CN103855286B - LED support and preparation method thereof and double material strips LED support module - Google Patents
LED support and preparation method thereof and double material strips LED support module Download PDFInfo
- Publication number
- CN103855286B CN103855286B CN201410061413.0A CN201410061413A CN103855286B CN 103855286 B CN103855286 B CN 103855286B CN 201410061413 A CN201410061413 A CN 201410061413A CN 103855286 B CN103855286 B CN 103855286B
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- Prior art keywords
- copper
- aluminum
- lead foot
- plastic cement
- led support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Abstract
Open a kind of LED support of the present invention and preparation method thereof and double material strips LED support module, this LED support includes plastic cement seat and the aluminum matter paster being arranged on plastic cement seat and copper lead foot；It is provided with package cavity on this plastic cement seat；This aluminum matter paster has die bond portion, and the surface in this die bond portion is exposed in package cavity, and the bottom surface of aluminum matter paster is exposed to the bottom surface of plastic cement seat；This copper lead foot includes bonding wire portion and the weld part of one-body molded connection, and bonding wire portion is exposed in package cavity, and weld part is exposed to outside plastic cement seat；This double material strips LED support module includes aluminum bracket, copper coin support and multiple plastic cement seat；By using aluminum material as paster, and coordinate employing copper material as lead foot, on the premise of ensureing that radiating effect is unaffected, effectively prevent the sulfuration problem that die bond bonding wire region occurs, Improving The Quality of Products, improves the reflectance of product, improves the brightness of product, wattage can be risen to 14W by original 7W, so that the serviceability of product is more preferably.
Description
Technical field
The present invention relates to LED field technology, refer in particular to a kind of LED support and preparation method thereof and double material strips LED support module.
Background technology
LED(Light Emitting Diode, light emitting diode) it is the semiconductor device of a kind of solid-state, it can directly convert electrical energy into light, it has, and volume is little, power consumption is low, length in service life, high brightness, low in calories, environmental protection, the advantage such as sturdy and durable, be one of optimal light source.
It is known that this LED support includes using the insulating base that plastic cement is made and the metal rack fixed by this insulating base；This metal rack includes metal patch and is arranged at the metal lead foot that metal patch side is other, and this metal patch is used for fixing LED chip and can playing thermolysis, and this metal lead foot is for being welded to connect with external circuit.But, in the prior art, this metal rack generally copper material, cause die bond bonding wire region to be susceptible to sulfuration problem, affect product quality, and the reflectance of product is low, the brightness to product impacts, so that the serviceability of product is the best at present.Additionally, in prior art, the bonding wire portion of two metal lead foots lays respectively in two diagonal planes of insulating base, the bonding wire mode making metal lead foot is only capable of being gradient mode bonding wire, gradient mode bonding wire can only use manual welding, it is impossible to carries out automatic welding, thus is unfavorable for quickly realizing assembling product.
Summary of the invention
In view of this, the present invention is directed to the disappearance of prior art existence, its main purpose is to provide a kind of LED support and preparation method thereof and double material strips LED support module, and it can effectively solve the problem that existing LED support die bond bonding wire region is susceptible to vulcanize and product emissivity is low.
For achieving the above object, the present invention uses such as purgation technical scheme:
A kind of LED support, includes plastic cement seat and the aluminum matter paster being arranged on plastic cement seat and copper lead foot；It is provided with package cavity on this plastic cement seat；This aluminum matter paster has die bond portion, and the surface in this die bond portion is exposed in package cavity, and the bottom surface of aluminum matter paster is exposed to the bottom surface of plastic cement seat；This copper lead foot includes bonding wire portion and the weld part of one-body molded connection, and bonding wire portion is exposed in package cavity, and weld part is exposed to outside plastic cement seat.
As a kind of preferred version, described aluminum matter paster is specular aluminium material.
As a kind of preferred version, between described aluminum matter paster and copper lead foot, dislocation is formed with difference in height up and down, and aluminum matter paster is positioned at the lower section of copper lead foot.
As a kind of preferred version, described copper lead foot includes positive pole lead foot and negative pole lead foot, the weld part of positive pole lead foot and the weld part of negative pole lead foot lay respectively at two diagonal positions of plastic cement seat, and the bonding wire portion of positive pole lead foot and the bonding wire portion of negative pole lead foot extend and the most symmetrical both sides being positioned at die bond portion along the two relative side of plastic cement seat respectively.
As a kind of preferred version, it is provided with negative pole identification on described plastic cement seat to indicate, this negative pole identification indicates the top being positioned at negative pole lead foot, this negative pole identification is denoted as a circular hole, and this plastic cement seat has the covering part for preventing creepage phenomenon, this covering part wraps the polarity marker location of copper lead foot.
