CN201749865U - LED heat dissipation structure - Google Patents
LED heat dissipation structure Download PDFInfo
- Publication number
- CN201749865U CN201749865U CN2010201358020U CN201020135802U CN201749865U CN 201749865 U CN201749865 U CN 201749865U CN 2010201358020 U CN2010201358020 U CN 2010201358020U CN 201020135802 U CN201020135802 U CN 201020135802U CN 201749865 U CN201749865 U CN 201749865U
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- China
- Prior art keywords
- conductive connecting
- connecting pin
- groove
- cooling stand
- lead
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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Abstract
The utility model relates to an LED heat dissipation structure which comprises a packaging body, a radiating bracket, at least one light-emitting chip, a plurality of conductive connecting pins and a plurality of leads, wherein the packaging body is provided with a groove and an outer surface; the radiating bracket is combined with the packaging body; one part of the radiating bracket is configured in the groove; at least one end of the radiating bracket passes through from at least one side of the groove to at least one side of the outer surface; one end of the radiating bracket at one side of the outer surface extends along the outer surface of the packaging body in a bending way; the light-emitting chip is positioned in the groove and is arranged on the radiating bracket; the conductive connecting pins comprise a first conductive connecting pin and a second conductive connecting pin which are positioned in the groove and pass through from one side of the groove to one side of the outer surface; and the plurality of leads comprise a first lead and a second lead, wherein the first lead is connected with the light-emitting chip and the first conductive connecting pin in the groove, and the second lead is connected with the light-emitting chip and the second conductive connecting pin in the groove.
Description
Technical field
The utility model is about having a cooling stand in a kind of the LED radiator structure, particularly encapsulation main body, and this cooling stand extends and is through to the LED encapsulation main body outside field of dispelling the heat.
Background technology
Because LED can produce a large amount of heats in luminescence process, suitable heat abstractor must be set, to avoid that the life-span of luminescence chip itself is caused damage.
Tradition LED radiator structure 1a (as shown in Figures 1 and 2) has the first relative conductive connecting pin 141a and the second conductive connecting pin 142a in its encapsulation main body 11a.Luminescence chip 13a is installed on first conductive connecting pin, by the first conductive connecting pin 141a by extending in the groove 111a outside the encapsulation main body 11a, the first conductive connecting pin 141a connecting circuit plate 2a end face that encapsulation main body 11a is outer, and dispelled the heat by the radiating subassembly 3a (for example aluminium base) of contact circuit plate bottom surface.And radiating subassembly 3a can have the radiating fin of assisting a ruler in governing a country, heat radiation conduit, cooling chip, soaking plate or radiator fan or the like structure, in order to discharge the heat that luminescence chip 13a is generated.
Yet, the first conductive connecting pin 141a and the second conductive connecting pin 142a are connecting circuit plate 2a, because of being subject to the narrow narrow circuit on the circuit board 2a, so, the first conductive connecting pin 141a and the second conductive connecting pin 142a only can the limit pin area be connected in according to this on the narrow narrow circuit and can't strengthen the area of its heat radiation, cause that traditional light-emitting diode (LED) radiating effect is not good, radiating rate reaches the excessive defective of its volume of auxiliary radiating device inadequately rapidly.
In addition, it is high to purchase the cost of aluminium base radiating subassembly cost, if again aluminium base processing is connected in the circuit board bottom side, LED radiator structure cost is significantly raise.
The utility model content
The purpose of this utility model provides a kind of LED radiator structure, is difficult to the problem of discharging and reducing mother metal expenditure cost with solution luminescence chip heat.
