CN201060870Y - Side light-emitting diode device - Google Patents
Side light-emitting diode device Download PDFInfo
- Publication number
- CN201060870Y CN201060870Y CNU2007200528713U CN200720052871U CN201060870Y CN 201060870 Y CN201060870 Y CN 201060870Y CN U2007200528713 U CNU2007200528713 U CN U2007200528713U CN 200720052871 U CN200720052871 U CN 200720052871U CN 201060870 Y CN201060870 Y CN 201060870Y
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- China
- Prior art keywords
- metal substrate
- emitting diode
- lateral light
- cavity
- tube core
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- Expired - Lifetime
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Abstract
The utility model discloses a lateral-emitting light emitting diode (LED), comprising a tube core, a packaging gel, a plurality of bonding wires, and a packaging body support, which is characterized in that the packaging body support adopts a metal base plate with a cavity structure, wherein, the metal base plate form the positive and negative of the lateral-emitting LED; the tube core is arranged in the cavity of the metal base plate; the tube core pole is connected with the other pole of the metal base plate via the bonding wire; the tube core, the cavity of the metal base plate, the bonding wire, and the pole pins of the metal base plate are packaged via the packaging gel; the two spacing parts of the metal base plate are connected together via the packaging gel. The utility model has the advantages of good heat dissipation effect, stable photoelectric character, large bearable current, and low production cost. The utility model is applied to the production and manufacture of various lateral-emitting LED products.
Description
Technical field
The utility model relates to the light-emitting diode field, but more particularly relates to a kind ofly have that the good heat dissipation effect loaded current is big, photoelectric characteristic is stable, the lateral light-emitting diode of low cost of manufacture.
Background technology
Lateral light-emitting diode has been widely used in the light source of the back light unit of small-medium size LCD such as PDA, mobile phone, MP3 at present.At present, the brightness of lateral light-emitting diode, thickness etc. all develop into than higher level, as Chinese patent application number is 200510133995.X, the applying date is on August 23rd, 2005, denomination of invention is the side view LED encapsulation with the lead frame structure that is designed to improve resin flows, and main contents have related to a kind of side view LED encapsulation of the LCD of being used for back light unit, and this side view LED encapsulation comprises: led chip, the strip lead frame has the toothing that is formed in its lateral edges.Led chip is assemblied on the surface of lead frame.The package main body of one is formed from a resin, and comprise the hollow with the cavity that is used to hold led chip the first half and by lead frame and the first half separate solid back half.The toothing of lead frame can improve resin flows, thereby even the LED encapsulation is done to such an extent that also can guarantee stability as thin as a wafer.
Be described below referring to figs. 1 through Fig. 2: Fig. 1 is the encapsulation front view of known lateral light-emitting diode, and Fig. 2 is the encapsulation cutaway view of known lateral light-emitting diode.
At first bar shaped lead frame A is placed in as shown in Figure 3 the mold, and resin flows with groove after injecting mold, adds curing molding behind full all spaces, forms the cavity of placing chip.
Because known product adopts the structure of plastic packaging chassis body, heat dissipation problem is not settled properly, and the photoelectricity stability characteristic (quality) is subjected to bigger restriction.Along with improving constantly of light-emitting diode production technology, the light-emitting diode range of application constantly enlarges, and light-emitting diode must be considered heat dissipation problem, and for a long time, known framework adopts the technology of traditional plastic packaging that this problem is effectively solved.
Summary of the invention
The purpose of this utility model is exactly the stable lateral light-emitting diode of a kind of good heat dissipation effect, photoelectric characteristic that provides for the deficiency that solves prior art.
The utility model is to adopt following technical solution to realize above-mentioned purpose: a kind of lateral light-emitting diode, comprise tube core, packing colloid, bonding line, the package main body support, it is characterized in that, the package main body support adopts the metal substrate with cavity body structure, two parts that metal substrate is divided into mutually insulated form two electrodes, tube core is placed in the cavity of metal substrate, bonding line is tube connector core electrode and metal substrate another part electrode respectively, packing colloid is with tube core, the metal substrate cavity, bonding line, the electrode pin of metal substrate encapsulates, and metal substrate two parts are at interval linked together.
As further specifying of such scheme, be provided with one or more tube cores in the cavity of described metal substrate.
Described tube core is placed in the cavity of metal substrate by adhesive.
Described cavity body structure is ellipse or rectangle or strip.
Described metallic substrate surfaces is provided with coating, this coating for silver or the gold, palladium other have the metal of reflecting properties.
The encapsulation upper surface is plane, concavees lens type or lenticular lens type after the described packing colloid moulding.
Described adhesive is conducting resinl, insulating cement or auxiliary welding material.
Described one or more tube core, bonding line, packing colloid, metal substrate constitute a unit, and the metal substrate of some unit forms the cell array that an integral body constitutes the capable N row of M, M 〉=1 wherein, N 〉=1.
The beneficial effect that the utility model adopts above-mentioned technical solution to reach is: the utility model adopts the metal substrate support with cavity body structure to use known plastic packaging support as main packing bearing main body as an alternative, two parts that metal substrate is divided into mutually insulated form two electrodes, tube core is placed in the metal substrate cavity by adhesive, bonding line is tube connector core electrode and metal substrate another part electrode respectively, good heat conductivity, but loaded current is big, it is poor to have solved traditional lateral light-emitting diode radiating effect, the problem that photoelectricity stability is low, overcome the idea that traditional package main body support adopts plastic packaging for a long time, luminous efficiency improves greatly.
