CN102630119A - LED circuit board and manufacturing method thereof - Google Patents
LED circuit board and manufacturing method thereof Download PDFInfo
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- CN102630119A CN102630119A CN2011101499757A CN201110149975A CN102630119A CN 102630119 A CN102630119 A CN 102630119A CN 2011101499757 A CN2011101499757 A CN 2011101499757A CN 201110149975 A CN201110149975 A CN 201110149975A CN 102630119 A CN102630119 A CN 102630119A
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Abstract
The invention relates to an LED circuit board and a manufacturing method thereof. More particularly, provided in the invnetion is an LED circuit board, comprising: a circuit layer (8), which is directly formed by a single-layer metal material; and cover layers (5,5), which are respectively covered on the right side and the back side of the circuit layer. Besides, provided is a method for manufacturing the LED circuit board. The method comprises the following steps: providing a single-layer metal material; carrying out first-time punching or cutting on the single-layer metal material so as to form the circuit layer (8); attaching the back-side cover film (5) on the back side of the circuit layer (8) and carrying out stitching; carrying out punching or cutting on the circuit layer (8) for the second time to form a nascent circuit board (8); and attaching the right-side cover film (5) on the right side of the nascent circuit board (8) and carrying out stitching. According to the invention, a structure including a PI layer clamped between two layers of coppers in a current LED circuit board product is directly eliminated and a copper foil layer is used for replacement, thereby simplifying the manufacturing technology and the product structure, reducing cost, environmental pollution and energy consumption, improving reliability of the product and prolonging actual working life.
Description
Technical field
The present invention relates to the field of printed substrate, be specifically related to a kind of new LED wiring board and preparation method thereof.
Background technology
In the LED wiring board of prior art; For example as shown in Figure 1, the structure of its LED wiring board is that the centre is a layer insulating 6 (for example being processed by typical PI material); Two sides at insulating barrier is respectively equipped with (for example through bonding mode) line layer 3; 7 (for example being typical Copper Foil) are respectively equipped with the covering rete 5,5 (being typically CVL) that (mode of for example bonding, coating, coating or printing) plays protective action in the outside of this two-layer line layer.
The defective of the LED wiring board of this prior art is many-sided.
For example, copper foil layer 3,7 need be adhered on the insulating barrier 6 through for example adhesion technique, and sometimes need lay additional adhesive layer, and the complicacy of processing step will cause the cost of LED wiring board finished product to increase with additional jointing material;
The line construction of copper foil layer 3,7 will realize through etching mode, and the interlayer conduction of copper foil layer 3,7 needs the plating mode plated-through-hole to realize, therefore unavoidably can bring pollution to environment, and its energy consumption be also high;
Therefore, press for a kind of novel more simple LED wiring board in this area, with alleviate or even avoid above-mentioned defective, simplify manufacture craft and product structure, reduce cost, reduce environmental pollution and energy consumption, improve reliability of products and real work life-span.
Summary of the invention
In view of the above, the present invention has been proposed.The present invention is intended to solve above technical problem with other.
According to the present invention; The structure of folder PI layer between the two-layer copper in the LED wiring board product of prior art is directly dispensed; Be replaced with simple copper foil layer, therefore simplified manufacture craft and product structure, reduced cost; Reduce environmental pollution and energy consumption, improved reliability of products and real work life-span.
According to an aspect of the present invention, disclosed a kind of LED wiring board, having comprised: direct line layer by the single-layer metal material forming; Cover the coverlay on the obverse and reverse of said line layer respectively.
According to a preferred embodiment of the present invention, said line layer directly replaces the sandwich construction of existing LED board substrate.
According to another preferred embodiment of the invention, said metal material is a Copper Foil.
According to another preferred embodiment of the invention, said Copper Foil is the fine copper of T2 grade, or copper alloy.
According to another preferred embodiment of the invention, said line layer (8) is through line layer die-cut or the said single-layer metal material forming of etching.
According to another preferred embodiment of the invention, said LED wiring board is the single or multiple lift FPC.
According to another preferred embodiment of the invention, also comprise LED and the resistance that is installed on the said LED wiring board.
According to another preferred embodiment of the invention, the model of said LED comprises one or more in 335,3528,5050 and 5060, and the model of said resistance comprises one or more in 0603,0805 and 0812.
According to a further aspect in the invention, disclosed a kind of method of the LED of making wiring board, it is characterized in that, having comprised: the single-layer metal material is provided; Through said single-layer metal material being carried out the die-cut or cutting first time, and form line layer; Paste the reverse side coverlay and carry out pressing at the back side of said line layer; Said line layer is carried out the die-cut or cutting second time, form the blank wiring board; With stick the front coverlay in the front of said blank wiring board and carry out pressing.
