CN203260619U - Novel high-heat-conductivity COB substrate - Google Patents
Novel high-heat-conductivity COB substrate Download PDFInfo
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- CN203260619U CN203260619U CN 201320166776 CN201320166776U CN203260619U CN 203260619 U CN203260619 U CN 203260619U CN 201320166776 CN201320166776 CN 201320166776 CN 201320166776 U CN201320166776 U CN 201320166776U CN 203260619 U CN203260619 U CN 203260619U
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Abstract
The utility model discloses a novel high-heat-conductivity COB substrate. The novel high-heat-conductivity COB substrate comprises a heat-conducting metal base plate. An insulating material layer is arranged on the heat-conducting metal base plate. The insulating material layer is provided with a packaging groove communicated with the heat-conducting metal base plate. Conducting strips are packaged in the insulating material layer. The conducting strips are connected with pin conducting ends. Compared with the prior art, the novel high-heat-conductivity COB substrate has the advantages that LED chips are directly fixed on the metal base plate, and heat generated by the chips is directly conducted to the base plat since there is no isolation of an insulating layer, so that heat-dissipation thermal resistances of the chips are reduced, and heat conduction efficiency is increased; fixing screw holes are arranged on the metal base plate, so that the product failure caused by that the insulating material layer and a circuit board are compressed in the process of installation is prevented; the pin conducting ends are arranged far away from a packaging region, so that a reflection cup is prevented against a short circuit caused by being contacted with an electrode in the process of covering the reflection cup. Bright silver layers are arranged on the surfaces of the heat-conducting metal base plate and the conducting strips, and by adopting a silver plating mode or a silver precipitating mode, film formation quality is good, so that light reflection is increased, and light emerging efficiency is greatly increased.
Description
[technical field]
The utility model relates to novel high heat conduction COB substrate, is specifically related to a kind of high thermal conductive substrate for the COB encapsulation.
[background technology]
Usually LED high power products input power has 35% to convert light to approximately, and remaining about 65% electric energy directly is converted to heat energy.If can't in time derive, will make LED knot surface temperature too high, and then affect product life cycle, luminous efficiency and stability.The COB encapsulating structure that existing market is traditional mainly is to adopt the mode of led chip integration packaging on substrate.Adopt metal substrate to carry out in the mode of led chip encapsulation, because the high-power LED chip caloric value is large, heat is concentrated, and insulating barrier is arranged on the metal substrate, and the insulating barrier heat-conducting effect is poor, to cause the reduction of product light efficiency, light decay to increase, thereby cause the LED product failure.Ceramic substrate good heat dissipation effect but its cost is high, light efficiency is low also not to be desirable baseplate material.
[utility model content]
The purpose of this utility model is to overcome the deficiencies in the prior art part, provides that a kind of to have heat conduction good, and light emission rate is high, manufacture craft high reflectance and the good COB base plate for packaging of heat conduction simple and with low cost.
The purpose of this utility model is achieved in that
Novel high heat conduction COB substrate, it is characterized in that it comprises heat-conducting metal substrate, heat-conducting metal substrate is provided with the insulation material layer that adopts one-shot forming technique to make, insulation material layer is provided with the encapsulation groove that communicates with the heat dissipation metal substrate, be packaged with conducting strip in the insulation material layer, conducting strip is connected with the pin conducting end.
Aforesaid novel high heat conduction COB substrate, it is characterized in that described encapsulation groove comprises rounded bottom surface and the outer ring conducting strip that is located at the rounded bottom surface periphery, be provided with insulating barrier between described rounded bottom surface and the outer ring conducting strip, the outer ring conducting strip is divided into a plurality of conducting strips by insulating material.
Aforesaid novel high heat conduction COB substrate, it is characterized in that: the positive and negative polar region of described outer ring conducting strip respectively is provided with 3.
Aforesaid novel high heat conduction COB substrate, it is characterized in that: the edge of described encapsulation groove is provided with box dam.
Aforesaid novel high heat conduction COB substrate is characterized in that vertical connection between described box dam and the insulation material layer upper surface.
Aforesaid novel high heat conduction COB substrate is characterized in that arc transition is joined between described box dam and the insulation material layer upper surface.
