CN201904999U - Improved radiating structure of circuit board - Google Patents

Improved radiating structure of circuit board Download PDF

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Publication number
CN201904999U
CN201904999U CN2010206221908U CN201020622190U CN201904999U CN 201904999 U CN201904999 U CN 201904999U CN 2010206221908 U CN2010206221908 U CN 2010206221908U CN 201020622190 U CN201020622190 U CN 201020622190U CN 201904999 U CN201904999 U CN 201904999U
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CN
China
Prior art keywords
heat
circuit board
tuck pointing
perforation
conductive assembly
Prior art date
Application number
CN2010206221908U
Other languages
Chinese (zh)
Inventor
董林洲
Original Assignee
董林洲
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 董林洲 filed Critical 董林洲
Priority to CN2010206221908U priority Critical patent/CN201904999U/en
Application granted granted Critical
Publication of CN201904999U publication Critical patent/CN201904999U/en

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Abstract

The utility model provides an improved radiating structure of a circuit board, which is mainly characterized in that the circuit board is provided with at least a penetrating through hole, a heat source body capable of generating heat is arranged close to one end of the through hole, one surface of the circuit board, relatively far away from the heat source body, is provided with a heat conductive component, at least a convex embedded part protruding the surface is arranged on the heat conductive component at the position corresponding to the through hole, and a plating layer is arranged at the outer end part of the convex embedded part, is embedded in the through hole by the convex embedded part through the heat conductive component, penetrates through the through hole and is embedded on the heat source body, so that the accumulated heat of the heat source body is transmitted to the heat conductive component by the convex embedded part so as to be radiated efficiently for a large area.

