CN202032491U - LED welding-free mounting structure with low thermal resistance and LED lamp fitting adopting structure - Google Patents
LED welding-free mounting structure with low thermal resistance and LED lamp fitting adopting structure Download PDFInfo
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- CN202032491U CN202032491U CN2011200788666U CN201120078866U CN202032491U CN 202032491 U CN202032491 U CN 202032491U CN 2011200788666 U CN2011200788666 U CN 2011200788666U CN 201120078866 U CN201120078866 U CN 201120078866U CN 202032491 U CN202032491 U CN 202032491U
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- led
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- radiator
- led lamp
- lamp pearl
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Abstract
An LED lamp fitting with an LED welding-free mounting structure with low thermal resistance comprises a substrate, LED bulbs, a radiator, a front shell and an LED driving power source. The LED lamp fitting is characterized in that an electronic circuit is printed at the bottom of the substrate, through holes are arranged on the substrates, the diameter of each through hole is equal to or larger than that of each LED bulb body, the LED bulbs are embedded in the through holes, bottoms of the LED bulbs contact with the radiator fixed to the bottom of the substrate, LED pressing sheets made of insulation flame-retardant materials are further disposed between the substrate and the radiator, pins of the LED bulbs are tightly combined with the electronic circuit printed on the bottom surface of the substrate under action of the LED press sheets, and the front shell is connected with the radiator.
Description
Technical field
The utility model relates to a kind of LED mounting structure, and particularly a kind of LED low thermal resistance is exempted from soldering mounting structure and a kind of LED light fixture that adopts this structure.
Background technology
Along with the enhancing of people's environmental consciousness, the LED(light emitting diode of environmental protection and energy saving, Light Emitting Diode) light fixture enters the illumination application market gradually.The LED industrial technology constantly develops, but the heat power consumption of LED is still bigger, and this part heat energy is dispersed and will directly be influenced luminous efficiency and the service life of LED as if can not in time conducting, and therefore, industry is very paid attention to the heat radiation research of LED.
Most at present LED illuminating lamp products, its thermoelectric structure is the encapsulated moulding led module to be welded in one comprise on the substrate (resin PCB or thermal conductance preferred metal composite base plates such as aluminium, copper) that is electrically connected circuit basically, be connected on radiator and the light fixture, at first need in this structure the LED solder joints to substrate, this electric connecting mode is easy to LED itself is produced directly injury, as: rosin joint, the too high damage of temperature etc., and produce many product quality hidden danger thus.Secondly, the power-consumption heat of LED itself need pass through LED itself, substrate, and links such as radiator and shell just can diffuse in the air, and link is many, and thermal resistance is big, and actual radiating effect is unsatisfactory.Though industry has the particular design radiator can solve heat dissipation problem better, need mostly the manufacturing process of more complicated with than higher manufacturing cost, be difficult to popularize.
The utility model content
For satisfying the needs in market, the utility model proposes a kind of LED mounting structure and a kind of LED light fixture that adopts described structure that low thermal resistance great heat radiation effect and that be applicable to the high-power LED lamp use exempts to weld that have.
The technical solution adopted in the utility model can be described as:
A kind of LED low thermal resistance is exempted from soldering mounting structure, the LED lamp pearl and the radiator that comprise substrate, encapsulated moulding, wherein said base plate bottom is printed with electronic circuit, and have a through hole that diameter is equal to, or greater than described LED lamp pearl main diameter, described LED lamp pearl is inlaid in the described through hole, and its bottom contacts with the radiator that is fixed on base plate bottom; Also be provided with between described substrate and the described radiator by the made LED compressing tablet of insulation fire proofing, the pin of described LED lamp pearl is combined closely with the electronic circuit that is printed on substrate bottom surface under the pressure effect of described LED compressing tablet.
As a kind of improvement of above technical scheme, be coated with soft Heat Conduction Material between described LED lamp pearl and the described radiator.