For achieving the above object, the LED radiator structure that the utility model provides, it comprises:
One encapsulation main body has a groove and an outer surface;
One cooling stand, combine with this encapsulation main body, this cooling stand some is disposed in this groove, and at least one end of this cooling stand is through at least one side of this outer surface by at least one side of this groove, and this cooling stand one end of this outer surface one side is along this outer surface bending and extension;
At least one luminescence chip is positioned at this groove and is installed on this cooling stand;
The complex conduction pin has at least one first conductive connecting pin and at least one second conductive connecting pin, and this first conductive connecting pin and this second conductive connecting pin are positioned at this groove and are through to this outer surface one side by this groove one side; And
Complex lead has at least one first lead and at least one second lead, and this first lead connects this luminescence chip and connects this interior first conductive connecting pin of this groove, and this second lead connects this luminescence chip and connects this interior second conductive connecting pin of this groove.
Described LED radiator structure wherein comprises a light penetrating object, is formed in this groove.
Described LED radiator structure, wherein this cooling stand one end of Yan Shening runs through a circuit board and is connected on the radiating subassembly.
Described LED radiator structure, wherein this cooling stand and this complex conduction pin be for once being stamped to form, and thickness is identical.
Effect of the present utility model is:
1) is combined with a cooling stand by encapsulation main body, is equiped with the luminescence chip that produces thermal source on this cooling stand, extend and be through to outside the encapsulation main body by at least one end of cooling stand, to solve the problem that the luminescence chip heat is difficult to discharge.
2) once be stamped to form with same mother metal by conductive connecting pin and cooling stand; so the two material is identical, thickness is identical; applicable existing various decompressor (for example punch press) is stamped simultaneously; do not need secondary operations to produce two assemblies; therefore can reduce waste material generates; reduce mother metal expenditure cost, meet the theory of environmental protection and reduce construction process.
Description of drawings
Fig. 1 is the schematic top plan view of known LED radiator structure.
Fig. 2 is the side-looking generalized section of known LED radiator structure.
Fig. 3 is the perspective view of the first embodiment LED radiator structure of the present utility model.
Fig. 4 is the schematic top plan view of the first embodiment LED radiator structure of the present utility model.
Fig. 5 is the a-a ' generalized section of the first embodiment LED radiator structure of the present utility model.
Fig. 6 is the right side schematic diagram of the first embodiment LED radiator structure of the present utility model.
Fig. 7 is the front-view schematic diagram of the first embodiment LED radiator structure of the present utility model.
Fig. 8 is the schematic top plan view of the second embodiment LED radiator structure of the present utility model.
Primary clustering symbol description in the accompanying drawing:
Embodiment
The LED radiator structure that the utility model provides, it comprises an encapsulation main body, a cooling stand, at least one luminescence chip, complex conduction pin and complex lead.Encapsulation main body has a groove and an outer surface.Cooling stand combines with encapsulation main body, and the cooling stand some is disposed in the groove, and at least one end of cooling stand is through at least one side of outer surface by at least one side of groove, and cooling stand one end of outer surface one side is along bending of encapsulation main body outer surface and extension.At least one luminescence chip is positioned at groove and is installed on the cooling stand.The complex conduction pin has at least one first conductive connecting pin and at least one second conductive connecting pin, and first conductive connecting pin and second conductive connecting pin are positioned at groove and are through to outer surface one side by groove one side.Complex lead has at least one first lead and at least one second lead, and first lead connects luminescence chip and connects the first interior conductive connecting pin of groove, and second lead connects second conductive connecting pin in luminescence chip and the connection groove.
In order further to understand feature of the present utility model, characteristics and technology contents, see also following about detailed description of the present utility model and accompanying drawing, only accompanying drawing only provide with reference to and explanation usefulness, non-in order to restriction the utility model.
See also Fig. 3 to Fig. 7, be perspective view, schematic top plan view, a-a ' generalized section, right side schematic diagram and the front-view schematic diagram of the utility model first embodiment LED radiator structure.Among the figure, LED radiator structure 1 comprises an encapsulation main body 11, a cooling stand 12, at least one luminescence chip 13, complex root conductive connecting pin 14 (being at least one first conductive connecting pin 141 and at least one second conductive connecting pin 142) and plural wires 15.Encapsulation main body 11 has a groove 111 and an outer surface 112 (as shown in Figures 3 and 4).
