CN102610733A - LED (Light Emitting Diode) lamp, LED bracket and LED bracket material strip structure - Google Patents
LED (Light Emitting Diode) lamp, LED bracket and LED bracket material strip structure Download PDFInfo
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- CN102610733A CN102610733A CN2012100319520A CN201210031952A CN102610733A CN 102610733 A CN102610733 A CN 102610733A CN 2012100319520 A CN2012100319520 A CN 2012100319520A CN 201210031952 A CN201210031952 A CN 201210031952A CN 102610733 A CN102610733 A CN 102610733A
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- led
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- conductive feet
- support
- insulating body
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Abstract
The invention discloses an LED (Light Emitting Diode) lamp, an LED bracket and an LED bracket material strip structure. The LED bracket comprises a metal bracket and an insulation main body formed on the metal bracket in a wrapping manner, wherein the insulation main body is recessed to form an accommodating cavity; a vertical clapboard is arranged in the accommodating cavity and divides the accommodating cavity into a first cavity and a second cavity to form a dual-cup structure; and accordingly, during packaging, LED chips with different rays can be placed in the first cavity and the second cavity, and the vertical clapboard between the two cavities is lighttight, so that the brightness of light sources can be regulated for the two types of light so as to acquire better brightness of the light sources. The LED bracket is more flexible to use and has better superiority compared with single cup and single light source in the prior art.
Description
Technical field
The present invention relates to the LED technical field, refer in particular to a kind of LED lamp, led support and led support material-strap structure.
Background technology
LED (Light Emitting Diode; Light-emitting diode) is a kind of solid-state semiconductor device; It can directly be converted into light to electricity, and it has, and volume is little, power consumption is low, long service life, high brightness, low in calories, environmental protection, plurality of advantages such as sturdy and durable, is optimal light source.
Existing led support comprises that the insulating body that adopts plastic cement to process reaches by the fixing metallic support of this insulating body; This metallic support comprises strip and a plurality of by the integrated conductive feet of strip, wherein, is concaved with a ccontaining cavity on the aforementioned dielectric main body; This single cup type structure of ccontaining cavity system; Can only only do a kind of light sources such as cold light, warm light in it, be not easy to adjust light-source brightness, restriction has been played in the raising of light source quality; And; Aforementioned conductive feet comprises integrated fixed part and solder sections, utilizes this fixed part and insulating body produced by insert molding and makes conductive feet fix, yet; The fixed part of each conductive feet is separated from one another; The area of biting insulating body is less, makes to be prone between conductive feet and insulating body form loosening phenomenon, the phenomenon of red ink test infiltration very easily occurs; In addition, the led support spacing that is provided with on the aforementioned strip in the conventional art is big, density is little, has wasted many frock times and cost.
Summary of the invention
First kind of purpose of the present invention provides a kind of led support, and its ccontaining cavity that will be used to put led chip is designed to two cup structures, so that the adjustment light-source brightness obtains better light-source brightness;
Second kind of purpose of the present invention provides a kind of LED lamp, and it adjusts light-source brightness through cold white light and two kinds of light of warm white, to obtain better light-source brightness;
The third purpose of the present invention provides a kind of material-strap structure of led support, and it has changed the pattern that the led support spacing is big in the conventional art, density is little, has effectively reduced frock time and cost.
For realizing that above-mentioned purpose the present invention adopts following technical scheme:
A kind of led support comprises metallic support and is overmolded in the insulating body on this metallic support, and wherein, indent forms and is useful on the ccontaining cavity of putting led chip on this insulating body, and this metallic support comprises a plurality of conductive feet; This ccontaining cavity bottom surface one extends upward and is formed with an opaque vertical dividing plate, and these vertical dividing plate both sides form first cavity and second cavity, and this first cavity is furnished with different conductive feet respectively with the second cavity bottom.
As a kind of preferred version, the degree of depth of said ccontaining cavity is 0.5mm.
As a kind of preferred version, said conductive feet comprises the fixed part and the solder sections of one-body molded connection, and this fixed part is exposed to the inner bottom part of aforementioned ccontaining cavity, and this solder sections is stretched out the side of insulating body and the bottom that bending extends to insulating body; The upper and lower surperficial symmetrical expression indent of junction is formed with holddown groove, this holddown groove and aforementioned dielectric main body produced by insert molding between the fixed part of conductive feet and solder sections.
As a kind of preferred version, the junction is formed with location hole between the fixed part of said conductive feet and the solder sections, this location hole and aforementioned dielectric main body produced by insert molding.
As a kind of preferred version, be formed with spacing protuberance on the fixed part of said conductive feet, this spacing protuberance and aforementioned dielectric main body produced by insert molding.
As a kind of preferred version, totally four of said conductive feet, the structure of each conductive feet is identical, and four fixed parts are the matrix pattern layout.
As a kind of preferred version, said ccontaining cavity is cup-shaped.
A kind of LED lamp; Comprise led support and be installed on the led chip on this led support; Wherein, this led support comprise metallic support be overmolded in the insulating body on this metallic support, wherein; Indent forms and is useful on the ccontaining cavity of putting led chip on this insulating body, and this metallic support comprises a plurality of conductive feet; This ccontaining cavity bottom surface one extends upward and is formed with an opaque vertical dividing plate, and these vertical dividing plate both sides form first cavity and second cavity; Aforementioned led chip comprises that aforementioned led chip comprises the led chip of two different light rays, and it is placed in respectively in first cavity and second cavity, and said led chip can be cold White-light LED chip and warm white LED chip.
A kind of material-strap structure comprises a metal plate, mold many rows led support as claimed in claim 1 on this metal plate at interval, and the quantity of every row's led support is 14.
The present invention compared with prior art has tangible advantage and beneficial effect, particularly, can be known by technique scheme; Main system is through being provided with a vertical dividing plate, ccontaining cavity is separated into two cup structures of first cavity and second cavity, thus in aforementioned ccontaining cavity; When encapsulation, can accomplish in first cavity and second cavity, to put the led chip of different light rays; And be lighttight vertical dividing plate between two cavitys, make it two kinds of light and can adjust light-source brightness effectively, obtain better light-source brightness; Compare single glass, single light source in the conventional art, it has more superiority; And; The material-strap structure system of aforementioned led support is by molding many row's led supports on the metal plate at interval; And the quantity of every row's led support is 14, has changed the pattern that the led support spacing is big in the conventional art, density is little, has effectively reduced frock time and cost.
For more clearly setting forth architectural feature of the present invention and effect, the present invention is further described below in conjunction with accompanying drawing and specific embodiment.
Description of drawings
Fig. 1 is the package assembly sketch map of the present invention's preferred embodiment;
Fig. 2 is the package assembly sketch map of another angle of preferred embodiment of the present invention;
Fig. 3 is the decomposition texture sketch map of the present invention's preferred embodiment;
Fig. 4 is the front view of product shown in Figure 1;
Fig. 5 is the cross section enlarged diagram at M-M place among Fig. 4;
Fig. 6 is the strip organigram of product shown in Fig. 1;
Fig. 7 is the strip organigram of the present invention's preferred embodiment medium-height trestle.
The accompanying drawing identifier declaration:
100, led support
10, metallic support 11, conductive feet
111, fixed part 112, solder sections
113, holddown groove 114, location hole
115, spacing protuberance
20, insulating body 21, ccontaining cavity
22, vertical dividing plate 211, first cavity
212, second cavity
30, copper coin support 31, strip.
Embodiment
Please referring to figs. 1 through shown in Figure 5, it has demonstrated the concrete structure of the present invention's preferred embodiment, and this led support 100 comprises metallic support 10 and is overmolded in the insulating body 20 on this metallic support 10.
Wherein, indent is formed with ccontaining cavity 21 on this insulating body 20, and this ccontaining cavity 21 is cup-shaped, and its degree of depth is 0.5mm; These ccontaining cavity 21 bottom surface one extend upward and have formed an opaque vertical dividing plate 22; And the left and right ora terminalis of this vertical dividing plate 22 is connected to the sidewall of ccontaining cavity 21, and this vertical dividing plate 22 is separated into two cup structures of first cavity 211 and second cavity 212 with aforementioned ccontaining cavity 21, so; When encapsulation, can accomplish to put in the cup cold White-light LED chip; Another cup is put the warm white LED chip, and two kinds of light can be adjusted light-source brightness, obtain better light-source brightness; Compare single glass, single light source in the conventional art, it has more superiority; Certain above-mentioned led chip can also be the led chip of other different light rays, does not add at this and gives restriction.
