CN107613653A - The preparation method of high multistage HDI printed circuit board (PCB)s - Google Patents
The preparation method of high multistage HDI printed circuit board (PCB)s Download PDFInfo
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- CN107613653A CN107613653A CN201710854991.3A CN201710854991A CN107613653A CN 107613653 A CN107613653 A CN 107613653A CN 201710854991 A CN201710854991 A CN 201710854991A CN 107613653 A CN107613653 A CN 107613653A
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- fin
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- circuit board
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Abstract
The invention discloses the preparation method of high multistage HDI printed circuit board (PCB)s, it comprises the following steps：S1, the circuit substrate from copper material（1）, the copper foil that a layer thickness is 0.5 ~ 1mm is pressed on the surface of circuit substrate（2）；S2, line layer making；S3, make lower fin；Fin on S4, making；S5, in step S3 the adhesive layer of fin will be played to be attached to circuit substrate（1）Basal surface；The adhesive layer of fin will be gone up in step S4 down and be adhered to line layer（3）Top；S6, the pressure by forcing press to 30 ~ 40N of upper fin top surface application, while pressure is applied to the basal surface of lower fin with the pressure of formed objects, to ensure that two layers of adhesive layer is heat sealing at circuit substrate（1）On, it is achieved thereby that the making of high multistage HDI printed circuit board (PCB)s.The beneficial effects of the invention are as follows：Manufacture craft is simple, product quality is high, makes circuit board service life length, good heat dissipation effect, low manufacture cost.
Description
Technical field
The present invention relates to the technical field of HDI print circuit plates makings, the making of particularly high multistage HDI printed circuit board (PCB)s
Method.
Background technology
HDI printed circuit board (PCB)s are the supporting bodies of electronic device, are essential in an electronic product or electrical equipment
Part.At present, with the development of electronics, electrical technology, requirement of the people to HDI printed circuit board (PCB)s also more and more higher, especially
As LED is as illuminating device, after entering into the life of people, the heat dispersion of HDI printed circuit board (PCB)s is required also increasingly
Height, at present, it is all to use aluminum base circuit board that some, which need the HDI printed circuit board (PCB)s of high heat dispersion, and it is provided with aluminium sheet
One layer of heat-conducting glue, it on the one hand can play a part of heat conduction, on the other hand also have the effect of insulation, one layer is attached with heat-conducting glue
Copper film circuit board line, but the heat conductivility of heat-conducting glue is not fine, so as to which the heat conduction of whole HDI printed circuit board (PCB)s can be influenceed
Performance.With working long hours for circuit board, heat bulk deposition ultimately results in line layer and burnt on line layer, serious drop
The low service life of circuit board, the competitiveness in market are also gradually reduced.
The content of the invention
The shortcomings that it is an object of the invention to overcome prior art, there is provided manufacture craft is simple, product quality is high, making is electric
Road plate service life length, good heat dissipation effect, low manufacture cost high multistage HDI printed circuit board (PCB)s preparation method.
The purpose of the present invention is achieved through the following technical solutions：The preparation method of high multistage HDI printed circuit board (PCB)s, it is wrapped
Include following steps：
S1, the circuit substrate from copper material, the copper foil that a layer thickness is 0.5 ~ 1mm is pressed on the surface of circuit substrate；
S2, line layer making, copper foil surface carry out ultrasonic wave cleaning；Ultrasonic wave cleaning after be put into 2min in acid deoiling liquid ~
6min, remove grease pollution and oxide layer on copper foil；Drying and processing ensures that copper foil surface is bright and clean after cleaning；Copper foil is sequentially led to
Overetch, exposure, leveling handle to obtain required line layer, realize the making of line layer；
S3, lower fin is made, one piece of one side glue A with circuit substrate formed objects is taken, by covering at the top of one side glue A
Epiphragma, which is torn, exposes adhesive layer, and groove is opened up at the top of adhesive layer, and several radiation tooths, radiation tooth are fixedly mounted in groove
Top it is concordant with gluing layer height, it is achieved thereby that the making of lower fin；
Fin on S4, making, one piece of one side glue B with circuit substrate formed objects is taken, is opened up in one side glue B snakelike
Passage, plug is clogged in the import and export of serpentine channel, cooling oil is closed between two plugs, it is achieved thereby that on
The making of fin；
S5, in step S3 the adhesive layer of fin will be played to be attached to the basal surface of circuit substrate, and ensure the top table of each radiation tooth
Face contacts with circuit substrate；The adhesive layer of fin will be gone up in step S4 down and be adhered at the top of line layer；
S6, high multistage HDI printed circuit board (PCB)s making, apply 30 ~ 40N pressure to upper fin top surface by forcing press,
Pressure is applied to the basal surface of lower fin with the pressure of formed objects simultaneously, to ensure that two layers of adhesive layer is heat sealing at circuit substrate
On, it is achieved thereby that the making of high multistage HDI printed circuit board (PCB)s.