According to another preferred embodiment of the invention, said single-layer metal material is a Copper Foil, and said method also comprises installation LED and resistance on said LED wiring board.
According to a further aspect in the invention, disclosed a kind of method of the LED of making wiring board, it is characterized in that, having comprised: the single-layer metal material is provided; Stick the reverse side coverlay at the back side of said single-layer metal material and carry out pressing; Said single-layer metal material is carried out etching, form line layer); Paste the front coverlay and carry out pressing in the front of said line layer; With paste the front coverlay in the front of said blank wiring board and carry out pressing.
According to another preferred embodiment of the invention, said single-layer metal material is a Copper Foil, and said method also comprises installation LED and resistance on said LED wiring board.
In following description, with the details of setting forth one or more embodiment of the present invention to accompanying drawing and embodiment.From these descriptions, accompanying drawing and claim, can know other features, objects and advantages of the present invention.
Description of drawings
Through combining following this specification of advantages, it is more obvious that characteristic of the present invention, purpose and advantage will become, in the accompanying drawings:
Fig. 1 is the partial section of the LED wiring board of prior art, has shown the structure of the LED wiring board of prior art; And
Fig. 2 has shown the New LED wiring board of one embodiment of the invention, has shown the structure of this LED wiring board.
Embodiment
Below will be to be applicable to that the double-sided flexible printed circuit board that LED and other element are installed is that specific embodiment comes the present invention is described in more detail.But, should be appreciated that the present invention is not only applicable to double-sided flexible printed circuit board, also be applicable to two-sided rigidity printed substrate (being also referred to as " hardboard " in the industry), and more than the multilayer LED wiring board of two-layer line layer.
In addition, term " double-sided flexible printed circuit board " refers on the two sides of this flexible print circuit board and all is provided with circuit.
Before describing the present invention in detail, it will be appreciated by those skilled in the art that " element " should do the understanding on the most wide in range connotation in this application; Promptly comprise all types of elements that are used for electronic component, electric component or other type of circuit; For example various resistance, the element of various surface mount (SMT) type, the element of support rack type, various high power devices or the like; Comprise great power LED, or the like.
In addition, term " wiring board " and " circuit board " can use in the application with exchanging.
Below in conjunction with accompanying drawing and embodiment the manufacturing process of LED wiring board of the present invention is done further to specify with structure.
The relevant material of LED wiring board
The raw material volume of traditional double-sided flexible printed circuit board is also referred to as the coiled material of copper-clad plate.As shown in Figure 1, Fig. 1 is the partial section of the LED wiring board of prior art, has shown the structure of the LED wiring board of prior art.In the structure of this LED wiring board, typical structure is five layers, promptly; (modal is to adopt Copper Foil to two- layer line layer 3,7, can be described as again in the present embodiment and covers copper layer or Copper Foil; These terms use sometimes interchangeably), and be bonded in the insulating barrier 6 between this two-layer line layer 3,7.Insulating barrier 6 has formed the basal layer of flexible circuit.The outside at this two- layer line layer 3,7 is respectively equipped with the covering rete 5,5 that (mode of for example bonding, coating, coating or printing) plays protective action, and this covering rete for example can be processed by CVL.
Certainly,, in fact, can be respectively equipped with adhesive layer usually with insulating barrier 6, be used for line layer and insulating barrier are glued together at two- layer line layer 3,7 although not shown in Fig. 1.Therefore, under a lot of situations, this LED wiring board structure of prior art is actually seven layers complicated structure.
The material of insulating barrier 6 has many kinds, and wherein the most commonly used is polytetrafluoroethylene, polyimides, polyester and PI (PI) material.Polyimide material has non-flammable, and physical dimension is stable, has advantages of higher tensile strength; And the ability with the welding temperature of bearing, polyester is also referred to as PETG (being called for short PET); Its physical property is similar to polyimides; Have lower dielectric constant, the humidity of absorption is very little, but non-refractory.Polyester demonstrates rigidity in cryogenic applications.These materials all can be used for forming insulating barrier.
In a preferred embodiment of the present invention, adopt PI (PI) material to make insulating barrier.Certainly, those skilled in the art obviously are appreciated that and can adopt any other material well known in the art to make insulating barrier.
