CN203466219U - Split type LED support - Google Patents
Split type LED support Download PDFInfo
- Publication number
- CN203466219U CN203466219U CN201320577264.4U CN201320577264U CN203466219U CN 203466219 U CN203466219 U CN 203466219U CN 201320577264 U CN201320577264 U CN 201320577264U CN 203466219 U CN203466219 U CN 203466219U
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- China
- Prior art keywords
- die bond
- led support
- split type
- type led
- pin
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- Expired - Lifetime
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Abstract
Disclosed in the invention is a split type LED support comprising a main plastic body, a die bonding pin and two welding pins. The die bonding pin and the two welding pins are arranged in a split mode; and the main plastic body, the die bonding pin and the welding pins are in an integrated inlaying moulding mode. The main plastic body is provided with a reflection cup. The die bonding pin includes an oblong die bonding portion and two extending portions for material tape connection; and the two welding pins are arranged at the two sides of the die bonding pin in a left-right symmetrical mode. All the welding pins include welding wire portions and SMT welding portions. The surfaces of the die bonding portions and the welding wire portions are exposed out of the bottom of the reflection cup; the backs of the die bonding portions and the welding wire portions are exposed out of the bottom of the main plastic body; and the extending portions and the SMT welding portions extend out of the outer side of the main plastic body. Therefore, on the basis of the split design of the die bonding pin and the welding pins, the radiating surface of the bottom of the die bonding pin is directly exposed out of the bottom of the main plastic body, so that the heat radiation performance is good. Moreover, the LED support can be produced simply and easily; the product quality can be improved; and the product efficiency is enhanced.
Description
Technical field
The utility model relates to LED art, refers in particular to a kind of split type LED support.
Background technology
LED(Light Emitting Diode, light-emitting diode) be a kind of solid-state semiconductor device, it can be directly light by electric energy conversion, it has that volume is little, power consumption is low, long service life, high brightness, low in calories, environmental protection, the advantage such as sturdy and durable, is one of optimal light source.As everyone knows, LED support comprises the insulating base that employing plastic cement is made and the metallic support of being fixed by this insulating base, this metallic support comprises material strip and a plurality of by the integrated conductive feet of material strip, simultaneously in order to solve heat dissipation problem, is also provided with fin on LED support.
Each conductive feet of existing LED support includes a die bond portion and a leg portion of one-body molded connection, utilize this die bond portion and insulating base produced by insert molding and conductive feet is fixed, yet, the die bond portion of each conductive feet is owing to being and the integral type design of leg portion, the area that is directed at die bond is less, radiating effect is undesirable, in addition, the fin of tradition and metallic support are separate type, need to respectively offer a mold, then fin and metallic support stack are put into plastic mold and insulating base produced by insert molding (molding), this structure makes Mould Machining cost expensive, mould processing technology is complicated, assembly problem and tolerance value be difficulty comparatively, be unfavorable for enhancing productivity.
Utility model content
In view of this, the utility model is for the disappearance of prior art existence, and its main purpose is to provide a kind of split type LED support, and it produces easily simple, can improve product quality, enhances productivity.
For achieving the above object, the utility model adopts following technical scheme:
A kind of split type LED support, comprise a plastic cement main body, one die bond pin and two legs, this die bond pin and two leg splits arrange, and plastic cement main body and die bond pin, leg one produced by insert molding, plastic cement main body is provided with a reflector, die bond pin comprises a rectangular die bond portion and two extensions that are connected material strip, the symmetrical die bond pin both sides that are positioned at of two legs, each leg includes bonding wire portion and SMT weld part, at the bottom of reflector is exposed on the surface of this die bond portion and bonding wire portion, the bottom surface of plastic cement main body is exposed at the back side of die bond portion and bonding wire portion, extension and SMT weld part stretch out plastic cement main body outside.
Preferably, there is vertical straight flange face the rim of a cup of described reflector inner side, and the degree of depth of this straight flange face is 0.1mm.
Preferably, the cup of described reflector top to the degree of depth at the cup end is 0.55mm.
Preferably, the die bond portion of described die bond pin is rectangle, and the root edge of this die bond portion is provided with offset.