In addition, cooling stand 12 other ends are through to outer surface 112 opposite sides by groove 111 opposite sides, again along outer surface 112 opposite sides bendings and extend and run through circuit board 2.At last, cooling stand 12 other ends that run through circuit board 2 are connected on the radiating subassembly 3 and (see also shown in Figure 7), and for example cooling stand 12 is connected on the pedestal of radiating fin.
In addition, the circuit board 2 that runs through can for soft circuit board (Flexible Printed Circuit, FPC) or rigid circuit board (Rigid Printed Circuit, RPC).At least one luminescence chip 13 is positioned at groove 111 and is installed on the cooling stand 12.Represented with three luminescence chips 13, but that not as limit luminescence chip 13 can also one, more than two or four and be located on the cooling stand 12.
Complex root conductive connecting pin 14 comprises at least one first conductive connecting pin 141 and at least one second conductive connecting pin 142, the profile of this first conductive connecting pin 141 and second conductive connecting pin 142 is not limited standard, the profile of first conductive connecting pin 141 and second conductive connecting pin 142 can be identical or different, conveniently to be disposed in the narrow and small groove 111.First conductive connecting pin, 141 somes are positioned at groove 111, first conductive connecting pin, 141 1 ends are through to outer surface 112 1 sides of encapsulation main body 11 by groove 111 inboards, again along outer surface 112 bendings of encapsulation main body 11 and extend downward a side and the bottom side intersection (as Fig. 5 and shown in Figure 6) of outer surface 112.At last, first conductive connecting pin, 141 1 ends bend and extend to outer surface 112 bottom sides (being encapsulation main body 11 bottom surfaces).Represented explanation with second conductive connecting pin 142 of first conductive connecting pin 141 of three bendings and three bendings, but not as limit, first conductive connecting pin 141 and second conductive connecting pin 142 also can be respectively one, more than two or four.
Second conductive connecting pin, 142 somes are positioned at groove 111 and with respect to first conductive connecting pin 141, second conductive connecting pin, 142 1 ends are through to outer surface 112 1 sides of encapsulation main body 11 by groove 111 inboards, again along outer surface 112 bendings and extend downward a side and the bottom side intersection (as Fig. 5 and shown in Figure 6) of outer surface 112.At last, second conductive connecting pin, 142 1 ends bend and extend to outer surface 112 bottom sides (being encapsulation main body 11 bottom surfaces) of encapsulation main body 11.Above-mentioned first conductive connecting pin, 141 1 ends and second conductive connecting pin, 142 1 ends that extend to encapsulation main body 11 bottom surfaces, it can be connected on the circuit board 2 by welding manner.
Wherein, first conductive connecting pin 141, second conductive connecting pin 142 and cooling stand 12, can be engraved on the male and female mould simultaneously, in punching course, metal substrate can produce first conductive connecting pin 141, second conductive connecting pin 142 and cooling stand 12 3 assemblies, so its material is identical and thickness is identical.
See also Fig. 8, be the schematic top plan view of the second embodiment LED radiator structure of the present utility model.Among the figure, LED radiator structure 1 also can comprise a light penetrating object 16, is formed in the groove 111.This light penetrating object 16 can be filled in groove 111 and be solidified and be formed by the printing opacity colloid of fusion, with cooling stand 12, luminescence chip 13, conductive connecting pin 14 and the lead 15 in the encapsulation groove 111.In addition, can include the fluorescent material composition in the light penetrating object 16, the light that penetrates when luminescence chip 13 turns usefulness into through fluorescent phosphor, is converted into different wave length, and launches the light of different color.
