CN201854501U - Circuit board - Google Patents
Circuit board Download PDFInfo
- Publication number
- CN201854501U CN201854501U CN201020625832XU CN201020625832U CN201854501U CN 201854501 U CN201854501 U CN 201854501U CN 201020625832X U CN201020625832X U CN 201020625832XU CN 201020625832 U CN201020625832 U CN 201020625832U CN 201854501 U CN201854501 U CN 201854501U
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- China
- Prior art keywords
- wiring board
- metal
- base material
- flexible parent
- parent metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Insulated Metal Substrates For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The utility model provides a circuit board which is characterized by comprising substrates that are sequentially superposed and jointed with one another from bottom to top and flexible substrates that are provided with metal foils on the surfaces. The flexible substrates that are provided with the metal foils on the surfaces are provided with required circuits after die-cutting process, therefore, by adopting the circuit board, the technical problems existing in the production process of normal circuit boards, such as easily generated environment pollution, dangerous operation and high cost, can be solved.
Description
Technical field
The utility model belongs to the circuit board technology field, relates to the wiring board that a kind of cross cutting processing obtains specifically.
Background technology
At present, miniaturization of electronic products, the development trend of high speed is promoting the electronic circuit board industry and is entering a new developing period, and in the manufacturing process of wiring board, normally by the Copper Foil process pressing that is pressed on the base material, exposure, develop, a plurality of steps such as etching form the conducting wire, and then formation wiring board, the appearance of flexible circuit board, the sector has been played more revolutionary progradation, but flexible circuit board is also mostly to be the conducting wires of adopting flexible insulating substrate to finish by above-mentioned making step, though this type of wiring board have a lot of rigid wiring boards the advantage part that can't accomplish, as flexible, reel, fold etc., can require to arrange arbitrarily according to space layout, the degree of freedom is very strong, be highly suitable for electronic product to high density, miniaturization, the direction of high reliability develops, and flexible circuit board is in space flight, military, be used widely in fields such as mobile electronic device.But, using above-mentioned manufacture method needs to handle by the chemical corrosion solvent in process of production, be easy to generate environmental pollution and operational hazards, and because loaded down with trivial details, the equipment complex and expensive of production link, the cost of raw material are higher, directly cause product cost to raise, reduce market competition advantage.Therefore, be necessary to provide a kind of manufacture method of wiring board,, improve the inter-industry competition advantage in order to reduce pollution and the cost of manufacture of bringing in the prior art dangerous and the reduction wiring board.
The utility model content
The utility model purpose is to provide a kind of wiring board, solves present conventional line plate cost technical problems of high by adopting this wiring board.
For solving the problems of the technologies described above, the technical solution of the utility model is: a kind of wiring board is provided, comprise the base material that superposes successively and be engaged in one, the flexible parent metal that the surface has metal forming from bottom to top, described surface has the flexible parent metal of metal forming for forming the flexible parent metal with required circuit through cross cutting processing back.
By technique scheme, described wiring board is put together by double-layer structure, compared to existing technology in, have advantage with low cost by on one deck medium, carrying out the wiring board that etched technology gets.
Further, engage by hot melt glue or hot melt adhesive film between the one side of described flexible parent metal metal-foil-free and the base material.
Further, the described wiring board metal foil surface that forms required circuit is covered with dielectric film.
Perhaps further, engage by hot melt glue or hot melt adhesive film between the one side of described flexible parent metal with metal forming and the base material.
Further, engage by being laminated with glue between described metal forming and the flexible parent metal.
Particularly, described base material is flexible insulation base material or rigid insulation base material, and described metal forming is goldleaf or silver foil or Copper Foil or aluminium foil.
More specifically, it is characterized in that: described flexible insulation base material adopts PETG or polyimide film.
Particularly, described flexible parent metal adopts PETG or polyimide film.
The wiring board that the utility model provides, by adopting base material stacked with the flexible parent metal of utilization cutting die, because the flexible material surface is covered with the layer of metal paper tinsel, can have conductivity, the flexible material that is cut, by peeling off required circuit flexible material in addition, form required wiring board, above-mentioned wiring board assembly has been abandoned the base material that utilizes the corrosive goods confrontation to have metal forming in the traditional handicraft and has been carried out etched chemical method, avoided producing the poisonous and harmful substances that produces owing to chemical reaction, has good environment protecting, also reduced operating personnel's danger, simultaneously, the wiring board that utilizes the mode of cross cutting to obtain, the production equipment cost, material cost all significantly reduces, and has fully improved the market competitiveness.