Aforesaid novel high heat conduction COB substrate is characterized in that the place, diagonal angle of insulation material layer respectively is provided with a fixing threaded hole position that is used for fixing cooling fins, and heat-conducting metal substrate is provided with the fixing threaded hole that is positioned at lower end, fixing threaded hole position.
Aforesaid novel high heat conduction COB substrate is characterized in that the surface of described heat-conducting metal substrate is provided with the silver lustre layer.
Aforesaid novel high heat conduction COB substrate is characterized in that the surface of described conducting strip is provided with the silver lustre layer.
Aforesaid novel high heat conduction COB substrate is characterized in that described silver lustre layer thickness is 0.1～10um.
The utility model advantage compared with prior art:
1, compare traditional C OB encapsulation, led chip is directly fixed on metal substrate, and because of the isolation of naked layer, the chip heating can directly be conducted in substrate, reduces the chip cooling thermal resistance, promotes heat transfer efficiency.
2, compare traditional C OB encapsulation, the product failure that insulating barrier and circuit board caused because of pressurized when fixing threaded hole placed metal substrate effectively to prevent from installing.
3, the pin conducting end from encapsulation region away from, thereby the short circuit that button can effectively avoid the reflector contact electrode to cause during reflector.
4, compare traditional C OB encapsulation, heat-conducting metal substrate and conducting strip surface are equipped with the silver lustre layer, adopt silver-plated or heavy silver-colored mode quality of forming film good, have increased reflection of light, significantly improving extraction efficiency.
5, compare traditional C OB encapsulation, conducting strip be provided with 3 respectively connecting circuit design, realize the personalization regulation and control of full-color light-emitting and luminous intensity, luminous color etc.
6, the box dam of encapsulation groove periphery is higher than peripheral insulating material and with the insulating material Surface Vertical or littlely incline, according to reflector bore design box dam external diameter, can directly fixes reflector.
[description of drawings]
Fig. 1 is stereogram of the present utility model;
Fig. 2 is stereogram of the present utility model.
Fig. 3 is end view of the present utility model.
[embodiment]
Novel high heat conduction COB substrate, it comprises heat-conducting metal substrate 1, heat-conducting metal substrate 1 is provided with the insulation material layer 2 that adopts one-shot forming technique to make, insulation material layer 2 is provided with the encapsulation groove 3 that communicates with heat dissipation metal substrate 1, be packaged with conducting strip 4 in the insulation material layer 2, conducting strip 4 is connected with pin conducting end 5, heat-conducting metal substrate 1 adopts copper, iron, aluminium or high thermal conductivity alloy are made, conducting strip adopts copper, iron, aluminium or alloy are made, heat-conducting metal substrate 1 and conducting strip surface adopt silver-plated or heavy silver process to generate the high silver lustre layer of the good reflectivity of one deck quality of forming film, and the silver lustre layer thickness is 0.1～10um.
The edge of encapsulation groove 3 is provided with box dam 33.Difference in height between box dam 33 and insulation material layer 2 upper surfaces is 0.1～5mm.Vertical connection between box dam 33 and insulation material layer 2 upper surfaces.Perhaps join for arc transition between box dam 33 and insulation material layer 2 upper surfaces.
Heat-conducting metal substrate 1 of the present utility model and insulation material layer 2 are square, the wherein pair of horns place of insulation material layer 2 respectively is provided with 1 fixing threaded hole position 21 that is used for fixing cooling fins, and heat-conducting metal substrate 1 is provided with the fixing threaded hole 11 that is positioned at 1 lower end, fixing threaded hole position.
Fan-shaped metal pins end 51 is preferential connectivity port, metal pins conducting end 52,53 is auxiliary connectivity port, metal pins conducting end 52,53 common phosphors excited white light LED directly are connected to fan-shaped metal pins end 51 when connecting one road circuit outward, fan-shaped metal pins end 51 areas are larger, when having multiplex circuit to connect, can be connected to metal pins conducting end 52,53 and make up adjustment, realize luminous personalization regulation and control.Wherein the encapsulation region box dam 33 of fan-shaped metal pins end 4 and encapsulation groove 3 is apart from 2-10mm.