Description

The circuit board heat dissipation improved structure
Technical field
The utility model relates to a kind of circuit board heat dissipation improved structure, refers to a kind of circuit board radiator structure of simplifying processing procedure, promoting the product yield and effectively reduce production costs especially.
Background technology
Known circuit board radiator structure, announce just like TaiWan, China that No. 453629 " circuit board of tool radiating effect " novel patent case disclosed, it mainly comprises: be arranged at the several heat dissipating layers in the circuit board, isolate with insulating barrier between each heat dissipating layer, several that are provided with corresponding to the position of electronic building brick to be placed first conducting strip and through hole, this first conducting strip is connected between electronic building brick and the through hole, and this through hole runs through the entire circuit plate and links to each other with several heat dissipating layers in the circuit board, other has second conducting strip that is arranged at circuit board table side, this second conducting strip and the through hole that is arranged at board edge and the casing of taking in this circuit board link to each other, with the heat conduction of electronic building brick to casing.
Other has a TaiWan, China to announce " radiator structure of circuit board " novel patent case M369636 number, it is to be provided with at least one groove of wearing in circuit board, wear in this and to be provided with the heat dissipation metal body in groove, this heat dissipation metal body and wear and be provided with adhesion layer between groove, making this heat dissipation metal body be fixed in this wears in the groove, expose to and wear in the groove and can be provided with the internal layer circuit layer according to need in circuit board, this adhesion layer then is located between this internal layer circuit layer and the heat dissipation metal body.
Have one to disclose different again with above-mentioned two patent cases, its structure is as shown in Figures 1 and 2, mainly be to be provided with at least one perforation 11 in circuit board 1, and this circuit board 1 surface is respectively equipped with conducting wire 12 in these perforation 11 at least two other offsides, other has a heat-conductive assembly 20 to be provided with an annular groove 201 in the stage casing can be sleeved in this perforation 11, be respectively equipped with in two ends of this heat-conductive assembly 20 and expose perforation 11 and smooth first, two contact-making surfaces 202,203, wherein this first contact-making surface 202(or second contact-making surface 203) can be a LED or other power electronic assembly for a heat source body 3() contact of fitting, and the pin 31 that makes this heat source body 3 and this conducting wire 12 mutually seam be electrically connected this second contact-making surface 203(or first contact-making surface 202 to form) then can contact a radiating subassembly 4 in addition; Making this heat source body 3(LED or electronic building brick) heat that produced down in working order can conduct to circuit board 1 opposite side via heat-conductive assembly 20, externally disperse via radiating subassembly 4 again, to reduce high temperature that this heat produces harmful effect that related electronic components was produced.
The structure that above-mentioned Fig. 1 and Fig. 2 disclosed, the program of its production and assembly is earlier this heat-conductive assembly 20 to be fixed in the perforation 11 of circuit board 1, utilizing the automatic assembling tool again with this heat source body 3(LED or electronic building brick) the seam assembly is on this circuit board 1, and with first contact-making surface 202(or second contact-making surface 203 of its heating face 32 with heat-conductive assembly 20) contact, then, according to need a radiating subassembly 4 is fitted in addition the second contact-making surface 203(or first contact-making surface 202 of heat-conductive assembly 20 again) on; Yet, the procedure of this kind structural entity is comparatively loaded down with trivial details, and its assembling welding is just can carry out after heat-conductive assembly 20 assemblings, not only degree of difficulty is higher, and its pin 31 needs accurate control, just can make heat source body 3 keep well contacting with radiating subassembly 4, and the whole yield that influences product is very huge, and cause the increase of production cost indirectly, reduce the competitiveness of product on market.
Because known circuit board radiator structure has above-mentioned shortcoming, the creator is the road at those shortcoming research improvement, has the utility model to produce finally.
Summary of the invention
Technical problem to be solved in the utility model is: at above-mentioned the deficiencies in the prior art, provide a kind of circuit board heat dissipation improved structure, it can be simplified procedure for processing, lifting product yield and reduce production costs.
In order to solve the problems of the technologies described above, the technical scheme that the utility model adopted is: a kind of circuit board heat dissipation improved structure, it comprises circuit board and heat-conductive assembly at least, this circuit board has the perforation of at least one perforation, and the position in a surface of this circuit board near this perforation is provided with a heat source body, and the heating face of this heat source body is bored a hole corresponding to this; Be characterized in: described heat-conductive assembly is arranged at another surface of the relative stow away from heat body of this circuit board, be provided with at least one tuck pointing portion of protruding the surface in this heat-conductive assembly, and this tuck pointing portion can be embedded in this perforation, and contact with the heating face of this heat source body, have heat conducting bonding state with formation.
According to said structure, wherein this tuck pointing portion is provided with a coating in the position that contacts with heat source body.
According to said structure, wherein this coating is welded in the heating face of heat source body.
According to said structure, wherein be provided with the adhesion layer of a tool stickiness between this heat-conductive assembly and the circuit board.
According to said structure, wherein this heat-conductive assembly surface is provided with the radiating fin that can increase area of dissipation.
