CN206775824U - Thermoelectricity separates metal substrate - Google Patents
Thermoelectricity separates metal substrate Download PDFInfo
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- CN206775824U CN206775824U CN201720586821.7U CN201720586821U CN206775824U CN 206775824 U CN206775824 U CN 206775824U CN 201720586821 U CN201720586821 U CN 201720586821U CN 206775824 U CN206775824 U CN 206775824U
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- metal substrate
- insulating barrier
- thermoelectricity
- based layer
- boss
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Abstract
It the utility model is related to a kind of thermoelectricity separation metal substrate; wherein described metal substrate includes metal-based layer, insulating barrier and circuit layer successively from bottom to up; the upper surface of described metal-based layer has boss; the lower surface of described metal-based layer is provided with Protection glue band and remaining surface is provided with copper coating, and described insulating barrier and circuit layer are set gradually on the copper coating of the upper surface of the non-boss of described metal-based layer.The thermoelectricity separation metal substrate in the utility model is employed, the thermoelectricity that can be processed by technique separates aluminium base, and heat directly can be conducted by radiating area caused by device, and heat transfer efficiency is greatly improved.
Description
Technical field
It the utility model is related to field of circuit boards, more particularly to metal substrate technical field, in particular to a kind of thermoelectricity point
From metal substrate.
Background technology
Existing metal substrate is made up of three-decker, is circuit layer, thermally conductive insulating layer, metal-based layer respectively.Work is former
Reason is：Power device surface mount is in circuit layer, and heat is transmitted to metal-based layer, Ran Houyou by insulating barrier caused by device
Metal-based layer is diffused into module-external, realizes radiating.Non-metallic insulation layer thermal conductivity factor is mostly in 1-10W/ in the market
M.K, the thermal conductivity factor of copper is 398W/M.K, and the thermal conductivity factor of aluminium is 237W/M.K, so insulating barrier turns into whole sinking path
Bottleneck layer.In order to solve this problem, occurs thermoelectricity separation metal substrate again, this patent provides a kind of gold of thermoelectricity separation
Belong to substrate.
Utility model content
The purpose of this utility model is the shortcomings that overcoming above-mentioned prior art, there is provided a kind of by heat caused by device
The thermoelectricity separation metal substrate of heat transfer efficiency is directly conducted, greatly improved by radiating area.
To achieve these goals, thermoelectricity separation metal substrate of the present utility model has following form：
Described metal substrate includes metal-based layer, insulating barrier and circuit layer, described metal-based layer successively from bottom to up
Upper surface there is boss, the lower surface of described metal-based layer is provided with Protection glue band and remaining surface is provided with copper coating,
Described insulating barrier and circuit layer are set gradually on the copper coating of the upper surface of the non-boss of described metal-based layer.
It is preferred that described boss is located at the middle section of described metal-based layer upper surface.
It is preferred that described metal substrate is aluminium base.
It is preferred that described insulating barrier is not flow prepreg insulating barrier.
It is preferred that described boss is equal to described insulating barrier and circuit layer relative to the height of metal-based layer upper surface
Thickness.
It is preferred that described metal substrate and boss are integral type structure.
The thermoelectricity separation metal substrate in the utility model is employed, the thermoelectricity that can be processed by technique separates aluminium base
Plate, heat directly can be conducted by radiating area caused by device, and heat transfer efficiency is greatly improved.
Brief description of the drawings
Fig. 1 is the structural representation that thermoelectricity of the present utility model separates metal substrate.
Reference：
1 metal-based layer
2 Protection glue bands
3 copper coatings
4 insulating barriers
5 circuit layers
6 boss
Embodiment
In order to more clearly describe technology contents of the present utility model, enter traveling one with reference to specific embodiment
The description of step.
In order to solve the above technical problems, thermoelectricity separation metal substrate of the present utility model adopts the following technical scheme that：
A kind of thermoelectricity separation metal substrate as shown in Figure 1, described metal substrate include Metal Substrate successively from bottom to up
Layer 1, insulating barrier 4 and circuit layer 5, the upper surface of described metal-based layer have boss 6, the lower surface of described metal-based layer 1
Be provided with Protection glue band 2 and remaining surface be provided with copper coating 3, the copper coating of the upper surface of the non-boss of described metal-based layer it
On set gradually described insulating barrier 4 and circuit layer 5.