The present invention has advantages below：Manufacture craft of the present invention is simple, product quality is high, makes circuit board service life
Length, good heat dissipation effect, low manufacture cost.
Brief description of the drawings
Fig. 1 is the structural representation that pressing has copper foil on circuit substrate surface；
Fig. 2 is the structural representation that copper foil is processed into line layer；
Fig. 3 is the structural representation of lower fin；
Fig. 4 is Fig. 3 top view；
Fig. 5 is the structural representation of lower fin；
Fig. 6 is Fig. 5 top view；
Fig. 7 is the structural representation of the high multistage HDI printed circuit board (PCB)s of finished product；
In figure, 1- circuit substrates, 2- copper foils, 3- line layers, 4- one side glues A, 5- groove, 6- radiation tooths, 7- one side glues B, 8- snake
Shape passage, 9- plugs.
Embodiment
The present invention will be further described below in conjunction with the accompanying drawings, and protection scope of the present invention is not limited to as described below：
Embodiment one：As shown in Fig. 1 ~ 7, the preparation method of high multistage HDI printed circuit board (PCB)s, it comprises the following steps：
S1, the circuit substrate 1 from copper material, the copper foil 2 that a layer thickness is 0.5mm is pressed on the surface of circuit substrate；
S2, line layer making, the surface of copper foil 2 carry out ultrasonic wave cleaning, make water emulsification, avoid after moisture evaporation on copper foil 2
Produce decorative pattern；2min in acid deoiling liquid is put into after ultrasonic wave cleaning, removes grease pollution and oxide layer on copper foil 2；Cleaning
Drying and processing ensures that copper foil surface is bright and clean afterwards；Copper foil 2 is sequentially passed through into etching, exposure, leveling handle to obtain required line layer
3, realize the making of line layer；
S3, lower fin is made, take one piece of one side glue A4 with the formed objects of circuit substrate 1, will be located at the top of one side glue A4
Cover layer tear and expose adhesive layer, groove 5 is opened up at the top of adhesive layer, several radiation tooths are fixedly mounted in groove 5
6, the top of radiation tooth 6 is concordant with gluing layer height, it is achieved thereby that the making of lower fin；
Fin on S4, making, one piece of one side glue B7 with the formed objects of circuit substrate 1 is taken, is opened up in one side glue B7
Serpentine channel 8, plug 9 is clogged in the import and export of serpentine channel 8, cooling oil is closed between two plugs 9, so as to
Realize the making of fin；
S5, in step S3 the adhesive layer of fin will be played to be attached to the basal surface of circuit substrate 1, and ensure the top of each radiation tooth 6
Surface contacts with circuit substrate 1；The adhesive layer of fin will be gone up in step S4 down and be adhered to the top of line layer 3；
S6, high multistage HDI printed circuit board (PCB)s making, apply 30 ~ 40N pressure to upper fin top surface by forcing press,
Pressure is applied to the basal surface of lower fin with the pressure of formed objects simultaneously, to ensure that two layers of adhesive layer is heat sealing at circuit substrate 1
On, it is achieved thereby that the making of high multistage HDI printed circuit board (PCB)s.By the HDI printed circuit board (PCB)s that the technique is produced when long
Between when operating, produce amount of heat on line layer 3, a part of heat passes down to the radiating of lower fin through circuit substrate 1
On tooth 6, then the external world is delivered to by radiation tooth 6, and another part heat is passed up on the one side glue B7 of fin, it is snakelike
Cooling oil in passage 8 absorbs the partial heat, realizes while discharges heat, that is, realizes the conduction and release of heat, make
The multistage HDI printed circuit board (PCB)s of the height are under normal temperature state all the time, are not in the phenomenon for burning circuit connection, are greatly prolonged
The service life of circuit board is grown, the life-span was up to 5 ~ 8 years.
Embodiment two：The preparation method of high multistage HDI printed circuit board (PCB)s, it comprises the following steps：
S1, the circuit substrate 1 from copper material, the copper foil 2 that a layer thickness is 0.7mm is pressed on the surface of circuit substrate；
S2, line layer making, the surface of copper foil 2 carry out ultrasonic wave cleaning, make water emulsification, avoid after moisture evaporation on copper foil 2
Produce decorative pattern；4min in acid deoiling liquid is put into after ultrasonic wave cleaning, removes grease pollution and oxide layer on copper foil 2；Cleaning
Drying and processing ensures that copper foil surface is bright and clean afterwards；Copper foil 2 is sequentially passed through into etching, exposure, leveling handle to obtain required line layer
3, realize the making of line layer；
S3, lower fin is made, take one piece of one side glue A4 with the formed objects of circuit substrate 1, will be located at the top of one side glue A4
Cover layer tear and expose adhesive layer, groove 5 is opened up at the top of adhesive layer, several radiation tooths are fixedly mounted in groove 5
6, the top of radiation tooth 6 is concordant with gluing layer height, it is achieved thereby that the making of lower fin；
Fin on S4, making, one piece of one side glue B7 with the formed objects of circuit substrate 1 is taken, is opened up in one side glue B7
Serpentine channel 8, plug 9 is clogged in the import and export of serpentine channel 8, cooling oil is closed between two plugs 9, so as to
Realize the making of fin；
S5, in step S3 the adhesive layer of fin will be played to be attached to the basal surface of circuit substrate 1, and ensure the top of each radiation tooth 6
Surface contacts with circuit substrate 1；The adhesive layer of fin will be gone up in step S4 down and be adhered to the top of line layer 3；
S6, high multistage HDI printed circuit board (PCB)s making, apply 30 ~ 40N pressure to upper fin top surface by forcing press,
Pressure is applied to the basal surface of lower fin with the pressure of formed objects simultaneously, to ensure that two layers of adhesive layer is heat sealing at circuit substrate 1
On, it is achieved thereby that the making of high multistage HDI printed circuit board (PCB)s.
Embodiment three：The preparation method of high multistage HDI printed circuit board (PCB)s, it comprises the following steps：
S1, the circuit substrate 1 from copper material, the copper foil 2 that a layer thickness is 1mm is pressed on the surface of circuit substrate；
S2, line layer making, the surface of copper foil 2 carry out ultrasonic wave cleaning, make water emulsification, avoid after moisture evaporation on copper foil 2
Produce decorative pattern；6min in acid deoiling liquid is put into after ultrasonic wave cleaning, removes grease pollution and oxide layer on copper foil 2；Cleaning
Drying and processing ensures that copper foil surface is bright and clean afterwards；Copper foil 2 is sequentially passed through into etching, exposure, leveling handle to obtain required line layer
3, realize the making of line layer；
S3, lower fin is made, take one piece of one side glue A4 with the formed objects of circuit substrate 1, will be located at the top of one side glue A4
Cover layer tear and expose adhesive layer, groove 5 is opened up at the top of adhesive layer, several radiation tooths are fixedly mounted in groove 5
6, the top of radiation tooth 6 is concordant with gluing layer height, it is achieved thereby that the making of lower fin；
Fin on S4, making, one piece of one side glue B7 with the formed objects of circuit substrate 1 is taken, is opened up in one side glue B7
Serpentine channel 8, plug 9 is clogged in the import and export of serpentine channel 8, cooling oil is closed between two plugs 9, so as to
Realize the making of fin；
S5, in step S3 the adhesive layer of fin will be played to be attached to the basal surface of circuit substrate 1, and ensure the top of each radiation tooth 6
Surface contacts with circuit substrate 1；The adhesive layer of fin will be gone up in step S4 down and be adhered to the top of line layer 3；
S6, high multistage HDI printed circuit board (PCB)s making, apply 30 ~ 40N pressure to upper fin top surface by forcing press,
Pressure is applied to the basal surface of lower fin with the pressure of formed objects simultaneously, to ensure that two layers of adhesive layer is heat sealing at circuit substrate 1
On, it is achieved thereby that the making of high multistage HDI printed circuit board (PCB)s.
