CN206674296U - A kind of high heat conduction heat radiating type bilateral structure FPC aluminium bases - Google Patents
A kind of high heat conduction heat radiating type bilateral structure FPC aluminium bases Download PDFInfo
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- CN206674296U CN206674296U CN201720276950.6U CN201720276950U CN206674296U CN 206674296 U CN206674296 U CN 206674296U CN 201720276950 U CN201720276950 U CN 201720276950U CN 206674296 U CN206674296 U CN 206674296U
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Abstract
The utility model provides a kind of high heat conduction heat radiating type bilateral structure FPC aluminium bases, it is characterised in that：Including heat dissipating layer overlapping successively, the first heat conductive insulating glue-line, the first copper foil layer, the second heat conductive insulating glue-line, the second copper foil layer, the second heat conductive insulating glue-line and second copper foil layer are drilled with blind hole, and filling copper in the blind hole forms copper electroplating layer.The beneficial effects of the utility model are：The utility model solves one side harden structure high heat conduction heat radiating type aluminium base raw material, is only used for producing the fairly simple wiring board of circuit, for there is the problem of wiring board of complicated circuit does not reach requirement then.The wiring board of more complicated circuit can be designed, produced in the case where not increasing the appearance and size of product so that substrate material can meet the design requirement of more products.
Description
Technical field
It the utility model is related to FPC technical fields, more particularly to a kind of high heat conduction heat radiating type bilateral structure FPC aluminium bases.
Background technology
The high heat conduction heat radiating type raw material that industry FPC can be bought at present only have single sided board structure aluminium base, its structure such as Fig. 1
It is shown；It only has one side copper foil, is only used for design and produces simple FPC wiring boards.Technological process is usually：Purchase aluminium base
Material → blanking → patch dry film → exposure → development → etches → moved back film → cleaning → pasting protective film → lamination → change gold → lettering
Symbol → electrical measurement → punching external form → packaging → shipment.So because product material is aluminium base, high heat conduction heat radiating type can be produced
Wiring board, such as the heat radiating type wiring board for automobile LED car light.
But it is fairly simple to be only used for production circuit because only that one side copper foil for such a single sided board structure aluminum substrate raw materials
Wiring board, do not reach requirement then for the wiring board for having complicated circuit.
Utility model content
The utility model provides a kind of high heat conduction heat radiating type bilateral structure FPC aluminium bases, including radiating overlapping successively
Layer, the first heat conductive insulating glue-line, the first copper foil layer, the second heat conductive insulating glue-line, the second copper foil layer, second thermal conductive insulation glue
Layer and second copper foil layer are drilled with blind hole, and filling copper in the blind hole forms copper electroplating layer.
As further improvement of the utility model, the heat dissipating layer forms radiating aluminium lamination using aluminum.
The beneficial effects of the utility model are：The utility model solves one side harden structure high heat conduction heat radiating type aluminium base original
Material, it is only used for producing the fairly simple wiring board of circuit, does not reach requirement then for the wiring board for having complicated circuit
The problem of.The wiring board of more complicated circuit can be designed, produced in the case where not increasing the appearance and size of product so that base material
Material can meet the design requirement of more products.
Brief description of the drawings
Fig. 1 is the structural representation of existing high heat conduction heat radiating type single sided board structure aluminium base.
Fig. 2 is the material structure schematic diagram after the utility model improves.
Fig. 3 is the product schematic configuration diagram that the material after the utility model improves is produced by blind hole filling perforation electro-coppering.
Embodiment
As Figure 2-3, the utility model discloses a kind of high heat conduction heat radiating type bilateral structure FPC aluminium bases, including according to
Secondary overlapping heat dissipating layer, the first heat conductive insulating glue-line 2, the first copper foil layer 3, the second heat conductive insulating glue-line 4, the second copper foil layer 5, institute
State the second heat conductive insulating glue-line 4 and second copper foil layer 5 is drilled with blind hole 6, filling copper in the blind hole 6 forms copper electroplating layer 7.