In a kind of embodiment provided by the utility model, described boss is located in described metal-based layer upper surface
Entreat region.
In a kind of embodiment provided by the utility model, described metal substrate is aluminium base.
In a kind of embodiment provided by the utility model, described insulating barrier is not flow prepreg insulating barrier.
In a kind of embodiment provided by the utility model, described boss is relative to height of metal-based layer upper surface etc.
In the thickness of described insulating barrier and circuit layer.
In a kind of embodiment provided by the utility model, described metal substrate and boss are integral type structure.
The forming process of thermoelectricity separation metal substrate of the present utility model includes：Aluminum base layer one side is pasted into Protection glue band；It is logical
Cross circuit board technique and form the flows such as anti-etching printing ink, exposure imaging etching, radiating area is formed projection, height of projection is equal to exhausted
The thickness of edge layer and circuit layer；By soaking zinc and copper plating process last layer copper coating is electroplated in aluminium surface；Circuit layer (copper
Paper tinsel) and insulating barrier (not flow prepreg) stack；Window is outputed in circuit layer and insulating barrier radiating area, mould can be used
Punching or numerical control processing and forming mode open a window；Heat dissipating layer (copper facing aluminium base) and circuit layer (copper foil), insulating barrier (not gummosis ring
Oxygen prepreg) pressed to together by way of hot pressing；Circuit sandwich circuit is produced by wiring board work flow, you can is formed
Thermoelectricity provided by the utility model separates metal substrate.
The thermoelectricity separation metal substrate in the utility model is employed, thermoelectricity can be processed by above-mentioned technique and separate aluminium base
Plate, heat directly can be conducted by radiating area caused by device, and heat transfer efficiency is greatly improved.
In this description, the utility model is described with reference to its specific embodiment.But it is clear that still can be with
Various modification can be adapted and conversion is without departing from spirit and scope of the present utility model.Therefore, specification and drawings are considered as
It is illustrative and not restrictive.
Claims (6)
1. a kind of thermoelectricity separates metal substrate, it is characterised in that described metal substrate include successively from bottom to up metal-based layer,
Insulating barrier and circuit layer, the upper surface of described metal-based layer have boss, and the lower surface of described metal-based layer is provided with guarantor
Retaining tape and remaining surface are provided with copper coating, are set gradually on the copper coating of the upper surface of the non-boss of described metal-based layer
Described insulating barrier and circuit layer.
2. thermoelectricity according to claim 1 separates metal substrate, it is characterised in that described boss is located at described metal
The middle section of basic unit upper surface.
3. thermoelectricity according to claim 1 separates metal substrate, it is characterised in that described metal substrate is aluminium base.
4. thermoelectricity according to claim 1 separates metal substrate, it is characterised in that described insulating barrier is solid for not gummosis half
Change piece insulating barrier.
5. thermoelectricity according to claim 1 separates metal substrate, it is characterised in that described boss is relative to metal-based layer
The height of upper surface is equal to the thickness of described insulating barrier and circuit layer.
6. thermoelectricity according to claim 1 separates metal substrate, it is characterised in that described metal substrate and boss are one
Body formula structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720586821.7U CN206775824U (en) | 2017-05-24 | 2017-05-24 | Thermoelectricity separates metal substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720586821.7U CN206775824U (en) | 2017-05-24 | 2017-05-24 | Thermoelectricity separates metal substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206775824U true CN206775824U (en) | 2017-12-19 |
Family
ID=60639507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720586821.7U Active CN206775824U (en) | 2017-05-24 | 2017-05-24 | Thermoelectricity separates metal substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206775824U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107949160A (en) * | 2017-12-22 | 2018-04-20 | 珠海市航达科技有限公司 | A kind of hanging printed circuit board of the separated high heat conduction of thermoelectricity and its production method |
| CN108901121A (en) * | 2018-07-17 | 2018-11-27 | 景旺电子科技(龙川)有限公司 | A kind of wiring board and preparation method thereof |
-
2017
- 2017-05-24 CN CN201720586821.7U patent/CN206775824U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107949160A (en) * | 2017-12-22 | 2018-04-20 | 珠海市航达科技有限公司 | A kind of hanging printed circuit board of the separated high heat conduction of thermoelectricity and its production method |
| CN108901121A (en) * | 2018-07-17 | 2018-11-27 | 景旺电子科技(龙川)有限公司 | A kind of wiring board and preparation method thereof |
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