As a kind of preferred version, described aluminum matter paster and copper lead foot are provided with the structure that gets stuck, this aluminum matter paster and copper lead foot are provided with red ink antiseepage through groove.
As a kind of preferred version, the bottom surface of described plastic cement seat is provided with the hole, location for withstanding copper lead foot.
A kind of double material strips LED support module, includes aluminum bracket, copper coin support and multiple plastic cement seat；This aluminum bracket includes aluminum material band and the multiple aluminum matter pasters that are connected one-body molded with aluminum material band；This copper coin support includes copper material strip and many group copper lead foots being connected one-body molded with copper material strip, together with this copper material strip is folded each other be located at aluminum material band, each group of copper lead foot is positioned at by the side of aluminum matter paster of correspondence, one group of copper lead foot, an aluminum matter paster and a plastic cement seat produced by insert molding and constitute aforementioned LED support.
As a kind of preferred version, described copper material strip is laminated on the top of aluminum material band.
A kind of manufacture method of LED support, it is characterised in that: include following steps:
(1) producing aluminum bracket and copper coin support by impact style, this aluminum bracket includes aluminum material band and the multiple aluminum matter pasters that are connected one-body molded with aluminum material band；This copper coin support includes copper material strip and many group copper lead foots being connected one-body molded with copper material strip；
(2) copper coin support being laminated on aluminum bracket and puts in mould, each group of copper lead foot is positioned at by the side of aluminum matter paster of correspondence；
(3) each group of copper lead foot constitutes LED support with corresponding aluminum matter paster and corresponding plastic cement seat produced by insert molding, thus has obtained double material strips LED support module；
(4) the connection cut-out between each group of copper lead foot and copper material strip is separated, and the connection cut-out between each aluminum matter paster and aluminum material band is separated.
The present invention compared with prior art has clear advantage and beneficial effect, specifically, as shown from the above technical solution:
One, by using aluminum material as paster, and coordinate employing copper material as lead foot, on the premise of ensureing that radiating effect is unaffected, effectively prevent the sulfuration problem that die bond bonding wire region occurs, improve product quality, improve the reflectance of product simultaneously, improve the brightness of product, wattage can be risen to 14W by original 7W, so that the serviceability of product is more preferably.
Two, by the bonding wire portion of positive pole lead foot and the bonding wire portion of negative pole lead foot are extended and the most symmetrical both sides being positioned at die bond portion along the two relative side of plastic cement seat respectively, so when die bond bonding wire, left and right mode bonding wire can be used, instead of the gradient mode bonding wire of tradition, left and right mode bonding wire can use automatic welding to realize, thus be beneficial to quickly realize assembling product, improve assembling product efficiency.
Three, by copper coin support being laminated on aluminum bracket and putting into injection mo(u)lding in mould so that the manufacture method of product is simple, it is simple to realizes mass production, thus is beneficial to reduce production cost.
For more clearly illustrating architectural feature and effect of the present invention, next with specific embodiment below in conjunction with the accompanying drawings the present invention is described in detail.
Accompanying drawing explanation
Fig. 1 is the front schematic perspective view of LED support in the preferred embodiments of the invention；
Fig. 2 is the reverse side schematic perspective view of LED support in the preferred embodiments of the invention；
Fig. 3 is the exploded view of LED support in the preferred embodiments of the invention；
Fig. 4 is the front view of LED support in the preferred embodiments of the invention；
Fig. 5 is the sectional view in A-A direction in Fig. 4；
Fig. 6 is the sectional view in B-B direction in Fig. 4；
Fig. 7 is the schematic perspective view of plastic cement seat in the preferred embodiments of the invention；
Fig. 8 is the front schematic perspective view of double material strips LED support module in the preferred embodiments of the invention；
Fig. 9 is the reverse side schematic perspective view of double material strips LED support module in the preferred embodiments of the invention；
Figure 10 is the schematic perspective view of aluminum bracket in the preferred embodiments of the invention；
Figure 11 is the schematic perspective view of copper coin support in the preferred embodiments of the invention.
Accompanying drawing identifier declaration:
10, plastic cement seat
11, package cavity
12, negative pole identification indicates
13, hole, location
14, covering part
20, aluminum matter paster
21, die bond portion
30, copper lead foot
31, positive pole lead foot
32, negative pole lead foot
301, bonding wire portion
302, weld part
101, get stuck structure
102, red ink antiseepage through groove
200, aluminum bracket
20 ', aluminum material band
300, copper coin support
30 ', copper material strip.