Preferably, the width of the die bond portion of described die bond pin is greater than the width of extension.
Preferably, described plastic cement main body comprises upper strata insulation division and lower floor's insulation division, this upper strata insulation division is convexly set in die bond pin and two legs top, the thickness of this lower floor's insulation division and die bond pin, leg thickness are identical, the front and back end of lower floor's insulation division flushes with the external end edge of two SMT weld parts, and the left and right end of lower floor's insulation division flushes with the external end edge of the extension of die bond portion.
Preferably, the bonding wire portion root edge of described leg is provided with offset.
Preferably, the bonding wire portion of described leg and the surface between SMT weld part thin out many clamp bar slots.
Preferably, the both sides of the bonding wire portion of described leg and SMT weld part crossover position are provided with projection.
Preferably, the width of the bonding wire portion of described leg is greater than the width of SMT weld part.
The utility model compared with prior art has obvious advantage and beneficial effect, particularly, as shown from the above technical solution, design focal point of the present utility model is, it is mainly that the radiating surface of the bottom of die bond pin directly exposes the bottom of plastic cement main body by die bond pin and leg split-type design, perfect heat-dissipating, and the LED support of this structure is produced easily simple, can improve product quality, enhances productivity.
For more clearly setting forth architectural feature of the present utility model and effect, below in conjunction with accompanying drawing and specific embodiment, the utility model is elaborated.
Accompanying drawing explanation
Fig. 1 is the LED material strip figure of the embodiment of the utility model;
Fig. 2 is copper coin support schematic diagram in the embodiment of the utility model;
Fig. 3 is simple grain LED support finished product schematic diagram in the embodiment of the utility model;
Fig. 4 is the reverse side schematic diagram of Fig. 3;
Fig. 5 is the sectional view of a-a in Fig. 3;
Fig. 6 is the copper coin support schematic diagram of simple grain LED in the embodiment of the utility model;
Fig. 7 is the schematic diagram that in the embodiment of the utility model, the copper coin support of simple grain LED is connected in material strip;
Fig. 8 is the sectional view of b-b in Fig. 7;
Fig. 9 is the schematic diagram from material strip cuts not after simple grain LED moulding in the embodiment of the utility model;
Figure 10 is die bond pin in Fig. 9 schematic diagram from material strip cuts.
Accompanying drawing identifier declaration.
1, LED material strip 2, copper coin support
3, LED support 10, plastic cement main body
11, reflector 12, straight flange face
13, upper strata insulation division 14, lower floor insulation division
20, die bond pin 21, die bond portion
22, extension 23, offset
30, leg 31, bonding wire portion
32, SMT weld part 33, offset
34, draw-in groove 35, projection
41, plastics sealing glue position 42, position gets stuck.
Embodiment
Please refer to shown in Fig. 1 to Figure 10, it has demonstrated the concrete structure of the preferred embodiment of the utility model, one-body moldedly on each LED material strip 1 goes out 18 LED supports 3, and every LED support 3 has included plastic cement main body 10, a die bond pin 20 and two legs 30.This die bond pin 20 and two leg 30 split settings, and plastic cement main body 10 and die bond pin 20, leg 30 one produced by insert molding.
Wherein, plastic cement main body 10 is provided with a reflector 11, and there is vertical straight flange face 12 the rim of a cup inner side of reflector 11, and the depth H 2 of this straight flange face 12 is 0.1mm, and cup top to the depth H 1 at the cup end is 0.55mm.The dark H1 of traditional product design cup is 0.55mm, but without design 0.10mm straight flange face 12 in rim of a cup, cause produced by insert molding after rim of a cup place there are burr, affect product appearance and quality; And the present embodiment is done the straight flange face 12 of 0.10mm in rim of a cup, while effectively preventing produced by insert molding there are burr and cause quality problems in product.
