CN109435369A - The manufacturing method and LED light bar of LED light bar - Google Patents
The manufacturing method and LED light bar of LED light bar Download PDFInfo
- Publication number
- CN109435369A CN109435369A CN201811389676.9A CN201811389676A CN109435369A CN 109435369 A CN109435369 A CN 109435369A CN 201811389676 A CN201811389676 A CN 201811389676A CN 109435369 A CN109435369 A CN 109435369A
- Authority
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- China
- Prior art keywords
- led light
- insulating film
- circuit part
- light bar
- aperture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 19
- 230000008719 thickening Effects 0.000 claims abstract description 17
- 238000003825 pressing Methods 0.000 claims abstract description 12
- 239000011889 copper foil Substances 0.000 claims abstract description 7
- 238000004064 recycling Methods 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 22
- 239000005020 polyethylene terephthalate Substances 0.000 description 22
- 239000010949 copper Substances 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 11
- 238000000034 method Methods 0.000 description 10
- 239000003292 glue Substances 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000003466 welding Methods 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 235000017550 sodium carbonate Nutrition 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
- F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
- F21S4/24—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of ribbon or tape form, e.g. LED tapes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
The invention belongs to LED lamp technical fields, disclose the manufacturing method of LED light bar, comprising: and 101, by rotation mold, the circuit part formed after copper foil is rolled and rim charge part, and rim charge part is recycled；102, by rotation mold, insulating film is subjected to aperture by rotation mold；103, by heat pressing wheel, the front of insulating film and the circuit part after aperture is pressed together；104, by heat pressing wheel, thickening PET insulating film is pressed together on to the reverse side of the circuit part, forms lamp bar substrate.In addition, also disclosing LED light bar.The present invention realizes the intensity that can enhance software LED light bar, simplifies production technology.
Description
Technical field
The invention belongs to LED lamp technical field more particularly to the manufacturing methods and LED light bar of LED light bar.
Background technique
At present use aluminum substrate/glass-fiber-plate circuit hardware lamp bar, complex process, production efficiency is low, material and manually at
This height, and circuit fabrication needs pickling etching, via hole plating etc., it is very big to environmental hazard.Substantially step are as follows: by copper, insulating cement,
(aluminium/glass) substrate is pressed, and is then coated with photosensitive oil, exposed photosensitive oil, is developed later, being will not using Na2CO3
The photosensitive route oil of exposure dissolves, and the photosensitive route oil exposed has occurred that polymerization reaction and is retained on copper face, protects
Copper under river bottom protection is not etched liquid medicine dissolution, is to use ferric trichloride FeCl3 that hydrochloric acid is added as etching solution, benefit through overetch
Exposed copper is removed with the redox of copper, carries out moving back film, is the photosensitive route oil that will protect copper wire surface using NaOH
Remove, finally prints welding resistance oil, form hardware lamp bar, LED light is welded, can be completed, acid used in the above process
Property and alkaline solution, to human body, have sizable harm to environment, and the dangerous waste object recovery processing generated is not easy, more increase
Manufacturing cost is added.Software lamp bar at present is applied when on LED illumination fluorescent tube, and general to use: gluing mode is fixed with lamp bracket,
On the one hand overall aesthetic degree is influenced, another aspect processing technology is relative complex, at high cost.
Summary of the invention
The manufacturing method and LED light bar for being designed to provide LED light bar of the embodiment of the present invention, can enhance software LED
The intensity of lamp bar simplifies production technology.
The embodiments of the present invention are implemented as follows:
The manufacturing method of LED light bar, comprising:
101, by rotation mold, the circuit part formed after copper foil is rolled and rim charge part, and to rim charge part
It is recycled；
102, by rotation mold, insulating film is subjected to aperture by rotation mold；
103, by heat pressing wheel, the front of insulating film and the circuit part after aperture is pressed together；
104, by heat pressing wheel, thickening PET insulating film is pressed together on to the reverse side of the circuit part, forms lamp bar substrate,
The thickness range for thickening PET insulating film is: 0.2mm to 2mm.
After step 104, further include being welded on LED light on the front of the circuit part by the aperture, is formed
Light bar.
The manufacturing method of the LED light bar further includes that lamp bar substrate is assembled in the card slot of lamp bracket, the card slot
The two sides of lamp bar substrate are clamped, LED light bar is formed.