Detailed description of the invention
Refer to shown in Fig. 1 to Fig. 7, that show the concrete structure of LED support in the preferred embodiments of the invention, include plastic cement seat 10 and the aluminum matter paster 20 being arranged on plastic cement seat 10 and copper lead foot 30.
Being provided with package cavity 11 on this plastic cement seat 10, this package cavity 11 is used for accommodating and packaging LED chips (not shown),
This aluminum matter paster 20 has die bond portion 21, the surface in this die bond portion 21 is exposed in package cavity 11, this die bond portion 21 is used for accepting LED chip, the bottom surface of aluminum matter paster 20 is exposed to the bottom surface of plastic cement seat 10, and in the present embodiment, this aluminum matter paster 20 is specular aluminium material, use specular aluminium material can more efficiently prevent from die bond bonding wire region and sulfuration problem occurs, the most also can improve the reflectance of product, improve the brightness of product, wattage can be risen to 14W by original 7W.
This copper lead foot 30 includes bonding wire portion 301 and the weld part 302 of one-body molded connection, bonding wire portion 301 is exposed in package cavity 11, weld part 302 is exposed to outside plastic cement seat 10, specifically, in the present embodiment, this copper lead foot 30 includes positive pole lead foot 31 and negative pole lead foot 32, the weld part 302 of positive pole lead foot 31 and the weld part 302 of negative pole lead foot 32 lay respectively at two diagonal positions of plastic cement seat 10, the bonding wire portion 301 of positive pole lead foot 31 and the bonding wire portion 301 of negative pole lead foot 31 extend and the most symmetrical both sides (as shown in Figure 4 and Figure 6) being positioned at die bond portion 21 along the two relative side of plastic cement seat 10 respectively, so can use left and right mode bonding wire when installing LED chip, automatic welding can be facilitated implementation, improve production efficiency.
And, between this aluminum matter paster 20 and copper lead foot 30, dislocation is formed with difference in height up and down, and, in the present embodiment, this aluminum matter paster 20 is positioned at the lower section of copper lead foot 30.Additionally, it is provided with, on this aluminum matter paster 20 and copper lead foot 30, the structure 101 that gets stuck, this structure 101 that gets stuck is for abnormity, effectively to fix the position of plastic cement seat 10, prevent plastic cement seat 10 from occurring to loosen, and, this aluminum matter paster 20 and copper lead foot 30 are provided with red ink antiseepage through groove 102, to improve sealing effectiveness, prevent red ink infiltration from entering.
Additionally, be provided with negative pole identification on this plastic cement seat 10 to indicate 12, this negative pole identification indicates 12 tops being positioned at negative pole lead foot 32, to facilitate user to identify the both positive and negative polarity of product, prevents user anti-loaded.In the present embodiment, it is a circular hole that this negative pole identification indicates 12, not to be limited；And this plastic cement seat 10 has the covering part 14 for preventing creepage phenomenon, this covering part 14 wraps the polarity marker location of copper lead foot 30 so that product does not haves creepage phenomenon in the course of the work；The bottom surface of this plastic cement seat 10 is provided with the hole, location 13 for withstanding copper lead foot 30, and when plastics produced by insert molding (molding), hole 13, location can prevent plastics from swashing and affect die bond bonding wire region and both positive and negative polarity bonding wire region.
Refer to shown in Fig. 8 to Figure 11, that show the concrete structure of double material strips LED support module in the preferred embodiments of the invention, it includes aluminum bracket 200, copper coin support 300 and multiple plastic cement seat 10.
This aluminum bracket 200 includes aluminum material band 20 ' and the multiple aluminum matter pasters 20 that are connected one-body molded with aluminum material band 20 '；This copper coin support 300 includes copper material strip 30 ' and many group copper lead foots 30 being connected one-body molded with copper material strip 30 ', together with this copper material strip 30 ' is folded each other be located at aluminum material band 20 ', in the present embodiment, this copper material strip 30 ' is laminated on the top of aluminum material band 20 ', so that copper lead foot 30 is formed with difference in height with aluminum matter paster 20, each group of copper lead foot 30 is positioned at by the side of aluminum matter paster 20 of correspondence, the group number of this copper lead foot 30 and the number of aluminum matter paster 20, the number of plastic cement seat 10 is equal, one group of copper lead foot 30, one aluminum matter paster 20 and plastic cement seat 10 produced by insert molding and constitute aforementioned LED support.