The heat dissipating layer forms radiating aluminium lamination 1 using aluminum.
The utility model forms a kind of new double-side material structure by adding layer to increase by one layer of copper foil, and the structural material solves
Existing single sided board structure aluminum substrate raw materials are only used for producing the problem of circuit fairly simple wiring board.Given birth to by blind hole
Production. art can make the complicated circuit wiring board of double-side conduction circuit.And by blind hole process for filling hole, the copper post after filling perforation is led
Heat, product can be also set to reach heat transfer, the requirement of rapid heat dissipation.
The specific technological process of the utility model is：After single sided board structure aluminium base base material blanking → patch dry film → exposure →
Etching（Etch inner line figure）The pure glue of → patch heat conduction → folded outer layer pure copper foil（One layer of pure copper foil is pasted on the pure glue of heat conduction）
→ lamination → laser drilling blind hole → heavy copper → copper facing（With plating process for filling hole）Dry film → exposure → development → the etching of → patch（Etch
Outer-layer circuit, pad）→ lamination（Folded diaphragm）→ lamination → surface treatment → lettering symbol → electrical measurement → punching external form → inspection
→ shipment.One layer of copper foil is so added on the basis of original individual layer copper foil, by the copper post conduction after blind hole filling perforation, is led
Heat, it becomes possible to the wiring board of more complicated circuit is designed, produced in the case where not increasing the appearance and size of product so that base material
Material can meet the design requirement of more products.
The beneficial effects of the utility model are：Solve one side harden structure high heat conduction heat radiating type aluminium base raw material, can only
The wiring board fairly simple for producing circuit, for there is the problem of wiring board of complicated circuit does not reach requirement then.
The wiring board of more complicated circuit can be designed, produced in the case of not increasing the appearance and size of product so that substrate material can expire
The design requirement of sufficient more products.
Above content is to combine specific preferred embodiment further detailed description of the utility model, it is impossible to
Assert that specific implementation of the present utility model is confined to these explanations.For the ordinary skill of the utility model art
For personnel, without departing from the concept of the premise utility, some simple deduction or replace can also be made, should all be regarded
To belong to the scope of protection of the utility model.
Claims (2)
- A kind of 1. high heat conduction heat radiating type bilateral structure FPC aluminium bases, it is characterised in that：Including heat dissipating layer overlapping successively, first Heat conductive insulating glue-line, the first copper foil layer, the second heat conductive insulating glue-line, the second copper foil layer, the second heat conductive insulating glue-line and institute State the second copper foil layer and be drilled with blind hole, filling copper in the blind hole forms copper electroplating layer.
- 2. high heat conduction heat radiating type bilateral structure FPC aluminium bases according to claim 1, it is characterised in that：The heat dissipating layer Radiating aluminium lamination is formed using aluminum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720276950.6U CN206674296U (en) | 2017-03-21 | 2017-03-21 | A kind of high heat conduction heat radiating type bilateral structure FPC aluminium bases |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720276950.6U CN206674296U (en) | 2017-03-21 | 2017-03-21 | A kind of high heat conduction heat radiating type bilateral structure FPC aluminium bases |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206674296U true CN206674296U (en) | 2017-11-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720276950.6U Active CN206674296U (en) | 2017-03-21 | 2017-03-21 | A kind of high heat conduction heat radiating type bilateral structure FPC aluminium bases |
Country Status (1)
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| CN (1) | CN206674296U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107846775A (en) * | 2017-12-22 | 2018-03-27 | 珠海市航达科技有限公司 | A kind of hanging printed circuit board of high heat conduction and its production method |
-
2017
- 2017-03-21 CN CN201720276950.6U patent/CN206674296U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107846775A (en) * | 2017-12-22 | 2018-03-27 | 珠海市航达科技有限公司 | A kind of hanging printed circuit board of high heat conduction and its production method |
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