Described die bond pin 20 comprises that a rectangular die bond portion 21 is connected the extension 22 of material strip with two, die bond portion 21 is rectangles, the width H5 of die bond portion 21 is greater than the width H6 of extension 22, effectively strengthen die bond area, make the radiating surface of bottom larger, the extension 22 of two narrows down, and can save material, and with plastic cement main body 10 one produced by insert molding after can more firmly bite plastic cement.Root edge in this die bond portion 21 is provided with offset 23, this be designed with and be beneficial to copper coin support 2 and plastic cement main body 10 produced by insert molding after copper coin can bite plastics, improve product serviceability.
Symmetrical die bond pin 20 both sides that are positioned at of two legs 30, each leg 30 includes bonding wire portion 31 and SMT weld part 32, and 11 ends of reflector, are exposed on the surface of this die bond portion 21 and bonding wire portion 31, and extension 22 and SMT weld part 32 stretch out plastic cement main body 10 outsides.Bonding wire portion 31 root edges are provided with offset 33, this be designed with and be beneficial to copper coin support and plastic cement main body 10 one produced by insert molding after copper coin can bite plastics, improve product usability.Bonding wire portion 31 and the surface between SMT weld part 32 of leg 30 thin out many clamp bar slots 34, adopt and thin structure herein, block plastics, reduce stamping-out below plastic material is pulled, and effectively prevent red ink test infiltration.The bonding wire portion 31 of leg 30 is provided with projection 35 with the both sides of SMT weld part 32 crossover positions.The width H4 of the bonding wire portion 31 of described leg 30 is greater than the width H3 of SMT weld part 32, bonding wire portion 31 is increased, processing ease in the time of can facilitating bonding wire.
After die bond pin 20, two legs 30 and plastic cement main body 10 one produced by insert molding, 11 ends of reflector, are exposed on the surface of this die bond portion 21 and bonding wire portion 31, the bottom surface of plastic cement main body 10 is exposed at the back side of die bond portion 21 and bonding wire portion 31, and extension 22 and SMT weld part 32 stretch out plastic cement main body 10 outsides.Radiating surface by the back side of this die bond portion 21 directly exposes plastic cement main body 10 bottom surfaces, and efficiently radiates heat extends useful life of LED.
Described plastic cement main body 10 comprises upper strata insulation division 13He lower floor insulation division 14, this upper strata insulation division 13 is convexly set in die bond pin 20 and two leg 30 tops, the thickness of this lower floor's insulation division 14 and die bond pin 20, leg 30 thickness are identical, the front and back end of lower floor's insulation division 14 flushes with the external end edge of two SMT weld parts 32, the left and right end of lower floor's insulation division 14 flushes with the external end edge of the extension 22 of die bond portion 21, moulding is easy like this, and the blanking edge of a knife is neat, and Design of Dies is simple in structure.
The production process of this product is as follows: first, by piece of metal sheet, stamp out many flat coppers board mount 2, then whole plate copper coin support 2 is put into mould produced by insert molding and go out plastic cement main body 10, thereby one-shot forming goes out many material strips, on every material strip, have 18 LED supports 3.
It should be noted that, plastics sealing glue position 41 on copper coin support 2 is designed to the copper coin position 42 that gets stuck to seal together, this structural design can prevent produced by insert molding (MOLDING) mould sealing parts depreciation, reduce the modification of mould parts, after product MOLDING, be not prone to weigh wounded, the common abnormal conditions such as burr, improve the quality of products, plastics sealing glue position 41 on another support is herein designed to the copper coin position 42 that gets stuck to seal together, this structural design can be relaxed the size management and control to the position 42 that gets stuck, and enhances productivity.
The product copper coin left and right sides is different from traditional glue sealing structure, existing this product design becomes with solid glue, the effect that gets stuck, and traditional glue sealing structure only has the single effect of getting stuck, and because existing product structure fills up the copper coin position 42 that gets stuck by plastics, after produced by insert molding is complete, to finished product cut-out step, it can be cut away together with copper coin waste material.So the copper coin of the product left and right sides gets stuck, dimensional tolerance can be relaxed, and does not need often to adjust machine.
In sum, design focal point of the present utility model is, it is mainly by die bond pin 20 and leg 30 split-type design, the bottom of plastic cement main body 10 is directly exposed in the bottom surface of die bond pin 20, perfect heat-dissipating, and the LED support 3 of this structure is produced easily simple, can improve product quality, enhances productivity.