LED light bar, including lamp bar substrate as described above, the lamp bar substrate include the insulating film of aperture, circuit part
And PET insulating film is thickeied, the insulating film of the aperture is pressed together on the front of circuit part, the thickening PET insulating film pressing
In the reverse side of circuit part, the thickness range for thickening PET insulating film is: 0.2mm to 2mm.
The LED light bar further includes the LED light being welded on the front of circuit part by the aperture.
The LED light bar further includes lamp bracket, and the lamp bracket has card slot, and the two sides of lamp bar substrate are respectively engaged with card
In slot.
The LED light bar further includes lampshade, is fixedly connected with lamp bracket, and accommodating lamp bar base is formed between lampshade and lamp bracket
The space of plate and LED light.
The processing method (or flat plate mold punching) of rotation mold rolling is used to be die cut out in the embodiment of the present invention required
Copper circuit will thicken PET insulating film (enhancing thickness and hardness) and be attached to the back side of lamp bar by Wear Characteristics of Epoxy Adhesive, and continuous circulation is made
Industry, process is simple, high production efficiency, and all process steps all do not need acid and alkaline solution and carry out pickling etching, solve ring
Guarantor's problem；Due to lamp bar enhanced strength, when assembling LED light bar, operation difficulty is reduced, technique is simplified.
Detailed description of the invention
Fig. 1 is the manufacturing method process schematic of LED light strip of the present invention；
Fig. 2 is the sectional view of LED light strip of the present invention；
Fig. 3 is the sectional view of LED light strip after welding LED light in Fig. 2；
Fig. 4 is the structure chart of LED light bar of the present invention.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
Specific implementation of the invention is described in detail below in conjunction with specific embodiment:
It is specific as shown in Figures 1 to 4.
The manufacturing method of LED light bar, comprising:
101, by rotation mold, the circuit part formed after copper foil is rolled and rim charge part, and to rim charge part
It is recycled；
102, by rotation mold, insulating film is subjected to aperture by rotation mold；
103, by heat pressing wheel, the front of insulating film and the circuit part after aperture is pressed together；
104, by heat pressing wheel, thickening PET insulating film is pressed together on to the reverse side of the circuit part, forms lamp bar substrate,
It is described thicken PET insulating film thickness range be: 0.2mm to 2mm, wherein polyethylene terephthalate chemical formula be-
OCH2-CH20COC6H4CO- English name: polyethyleneterephthalate, abbreviation PET.After step 104, also wrap
It includes, LED light is welded on the front of the circuit part by the aperture, form light bar.It further include filling lamp bar substrate
It is fitted in the card slot of lamp bracket, the two sides of the card slot clamping lamp bar substrate form LED light bar.
LED light bar, including the upper lamp bar substrate 1100, the lamp bar substrate 1100 includes the insulating film with aperture 11
1, circuit part (or circuit) 21 and thickening PET insulating film 4, the insulating film 1 with aperture 11 are pressed together on circuit part 21
Front, the PET insulating film 4 that thickeies is pressed together on the reverse side of circuit part 21, the thickness range for thickening PET insulating film
Be: 0.2mm to 2mm, such thickness ensure that the intensity of lamp bar substrate, while but also thicken the pressing effect of PET insulating film
Fruit is more preferable.
Further, the LED light bar further includes being welded on the front of circuit part by the aperture 11
LED light 600.
Further, the LED light bar, further includes lamp bracket 700, and the lamp bracket has card slot 750, lamp bar substrate 1100
Two sides be respectively engaged in card slot 750.
Further, the LED light bar further includes lampshade 800, is fixedly connected with lamp bracket, shape between lampshade and lamp bracket
At accommodating lamp bar substrate and the space of LED light.
In Fig. 1,1 is the insulating film of one side coating epoxide-resin glue, and 11 be that (aperture is to expose copper for aperture on insulating film
Circuit, for welding electronic component)；
Wherein, 2 be copper foil, and 21 be copper foil by the circuit formed after rotation mold rolling, and 23 be copper bound material (waste material)；
Wherein, 4 thicken PET insulating film for the high temperature of bottom one side coating epoxide-resin glue.
Wherein, 61,62 be first group of rotation mold (or plate mould), for being die cut aperture to insulating film 1；
Wherein, 71,72 be second group of rotation mold (or plate mould), for being die cut out circuit to copper foil 2；
Wherein, 8 be first group of heat pressing wheel, for the copper circuit 21 after the insulating film 1 and cross cutting after cross cutting to be pressed into one
Body；
Wherein, 9 be second group of heat pressing wheel, for by the insulation insulating film 1 of 8 hot pressing and copper circuit 21 and being thickeied PET
Insulating film 4 presses integrally.
As seen from the figure, it is that insulating film is carried out aperture, presses fit into the front of circuit that manufacturing method, which can be sketched, it
Afterwards, the reverse side that thickening PET insulating film is pressed to circuit, can be completed.
After being pressed together in Fig. 1, lamp bar substrate in Fig. 2 is formed, sectional view is from top to bottom successively are as follows: insulating film
1, circuit 21 and thickening PET insulating film 4.The insulating film 1 of one side coating epoxide-resin glue and circuit 21 are pressed integrally, formed
The circuit of one-side band insulating layer.
Wherein 1 be one side coating epoxide-resin glue insulating film, 11 be aperture (aperture on insulating layer
It is in order to expose copper circuit, for welding electronic component)；
Wherein 21 be circuit.
Wherein 4 be bottom one side coating epoxide-resin glue thickening PET insulating film.
The insulating film 1 of one side coating epoxide-resin glue and circuit 21 and thickening PET insulating film 4 are pressed integrally above,
The circuit of one-side band insulating layer is formd, simple process meets environmental requirement, and enhances the thickness and hardness of product, makes product
Not pliable, fracture, and product is smooth, does not influence circuit and external connection.
In Fig. 3, LED light 600 is welded on lamp bar substrate 1100 by SMT or other welding procedures.
In Fig. 4, the lamp bar substrate with LED light is pierced into lamp bar card slot, then interface of connecting with the mains, last both ends insulation
Material, which is fixed, is assembled into LED light bar.
Reinforced software lamp bar of the invention uses novel stiffening plate insulating film, and substitution uses aluminum substrate/glass-fiber-plate circuit
Hardware lamp bar, and cost is lower, simple process, meets environmental requirement；Reinforced software lamp bar is exhausted because using novel thickening PET
Velum enhances the thickness and hardness of product, so can be with as having used aluminum substrate/glass-fiber-plate hardware lamp bar
Directly product alignment fluorescent tube card slot is fitted inside, does not have to software lamp bar, handy glue as and fixes, this sampling technology is simpler
Single, the lower work of cost.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to restrict the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (7)
- The manufacturing method of 1.LED lamp bar characterized by comprising101, by rotation mold, the circuit part formed after copper foil is rolled and rim charge part, and rim charge part is carried out Recycling；102, by rotation mold, insulating film is subjected to aperture by rotation mold；103, by heat pressing wheel, the front of insulating film and the circuit part after aperture is pressed together；104, by heat pressing wheel, thickening PET insulating film is pressed together on to the reverse side of the circuit part, forms lamp bar substrate, it is described The thickness range for thickening PET insulating film is: 0.2mm to 2mm.
- 2. the manufacturing method of LED light bar according to claim 1, it is characterised in that: after step 104, further include, it will LED light is welded on the front of the circuit part by the aperture, and light bar is formed.
- 3. the manufacturing method of LED light bar according to claim 2, it is characterised in that: further include being assembled to lamp bar substrate In the card slot of lamp bracket, the two sides of the card slot clamping lamp bar substrate form LED light bar.
- 4.LED lamp bar, it is characterised in that: including lamp bar substrate as described in claim 1, the lamp bar substrate includes aperture Insulating film, circuit part and thickening PET insulating film, the insulating film of the aperture is pressed together on the front of circuit part, described to add Thick PET insulating film is pressed together on the reverse side of circuit part, and the thickness range for thickening PET insulating film is: 0.2mm to 2mm.
- 5. LED light bar according to claim 4, it is characterised in that: further include being welded on circuit part by the aperture Front on LED light.
- 6. LED light bar according to claim 5, it is characterised in that: further include lamp bracket, the lamp bracket has card slot, lamp bar The two sides of substrate are respectively engaged in card slot.
- 7. LED light bar according to claim 6, it is characterised in that: further include lampshade, be fixedly connected with lamp bracket, lampshade with The space of accommodating lamp bar substrate and LED light is formed between lamp bracket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811389676.9A CN109435369A (en) | 2018-11-20 | 2018-11-20 | The manufacturing method and LED light bar of LED light bar |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811389676.9A CN109435369A (en) | 2018-11-20 | 2018-11-20 | The manufacturing method and LED light bar of LED light bar |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109435369A true CN109435369A (en) | 2019-03-08 |
Family
ID=65554667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811389676.9A Pending CN109435369A (en) | 2018-11-20 | 2018-11-20 | The manufacturing method and LED light bar of LED light bar |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109435369A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102630119A (en) * | 2011-06-03 | 2012-08-08 | 田茂福 | LED circuit board and manufacturing method thereof |
| CN204272493U (en) * | 2014-12-31 | 2015-04-15 | 广州市宝利邦德高分子材料有限公司 | A kind of flexible LED substrate |
| CN204879722U (en) * | 2015-08-20 | 2015-12-16 | 浙江阳光照明电器集团股份有限公司 | Ultra -thin down lamp of LED |
| CN105898982A (en) * | 2016-06-30 | 2016-08-24 | 广东顺德施瑞科技有限公司 | High-voltage flexible circuit board and multi-layer flexible circuit board |
| CN205693972U (en) * | 2016-06-30 | 2016-11-16 | 广东顺德施瑞科技有限公司 | A kind of double-faced flexible wiring board |
| CN205716629U (en) * | 2016-06-30 | 2016-11-23 | 广东顺德施瑞科技有限公司 | A kind of anti-tampering light bar of double-faced flexible |
| CN207094570U (en) * | 2017-09-05 | 2018-03-13 | 鹤山市得润电子科技有限公司 | Flexible circuit board and the LED with the flexible circuit board |
| CN207219184U (en) * | 2017-09-21 | 2018-04-10 | 鹤山市得润电子科技有限公司 | A kind of production equipment of multi-layer soft circuit board |
| CN207219183U (en) * | 2017-09-21 | 2018-04-10 | 鹤山市得润电子科技有限公司 | A kind of production equipment of multi-layer soft circuit board |
| CN208011370U (en) * | 2017-12-16 | 2018-10-26 | 中山市富大照明科技有限公司 | A kind of flexible LED rope light |
-
2018
- 2018-11-20 CN CN201811389676.9A patent/CN109435369A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102630119A (en) * | 2011-06-03 | 2012-08-08 | 田茂福 | LED circuit board and manufacturing method thereof |
| CN204272493U (en) * | 2014-12-31 | 2015-04-15 | 广州市宝利邦德高分子材料有限公司 | A kind of flexible LED substrate |
| CN204879722U (en) * | 2015-08-20 | 2015-12-16 | 浙江阳光照明电器集团股份有限公司 | Ultra -thin down lamp of LED |
| CN105898982A (en) * | 2016-06-30 | 2016-08-24 | 广东顺德施瑞科技有限公司 | High-voltage flexible circuit board and multi-layer flexible circuit board |
| CN205693972U (en) * | 2016-06-30 | 2016-11-16 | 广东顺德施瑞科技有限公司 | A kind of double-faced flexible wiring board |
| CN205716629U (en) * | 2016-06-30 | 2016-11-23 | 广东顺德施瑞科技有限公司 | A kind of anti-tampering light bar of double-faced flexible |
| CN207094570U (en) * | 2017-09-05 | 2018-03-13 | 鹤山市得润电子科技有限公司 | Flexible circuit board and the LED with the flexible circuit board |
| CN207219184U (en) * | 2017-09-21 | 2018-04-10 | 鹤山市得润电子科技有限公司 | A kind of production equipment of multi-layer soft circuit board |
| CN207219183U (en) * | 2017-09-21 | 2018-04-10 | 鹤山市得润电子科技有限公司 | A kind of production equipment of multi-layer soft circuit board |
| CN208011370U (en) * | 2017-12-16 | 2018-10-26 | 中山市富大照明科技有限公司 | A kind of flexible LED rope light |
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