Description of drawings
Fig. 1 is the encapsulation front view of known lateral light-emitting diode;
Fig. 2 is the encapsulation cutaway view of known lateral light-emitting diode;
Fig. 3 is the encapsulation mold of known lateral light-emitting diode;
Fig. 4 is that the utility model lateral light-emitting diode metal substrate partly etches plane graph;
Fig. 5 is that the utility model lateral light-emitting diode chip mount is finished plane graph;
Fig. 6 is that the utility model lateral light-emitting diode lead-in wire bonding is finished plane graph;
Fig. 7 is the structure chart after the final separation of the utility model lateral light-emitting diode;
Fig. 8 is the structure vertical view after the final separation of the utility model lateral light-emitting diode.
Description of reference numerals: 1, metal substrate 2, cavity body structure 3, perforation 4, tube core 5, bonding line 6, electrode pin 7, electrode 8, packing colloid
Embodiment
Shown in Fig. 4～8, a kind of lateral light-emitting diode of the utility model, comprise tube core 4, packing colloid 8, adhesive, bonding line 5, employing has the metal substrate 1 of cavity body structure 2 as package main body, two parts that metal substrate 1 is divided into mutually insulated form two electrodes 7, tube core 4 is placed in the cavity of metal substrate 1 by adhesive, adhesive is a conducting resinl, insulating cement or auxiliary welding material, cavity body structure 2 is oval, rectangle, strip or other shape, bonding line 5 is tube connector core electrode and metal substrate another part electrode respectively, packing colloid 8 is with tube core 4, the metal substrate cavity, bonding line 5, electrode pin 6 encapsulation of metal substrate are got up, and metal substrate 1 two parts are at interval linked together.Each tube core, bonding line, packing colloid, metal substrate constitute a unit, and the metal substrate of some unit forms the cell array that an integral body constitutes the capable N row of M, M 〉=1 wherein, and N 〉=1, the periphery of this cell array is provided with perforation.The encapsulation upper surface is designed to plane, concavees lens type or lenticular lens type according to application demand after packing colloid 8 moulding, and in the present embodiment, packing colloid 8 upper surfaces are shaped as sphere, and packing colloid 8 can be water white transparency, scattering, fluorescent glue etc.Metal substrate 1 overlay coating is silver or other reflecting properties preferred metal, as palladium, gold.
As previously discussed, only be preferred embodiment of the present utility model, be not to be used for limiting scope of the present utility model, those skilled in the art also can do numerous modifications and variations, under the spirit that does not break away from utility model, all in the claimed scope of the utility model.
Claims (8)
1. lateral light-emitting diode, comprise tube core, packing colloid, bonding line, the package main body support, it is characterized in that, the package main body support adopts the metal substrate with cavity body structure, metal substrate forms positive and negative two electrodes of lateral light-emitting diode, tube core is placed in the cavity of metal substrate, bonding line is tube connector core electrode and metal substrate another part electrode respectively, packing colloid encapsulates the electrode pin of tube core, metal substrate cavity, bonding line, metal substrate, and the metal substrate each several part is linked together.
2. a kind of lateral light-emitting diode according to claim 1 is characterized in that, is provided with one or more tube cores in the cavity of described metal substrate.
3. a kind of lateral light-emitting diode according to claim 1 and 2 is characterized in that described tube core is placed in the cavity of metal substrate by adhesive.
4. a kind of lateral light-emitting diode according to claim 1 is characterized in that, described cavity body structure is ellipse or rectangle or strip.
5. a kind of lateral light-emitting diode according to claim 1 is characterized in that described metallic substrate surfaces is provided with the coat of metal with reflecting properties.
6. a kind of lateral light-emitting diode according to claim 5 is characterized in that, the described coat of metal is silver, gold or palladium.
7. a kind of lateral light-emitting diode according to claim 1 is characterized in that, the encapsulation upper surface is plane or concavees lens type or lenticular lens type after the described packing colloid moulding.
8. a kind of lateral light-emitting diode according to claim 1, it is characterized in that, one or more tube cores in the described same packing colloid, bonding line and metal substrate constitute a unit, the metal substrate of some unit forms the cell array that an integral body constitutes the capable N row of M, M 〉=1 wherein, N 〉=1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200528713U CN201060870Y (en) | 2007-06-18 | 2007-06-18 | Side light-emitting diode device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200528713U CN201060870Y (en) | 2007-06-18 | 2007-06-18 | Side light-emitting diode device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201060870Y true CN201060870Y (en) | 2008-05-14 |
Family
ID=39409359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007200528713U Expired - Lifetime CN201060870Y (en) | 2007-06-18 | 2007-06-18 | Side light-emitting diode device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201060870Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102163685A (en) * | 2010-02-21 | 2011-08-24 | 福华电子股份有限公司 | Material sheet structure of support of light-emitting diode |
| CN102820408A (en) * | 2012-08-07 | 2012-12-12 | 苏州金科信汇光电科技有限公司 | Efficient LED chip packaging mechanism |
-
2007
- 2007-06-18 CN CNU2007200528713U patent/CN201060870Y/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102163685A (en) * | 2010-02-21 | 2011-08-24 | 福华电子股份有限公司 | Material sheet structure of support of light-emitting diode |
| CN102820408A (en) * | 2012-08-07 | 2012-12-12 | 苏州金科信汇光电科技有限公司 | Efficient LED chip packaging mechanism |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20080514 |