The above, it is only preferred embodiment of the present utility model, not technical scope of the present utility model is imposed any restrictions, therefore any trickle modification, equivalent variations and modification that every foundation technical spirit of the present utility model is done above embodiment, all still belong in the scope of technical solutions of the utility model.
Claims (10)
1. a split type LED support, it is characterized in that: comprise a plastic cement main body, one die bond pin and two legs, this die bond pin and two leg splits arrange, and plastic cement main body and die bond pin, leg one produced by insert molding, plastic cement main body is provided with a reflector, die bond pin comprises a rectangular die bond portion and two extensions that are connected material strip, the symmetrical die bond pin both sides that are positioned at of two legs, each leg includes bonding wire portion and SMT weld part, at the bottom of reflector is exposed on the surface of this die bond portion and bonding wire portion, the bottom surface of plastic cement main body is exposed at the back side of die bond portion and bonding wire portion, extension and SMT weld part stretch out plastic cement main body outside.
2. split type LED support according to claim 1, is characterized in that: there is vertical straight flange face the rim of a cup inner side of described reflector, and the degree of depth of this straight flange face is 0.1mm.
3. split type LED support according to claim 1 and 2, is characterized in that: the degree of depth at the cup top of described reflector to the cup end is 0.55mm.
4. split type LED support according to claim 1, is characterized in that: the die bond portion of described die bond pin is rectangle, and the root edge of this die bond portion is provided with offset.
5. split type LED support according to claim 4, is characterized in that: the width of the die bond portion of described die bond pin is greater than the width of extension.
6. split type LED support according to claim 4, it is characterized in that: described plastic cement main body comprises upper strata insulation division and lower floor's insulation division, this upper strata insulation division is convexly set in die bond pin and two legs top, the thickness of this lower floor's insulation division and die bond pin, leg thickness are identical, the front and back end of lower floor's insulation division flushes with the external end edge of two SMT weld parts, and the left and right end of lower floor's insulation division flushes with the external end edge of the extension of die bond portion.
7. split type LED support according to claim 1, is characterized in that: the bonding wire portion root edge of described leg is provided with offset.
8. split type LED support according to claim 1, is characterized in that: the bonding wire portion of described leg and the surface between SMT weld part thin out many clamp bar slots.
9. split type LED support according to claim 1, is characterized in that: the both sides of the bonding wire portion of described leg and SMT weld part crossover position are provided with projection.
10. split type LED support according to claim 1, is characterized in that: the width of the bonding wire portion of described leg is greater than the width of SMT weld part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320577264.4U CN203466219U (en) | 2013-09-17 | 2013-09-17 | Split type LED support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320577264.4U CN203466219U (en) | 2013-09-17 | 2013-09-17 | Split type LED support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203466219U true CN203466219U (en) | 2014-03-05 |
Family
ID=50178561
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320577264.4U Expired - Lifetime CN203466219U (en) | 2013-09-17 | 2013-09-17 | Split type LED support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203466219U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104600172A (en) * | 2014-09-10 | 2015-05-06 | 广东长盈精密技术有限公司 | Flip chip type LED (light-emitting diode) bracket and manufacturing method thereof |
| CN105526535A (en) * | 2016-02-05 | 2016-04-27 | 赵景添 | LED lamp bead, display module and display screen |
| CN112709937A (en) * | 2020-12-30 | 2021-04-27 | 深圳市新亿光光电有限公司 | COB lamp pearl |
-
2013
- 2013-09-17 CN CN201320577264.4U patent/CN203466219U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104600172A (en) * | 2014-09-10 | 2015-05-06 | 广东长盈精密技术有限公司 | Flip chip type LED (light-emitting diode) bracket and manufacturing method thereof |
| CN105526535A (en) * | 2016-02-05 | 2016-04-27 | 赵景添 | LED lamp bead, display module and display screen |
| CN112709937A (en) * | 2020-12-30 | 2021-04-27 | 深圳市新亿光光电有限公司 | COB lamp pearl |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140305 |
|
| CX01 | Expiry of patent term |