Copper Foil generally is suitable among flexible circuit, being used as line layer 5, and it can adopt the mode of electro-deposition (ED), forging.Copper Foil is the material with compliance, can be made into many kinds of thickness and width.The Copper Foil of forging also has the level and smooth characteristics of hard except having pliability, it is suitable for being applied among the occasion that requires dynamic deflection.
According to one embodiment of the invention, adoptable aborning at present material is fine copper or copper alloy, zinc yellow copper for example, and the thickness of Copper Foil is more than the 10Z.If the employing fine copper, then the general requirement of fine copper is a T2 copper.The requirement of copper alloy is generally Tp2 or copper content more than 20%, and remaining composition can be zinc (Zn) or other trace additives.
The main design of LED wiring board product of the present invention and technology
As stated; The product of prior art is formed the structure that structure is five layers or seven layers: the centre is a layer insulating; The two sides is respectively line layer (also having the adhesive layer with the insulating barrier pressing in the seven-layer structure respectively), and the outside of this two-layer line layer is respectively equipped with coverlay (for example CVL).
According to the present invention, with the insulating barrier of prior art, the structure that accompanies one deck insulating barrier (for example PI) in the middle of the two-layer line layer directly is replaced with one deck line layer (for example Copper Foil).
The wiring of LED wiring board product and windowing
According to different application scenarios, come the wiring of deisgn product and pad to window, to satisfy the requirement of Different products and purposes.These all are the technological know-hows that those skilled in the art use always, give unnecessary details no longer one by one.
The technological process of the LED wiring board product of prior art
The manufacturing process of the LED lamp bar wiring board of prior art as shown in Figure 1 generally comprises main technological process and auxiliary process flow process.
Main flow: open material and (open base material; Base material is two-sided 10Z base material, the base material here refer to by the PI of 25 microns of two-layer 10Z Copper Foil, two-layer 25 microns glue and one decks totally 5 layers form)-boring (brill base material)-heavy copper-copper facing-exposure-development-etching-paste epiphragma (the obverse and reverse coverlay is attached on the wiring board after the etching simultaneously)-pressing-baking-silk-screen-electrical measurement-anti-oxidation-profile-FQC-packing-shipment.
Auxilliary flow process: open material (obverse and reverse coverlay)-boring (brill obverse and reverse coverlay)-change over to and paste the epiphragma operation.
Traditional LED lamp bar wiring board of prior art need be used aborning is that highly basic strong acid materials such as sulfuric acid, hydrochloric acid, nitric acid, NaOH, sodium carbonate are used for heavy copper and circuit etching, and this kind manufacturing process not only manufacturing cost is high but also can bring severe contamination to environment.
The typical process flow of LED wiring board product of the present invention
According to a preferred embodiment of the invention, the manufacture craft of LED wiring board for example as shown in Figure 2 of the present invention is following:
Main flow (a): (karat gold belongs to base material to open material; This base material for example is the pure copper foil 8 of the above thickness of 10Z; The above thickness Copper Foil 8 of the 10Z here is one deck fine copper)-die-cut 1 (copper foil base material 8 is carried out die-cut for the first time or cutting)-paste epiphragma (pasting Copper Foil 8 back sides of reverse side coverlay after die-cut)-die-cut for the second time or cutting (this time die-cut back circuit displays fully, forms blank wiring board 8)-paste epiphragma 5 (pasting on the wiring board 8 of front coverlay 5 after die-cut)-pressing-baking-silk-screen-electrical measurement-anti-oxidation-profile-FQC-packing-shipment.
Perhaps according to another preferred embodiment; Also can select main flow (b) for use: open material and (open base material; Base material for example is the above pure copper foil 8 of 10Z, and the Copper Foil of the above thickness of 10Z here 8 is one deck fine copper)-paste epiphragma 5 (pasting on the Copper Foil 8 of reverse side coverlay after opening material)-pressing-etching-subsides end face CVL-pressing-baking-silk-screen-electrical measurement-anti-oxidation-profile-FQC-packing-shipment.
Auxilliary flow process: open material (opening the obverse and reverse coverlay)-hole-change over to and paste the epiphragma operation.
Through with the technology of above prior art relatively, just can know that manufacture craft according to the present invention has been omitted many processing steps, much simple, therefore not only save time, save processing step and cost accordingly, and its reliability is also very high.In addition importantly, manufacture craft of the present invention no longer relates to operations such as heavy copper, copper facing, plating, exposure, development, even also can not adopt etch process, therefore very environmental protection.