As a kind of improvement of above technical scheme, adopt the conductive material welding manner to be connected between the pin of the electronic circuit on the described substrate and described LED lamp pearl.
As a kind of improvement of above technical scheme, described substrate top surface is provided with the made supporting construction of strong rigid material.
As a kind of improvement of above technical scheme, described substrate adopts the flexible compound wiring board.
As a kind of improvement of above technical scheme, described substrate adopts Metal Substrate composite line plate.
The utility model has also proposed a kind of LED light fixture that adopts above structure, it comprises substrate, LED lamp pearl, radiator, front casing and LED driving power, it is characterized in that: described base plate bottom is printed with electronic circuit, and have a through hole that diameter is equal to, or greater than described LED lamp pearl main diameter, described LED lamp pearl is inlaid in the described through hole, and its bottom contacts with the radiator that is fixed on base plate bottom; Also be provided with between described substrate and the described radiator by the made LED compressing tablet of insulation fire proofing, the pin of described LED lamp pearl is combined closely with the electronic circuit that is printed on substrate bottom surface under the effect of described LED compressing tablet; Described front casing is connected with described radiator.
The beneficial effects of the utility model are:
The utility model has the through hole that is equal to or greater than the LED module on circuit substrate, the bottom of LED lamp pearl directly contacts with radiator by described through hole, and the pin of LED lamp pearl is connected with the copper foil circuit that is arranged on the substrate back by compressing tablet.Like this, the bottom of LED lamp pearl directly is connected with radiator, has reduced thermal resistance, and radiating effect is effectively improved, and in addition, the pin of LED lamp pearl does not need to be connected with wiring board by welding manner, has avoided causing in the welding process damage of LED lamp pearl.This shows that the low cost that the utility model discloses a kind of LED of being used for module installation exempts to weld the low thermal resistance mounting structure, and the high-power LED lamp that a kind of production cost is lower, the product expansion is more flexible, radiating effect is better is provided in view of the above.
Description of drawings
Fig. 1 exempts from the schematic diagram of soldering mounting structure for LED low thermal resistance of the present utility model;
Fig. 2 exempts from the structural representation of welded LED light fixture for adopting described low thermal resistance.
The specific embodiment
As shown in Figure 1, the low thermal resistance of a kind of LED module that the utility model proposed is exempted from soldering mounting structure, comprises substrate 1, LED lamp pearl 2, radiator 3 and the LED compressing tablet 4 of encapsulated moulding.Wherein said substrate 1 is copper-clad plate, and its bottom surface is printed with electric wiring, also is provided with on the described substrate 1 and described LED lamp pearl 2 the same number of through holes 11, and the diameter of described through hole 11 equals or be slightly larger than the appearance and size of described LED lamp pearl 2.
During installation, the LED lamp pearl 2 of described encapsulated moulding is gone in the through hole 11 of substrate 1 by following direct up intercalation, and substrate 1 fixes by screw, buckle or other mechanical fasteners modes and radiator 3.Like this, the pressure that utilizes described substrate 1 to be fastenedly connected on the radiator 3 just directly contacts the bottom of LED lamp pearl 2 with the top of described radiator 3, avoided the thermal resistance that mediate contact brought, and has increased heat dispersion.
In addition, also clamped LED compressing tablet 4 between described radiator 3 and the substrate 1, described LED compressing tablet 4 is made by the heat resistant plastice or the heat resistance fiber of fire retardant insulating that (but it is not limited only to these materials, other reaches to difficulty combustion and non-conductive purpose material and all can adopt), its thickness is slightly larger than the gap between radiator 3 and the substrate 1.Through hole 11 both sides that substrate 1 is printed with the circuit one side are printed with metal spraying or the spray soldering dish that is a bit larger tham LED pin 21 overall size sizes, during installation, the pin 21 that is inlaid in the LED lamp pearl 2 in the through hole 11 is placed on the corresponding bonding pad, in the good bond that has realized under the pressure effect of LED compressing tablet 4 exempting to weld between pin 21 and the circuit.This exempts from the degree of oxidation that Welding Structure has not only reduced pin 21, the more important thing is that it has avoided in the welding process heat to the infringement of LED lamp pearl 2 effectively.