During making, first, aluminum bracket 200 and copper coin support 300 are produced by impact style；Then, copper coin support 300 it is laminated on aluminum bracket 200 and puts in mould；Then, each group of copper lead foot 30 constitutes LED support with corresponding aluminum matter paster 20 and corresponding plastic cement seat 10 produced by insert molding, thus has obtained double material strips LED support module (as shown in Figure 8 and Figure 9)；Then, the connection between each group of copper lead foot 30 and copper material strip 30 ' is cut off and separates, and the connection cut-out between each aluminum matter paster 20 and aluminum material band 20 ' is separated, i.e. can get single led support finished product (as depicted in figs. 1 and 2).
The design focal point of the present invention is: first, by using aluminum material as paster, and coordinate employing copper material as lead foot, on the premise of ensureing that radiating effect is unaffected, effectively prevent the sulfuration problem that die bond bonding wire region occurs, improve product quality, improve the reflectance of product simultaneously, improving the brightness of product, wattage can be risen to 14W by original 7W, so that the serviceability of product is more preferably.Secondly, by the bonding wire portion of positive pole lead foot and the bonding wire portion of negative pole lead foot are extended and the most symmetrical both sides being positioned at die bond portion along the two relative side of plastic cement seat respectively, so when die bond bonding wire, left and right mode bonding wire can be used, instead of the gradient mode bonding wire of tradition, left and right mode bonding wire can use automatic welding to realize, thus is beneficial to quickly realize assembling product, improves assembling product efficiency.Furthermore, by copper coin support being laminated on aluminum bracket and putting into injection mo(u)lding in mould so that the manufacture method of product is simple, it is simple to realizes mass production, thus is beneficial to reduce production cost.
The above, it it is only presently preferred embodiments of the present invention, not the technical scope of the present invention is imposed any restrictions, therefore every any trickle amendment, equivalent variations and modification above example made according to the technical spirit of the present invention, all still fall within the range of technical solution of the present invention.
Claims (9)
1. a double material strips LED support module, it is characterised in that: include aluminum bracket, copper coin support and multiple plastic cement seat；This aluminum bracket includes aluminum material band and the multiple aluminum matter pasters that are connected one-body molded with aluminum material band；This copper coin support includes copper material strip and many group copper lead foots being connected one-body molded with copper material strip, together with this copper material strip is folded each other be located at aluminum material band, each group of copper lead foot is positioned at by the side of aluminum matter paster of correspondence, one group of copper lead foot, an aluminum matter paster and a plastic cement seat produced by insert molding and constitute a LED support, this LED support includes plastic cement seat and the aluminum matter paster being arranged on plastic cement seat and copper lead foot；It is provided with package cavity on this plastic cement seat；This aluminum matter paster has die bond portion, and the surface in this die bond portion is exposed in package cavity, and the bottom surface of aluminum matter paster is exposed to the bottom surface of plastic cement seat；This copper lead foot includes bonding wire portion and the weld part of one-body molded connection, and bonding wire portion is exposed in package cavity, and weld part is exposed to outside plastic cement seat.
Double material strips LED support module the most according to claim 1, it is characterised in that: described copper material strip is laminated on the top of aluminum material band.
Double material strips LED support module the most according to claim 1, it is characterised in that: described aluminum matter paster is specular aluminium material.
Double material strips LED support module the most according to claim 1, it is characterised in that: between described aluminum matter paster and copper lead foot, dislocation is formed with difference in height up and down, and aluminum matter paster is positioned at the lower section of copper lead foot.
Double material strips LED support module the most according to claim 1, it is characterized in that: described copper lead foot includes positive pole lead foot and negative pole lead foot, the weld part of positive pole lead foot and the weld part of negative pole lead foot lay respectively at two diagonal positions of plastic cement seat, and the bonding wire portion of positive pole lead foot and the bonding wire portion of negative pole lead foot extend and the most symmetrical both sides being positioned at die bond portion along the two relative side of plastic cement seat respectively.
Double material strips LED support module the most according to claim 5, it is characterized in that: be provided with negative pole identification on described plastic cement seat and indicate, this negative pole identification indicates the top being positioned at negative pole lead foot, this negative pole identification is denoted as a circular hole, and this plastic cement seat has the covering part for preventing creepage phenomenon, this covering part wraps the polarity marker location of copper lead foot.
Double material strips LED support module the most according to claim 1, it is characterised in that: it is provided with, on described aluminum matter paster and copper lead foot, the structure that gets stuck, this aluminum matter paster and copper lead foot are provided with red ink antiseepage through groove.
Double material strips LED support module the most according to claim 1, it is characterised in that: the bottom surface of described plastic cement seat is provided with the hole, location for withstanding copper lead foot.