Like this, just can obtain LED wiring board as shown in Figure 2 of the present invention.Fig. 2 has shown the New LED wiring board of one embodiment of the invention, has shown the structure of this LED wiring board, wherein; Compare with the wiring board shown in Figure 1 of prior art; Just can find out significantly that the present invention directly uses one deck Copper Foil 8 (line layer) to replace the structure that accompanies insulating barrier 6 between the two- layer line layer 3,7 of prior art; It not only shows the many above-mentioned superiority that is superior to prior art on manufacture craft; And the structure of itself is simpler, omitted an one deck Copper Foil and a layer insulating (also comprising two-layer adhesive layer in certain embodiments) and window, the technological requirement of bonding contraposition, saved material cost and technology cost; Therefore the cost of product is lower, and reliability is higher.
Width according to LED wiring board product of the present invention for example can reach more than 3 millimeters, for example the 3-20 millimeter.
According to a preferred embodiment of the invention, the connected length of LED wiring board product of the present invention can reach 5-100 rice.And the length of the attachable LED wiring board of the manufacture craft of prior art is merely 5 meters.
And this structure of the present invention and manufacture craft make the useful life can prolong the LED lamp that reliability is high, and thermal diffusivity is good, and this is that so conductivity and thermal diffusivity are better because the thickness of copper foil layer can be chosen to thicklyer.
In addition, connect and to window, also can not window according to the LED wiring board product of the present invention back side.This also is that the LED wiring board of prior art is not accomplished.
According to a preferred embodiment of the invention, according to the operating voltage of LED wiring board of the present invention product design applicable to 12V, 24V or other different direct current safety.
According to a preferred embodiment of the invention, the element that on LED wiring board product of the present invention, mounts or carry can comprise all kinds of LED and resistance, and preferred element can be:
The model of LED is following: 335,3528,5050,5060, or the like.
The model of resistance is following: 0603,0805,0812, or the like.
Obviously, this area designer is appreciated that fully that according to different application scenarios and customer requirement LED wiring board product of the present invention can comprise other various types of LED, resistance and other components and parts or the like.
Preceding text by the agency of specific embodiment of the present invention.Yet should be appreciated that under the premise without departing from the spirit and scope of the present invention, can carry out various modifications.Therefore, other embodiment also belongs to the protection range of claim of the present invention.
Claims (10)
1. a LED wiring board is characterized in that, comprising:
Direct line layer (8) by the single-layer metal material forming; With
Cover the coverlay (5,5) on the obverse and reverse of said line layer respectively.
2. LED wiring board according to claim 1 is characterized in that, said line layer (8) directly replaces the sandwich construction of existing LED board substrate.
3. LED wiring board according to claim 1 is characterized in that said metal material is a Copper Foil.
4. LED wiring board according to claim 3 is characterized in that, said Copper Foil is the fine copper of T2 grade, or copper alloy.
5. LED wiring board according to claim 1 is characterized in that, said line layer (8) is through line layer die-cut or the said single-layer metal material forming of etching.
6. LED wiring board according to claim 1; It is characterized in that; Also comprise the LED and the resistance that are installed on the said LED wiring board; The model of wherein said LED comprises one or more in 335,3528,5050 and 5060, and the model of said resistance comprises one or more in 0603,0805 and 0812.
7. a method of making the LED wiring board is characterized in that, comprising:
The single-layer metal material is provided;
Through said single-layer metal material being carried out the die-cut or cutting first time, and form line layer (8);
Paste reverse side coverlay (5) and carry out pressing at the back side of said line layer (8);
Said line layer (8) is carried out the die-cut or cutting second time, form blank wiring board (8); With
Stick front coverlay (5) in the front of said blank wiring board (8) and carry out pressing.
8. method according to claim 7 is characterized in that, said single-layer metal material is a Copper Foil, and said method also comprises, LED, resistance and/or relevant components and parts are installed on said LED wiring board.
9. a method of making the LED wiring board is characterized in that, comprising:
The single-layer metal material is provided;
Stick reverse side coverlay (5) at the back side of said single-layer metal material and carry out pressing;
Said single-layer metal material is carried out etching, form line layer (8);
Paste front coverlay (5) and carry out pressing in the front of said line layer (8); With
Paste front coverlay (5) and carry out pressing in the front of said blank wiring board (8).