Description of drawings
Fig. 1 is the wiring board view sub-anatomy that the utility model embodiment provides;
Fig. 2 is the wiring board part view sub-anatomy that the utility model embodiment one provides;
Fig. 3 is the wiring board phantom that the utility model embodiment two provides;
Fig. 4 is the preceding assembled sectional view of wiring board cross cutting that the utility model embodiment provides;
Fig. 5 is the wiring board cross cutting step cutaway view that the utility model embodiment provides;
Fig. 6 is a cutaway view after wiring board cross cutting step that the utility model embodiment provides is finished;
Fig. 7 is that wiring board that the utility model embodiment provides is peeled off cutaway view behind the waste material;
Fig. 8 is the wiring board heat-press step cutaway view that the utility model embodiment provides;
Fig. 9 is the wiring board part view sub-anatomy that the utility model embodiment three provides;
Figure 10 is the preceding assembled sectional view of wiring board cross cutting that the utility model embodiment three provides;
Figure 11 is the wiring board cross cutting step cutaway view that the utility model embodiment three provides;
Figure 12 is a cutaway view after wiring board cross cutting step that the utility model embodiment three provides is finished;
Figure 13 is that wiring board that the utility model embodiment three provides is peeled off cutaway view behind the waste material;
Figure 14 is the wiring board heat-press step cutaway view that the utility model embodiment three provides;
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer,, the utility model is further elaborated below in conjunction with drawings and Examples.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
The technical solution of the utility model is: a kind of wiring board is provided, comprise the base material that superposes successively and be engaged in one, the flexible parent metal that the surface has metal forming from bottom to top, described surface has the flexible parent metal of metal forming for forming the flexible parent metal with required circuit through cross cutting processing back.
By technique scheme, described wiring board is put together by double-layer structure, compared to existing technology in, have advantage with low cost by on one deck medium, carrying out the wiring board that etched technology gets.
With the technique scheme is that following examples are enumerated on the basis:
Embodiment one
With reference to Fig. 1, Fig. 2, Fig. 4 to Fig. 8, the utility model embodiment one provides a kind of wiring board, have and be followed successively by base material 3 from bottom to top, glue 2, flexible parent metal 13 is laminated with glue 12, the structure of metal forming 11 and dielectric film 9, the wiring board that full physics mode is handled gained has better environmental protection characteristic, has reduced cost.Make the method for above-mentioned wiring board, comprise following processing step:
The flexible insulation base material 3 that preparation one adopts PETG or polyimide film to make; To adopt the glue 2 of hot melt glue or hot melt adhesive film to be applied to described base material 3 surfaces, the flexible parent metal 13 that a surface is had a metal forming 11 places on described base material 3 surfaces and by above-mentioned glue 2 and engages with it; Above-mentioned flexible parent metal 13 adopts PETG or polyimide film to make, and the metal forming 11 that described flexible parent metal 13 surfaces are had is attached to described flexible parent metal 13 surfaces by being laminated with glue 12.
To lower die cut, tangent line 5 connects to have the flexible parent metal 13 of metal forming 11 and forms required circuit 6 by described flexible parent metal 13 surfaces with metal forming 11 for preparation cutting die 4, utilization cutting die 4;
Peel off required circuit 6 residual metallic paper tinsel and flexible parent metal waste material 7 in addition; After pressing has the flexible parent metal 13 and base material 3 of metal forming 11, after dielectric film 9 is covered on metal forming 11 surfaces that form required circuit 6, add hot pressing and form required wiring board by heating board 8, above-mentioned metal forming 11 is goldleaf or silver foil or Copper Foil or aluminium foil, adopt above-mentioned manufacture method assembly to abandon the base material that utilizes the corrosive goods confrontation to have metal forming in the traditional handicraft and carry out etched chemical method, avoided producing the poisonous and harmful substances that produces owing to chemical reaction, has good environment protecting, also reduced operating personnel's danger, simultaneously, the wiring board that utilizes the mode of cross cutting to obtain, the production equipment cost, material cost all significantly reduces, and has fully improved the market competitiveness.