9. the manufacture method of the LED support as described in any one of claim 1 to 8, it is characterised in that: include following steps:
(1) producing aluminum bracket and copper coin support by impact style, this aluminum bracket includes aluminum material band and the multiple aluminum matter pasters that are connected one-body molded with aluminum material band；This copper coin support includes copper material strip and many group copper lead foots being connected one-body molded with copper material strip；
(2) copper coin support being laminated on aluminum bracket and puts in mould, each group of copper lead foot is positioned at by the side of aluminum matter paster of correspondence；
(3) each group of copper lead foot constitutes LED support with corresponding aluminum matter paster and corresponding plastic cement seat produced by insert molding, thus has obtained double material strips LED support module；
(4) the connection cut-out between each group of copper lead foot and copper material strip is separated, and the connection cut-out between each aluminum matter paster and aluminum material band is separated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410061413.0A CN103855286B (en) | 2014-02-20 | 2014-02-24 | LED support and preparation method thereof and double material strips LED support module |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420073032.X | 2014-02-20 | ||
| CN201420073032X | 2014-02-20 | ||
| CN201420073032 | 2014-02-20 | ||
| CN201410061413.0A CN103855286B (en) | 2014-02-20 | 2014-02-24 | LED support and preparation method thereof and double material strips LED support module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103855286A CN103855286A (en) | 2014-06-11 |
| CN103855286B true CN103855286B (en) | 2016-09-21 |
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420077925.1U Expired - Lifetime CN203721766U (en) | 2014-02-20 | 2014-02-24 | LED bracket and double-belt LED bracket module |
| CN201410061413.0A Active CN103855286B (en) | 2014-02-20 | 2014-02-24 | LED support and preparation method thereof and double material strips LED support module |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420077925.1U Expired - Lifetime CN203721766U (en) | 2014-02-20 | 2014-02-24 | LED bracket and double-belt LED bracket module |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN203721766U (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109904147B (en) * | 2014-09-05 | 2023-04-11 | 光宝光电(常州)有限公司 | Substrate and light emitting device comprising same |
| CN104882524A (en) * | 2015-06-01 | 2015-09-02 | 木林森股份有限公司 | SMD type LED support based on aluminum base material, and lamp bead employing the support |
| CN208062105U (en) | 2018-05-10 | 2018-11-06 | 京东方科技集团股份有限公司 | Light emitting diode, backlight and display device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007250979A (en) * | 2006-03-17 | 2007-09-27 | Zeniya Sangyo Kk | Semiconductor package |
| KR20110111173A (en) * | 2010-04-02 | 2011-10-10 | 김경동 | Lead-frame for led light and method thereof |
| CN203260619U (en) * | 2013-04-03 | 2013-10-30 | 中山市光圣半导体科技有限责任公司 | Novel high-heat-conductivity COB substrate |
| CN203260639U (en) * | 2013-04-03 | 2013-10-30 | 中山市光圣半导体科技有限责任公司 | High-luminous-efficiency and good-heat-dissipation COB light source |
| CN103426998A (en) * | 2013-07-24 | 2013-12-04 | 博罗承创精密工业有限公司 | Light emitting diode (LED) support and copper plate support |
| CN203434194U (en) * | 2013-07-24 | 2014-02-12 | 博罗承创精密工业有限公司 | LED stent and copper plate stent |
-
2014
- 2014-02-24 CN CN201420077925.1U patent/CN203721766U/en not_active Expired - Lifetime
- 2014-02-24 CN CN201410061413.0A patent/CN103855286B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007250979A (en) * | 2006-03-17 | 2007-09-27 | Zeniya Sangyo Kk | Semiconductor package |
| KR20110111173A (en) * | 2010-04-02 | 2011-10-10 | 김경동 | Lead-frame for led light and method thereof |
| CN203260619U (en) * | 2013-04-03 | 2013-10-30 | 中山市光圣半导体科技有限责任公司 | Novel high-heat-conductivity COB substrate |
| CN203260639U (en) * | 2013-04-03 | 2013-10-30 | 中山市光圣半导体科技有限责任公司 | High-luminous-efficiency and good-heat-dissipation COB light source |
| CN103426998A (en) * | 2013-07-24 | 2013-12-04 | 博罗承创精密工业有限公司 | Light emitting diode (LED) support and copper plate support |
| CN203434194U (en) * | 2013-07-24 | 2014-02-12 | 博罗承创精密工业有限公司 | LED stent and copper plate stent |
Also Published As
| Publication number | Publication date |
|---|---|
| CN203721766U (en) | 2014-07-16 |
| CN103855286A (en) | 2014-06-11 |
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