In sum, the characteristics of LED radiator structure of the present utility model are, are extended and are run through circuit board to encapsulation main body by its at least one end of large-area cooling stand, can solve the problem that the luminescence chip heat is difficult to discharge.Assist a ruler in governing a country the cooling stand heat radiation according to this if its at least one end of cooling stand connects radiating subassembly 3 (for example radiating fin, heat radiation conduit, cooling chip, soaking plate or radiator fan), more can significantly promote the effect of heat radiation.
Another characteristics of LED radiator structure of the present utility model are, cooling stand, first conductive connecting pin and second conductive connecting pin, it can utilize the male mould that is carved with cooling stand, first conductive connecting pin and the second conductive connecting pin three on the decompressor, in addition the stamped metal substrate is to the master tooling that is carved with cooling stand, first conductive connecting pin and the second conductive connecting pin three, and combination system is produced cooling stand, first conductive connecting pin and second conductive connecting pin, three assemblies simultaneously.Therefore, conductive connecting pin and cooling stand that the stamped material is identical simultaneously, thickness is identical are not manufactured and need not distinguish secondary operations; can reduce waste material generates; reduce metal substrate expenditure cost, reduce the program circuit of construction, to meet the theory trend of present environmental protection.
The above, it only is preferable possible embodiments of the present utility model, non-so promptly limit to claim of the present utility model, the equivalent structure that uses the utility model specification and accompanying drawing content to do such as changes, and all reason is with being contained in the claim scope of the present utility model.
Claims (4)
1. a LED radiator structure is characterized in that, comprises:
One encapsulation main body has a groove and an outer surface;
One cooling stand, combine with this encapsulation main body, this cooling stand some is disposed in this groove, and at least one end of this cooling stand is through at least one side of this outer surface by at least one side of this groove, and this cooling stand one end of this outer surface one side is along this outer surface bending and extension;
At least one luminescence chip is positioned at this groove and is installed on this cooling stand;
The complex conduction pin has at least one first conductive connecting pin and at least one second conductive connecting pin, and this first conductive connecting pin and this second conductive connecting pin are positioned at this groove and are through to this outer surface one side by this groove one side; And
Complex lead has at least one first lead and at least one second lead, and this first lead connects this luminescence chip and connects this interior first conductive connecting pin of this groove, and this second lead connects this luminescence chip and connects this interior second conductive connecting pin of this groove.
2. LED radiator structure as claimed in claim 1 is characterized in that, comprises a light penetrating object, is formed in this groove.
3. LED radiator structure as claimed in claim 1 is characterized in that, this cooling stand one end of extension runs through a circuit board and is connected on the radiating subassembly.
4. LED radiator structure as claimed in claim 1 is characterized in that, this cooling stand and this complex conduction pin are for once being stamped to form, and thickness is identical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201358020U CN201749865U (en) | 2010-03-03 | 2010-03-03 | LED heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201358020U CN201749865U (en) | 2010-03-03 | 2010-03-03 | LED heat dissipation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201749865U true CN201749865U (en) | 2011-02-16 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201358020U Expired - Fee Related CN201749865U (en) | 2010-03-03 | 2010-03-03 | LED heat dissipation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201749865U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108443846A (en) * | 2018-04-09 | 2018-08-24 | 澳洋集团有限公司 | A kind of cooling stand for LED chip installation base plate |
| CN111987212A (en) * | 2017-06-27 | 2020-11-24 | 亿光电子工业股份有限公司 | Packaging support structure and light-emitting device comprising same |
-
2010
- 2010-03-03 CN CN2010201358020U patent/CN201749865U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111987212A (en) * | 2017-06-27 | 2020-11-24 | 亿光电子工业股份有限公司 | Packaging support structure and light-emitting device comprising same |
| CN108443846A (en) * | 2018-04-09 | 2018-08-24 | 澳洋集团有限公司 | A kind of cooling stand for LED chip installation base plate |
| CN108443846B (en) * | 2018-04-09 | 2020-08-11 | 澳洋集团有限公司 | Heat dissipation support for LED chip mounting substrate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110216 Termination date: 20170303 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |