CN202058782U - Light-emitting diode (LED) bracket and material belt structure - Google Patents
Light-emitting diode (LED) bracket and material belt structure Download PDFInfo
- Publication number
- CN202058782U CN202058782U CN2011201297093U CN201120129709U CN202058782U CN 202058782 U CN202058782 U CN 202058782U CN 2011201297093 U CN2011201297093 U CN 2011201297093U CN 201120129709 U CN201120129709 U CN 201120129709U CN 202058782 U CN202058782 U CN 202058782U
- Authority
- CN
- China
- Prior art keywords
- insulating base
- metal plate
- containing cavity
- led
- chip containing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Images
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a light-emitting diode (LED) bracket and a material belt structure. The LED bracket comprises an insulating base, a plurality of conductive pins and a radiating metal sheet, wherein the conductive pins and the radiating metal sheet are molded and coated in the insulating base; the insulating base is provided with a chip accommodating cavity; the inner side face of the opening of the chip accommodating cavity is a straight face; the radiating metal sheet is positioned among the conductive pins, and is exposed out of the inner bottom surface of the chip accommodating cavity; a material belt comprises at least two integrally molded and connected metal plates; multiple rows of LED brackets are molded at intervals on each metal plate; and the joint between the two metal plates is provided with a positioning hole. In the utility model, the inner side face of the opening of the chip accommodating cavity is designed into the straight face, and burrs easily occurring on the opening of the chip accommodating cavity during embedding molding are effectively prevented by using the straight face, so that the product quality is improved, the product appearance is more attractive, trimming of a product is eliminated, and the production efficiency of the product is greatly improved.
Description
Technical field
The utility model relates to the LED art, refers in particular to a kind of led support and material-strap structure.
Background technology
LED(Light Emitting Diode, light-emitting diode) is a kind of solid-state semiconductor device, it can directly be converted into light with electric energy, and it has, and volume is little, power consumption is low, long service life, high brightness, low in calories, environmental protection, advantage such as sturdy and durable, is one of optimal light source.As everyone knows, led support comprises insulating base that the employing plastic cement is made and the metallic support of being fixed by this insulating base, this metallic support comprises strip and a plurality of by the integrated conductive feet of strip, simultaneously in order to solve heat dissipation problem, also is provided with fin on the led support.
Each conductive feet of existing led support includes a fixed part and a solder sections of one-body molded connection, utilizes this fixed part and insulating base produced by insert molding and makes conductive feet fix, and be provided with the chip containing cavity in insulating base, to be used to take in led chip.Yet the chip containing cavity opening part of the insulating base of existing led support burr occur easily and causes quality problems when produced by insert molding (Insert Molding), need carry out deburring to product, has reduced production efficiency of products.And the existing a plurality of led supports that on a strip, mold, the spacing between them is big, density is little, and mold position and plating tool location are all comparatively difficult, thereby cause the appearance of problems such as the product precision is low.
The utility model content
In view of this, the utility model is at the disappearance of prior art existence, and its main purpose provides a kind of led support and material-strap structure, and it can effectively solve existing led support and burr occur easily and cause poor product quality, problem that production efficiency is low.
Another purpose of the present utility model provides a kind of led support and material-strap structure, and it can effectively solve the existing strip mold position and the problem of plating tool location difficulty.
For achieving the above object, the utility model adopts following technical scheme:
A kind of led support comprises that insulating base and moulding are coated on a plurality of conductive feet and the heat dissipation metal plate in this insulating base, and this insulating base is provided with the chip containing cavity, and the opening part medial surface of this chip containing cavity is to face directly; This heat dissipation metal plate is between this plural conductive pin, and heat dissipation metal plate exposes the inner bottom surface of aforementioned chip containing cavity.
As a kind of preferred version, the degree of depth of described chip containing cavity is 0.550mm, and this height of facing directly is 0.070mm.
As a kind of preferred version, described heat dissipation metal plate is with aforesaid wherein a conductive feet is one-body molded is connected.
As a kind of preferred version, described each conductive feet includes the fixed part and the solder sections of one-body molded connection, the inner bottom part of this fixed part exposed chip containing cavity, and this solder sections is stretched out the side of insulating base and the bottom that bending extends to insulating base.
As a kind of preferred version, the recessed holddown groove that is formed with of the upper surface of junction, this holddown groove and this insulating base produced by insert molding between the fixed part of described each conductive feet and the solder sections.
As a kind of preferred version, the lateral surface of junction is provided with draw-in groove between the fixed part of described each conductive feet and the solder sections, this draw-in groove and insulating base produced by insert molding.
As a kind of preferred version, described chip containing cavity is bowl-shape.
A kind of material-strap structure includes the metal plate of at least two one-body molded connections, molded many rows led support as claimed in claim 1 on this each metal plate at interval, and the junction between this two metals plate is provided with location hole
The utility model compared with prior art has tangible advantage and beneficial effect, particularly, and as shown from the above technical solution:
One, the opening part medial surface by the chip containing cavity is set to face directly, utilize this opening part of facing chip containing cavity when effectively preventing produced by insert molding directly to occur burr easily, promoted product quality, make that the outward appearance of product is more attractive in appearance, and removed from product has been carried out deburring, improved production efficiency of products greatly.
Two, be provided with location hole by the junction between two metal plates, utilize this location hole can realize mold position and plating tool location well, so that the product size precision improves greatly, more can effectively enhance productivity, and can change the pattern that distance is big between the tradition, density is little, thereby reduce frock time and cost.
Three, the upper surface by junction between fixed part and solder sections is provided with location notch, utilize this location notch can effectively reduce after the bending of solder sections relative fixed portion pulling function to insulating base, and make and the better tightness that is connected between insulating base and the conductive feet effectively prevent red ink test infiltration.
Four, the lateral surface by junction between fixed part and solder sections is provided with draw-in groove, utilize this draw-in groove also can effectively reduce after the bending of solder sections relative fixed portion pulling function to insulating base, and make and the better tightness that is connected between insulating base and the conductive feet effectively prevent red ink test infiltration.
For more clearly setting forth architectural feature of the present utility model and effect, come the utility model is elaborated below in conjunction with accompanying drawing and specific embodiment.
Description of drawings
Fig. 1 is the assembling schematic perspective view of the preferred embodiment of the utility model;
Fig. 2 is another angle schematic diagram of Fig. 1;
Fig. 3 is the sectional view of the preferred embodiment of the utility model;
Fig. 4 is the enlarged diagram of conductive feet and heat dissipation metal plate in the preferred embodiment of the utility model;
Fig. 5 is first view in the preferred embodiment manufacturing process of the utility model;
Fig. 6 is second view in the preferred embodiment manufacturing process of the utility model.
The accompanying drawing identifier declaration:
10, insulating base 11, chip containing cavity
12, face 20 directly, conductive feet
21, fixed part 22, solder sections
201, holddown groove 202, draw-in groove
30, heat dissipation metal plate 40, strip
41, metal plate 42, location hole.
Embodiment:
Please refer to Fig. 1 to shown in Figure 6, the concrete structure that it has demonstrated the preferred embodiment of the utility model includes insulating base 10 and moulding and is coated on a plurality of conductive feet 20 and a heat dissipation metal plate 30 in this insulating base 10.
Wherein, this insulating base 10 has a chip containing cavity 11, and this chip containing cavity 11 is bowl-shape, and it is used to take in led chip.The degree of depth of this chip containing cavity 11 is 0.550mm, the opening part medial surface of chip containing cavity 11 is for facing 12 directly, this height of facing 12 directly is 0.070mm, and this faces 12 directly can prevent effectively that burr from appearring in the opening part of insulating base 10 chip containing cavity 11 behind produced by insert molding, influences product appearance and quality.
These a plurality of conductive feet 20 and a heat dissipation metal plate 30 have been combined to form the metallic support of a led support, and the metallic support in the present embodiment is combined to form by four conductive feet 20 and a heat dissipation metal plate 30, and the quantity of conductive feet 20 is not limit.
Wherein, these four conductive feet 20 are divided into two rows, two row and arrange, each conductive feet 20 includes the fixed part 21 and the solder sections 22 of one-body molded connection, this fixed part 21 exposes the inner bottom part of aforementioned chip containing cavity 11, and this solder sections 22 is stretched out the side of insulating base 10 and the bottom that bending extends to insulating base 10.The upper surface of junction is by thinning the recessed holddown groove 201 that is formed with of moulding between this fixed part 21 and the solder sections 22, the holddown groove 201 of present embodiment is two that be arranged in parallel, the quantity of holddown groove 201 is not limit, be filled with plastic cement in this holddown groove 201, make holddown groove 201 and these insulating base 10 produced by insert molding with this, this holddown groove 201 produces pulling function to insulating base 10 after can reducing 21 bendings of solder sections 22 relative fixed portions, effectively prevents red ink test infiltration.And, the lateral surface of junction is provided with draw-in groove 202 between this fixed part 21 and the solder sections 22, be filled with plastic cement in this draw-in groove 202, make draw-in groove 202 and insulating base 10 produced by insert molding with this, this draw-in groove 202 produces pulling function to insulating base 10 after also can reducing 21 bendings of solder sections 22 relative fixed portions, effectively prevents red ink test infiltration.