10. method according to claim 9 is characterized in that, said single-layer metal material is a Copper Foil, and said method also comprises installation LED and resistance and/or relevant components and parts on said LED wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101499757A CN102630119A (en) | 2011-06-03 | 2011-06-03 | LED circuit board and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2011101499757A CN102630119A (en) | 2011-06-03 | 2011-06-03 | LED circuit board and manufacturing method thereof |
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| CN102630119A true CN102630119A (en) | 2012-08-08 |
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| CN2011101499757A Pending CN102630119A (en) | 2011-06-03 | 2011-06-03 | LED circuit board and manufacturing method thereof |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102595783A (en) * | 2011-07-27 | 2012-07-18 | 田茂福 | Novel LED circuit board and method |
| CN102927487A (en) * | 2012-11-07 | 2013-02-13 | 林广杰 | Preparation method of light-emitting diode (LED) light bar board |
| CN103298240A (en) * | 2012-08-09 | 2013-09-11 | 伟裕(厦门)电子有限公司 | Flexibility and hardness combined circuit board and manufacturing method thereof |
| CN109152199A (en) * | 2018-09-30 | 2019-01-04 | 惠州市鹏程电子科技有限公司 | The flexible circuit board and its die-cutting production method of single-layer or multi-layer cross cutting |
| CN109435369A (en) * | 2018-11-20 | 2019-03-08 | 鹤山市众晟科技有限公司 | The manufacturing method and LED light bar of LED light bar |
| CN114025499A (en) * | 2021-10-28 | 2022-02-08 | 广州安博新能源科技有限公司 | Single-sided flexible circuit board and preparation method and application thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001332836A (en) * | 2000-05-24 | 2001-11-30 | Hitachi Chem Co Ltd | Method for manufacturing printed-wiring board, and board manufactured thereby |
| CN101340778A (en) * | 2007-07-06 | 2009-01-07 | 富葵精密组件(深圳)有限公司 | Manufacturing method of hollowed-out PCB |
| CN101453832A (en) * | 2007-11-30 | 2009-06-10 | 比亚迪股份有限公司 | Method for manufacturing hollowed-out board |
| CN101938883A (en) * | 2010-08-26 | 2011-01-05 | 厦门弘信电子科技有限公司 | Single-side double contact flexible circuit board and making method thereof |
| CN201854501U (en) * | 2010-11-23 | 2011-06-01 | 罗海宁 | Circuit board |
| CN201869432U (en) * | 2010-10-12 | 2011-06-15 | 王定锋 | Circuit board with die cut line |
| CN202135398U (en) * | 2011-06-03 | 2012-02-01 | 田茂福 | Led circuit board |
-
2011
- 2011-06-03 CN CN2011101499757A patent/CN102630119A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001332836A (en) * | 2000-05-24 | 2001-11-30 | Hitachi Chem Co Ltd | Method for manufacturing printed-wiring board, and board manufactured thereby |
| CN101340778A (en) * | 2007-07-06 | 2009-01-07 | 富葵精密组件(深圳)有限公司 | Manufacturing method of hollowed-out PCB |
| CN101453832A (en) * | 2007-11-30 | 2009-06-10 | 比亚迪股份有限公司 | Method for manufacturing hollowed-out board |
| CN101938883A (en) * | 2010-08-26 | 2011-01-05 | 厦门弘信电子科技有限公司 | Single-side double contact flexible circuit board and making method thereof |
| CN201869432U (en) * | 2010-10-12 | 2011-06-15 | 王定锋 | Circuit board with die cut line |
| CN201854501U (en) * | 2010-11-23 | 2011-06-01 | 罗海宁 | Circuit board |
| CN202135398U (en) * | 2011-06-03 | 2012-02-01 | 田茂福 | Led circuit board |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102595783A (en) * | 2011-07-27 | 2012-07-18 | 田茂福 | Novel LED circuit board and method |
| CN103298240A (en) * | 2012-08-09 | 2013-09-11 | 伟裕(厦门)电子有限公司 | Flexibility and hardness combined circuit board and manufacturing method thereof |
| CN103298240B (en) * | 2012-08-09 | 2016-01-27 | 伟裕(厦门)电子有限公司 | A kind of rigid-flexible circuit board and preparation method thereof |
| CN102927487A (en) * | 2012-11-07 | 2013-02-13 | 林广杰 | Preparation method of light-emitting diode (LED) light bar board |
| CN109152199A (en) * | 2018-09-30 | 2019-01-04 | 惠州市鹏程电子科技有限公司 | The flexible circuit board and its die-cutting production method of single-layer or multi-layer cross cutting |
| CN109435369A (en) * | 2018-11-20 | 2019-03-08 | 鹤山市众晟科技有限公司 | The manufacturing method and LED light bar of LED light bar |
| CN114025499A (en) * | 2021-10-28 | 2022-02-08 | 广州安博新能源科技有限公司 | Single-sided flexible circuit board and preparation method and application thereof |
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Application publication date: 20120808 |