Certainly, be to strengthen the performance that is electrically connected between substrate 1 and the LED pin 21, can adopt the conductive material welding manner to be connected between the pin 21 of substrate 1 and LED lamp pearl 2.
For improving the heat conduction between LED lamp pearl 2 and radiator 3 contact surfaces, be coated with soft Heat Conduction Material between LED lamp pearl 2 and the radiator 3, such as heat dissipating silicone grease.
For strengthening the pressure that contacts between effect and maintenance LED mould lamp pearl 2 and the radiator 3 of being electrically connected between substrate 1 and the LED lamp pearl 2, above substrate 1, add by the made supporting construction 5 of strong rigid material.
In like manner, for strengthening the pressure that contacts between effect and maintenance LED lamp pearl 2 and the radiator 3 of being electrically connected between substrate 1 and the LED lamp pearl 2, and obtain extra heat-sinking capability, substrate 1 can adopt metal substrate, such as aluminium base.Certainly, because the existence of supporting construction 5, substrate 1 also can adopt flexible composite line plate as required.
The utility model also provides a kind of heat dispersion good high-power LED lamp on the basis of above-described structure, comprise substrate 1, LED lamp pearl 2, radiator 3, front casing 6 and LED driving power, wherein the connection between substrate 1, LED lamp pearl 2 and the radiator 3 is consistent with aforementioned structure.Radiator 3 tops be provided with lay substrate 1 and and LED lamp pearl 2 contacted planes, have the radiating fin of sheet or column bottom it.Described front casing 6 is provided with the light-passing board 61 that allows light pass through, and with described radiator 3 by being threaded, substrate 1 and LED lamp pearl 2 electronic components such as grade are placed in the cavity that radiator 3 and front casing 6 formed, described LED driving power then by the through hole on the radiator 3 directly and substrate 1 be electrically connected.Like this, described radiator 3 just becomes the rear casing of whole light fixture, has simplified the structure of light fixture and has strengthened heat-sinking capability simultaneously.
The characteristics of the mounting structure of the LED module that the utility model proposed are that its LED lamp pearl directly contacts with radiator and the pin of described lamp pearl adopts the pressing mode to be connected with wiring board, not only reduced the link of heat passage, promoted radiating effect, also reduced the relevant production process of welding, avoided by the welding problem of bringing, also improved the quality stability of product simultaneously, with the degree of flexibility of production line.
Claims (7)
1. a LED low thermal resistance is exempted from soldering mounting structure, comprise substrate (1), LED lamp pearl (2) and radiator (3), it is characterized in that: described substrate (1) bottom is printed with electronic circuit, and have a through hole (11) that diameter is equal to, or greater than described LED lamp pearl (2) main diameter, described LED lamp pearl (2) is inlaid in the described through hole (11), and its bottom contacts with the radiator (3) that is fixed on substrate (1) bottom; Also be provided with between described substrate (1) and the described radiator (3) by the made LED compressing tablet (4) of insulation fire proofing, the pin (21) of described LED lamp pearl (2) is combined closely with the electronic circuit that is printed on substrate (1) bottom surface under the effect of described LED compressing tablet (4).
2. a kind of LED low thermal resistance according to claim 1 is exempted from soldering mounting structure, it is characterized in that: be coated with soft Heat Conduction Material between described LED lamp pearl (2) and the described radiator (3).
3. a kind of LED low thermal resistance according to claim 1 is exempted from soldering mounting structure, it is characterized in that: adopt the conductive material welding manner to be connected between the pin (21) of the electronic circuit on the described substrate (1) and described LED lamp pearl (2).