This metallic support 10 comprises four conductive feet 11, and wherein two conductive feet are positioned at below, aforementioned first cavity 211 bottoms, and two conductive feet are positioned at below, second cavity, 212 bottoms in addition; Each conductive feet 11 comprises the fixed part 111 and solder sections 112 of one-body molded connection, and this fixed part 111 is exposed to the inner bottom part of aforementioned ccontaining cavity 21, and this solder sections 112 is stretched out the side of insulating body 20 and the bottom that bending extends to insulating body 20;
In conjunction with Fig. 3 and shown in Figure 5; The present invention is formed with holddown groove 113 through the upper and lower surperficial symmetrical expression indent of junction between the fixed part 111 of conductive feet 11 and solder sections 112; This holddown groove 113 and aforementioned dielectric main body 20 produced by insert molding thus, take place to become flexible between conductive feet 11 and the insulating body 20 when reducing the aforementioned solder sections 112 of bending; Guarantee the steadiness of its connection, effectively prevent red ink test infiltration; And the junction is formed with location hole 114 between fixed part 111 and solder sections 112, and when conductive feet 11 and insulating body 20 produced by insert molding, this insulating body 20 is filled in the location hole 114, to bite insulating body 20 better; In present embodiment; The structure of four conductive feet 11 of each metallic support 10 is identical; And its four fixed parts 112 are matrix pattern to be arranged, and is formed with spacing protuberance 115 on each fixed part 112, with its steadiness that is connected between further assurance conductive feet 11 and the insulating body 20.
Like Fig. 6 and shown in Figure 7; The material-strap structure that it has shown aforementioned led support 100 comprises a metal plate, is generally copper coin; Mold two row's led supports 100 on this metal plate at interval; The quantity of every row's led support 100 is 14, has changed the pattern that the led support spacing is big in the conventional art, density is little, has effectively reduced frock time and cost.During making, first punch forming goes out copper coin support 30 as shown in Figure 7; Then the copper coin support 30 that processes is put into plastic mould, mold insulating body 20, its product is as shown in Figure 6; Strip 31 to conductive feet 11 carries out punching molding again, and single led support 100 is separated, and so, an aforementioned copper coin can mold 28 led supports 100 simultaneously, and the structure of single led support 100 is as depicted in figs. 1 and 2.
In sum, design focal point of the present invention is that it mainly is through in aforementioned ccontaining cavity, being provided with a vertical dividing plate; Ccontaining cavity is separated into two cup structures of first cavity and second cavity, thus, when encapsulation, can accomplish in first cavity and second cavity, to put the led chip of different light rays; Make it two kinds of light and can adjust light-source brightness, obtain better light-source brightness, use comparatively flexible; Compare single glass, single light source in the conventional art, it has more superiority; And; The material-strap structure system of aforementioned led support is by molding many row's led supports on the metal plate at interval; And the quantity of every row's led support is 14, has changed the pattern that the led support spacing is big in the conventional art, density is little, has effectively reduced frock time and cost.
The above; It only is preferred embodiment of the present invention; Be not that technical scope of the present invention is done any restriction, so every foundation technical spirit of the present invention all still belongs in the scope of technical scheme of the present invention any trickle modification, equivalent variations and modification that above embodiment did.
Claims (10)
1. led support; Comprise metallic support and be overmolded in the insulating body on this metallic support that wherein, indent forms and is useful on the ccontaining cavity of putting led chip on this insulating body; This metallic support comprises a plurality of conductive feet; It is characterized in that: this ccontaining cavity bottom surface one extends upward and is formed with an opaque vertical dividing plate, and these vertical dividing plate both sides form first cavity and second cavity, and this first cavity is furnished with different conductive feet respectively with the second cavity bottom.
2. led support according to claim 1 is characterized in that: the degree of depth of said ccontaining cavity is 0.5mm.
3. led support according to claim 1; It is characterized in that: said conductive feet comprises the fixed part and the solder sections of one-body molded connection; This fixed part is exposed to the inner bottom part of aforementioned ccontaining cavity, and this solder sections is stretched out the side of insulating body and the bottom that bending extends to insulating body; The upper and lower surperficial symmetrical expression indent of junction is formed with holddown groove, this holddown groove and aforementioned dielectric main body produced by insert molding between the fixed part of conductive feet and solder sections.
4. led support according to claim 1 is characterized in that: the junction is formed with location hole between the fixed part of said conductive feet and the solder sections, this location hole and aforementioned dielectric main body produced by insert molding.
5. led support according to claim 1 is characterized in that: be formed with spacing protuberance on the fixed part of said conductive feet, this spacing protuberance and aforementioned dielectric main body produced by insert molding.