According to said structure, wherein the dorsal part of this tuck pointing portion is established and is had recess, and this recess can be for the slotting knot of the tuck pointing portion of different heat-conductive assemblies, and forms coinciding of different heat-conductive assemblies.
According to said structure, wherein the height of this tuck pointing portion is greater than the length of perforation, and the clearance distance of this tuck pointing portion height of protruding perforation between boring a hole with this greater than the heating face of this heat source body.
So, this structure has preferable heat transfer efficiency, can promote radiating efficiency; And can simplify procedure for processing, lifting product yield, and reduce production costs.
For can being obtained more specifically, above-mentioned purpose of the present utility model, effect and feature understand, as follows according to following description of drawings now:
Description of drawings:
Fig. 1 is the three-dimensional exploded view of known circuit board radiator structure.
Fig. 2 is the combination section of known circuit board radiator structure.
Fig. 3 is a structure decomposition map of the present utility model.
Fig. 4 is a combination section of the present utility model.
Fig. 5 is that the heat-conductive assembly of another form of the utility model is repeatedly put the combination schematic diagram.
Label declaration:
1..... circuit board 11.... perforation
12.... conducting wire 2,20,2a.... heat-conductive assembly
21, the 22.... of 21a.... tuck pointing portion coating
23a... recess 24.... adhesion layer
25.... weld part 201... annular groove
202... the first contact-making surface 203..., second contact-making surface
3..... heat source body 31.... pin
32.... heating face 4..... radiating subassembly
Embodiment:
See also Fig. 3 and shown in Figure 4, obviously can find out, the utility model mainly comprises: circuit board 1 and heat-conductive assembly 2 etc. are partly, wherein this circuit board 1 is provided with the perforation 11 of at least one perforation, and be provided with the conducting wire 12(that connects each related electronic components in these 11 sides of boring a hole and can be copper-foil conducting electricity or carbon film), heat-conductive assembly 2 can be the straight plates sheet type body of radiating fin (or be provided with in addition), can be in its at least one surface via punching press or at least one tuck pointing portion 21 that protrudes from the surface of other processing mode moulding, the external diameter of this tuck pointing portion 21 is just smaller or be slightly larger than the internal diameter of this perforation 11, and be provided with this coating 22 of a coating 22(in the outer end of this tuck pointing portion 21 and can be plating or evaporation machine-shaping, to help carrying out weld job) with other position.
When using, can be with the power-type electronic building brick of heat source body 3(LED or other heating) be arranged at the position of a surface of this circuit board 1 with its pin 31 seam near this perforation 11, and with its heating face 32 towards this perforation 11, and this heat-conductive assembly 2 is by a surface installing of this circuit board 1 relative stow away from heat body 3, and with in its tuck pointing portion this perforation 11 of 21 embeddings, utilize the coating 22 in this tuck pointing portion 21 to be welded on the heating face 32 of this heat source body 3, to form a weld part 25, and between this heat-conductive assembly 2 and circuit board 1, can be two-sided tape with an adhesion layer 24(, viscose) binds mutually, making this heat source body 3(LED or electronic building brick) the long-pending heat that produced is able to conduct to via this heat-conductive assembly 2 opposite side of circuit board 1 in the work, externally disperse by these heat-conductive assembly 2 surfaces again.
Said structure more can be provided with several fins in these heat-conductive assembly 2 surfaces according to need when practical application, using increases area of dissipation and the effect that this heat-conductive assembly 2 contacts with air.
Therefore, above-mentioned heat-conductive assembly 2 is its simple structure not only, be easy to processing, and its precision is easy to control, be suitable for after above-mentioned heat source body 3 is machined in circuit board 1 in advance, again these heat-conductive assembly 2 processing are incorporated on the circuit board 1, so, except the processing that can make each heat source body 3 is not subjected to influencing in advance of heat-conductive assembly 2, even protruding from the degree and the heat source body 3 processing back reservations of circuit board 1, this tuck pointing portion 21 highly differs, it needs this tuck pointing portion 21 of control to protrude from perforation 11 outer height and is not less than the heating face 32 of this heat source body 3 and the preset clearance between the perforation 11, then utilize the elasticity of the pin 31 of this heat source body 3 and heat-conductive assembly 2 itself, be fitting tightly between available buffer and maintenance coating 22 and the heating face 32, and then guarantee the heat conducting high efficiency that reaches really.
See also Fig. 5, the another kind of form of using of heat-conductive assembly of the present utility model as can be known is: the 21a of tuck pointing portion in this heat-conductive assembly 2a can be set as various different section shapes, also can be set as taper, and can be set as a recess 23a in this 21a of tuck pointing portion dorsal part, then this heat-conductive assembly 2a can embed in the recess 23a of another heat-conductive assembly 2a by the 21a of tuck pointing portion, make variant heat-conductive assembly 2a be formed repeatedly and put, using increases its whole radiating effect.
Comprehensive the above, circuit board heat dissipation improved structure of the present utility model really can be reached the simplification form of production, and significantly promotes yield, and then can obviously reduce the effect of integral production cost, be the creation of a tool novelty and progressive in fact, file an application novel patent in accordance with the law; Only the content of above-mentioned explanation only is preferred embodiment explanation of the present utility model, and variation, modification, change or the equivalent replacement that is extended according to technological means of the present utility model and category also all should fall in the patent claim of the present utility model such as.