Embodiment two,
With reference to Fig. 1, Fig. 3, Fig. 4 to Fig. 8, the utility model embodiment two provides a kind of wiring board, have and be followed successively by base material 3 from bottom to top, glue 2, flexible parent metal 13 is laminated with glue 12, the structure of metal forming 11 and dielectric film 9, the wiring board that full physics mode is handled gained has better environmental protection characteristic, has reduced cost.Make the method for above-mentioned wiring board, comprise following processing step:
The flexible insulation base material 3 that preparation one adopts PETG or polyimide film to make; Prepare the flexible parent metal 13 that a surface has metal forming 11, the glue 2 that adopts hot melt glue or hot melt adhesive film is applied to the one side of described flexible parent metal 13 metal-foil-frees 11, described flexible parent metal 13 is invested on the flexible insulation base material 3 and by above-mentioned glue 2 engages with described flexible insulation base material 3; Above-mentioned flexible parent metal 13 adopts PETG or polyimide film to make, and the metal forming 11 that described flexible parent metal 13 surfaces are had is attached to described flexible parent metal 13 surfaces by being laminated with glue 12.
To lower die cut, tangent line 5 connects to have the flexible parent metal 13 of metal forming 11 and forms required circuit 6 by described flexible parent metal 13 surfaces with metal forming 11 for preparation cutting die 4, utilization cutting die 4;
Peel off required circuit 6 residual metallic paper tinsel and flexible parent metal waste material 7 in addition;
After pressing has the flexible parent metal 13 and base material 3 of metal forming 11, after dielectric film 9 is covered on metal forming 11 surfaces that form required circuit 6, add hot pressing and form required wiring board by heating board 8, above-mentioned metal forming 11 is goldleaf or silver foil or Copper Foil or aluminium foil, adopt above-mentioned manufacture method assembly to abandon the base material that utilizes the corrosive goods confrontation to have metal forming in the traditional handicraft and carry out etched chemical method, avoided producing the poisonous and harmful substances that produces owing to chemical reaction, has good environment protecting, also reduced operating personnel's danger, simultaneously, the wiring board that utilizes the mode of cross cutting to obtain, the production equipment cost, material cost all significantly reduces, fully improved the market competitiveness, the main distinction that present embodiment is compared embodiment one is that glue 2 is applied to the one side of described flexible parent metal 13 metal-foil-frees 11, under the bigger situation of flexible insulation base material 3 areas, can multi-disc flexible parent metal 13 be engaged with flexible insulation base material 3 by glue 2, can not cause part that flexible parent metal 13 is not covered in generation to leave the situation of glue, be fit to the situation of flexible parent metal 13 areas less than flexible insulation base material 3.
Embodiment three,
With reference to Fig. 9, Figure 10, Fig. 5 to Fig. 8, the utility model embodiment three provides a kind of wiring board, have and be followed successively by base material 3 from bottom to top, glue 2, metal forming 11, be laminated with the structure of glue 12, flexible parent metal 13, save the wiring board that dielectric film 9 and full physics mode handle gained with respect to embodiment one and embodiment two and had better environmental protection characteristic, reduced cost.Make the method for above-mentioned wiring board, comprise following processing step:
The flexible insulation base material 3 that preparation one adopts PETG or polyimide film to make; Prepare the flexible parent metal 13 that a surface has metal forming 11, engage with described flexible insulation base material 3 adopting the glue 2 of hot melt glue or hot melt adhesive film to be applied to the one side that described flexible parent metal 13 has metal forming 11, described flexible parent metal 13 being invested on the flexible insulation base material 3 and by above-mentioned glue 2; Above-mentioned flexible parent metal 13 adopts PETG or polyimide film to make, and the metal forming 11 that described flexible parent metal surface is had is attached to described flexible parent metal 13 surfaces by being laminated with glue 12.
To lower die cut, tangent line 5 connects to have the flexible parent metal 13 of metal forming 11 and forms required circuit 6 by described flexible parent metal 13 surfaces with metal forming 11 for preparation cutting die 4, utilization cutting die 4;
Peel off required circuit 6 residual metallic paper tinsel and flexible parent metal waste material 7 in addition;
After adding flexible parent metal 13 that hot pressing has a metal forming 11 and flexible insulation base material 3 by heating board 8, form required circuit 6, above-mentioned metal forming 11 is goldleaf or silver foil or Copper Foil or aluminium foil, adopt above-mentioned manufacture method assembly to abandon the base material that utilizes the corrosive goods confrontation to have metal forming in the traditional handicraft and carry out etched chemical method, avoided producing the poisonous and harmful substances that produces owing to chemical reaction, has good environment protecting, also reduced operating personnel's danger, simultaneously, the wiring board that utilizes the mode of cross cutting to obtain, the production equipment cost, material cost all significantly reduces, fully improved the market competitiveness, the main distinction that present embodiment is compared embodiment one and embodiment two is, the surface that described flexible parent metal 13 has metal forming 11 engages with described flexible insulation base material 3, metal forming 11 is sealed between flexible parent metal 13 and the flexible insulation base material 3, because above-mentioned flexible parent metal 13 adopts PETG or polyimide film to make, itself has insulating properties, reduced the job step of covering dielectric film 9, further simplified operation and reduced cost.
The above only is preferred embodiment of the present utility model; not in order to restriction the utility model; all any modifications of within spirit of the present utility model and principle, being done, be equal to and replace and improvement etc., all should be included within the protection range of the present utility model.
Claims (8)
1. wiring board, it is characterized in that: comprise the base material that superposes successively and be engaged in one, the flexible parent metal that the surface has metal forming from bottom to top, described surface has the flexible parent metal of metal forming for forming the flexible parent metal with required circuit through cross cutting processing back.
2. wiring board as claimed in claim 1 is characterized in that: engage by hot melt glue or hot melt adhesive film between the one side of described flexible parent metal metal-foil-free and the base material.
3. wiring board as claimed in claim 2 is characterized in that: the metal foil surface that described wiring board forms required circuit is covered with dielectric film.
4. wiring board as claimed in claim 1 is characterized in that: engage by hot melt glue or hot melt adhesive film between the one side that described flexible parent metal has a metal forming and the base material.
5. as each described wiring board of claim 1 to 4, it is characterized in that: engage by being laminated with glue between described metal forming and the flexible parent metal.
6. as each described wiring board of claim 1 to 4, it is characterized in that: described base material is flexible insulation base material or rigid insulation base material, and described metal forming is goldleaf or silver foil or Copper Foil or aluminium foil.
7. wiring board as claimed in claim 6 is characterized in that: described flexible insulation base material adopts PETG or polyimide film.
8. as each described wiring board of claim 1 to 4, it is characterized in that: described flexible parent metal adopts PETG or polyimide film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020625832XU CN201854501U (en) | 2010-11-23 | 2010-11-23 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020625832XU CN201854501U (en) | 2010-11-23 | 2010-11-23 | Circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201854501U true CN201854501U (en) | 2011-06-01 |
Family
ID=44096878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201020625832XU Expired - Fee Related CN201854501U (en) | 2010-11-23 | 2010-11-23 | Circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201854501U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102630119A (en) * | 2011-06-03 | 2012-08-08 | 田茂福 | LED circuit board and manufacturing method thereof |
| WO2013155693A1 (en) * | 2012-04-19 | 2013-10-24 | Zhang Yu | Circuit board |
| WO2015032102A1 (en) * | 2013-09-09 | 2015-03-12 | 富国工业(惠阳)有限公司 | Circuit board machining process |
-
2010
- 2010-11-23 CN CN201020625832XU patent/CN201854501U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102630119A (en) * | 2011-06-03 | 2012-08-08 | 田茂福 | LED circuit board and manufacturing method thereof |
| WO2013155693A1 (en) * | 2012-04-19 | 2013-10-24 | Zhang Yu | Circuit board |
| WO2015032102A1 (en) * | 2013-09-09 | 2015-03-12 | 富国工业(惠阳)有限公司 | Circuit board machining process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110601 Termination date: 20151123 |