6. led support according to claim 1 is characterized in that: totally four of said conductive feet, the structure of each conductive feet is identical, and four fixed parts are the matrix pattern layout.
7. led support according to claim 1 is characterized in that: said ccontaining cavity is cup-shaped.
8. a LED lamp comprises led support and is installed on the led chip on this led support, wherein; This led support comprises metallic support and is overmolded in the insulating body on this metallic support; Wherein, indent forms and is useful on the ccontaining cavity of putting led chip on this insulating body, and this metallic support comprises a plurality of conductive feet; It is characterized in that: this ccontaining cavity bottom surface one extends upward and is formed with an opaque vertical dividing plate, and these vertical dividing plate both sides form first cavity and second cavity; Aforementioned led chip comprises the led chip of two different light rays, and it is placed in respectively in first cavity and second cavity.
9. said according to Claim 8 a kind of LED lamp is characterized in that: said led chip is cold White-light LED chip and warm white LED chip.
10. a material-strap structure is characterized in that: comprise a metal plate, mold many rows led support as claimed in claim 1 on this metal plate at interval, and the quantity of every row's led support is 14.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210031952.0A CN102610733B (en) | 2012-02-14 | 2012-02-14 | LED (Light Emitting Diode) lamp, LED bracket and LED bracket material strip structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210031952.0A CN102610733B (en) | 2012-02-14 | 2012-02-14 | LED (Light Emitting Diode) lamp, LED bracket and LED bracket material strip structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102610733A true CN102610733A (en) | 2012-07-25 |
| CN102610733B CN102610733B (en) | 2014-08-13 |
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| CN201210031952.0A Active CN102610733B (en) | 2012-02-14 | 2012-02-14 | LED (Light Emitting Diode) lamp, LED bracket and LED bracket material strip structure |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104183685A (en) * | 2014-08-14 | 2014-12-03 | 东莞市欧思科光电科技有限公司 | Color temperature and color rendering index adjustable type two-cup colorful LED lamp |
| CN104576885A (en) * | 2014-12-18 | 2015-04-29 | 上海大学 | Flip LED package member |
| CN104600172A (en) * | 2014-09-10 | 2015-05-06 | 广东长盈精密技术有限公司 | Flip chip type LED (light-emitting diode) bracket and manufacturing method thereof |
| CN105024001A (en) * | 2014-04-21 | 2015-11-04 | 重庆四联光电科技有限公司 | LED support bowl cup structure and LED lamp bead having the support bowl cup structure |
| CN109037173A (en) * | 2018-07-31 | 2018-12-18 | 上海源微电子科技有限公司 | A kind of paster type encapsulation structure of LED linear driving chip |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105024001A (en) * | 2014-04-21 | 2015-11-04 | 重庆四联光电科技有限公司 | LED support bowl cup structure and LED lamp bead having the support bowl cup structure |
| CN104183685A (en) * | 2014-08-14 | 2014-12-03 | 东莞市欧思科光电科技有限公司 | Color temperature and color rendering index adjustable type two-cup colorful LED lamp |
| CN104183685B (en) * | 2014-08-14 | 2017-03-22 | 东莞市欧思科光电科技有限公司 | Color temperature and color rendering index adjustable type two-cup colorful LED lamp |
| CN104600172A (en) * | 2014-09-10 | 2015-05-06 | 广东长盈精密技术有限公司 | Flip chip type LED (light-emitting diode) bracket and manufacturing method thereof |
| CN104576885A (en) * | 2014-12-18 | 2015-04-29 | 上海大学 | Flip LED package member |
| CN104576885B (en) * | 2014-12-18 | 2018-02-13 | 上海大学 | Flip LED packing component |
| CN109037173A (en) * | 2018-07-31 | 2018-12-18 | 上海源微电子科技有限公司 | A kind of paster type encapsulation structure of LED linear driving chip |
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|---|---|
| CN102610733B (en) | 2014-08-13 |
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Effective date of registration: 20200313 Address after: Yuanzhou town Shangnan Industrial Park, BOLUO County, Huizhou City, Guangdong Province Patentee after: BOLUO CHENGCHUANG PRECISION INDUSTRY Co.,Ltd. Address before: 516000, Guangdong, Huizhou province Boluo County town on the South Industrial Park Co-patentee before: BOLUO CHONGIA PRECISION INDUSTRY Co.,Ltd. Patentee before: BOLUO CHENGCHUANG PRECISION INDUSTRY Co.,Ltd. Co-patentee before: Chongia Precision Industry Co.,Ltd. |
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