink layer is located at the top of insulating layer, described
Heat-conducting layer includes heat-conducting glue layer and PP solidification film layers, and the PP solidifies the thickness of film layers and being of uniform thickness for heat-conducting glue layer,
The PP solidifies above and below the insulating layer that film layers and heat-conducting glue layer are located at, and is provided with below the aluminum base layer
Several heat sink strips, the heat sink strip are fish fin structure, and the surface of the copper sheet ontology is disposed with anti-corrosion by interior outward
Layer, damp-proof layer and protective film, the erosion resistant coating are made of polyethylene coating, and the damp-proof layer is made of aerogel material.
2. a kind of novel aluminum-based copper-clad plate according to claim 1, it is characterized in that: the protective film is release protective film.
3. a kind of novel aluminum-based copper-clad plate according to claim 1, it is characterized in that: the copper foil layer is by several copper foils
Composition.
4. a kind of novel aluminum-based copper-clad plate according to claim 1, it is characterized in that: the substrate is laminated structure, and its
It is hot-forming with copper foil layer and heat-conducting layer.
5. a kind of novel aluminum-based copper-clad plate according to claim 1, if it is characterized in that: being provided on the inside of the aluminum base layer
Dry heat release hole.
6. a kind of novel aluminum-based copper-clad plate according to claim 1, it is characterized in that: the thickness of the copper foil layer is greater than thermally conductive
The thickness of glue-line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820746619.0U CN208247631U (en) | 2018-05-18 | 2018-05-18 | A kind of novel aluminum-based copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820746619.0U CN208247631U (en) | 2018-05-18 | 2018-05-18 | A kind of novel aluminum-based copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208247631U true CN208247631U (en) | 2018-12-18 |
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ID=66481464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820746619.0U Active CN208247631U (en) | 2018-05-18 | 2018-05-18 | A kind of novel aluminum-based copper-clad plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208247631U (en) |
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2018
- 2018-05-18 CN CN201820746619.0U patent/CN208247631U/en active Active
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