This heat dissipation metal plate 30 is cuboid, heat dissipation metal plate 30 is between aforementioned four conductive feet 20,21 one-body molded connections of fixed part of heat dissipation metal plate 30 and a wherein conductive feet 20 of these four conductive feet 20, and this heat dissipation metal plate 30 exposes the inner bottom surface of aforementioned chip containing cavity 11, heat dissipation metal plate 30 is used to carry led chip, and led chip played thermolysis
The manufacturing process that present embodiment is described in detail in detail is as follows:
As shown in Figure 5, at first, on same block of metal material, mold a strip 40 and a plurality of aforementioned metal support simultaneously by punching press or other modes, this strip 40 includes the metal plate 41 of at least two one-body molded connections, junction between this two metals plate 41 also is provided with location hole 42, mold position and plating added plating tool location in man-hour when this location hole 42 helped punch forming, and simultaneously, the two ends of this strip 40 also are provided with location hole 42.
Then, strip 40 and a plurality of metallic support are put into mould, make each metallic support and corresponding insulating base 10 produced by insert molding as shown in Figure 6, to have molded eight row's led supports at interval on each metal plate 41, each row has two led supports.
Then, each led support is separated incision with strip 40, and the bottom that makes solder sections 22 relative fixed portions 21 bendings of conductive feet 20 extend to corresponding insulating base 10 gets final product.
Design focal point of the present utility model is: at first, opening part medial surface by the chip containing cavity is set to face directly, utilize this opening part of facing chip containing cavity when effectively preventing produced by insert molding directly to occur burr easily, promoted product quality, make that the outward appearance of product is more attractive in appearance, and removed from product has been carried out deburring, improved production efficiency of products greatly.Secondly, be provided with location hole by the junction between two metal plates, utilize this location hole can realize mold position and plating tool location well, so that the product size precision improves greatly, more can effectively enhance productivity, and can change the pattern that distance is big between the tradition, density is little, thereby reduce frock time and cost.Moreover, upper surface by junction between fixed part and solder sections is provided with location notch, utilize this location notch can effectively reduce after the bending of solder sections relative fixed portion pulling function to insulating base, and make and the better tightness that is connected between insulating base and the conductive feet effectively prevent red ink test infiltration.At last, lateral surface by junction between fixed part and solder sections is provided with draw-in groove, utilize this draw-in groove also can effectively reduce after the bending of solder sections relative fixed portion pulling function to insulating base, and make and the better tightness that is connected between insulating base and the conductive feet effectively prevent red ink test infiltration.
The above, it only is preferred embodiment of the present utility model, be not that technical scope of the present utility model is imposed any restrictions, so every foundation technical spirit of the present utility model all still belongs in the scope of technical solutions of the utility model any trickle modification, equivalent variations and modification that above embodiment did.
Claims (8)
1. led support, it is characterized in that: comprise that insulating base and moulding are coated on a plurality of conductive feet and the heat dissipation metal plate in this insulating base, this insulating base is provided with the chip containing cavity, and the opening part medial surface of this chip containing cavity is to face directly; This heat dissipation metal plate is between this plural conductive pin, and heat dissipation metal plate exposes the inner bottom surface of aforementioned chip containing cavity.
2. led support according to claim 1 is characterized in that: the degree of depth of described chip containing cavity is 0.550mm, and this height of facing directly is 0.070mm.
3. led support according to claim 1 is characterized in that: described heat dissipation metal plate is with aforesaid wherein a conductive feet is one-body molded is connected.
4. led support according to claim 1, it is characterized in that: described each conductive feet includes the fixed part and the solder sections of one-body molded connection, the inner bottom part of this fixed part exposed chip containing cavity, this solder sections stretch out the side of insulating base and the bottom that bending extends to insulating base.
5. led support according to claim 4 is characterized in that: the recessed holddown groove that is formed with of the upper surface of junction, this holddown groove and this insulating base produced by insert molding between the fixed part of described each conductive feet and the solder sections.