Claims (10)
1. novel high heat conduction COB substrate, it is characterized in that it comprises heat-conducting metal substrate (1), heat-conducting metal substrate (1) is provided with the insulation material layer (2) that adopts one-shot forming technique to make, insulation material layer (2) is provided with the encapsulation groove (3) that communicates with heat dissipation metal substrate (1), be packaged with conducting strip (4) in the insulation material layer (2), conducting strip (4) is connected with pin conducting end (5).
2. novel high heat conduction COB substrate according to claim 1, it is characterized in that described encapsulation groove (3) comprises rounded bottom surface (31) and is located at the peripheral outer ring conducting strip (32) of rounded bottom surface (31), be provided with insulating barrier (30) between described rounded bottom surface (31) and the outer ring conducting strip (32), outer ring conducting strip (32) is divided into a plurality of conducting strips (4) by insulating material.
3. novel high heat conduction COB substrate according to claim 2, it is characterized in that: the positive and negative polar region of described outer ring conducting strip (32) respectively is provided with 3.
4. novel high heat conduction COB substrate according to claim 2, it is characterized in that: the edge of described encapsulation groove (3) is provided with box dam (33).
5. novel high heat conduction COB substrate according to claim 4 is characterized in that vertical connection between described box dam (33) and insulation material layer (2) upper surface.
6. novel high heat conduction COB substrate according to claim 4 is characterized in that arc transition is joined between described box dam (33) and insulation material layer (2) upper surface.
7. novel high heat conduction COB substrate according to claim 1, the place, diagonal angle that it is characterized in that insulation material layer (2) respectively is provided with 1 fixing threaded hole position (21) that is used for fixing cooling fins, and heat-conducting metal substrate (1) is provided with the fixing threaded hole (11) that is positioned at lower end, fixing threaded hole position (1).
8. novel high heat conduction COB substrate according to claim 1 is characterized in that the surface of described heat-conducting metal substrate (1) is provided with the silver lustre layer.
9. novel high heat conduction COB substrate according to claim 1 is characterized in that the surface of described conducting strip (4) is provided with the silver lustre layer.
10. according to claim 8 or 9 described novel high heat conduction COB substrates, it is characterized in that described silver lustre layer thickness is 0.1～10um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320166776 CN203260619U (en) | 2013-04-03 | 2013-04-03 | Novel high-heat-conductivity COB substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320166776 CN203260619U (en) | 2013-04-03 | 2013-04-03 | Novel high-heat-conductivity COB substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203260619U true CN203260619U (en) | 2013-10-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320166776 Expired - Fee Related CN203260619U (en) | 2013-04-03 | 2013-04-03 | Novel high-heat-conductivity COB substrate |
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| Country | Link |
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| CN (1) | CN203260619U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103855286A (en) * | 2014-02-20 | 2014-06-11 | 博罗承创精密工业有限公司 | LED supporting frame, manufacturing method of LED supporting frame and double-material belt LED supporting frame module |
| CN111640846A (en) * | 2020-05-25 | 2020-09-08 | 旭宇光电（深圳）股份有限公司 | Deep ultraviolet LED packaging and lamp |
-
2013
- 2013-04-03 CN CN 201320166776 patent/CN203260619U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103855286A (en) * | 2014-02-20 | 2014-06-11 | 博罗承创精密工业有限公司 | LED supporting frame, manufacturing method of LED supporting frame and double-material belt LED supporting frame module |
| CN103855286B (en) * | 2014-02-20 | 2016-09-21 | 博罗承创精密工业有限公司 | LED support and preparation method thereof and double material strips LED support module |
| CN111640846A (en) * | 2020-05-25 | 2020-09-08 | 旭宇光电（深圳）股份有限公司 | Deep ultraviolet LED packaging and lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180409 Address after: 66 photoelectric industry garden, Lijiang Road, Yancheng City economic and Technological Development Zone, Jiangsu 224000, China Patentee after: Yancheng East Photoelectric Technology Co., Ltd. Address before: Seven Lanes and 528400 industrial zones in Guangdong Province, Zhongshan city town Tongyi Industrial Zone Patentee before: Zhongshan City Guangsheng Semiconductor Science & Technology Co., Ltd. |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131030 Termination date: 20190403 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |