CN206494890U - A kind of grid adhesive tape for electronic product radiating - Google Patents
A kind of grid adhesive tape for electronic product radiating Download PDFInfo
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- CN206494890U CN206494890U CN201720012316.1U CN201720012316U CN206494890U CN 206494890 U CN206494890 U CN 206494890U CN 201720012316 U CN201720012316 U CN 201720012316U CN 206494890 U CN206494890 U CN 206494890U
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- layer
- adhesive tape
- electronic product
- heat dissipating
- grid
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Abstract
The utility model is related to a kind of grid adhesive tape for electronic product radiating, it includes substrate layer, the adhesive layer formed on the substrate layer at least a surface and forms the release layer on another surface of the adhesive layer, the surface being in contact in the adhesive layer with the release layer is formed with the heat dissipating layer circulated for fluid, and the heat dissipating layer includes microchannel that is multiple raised and being formed between the projection.By including the heat dissipating layer of multiple raised and microchannels in the formation of gluing layer surface, it can so reduce the contact area with affixed object, reach exhaust radiating effect and the performance easily done over again.
Description
Technical field
The utility model belongs to adhesive tape area, is related to a kind of grid adhesive tape, and in particular to one kind is used for electronic product radiating
Grid adhesive tape.
Background technology
With the development of electronic information technology, the electronic product such as mobile phone, computer, digital camera becomes increasingly popular, these electricity
The adhesive tape that sub- product is used is needed with special performance, the need for it disclosure satisfy that its internal heat dissipating.But use in the market
It is generally to be bonded again with casing after graphite film is combined with PET adhesive tape in the adhesive tape product of radiating, cost costly, is using process
Layering occurs in middle PET adhesive tape and graphite flake, so as to influence the thermal diffusivity of product.And existing common copper foil tape make-up machine shell
Easily there is bubble and be difficult phenomenon of doing over again, it is difficult to meet the requirement of electronic product.
The content of the invention
The utility model purpose is to provide a kind of net for electronic product radiating to overcome the deficiencies in the prior art
Lattice adhesive tape.
To reach above-mentioned purpose, the technical solution adopted in the utility model is:A kind of grid for electronic product radiating
Adhesive tape, it includes substrate layer, the adhesive layer formed on the substrate layer at least a surface and formed another in the adhesive layer
The surface being in contact in release layer on one surface, the adhesive layer with the release layer is formed with the radiating circulated for fluid
Layer, the heat dissipating layer includes microchannel that is multiple raised and being formed between the projection.
Optimally, the material of the substrate layer is metal material or thin-film material, and the metal material is copper, aluminium, gold, silver
Or platinum, the thin-film material is PET, PI or PVC.
Optimally, when the material of the substrate layer is copper, it is carried out by copper sulfate electrolyte in the presence of direct current
Electro-deposition and it is roughened, it is resistance to heat treatment be made.
Optimally, when two surfaces of the substrate layer have been respectively formed on the adhesive layer, the table of any adhesive layer
Face is formed with the heat dissipating layer.
Optimally, the release layer has the structure being engaged with the heat dissipating layer.
Further, the raised end face integrally assume diamond in shape, it is square or trapezoidal, or for cone.
Further, the raised size is micron-sized.
Because above-mentioned technical proposal is used, the utility model has following advantages compared with prior art:The utility model
For the grid adhesive tape of electronic product radiating, by including the heat dissipating layer of multiple raised and microchannels in the formation of gluing layer surface,
The contact area with affixed object can so be reduced, exhaust radiating effect and the performance easily done over again is reached.
Brief description of the drawings
Fig. 1 is the structural representation for the grid adhesive tape that the utility model is used for electronic product radiating;
Fig. 2 is that the utility model is used for the grid adhesive tape heat dissipating layer part-structure schematic diagram of electronic product radiating:(a) water chestnut
Shape;(b) square, inside and outside contour is cambered;(c) square, outline is cambered;(d) it is trapezoidal;(e) it is square;(f) cone;
Wherein, 1, substrate layer;3rd, adhesive layer;31st, heat dissipating layer;311st, it is raised;312nd, microchannel;4th, release layer.
Embodiment
The utility model is further described below in conjunction with embodiment.
Grid adhesive tape for electronic product radiating as shown in Figure 1, mainly includes substrate layer 1, adhesive layer 3 and release layer
4。
Wherein, the material of substrate layer 1 is the film class materials such as metal material and PET, PI, PVC such as copper, aluminium, gold, silver or platinum
Material, and copper has natural cost and stability advantage;When the material of substrate layer 1 is copper, it is by copper sulfate electrolyte straight
Electro-deposition is carried out in the presence of stream electricity and roughened, resistance to heat treatment and anti-oxidation processing are made.Electrolytic copper foil is different from calendering copper
Paper tinsel, the former paper tinsel two sides crystal habit of electrolysis is different, presses close to the one side smoother of cathode roll, as smooth surface;Convex-concave is presented in another side
The crystallographic texture of shape, it is relatively rough, as hair side;In addition to carrying out necessary roughening treatment, heat-resisting place is also carried out
Manage (such as zinc-plated, brass plating), the anti-oxidation processing of special high temperature resistant, heat resisting temperature reaches 200 DEG C or so;Thickness can be according to need
Select, generally from the copper foil that thickness is 18 μm.Adhesive layer 3 is formed (is divided into two kinds of feelings on an at least surface for substrate layer 1
Condition:It is a kind of to be formed on any surface on 1 two surfaces of substrate layer;It is a kind of to be formed on two surfaces of substrate layer 1),
Its material can be the pressure sensitive adhesives such as polyacrylate.The quantity of release layer 4 is consistent with the quantity of adhesive layer 3, and it is formed in gluing
On another surface of layer 3.In order to reduce the contact area with affixed object, exhaust radiating effect and the performance easily done over again, glue are reached
The surface (surface being in contact with release layer 4) of glutinous layer 3 is formed with the heat dissipating layer 31 circulated for fluid (air), the heat dissipating layer
31 include multiple raised 311 and the microchannel 312 formed between projection 311;The size of these usual projections 311 is at three
It is micron order in dimension, and the size of microchannel 312 is also micron order.Substrate layer 1 effectively increases the thermal conductivity of adhesive tape, glue
Glutinous layer 3 has stronger adherence, and heat dissipating layer 31 has splendid venting quality and easy doing over again property, using the adhesive layer of specific materials
3 can make it have wet-heat resisting, it is ageing-resistant, good adhesion can be kept for a long time, and its shape can be processed as needed
Adjustment so that the adhesive tape is highly suitable for the radiating of electronic product.
In the present embodiment, when two surfaces of substrate layer 1 have been respectively formed on adhesive layer 3, it is only necessary to have one layer of adhesive layer 3
Surface be formed with heat dissipating layer 31.The construction of heat dissipating layer 31, which generally depends on release layer 4, i.e. release layer 4, to be had and heat dissipating layer 31
The structure being engaged, such as when release layer 4 being overlying on into adhesive layer 3 and representing, using its progress of the pressure roll pair with counter structure
Release layer 4 can be extruded corresponding mesh shape by rolling, so that the surface of adhesive layer 3 also has corresponding shape.When convex
Rise 311 end face integrally assume diamond in shape (Fig. 2 (a)), it is square (Fig. 2 (b, c, e)) or trapezoidal (Fig. 2 (d)), or for cone (Fig. 2
(f)) and other irregular structures, structure is simpler, and integral thickness is thin, high adhesion and venting quality;Release layer 4 have pair
Square, the trapezoidal, rhombus or other irregular structures answered, thus heat dissipating layer 31 also have corresponding square, trapezoidal, rhombus or
Other irregular shapes.
Above-described embodiment is only to illustrate technical concepts and features of the present utility model, and its object is to allow be familiar with technique
Personage can understand content of the present utility model and implement according to this, protection domain of the present utility model can not be limited with this.
All equivalent change or modifications made according to the utility model Spirit Essence, should all cover protection domain of the present utility model it
It is interior.
Claims (6)
1. a kind of grid adhesive tape for electronic product radiating, it includes substrate layer(1), formed in the substrate layer(1)At least
Adhesive layer on one surface(3)And formed in the adhesive layer(3)Release layer on another surface(4), it is characterised in that:Institute
State adhesive layer(3)In with the release layer(4)The surface being in contact is formed with the heat dissipating layer circulated for fluid(31), it is described to dissipate
Thermosphere(31)Including multiple projections(311)And formed in the projection(311)Between microchannel(312).
2. it is used for the grid adhesive tape of electronic product radiating according to claim 1, it is characterised in that:The substrate layer(1)'s
Material be metal material or thin-film material, the metal material be copper, aluminium, gold, silver or platinum, the thin-film material be PET, PI or
PVC。
3. it is used for the grid adhesive tape of electronic product radiating according to claim 1, it is characterised in that:When the substrate layer(1)
Two surfaces be respectively formed on the adhesive layer(3)When, any adhesive layer(3)Surface be formed with the heat dissipating layer
(31).
4. it is used for the grid adhesive tape of electronic product radiating according to claim 1, it is characterised in that:The release layer(4)Tool
Have and the heat dissipating layer(31)The structure being engaged.
5. it is used for the grid adhesive tape of electronic product radiating according to claim 1 or 4, it is characterised in that:The projection(311)
End face integrally assume diamond in shape, it is square or trapezoidal, or for cone.
6. it is used for the grid adhesive tape of electronic product radiating according to claim 5, it is characterised in that:The projection(311)'s
Size is micron-sized.
Priority Applications (1)
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CN201720012316.1U CN206494890U (en) | 2017-01-05 | 2017-01-05 | A kind of grid adhesive tape for electronic product radiating |
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CN201720012316.1U CN206494890U (en) | 2017-01-05 | 2017-01-05 | A kind of grid adhesive tape for electronic product radiating |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107613653A (en) * | 2017-09-20 | 2018-01-19 | 四川海英电子科技有限公司 | The preparation method of high multistage HDI printed circuit board (PCB)s |
CN108010438A (en) * | 2017-11-30 | 2018-05-08 | 武汉天马微电子有限公司 | A kind of manufacture method of display module, display device and display module |
CN110734706A (en) * | 2019-10-17 | 2020-01-31 | Oppo广东移动通信有限公司 | Heat dissipation film, manufacturing method thereof and electronic equipment |
CN113174216A (en) * | 2021-04-15 | 2021-07-27 | 浙江欧仁新材料有限公司 | Removable adhesive tape and preparation method thereof |
-
2017
- 2017-01-05 CN CN201720012316.1U patent/CN206494890U/en active Active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107613653A (en) * | 2017-09-20 | 2018-01-19 | 四川海英电子科技有限公司 | The preparation method of high multistage HDI printed circuit board (PCB)s |
CN108010438A (en) * | 2017-11-30 | 2018-05-08 | 武汉天马微电子有限公司 | A kind of manufacture method of display module, display device and display module |
CN110734706A (en) * | 2019-10-17 | 2020-01-31 | Oppo广东移动通信有限公司 | Heat dissipation film, manufacturing method thereof and electronic equipment |
CN113174216A (en) * | 2021-04-15 | 2021-07-27 | 浙江欧仁新材料有限公司 | Removable adhesive tape and preparation method thereof |
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