6. led support according to claim 4 is characterized in that: the lateral surface of junction is provided with draw-in groove between the fixed part of described each conductive feet and the solder sections, this draw-in groove and insulating base produced by insert molding.
7. according to claim 1 or 4 described led supports, it is characterized in that: described chip containing cavity is bowl-shape.
8. material-strap structure, it is characterized in that: the metal plate that includes at least two one-body molded connections, molded many rows led support as claimed in claim 1 on this each metal plate at interval, and the junction between this two metals plate is provided with location hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201297093U CN202058782U (en) | 2011-04-28 | 2011-04-28 | Light-emitting diode (LED) bracket and material belt structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201297093U CN202058782U (en) | 2011-04-28 | 2011-04-28 | Light-emitting diode (LED) bracket and material belt structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202058782U true CN202058782U (en) | 2011-11-30 |
Family
ID=45018747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201297093U Ceased CN202058782U (en) | 2011-04-28 | 2011-04-28 | Light-emitting diode (LED) bracket and material belt structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202058782U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103258946B (en) * | 2012-02-17 | 2017-08-15 | 赛恩倍吉科技顾问（深圳）有限公司 | Light-emitting diode light bar and its manufacture method |
-
2011
- 2011-04-28 CN CN2011201297093U patent/CN202058782U/en not_active Ceased
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103258946B (en) * | 2012-02-17 | 2017-08-15 | 赛恩倍吉科技顾问（深圳）有限公司 | Light-emitting diode light bar and its manufacture method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203260618U (en) | LED support and module thereof | |
| CN202159702U (en) | Improved LED support structure | |
| CN202058782U (en) | Light-emitting diode (LED) bracket and material belt structure | |
| CN102610733A (en) | LED (Light Emitting Diode) lamp, LED bracket and LED bracket material strip structure | |
| CN202363509U (en) | Led bracket and material belt structure | |
| CN203466217U (en) | Integrally formed LED and copper plate bracket | |
| CN203812910U (en) | High-utilization-rate and high-luminous-efficiency LED array support | |
| CN202018963U (en) | Integrated LED bracket | |
| CN202308034U (en) | Improved structure for LED (Light Emitting Diode) bracket | |
| CN203466219U (en) | Split type LED support | |
| CN202159701U (en) | LED support structure and tape structure | |
| CN203721766U (en) | LED bracket and double-belt LED bracket module | |
| CN202308035U (en) | Improved structure of LED bracket | |
| CN201689908U (en) | LED support | |
| CN102500636B (en) | Bar shearing and forming mould of square flat packaging outer shell | |
| CN101696774A (en) | Method for manufacturing integrated LED lamp panel | |
| CN203260632U (en) | LED support and terminal material strip | |
| CN202549919U (en) | Light emitting diode (LED) lamp, LED bracket and material belt structure for LED bracket | |
| CN204240116U (en) | The modified node method of LED bulb | |
| CN204614814U (en) | A kind of little PIN is apart from LED product and copper coin support thereof | |
| CN209947860U (en) | LED support and material belt structure | |
| CN203351665U (en) | LED support with concave cup and terminal material belt of LED support | |
| CN201715459U (en) | LED support | |
| CN202917532U (en) | LED bracket and terminal material belt thereof | |
| CN206460970U (en) | A kind of flange-cooled ultra-thin LED support |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Free format text: FORMER OWNER: CHONG-IA PRECISION INDUSTRY CO., LTD., BO LUO COUNTY STAMPING PRECISION INDUSTRY CO., LTD. Effective date: 20121011 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 516000 HUIZHOU, GUANGDONG PROVINCE TO: 516123 HUIZHOU, GUANGDONG PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20121011 Address after: 516123 Boluo City, Huizhou Province, the town of Chau Chau Industrial Zone Patentee after: Boluo Chengchuang Precision Industry Co., Ltd. Address before: 516000 Shang Nan Industrial Park, Garden Town, Boluo County, Huizhou, Guangdong Patentee before: Boluo Chengchuang Precision Industry Co., Ltd. Patentee before: Boluo Chongia Precision Industry Co., Ltd. Patentee before: Chongia Precision Industry Co., Ltd. |
|
| IW01 | Full invalidation of patent right | ||
| IW01 | Full invalidation of patent right |
Decision date of declaring invalidation: 20181114 Decision number of declaring invalidation: 37815 Granted publication date: 20111130 |