4. a kind of LED low thermal resistance according to claim 1 is exempted from soldering mounting structure, it is characterized in that: described substrate (1) end face is provided with the made supporting construction of strong rigid material (5).
5. a kind of LED low thermal resistance according to claim 1 is exempted from soldering mounting structure, it is characterized in that: described substrate (1) adopts the flexible compound wiring board.
6. a kind of LED low thermal resistance according to claim 1 is exempted from soldering mounting structure, it is characterized in that: described substrate (1) adopts Metal Substrate composite line plate.
7. the LED light fixture of soldering mounting structure is exempted from an employing according to each described a kind of LED low thermal resistance among the claim 1-6, comprise substrate (1), LED lamp pearl (2), radiator (3), front casing (6) and LED driving power, it is characterized in that: described substrate (1) bottom is printed with electronic circuit, and have a through hole (11) that diameter is equal to, or greater than described LED lamp pearl (2) main diameter, described LED lamp pearl (2) is inlaid in the described through hole (11), its bottom contacts with the radiator (3) that is fixed on substrate (1) bottom, also be provided with between described substrate (1) and the described radiator (3) by the made LED compressing tablet (4) of insulation fire proofing, the pin (21) of described LED lamp pearl (2) is combined closely with the electronic circuit that is printed on substrate (1) bottom surface under the effect of described LED compressing tablet (4); Described front casing (6) is connected with described radiator (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200788666U CN202032491U (en) | 2011-03-23 | 2011-03-23 | LED welding-free mounting structure with low thermal resistance and LED lamp fitting adopting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200788666U CN202032491U (en) | 2011-03-23 | 2011-03-23 | LED welding-free mounting structure with low thermal resistance and LED lamp fitting adopting structure |
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| CN202032491U true CN202032491U (en) | 2011-11-09 |
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| CN2011200788666U Expired - Fee Related CN202032491U (en) | 2011-03-23 | 2011-03-23 | LED welding-free mounting structure with low thermal resistance and LED lamp fitting adopting structure |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014015537A1 (en) * | 2012-07-21 | 2014-01-30 | Shen Zhenxu | 360-degree light-emitting led fluorescent tube |
| WO2014106462A2 (en) * | 2013-01-02 | 2014-07-10 | Ma Fei | Welding-free smd led light fixture structure |
| CN104654076A (en) * | 2014-12-31 | 2015-05-27 | 东莞市羽柏电子有限公司 | LED (Light Emitting Diode) module |
| CN105682359A (en) * | 2016-01-18 | 2016-06-15 | 冯俊谊 | PCB and surface mounting process therefor |
| CN106168654A (en) * | 2016-01-06 | 2016-11-30 | 常州市武进区半导体照明应用技术研究院 | A kind of RTA reliability test assembly that can collect LED electrical parameter number online |
-
2011
- 2011-03-23 CN CN2011200788666U patent/CN202032491U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014015537A1 (en) * | 2012-07-21 | 2014-01-30 | Shen Zhenxu | 360-degree light-emitting led fluorescent tube |
| WO2014106462A2 (en) * | 2013-01-02 | 2014-07-10 | Ma Fei | Welding-free smd led light fixture structure |
| WO2014106462A3 (en) * | 2013-01-02 | 2014-08-28 | Ma Fei | Welding-free smd led light fixture structure |
| CN104654076A (en) * | 2014-12-31 | 2015-05-27 | 东莞市羽柏电子有限公司 | LED (Light Emitting Diode) module |
| CN106168654A (en) * | 2016-01-06 | 2016-11-30 | 常州市武进区半导体照明应用技术研究院 | A kind of RTA reliability test assembly that can collect LED electrical parameter number online |
| CN105682359A (en) * | 2016-01-18 | 2016-06-15 | 冯俊谊 | PCB and surface mounting process therefor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111109 Termination date: 20130323 |