Claims (10)

1.. circuit board heat dissipation improved structure, it comprises circuit board and heat-conductive assembly at least, this circuit board has the perforation of at least one perforation, and the position near this perforation is provided with a heat source body in a surface of this circuit board, and the heating face of this heat source body is bored a hole corresponding to this; It is characterized in that: described heat-conductive assembly is arranged at another surface of the relative stow away from heat body of this circuit board, be provided with at least one tuck pointing portion of protruding the surface in this heat-conductive assembly, and this tuck pointing portion can be embedded in this perforation, and contact with the heating face of this heat source body, have heat conducting bonding state with formation.
2. circuit board heat dissipation improved structure as claimed in claim 1 is characterized in that: described tuck pointing portion is provided with a coating in the position that contacts with heat source body.
3. circuit board heat dissipation improved structure as claimed in claim 2, it is characterized in that: described coating is welded in the heating face of this heat source body.
4. as claim 1 or 2 or 3 described circuit board heat dissipation improved structures, it is characterized in that: the adhesion layer that is provided with a tool stickiness between described heat-conductive assembly and the circuit board.
5. as claim 1 or 2 or 3 described circuit board heat dissipation improved structures, it is characterized in that: described heat-conductive assembly surface is provided with the radiating fin that can increase area of dissipation.
6. circuit board heat dissipation improved structure as claimed in claim 4 is characterized in that: described heat-conductive assembly surface is provided with the radiating fin that can increase area of dissipation.
7. as claim 1 or 2 or 3 described circuit board heat dissipation improved structures, it is characterized in that: the dorsal part of described tuck pointing portion is established has recess, and this recess can be for the slotting knot of the tuck pointing portion of different heat-conductive assemblies, and forms coinciding of different heat-conductive assemblies.
8. circuit board heat dissipation improved structure as claimed in claim 4 is characterized in that: the dorsal part of described tuck pointing portion is established has recess, and this recess can be for the slotting knot of the tuck pointing portion of different heat-conductive assemblies, and forms coinciding of different heat-conductive assemblies.
9. circuit board heat dissipation improved structure as claimed in claim 5 is characterized in that: the dorsal part of described tuck pointing portion is established has recess, and this recess can be for the slotting knot of the tuck pointing portion of different heat-conductive assemblies, and forms coinciding of different heat-conductive assemblies.
10. as claim 1 or 2 or 3 described circuit board heat dissipation improved structures, it is characterized in that: the height of described tuck pointing portion is greater than the length of perforation, and the clearance distance of this tuck pointing portion height of protruding perforation between boring a hole with this greater than the heating face of this heat source body.
CN2010206221908U 2010-11-24 2010-11-24 Improved radiating structure of circuit board CN201904999U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010206221908U CN201904999U (en) 2010-11-24 2010-11-24 Improved radiating structure of circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010206221908U CN201904999U (en) 2010-11-24 2010-11-24 Improved radiating structure of circuit board

Publications (1)

Publication Number Publication Date
CN201904999U true CN201904999U (en) 2011-07-20

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013067840A1 (en) * 2011-11-09 2013-05-16 东莞勤上光电股份有限公司 Method of manufacturing heat sink structure for high-power led
CN105283031A (en) * 2014-07-11 2016-01-27 台达电子工业股份有限公司 Heat dissipation module and combination method
WO2016107020A1 (en) * 2015-01-04 2016-07-07 袁志贤 Led display screen
CN106471871A (en) * 2014-07-22 2017-03-01 株式会社自动网络技术研究所 Circuit structure
CN107318236A (en) * 2016-04-27 2017-11-03 佳邦科技股份有限公司 Portable electronic product and the heat dissipation type shell mechanism for portable electronic product
CN108093600A (en) * 2016-11-23 2018-05-29 鸿富锦精密工业(武汉)有限公司 The electronic device of heat sink and the application heat sink
WO2019184674A1 (en) * 2018-03-26 2019-10-03 华为技术有限公司 Heat-conducting assembly and terminal

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013067840A1 (en) * 2011-11-09 2013-05-16 东莞勤上光电股份有限公司 Method of manufacturing heat sink structure for high-power led
CN105283031A (en) * 2014-07-11 2016-01-27 台达电子工业股份有限公司 Heat dissipation module and combination method
CN106471871A (en) * 2014-07-22 2017-03-01 株式会社自动网络技术研究所 Circuit structure
WO2016107020A1 (en) * 2015-01-04 2016-07-07 袁志贤 Led display screen
CN107318236A (en) * 2016-04-27 2017-11-03 佳邦科技股份有限公司 Portable electronic product and the heat dissipation type shell mechanism for portable electronic product
CN107318236B (en) * 2016-04-27 2019-12-17 佳邦科技股份有限公司 portable electronic product and heat dissipation type shell structure for same
CN108093600A (en) * 2016-11-23 2018-05-29 鸿富锦精密工业(武汉)有限公司 The electronic device of heat sink and the application heat sink
WO2019184674A1 (en) * 2018-03-26 2019-10-03 华为技术有限公司 Heat-conducting assembly and terminal

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GR01 Patent grant
C14 Grant of patent or utility model
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110720

Termination date: 20121124

C17 Cessation of patent right