Described above is only the preferred embodiment of the present invention, it should be understood that the present invention is not limited to described herein
Form, the exclusion to other embodiment is not to be taken as, and can be used for various other combinations, modification and environment, and can be at this
In the text contemplated scope, it is modified by the technology or knowledge of above-mentioned teaching or association area.And those skilled in the art are entered
Capable change and change does not depart from the spirit and scope of the present invention, then all should be in the protection domain of appended claims of the present invention
It is interior.
Claims (1)
1. the preparation method of high multistage HDI printed circuit board (PCB)s, it is characterised in that：It comprises the following steps：
S1, the circuit substrate from copper material（1）, the copper foil that a layer thickness is 0.5 ~ 1mm is pressed on the surface of circuit substrate
（2）；
S2, line layer making, copper foil（2）Surface carries out ultrasonic wave cleaning；It is put into after ultrasonic wave cleaning in acid deoiling liquid
2min ~ 6min, remove copper foil（2）On grease pollution and oxide layer；Drying and processing ensures that copper foil surface is bright and clean after cleaning；By copper
Paper tinsel（2）Sequentially pass through etching, exposure, leveling handle to obtain required line layer（3）, realize the making of line layer；
S3, lower fin is made, take one piece and circuit substrate（1）The one side glue A of formed objects（4）, one side glue A will be located at
（4）The cover layer at top is torn and exposes adhesive layer, and groove is opened up at the top of adhesive layer（5）, in groove（5）Interior fixed installation
Several radiation tooths（6）, radiation tooth（6）Top it is concordant with gluing layer height, it is achieved thereby that the making of lower fin；
Fin on S4, making, take one piece and circuit substrate（1）The one side glue B of formed objects（7）, in one side glue B（7）'s
Inside open up serpentine channel（8）, in serpentine channel（8）Import and export clog plug（9）, cooling oil is closed in two and block up
Head（9）Between, it is achieved thereby that the making of upper fin；
S5, in step S3 the adhesive layer of fin will be played to be attached to circuit substrate（1）Basal surface, and ensure each radiation tooth（6）
Top surface and circuit substrate（1）Contact；The adhesive layer of fin will be gone up in step S4 down and be adhered to line layer（3）Top
Portion；
S6, high multistage HDI printed circuit board (PCB)s making, apply 30 ~ 40N pressure to upper fin top surface by forcing press,
Pressure is applied to the basal surface of lower fin with the pressure of formed objects simultaneously, to ensure that two layers of adhesive layer is heat sealing at circuit substrate
（1）On, it is achieved thereby that the making of high multistage HDI printed circuit board (PCB)s.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710854991.3A CN107613653A (en) | 2017-09-20 | 2017-09-20 | The preparation method of high multistage HDI printed circuit board (PCB)s |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710854991.3A CN107613653A (en) | 2017-09-20 | 2017-09-20 | The preparation method of high multistage HDI printed circuit board (PCB)s |
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| Publication Number | Publication Date |
|---|---|
| CN107613653A true CN107613653A (en) | 2018-01-19 |
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|---|---|---|---|
| CN201710854991.3A Pending CN107613653A (en) | 2017-09-20 | 2017-09-20 | The preparation method of high multistage HDI printed circuit board (PCB)s |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109526157A (en) * | 2018-11-30 | 2019-03-26 | 四川海英电子科技有限公司 | A kind of high-frequency high-speed high density circuit board manufacturing process |
| CN111683475A (en) * | 2020-06-29 | 2020-09-18 | 四川海英电子科技有限公司 | Production method of composite high-frequency circuit board |
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| EP1047294A1 (en) * | 1999-04-23 | 2000-10-25 | The Swatch Group Management Services AG | Insulated metallic substrate for printed circuit boards |
| US20060113063A1 (en) * | 2004-10-15 | 2006-06-01 | Lalit Chordia | Thin-plate microchannel structure |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109526157A (en) * | 2018-11-30 | 2019-03-26 | 四川海英电子科技有限公司 | A kind of high-frequency high-speed high density circuit board manufacturing process |
| CN111683475A (en) * | 2020-06-29 | 2020-09-18 | 四川海英电子科技有限公司 | Production method of composite high-frequency circuit board |
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Application publication date: 20180119 |