CN102163685A - Material sheet structure of support of light-emitting diode - Google Patents
Material sheet structure of support of light-emitting diode Download PDFInfo
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- CN102163685A CN102163685A CN2010101169860A CN201010116986A CN102163685A CN 102163685 A CN102163685 A CN 102163685A CN 2010101169860 A CN2010101169860 A CN 2010101169860A CN 201010116986 A CN201010116986 A CN 201010116986A CN 102163685 A CN102163685 A CN 102163685A
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- tablet
- electrode pin
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- section
- carrying tablet
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Abstract
The invention relates to a material sheet structure of a support of a light-emitting diode, which comprises a side frame, a carrying sheet connected with the side frame and an electrode connecting pin. The electrode connecting pin is positioned beside the carrying sheet and spaced with the carrying sheet, and the carrying sheet and the electrode connecting pin have the same thickness. The first electrode connecting pin comprises a first outer leading section, a routing section and a second outer leading section, which are sequentially connected, wherein the first outer leading section and the second outer leading section are connected with the side frame, and the routing section comprises a first raised part. Therefore, required routing material is reduced, the processing steps of a material sheet are reduced, the process speed is further upgraded, the product miniaturization is benefited, and the structure is also excellent in heat conduction.
Description
Technical field
The invention relates to a kind of tablet structure, refer to a kind of light-emitting diode (LightEmitting Diode that is applicable to especially; LED) the tablet structure of support.
Background technology
Known LED encapsulating structure mainly includes carrying support, a positive and negative electrode pin and has the insulation framework of bowl cup groove, and led chip is placed on the carrying support and is positioned at bowl cup groove.Because the insulation framework is an ejection formation on carrying support and electrode pin, its location soundness is one of key factor that influences the product yield.
TaiWan, China patent announcement M347687 discloses a kind of surface adhesion type LED and metallic support thereof, coil holder structure, it mainly is the space, location of producing a fovea superior structure in electrode pin bottom surface, insulation framework for ejection formation is filled coating, promotes integrally-built location steadiness.Wherein employed metal tablet (source of carrying support and electrode pin) need present a kind of thickness material kenel before carrying out the ejection formation step, the position that just corresponding chip is placed needs thicker.
The design of above-mentioned tablet has some shortcomings, promptly just must increase cut formality together in order to produce thickness material kenel, and as if the tablet of desiring to make thickness material kenel in one-body molded mode also not a duck soup, wayward because of its evenness, expense is also higher.
In addition, because the carrying support that is all metal with the electrode pin has radiating effect concurrently, the preceding position of having mentioned that corresponding chip is placed needs thicker, means that than thick material heat dissipation path is longer, and the chip cooling effect is had negative effect.
Summary of the invention
LED support tablet structure of the present invention comprises a frame, a carrying tablet, reaches one first electrode pin.The above-mentioned first electrode pin is positioned at by the carrying tablet side, and with carrying tablet separately.Carrying tablet, identical with the first electrode pin thickness, and the first electrode pin includes in regular turn the one first outer section of drawing that connects, a dozen line segments, and one second section of drawing outward, the first outer section of drawing all is connected in frame with the second outer section of drawing, and the routing section includes one first protrusion.
By said structure, the more known person of required wire rod more reduces during routing, select thin material and use reaching the product slimming, more can allow integrated artistic speed up and the metal tablet is optional, and LED structure heat-conducting effect is also better.
Above-mentioned carrying tablet can include a reduction inclined-plane in side, coats ability to promote the insulation framework.Carrying tablet also can include an auxiliary material grasping hole, has the insulation of lifting framework equally and coats the ability effect.Auxiliary material grasping hole can include a continuous conical section, reach one isometrical section, and two sections are opened on the bottom and the top of carrying tablet respectively.
Above-mentioned routing section can also include one second protrusion, is to define a recess jointly with first protrusion, in order to put a Zener diode.Above-mentioned frame can include a location hole, for the usefulness that adds the location in man-hour.
Tablet structure of the present invention can also include one second electrode pin, be to be positioned at the other side opposite of carrying tablet side with the first electrode pin, and with carrying tablet separately, carrying tablet, identical with the second electrode pin thickness.
Description of drawings
For foregoing of the present invention can be become apparent, preferred embodiment cited below particularly, and conjunction with figs. are described in detail below, wherein:
Fig. 1 is the LED metallic support tablet partial plan of a preferred embodiment of the present invention.
Fig. 2 is the original material exploded view of the led support of a preferred embodiment of the present invention.
Fig. 3 is the LED encapsulating structure stereogram of a preferred embodiment of the present invention.
Fig. 4 is Fig. 3 cutaway view.
Fig. 5 is the auxiliary material grasping hole of a Fig. 1 cutaway view.
Embodiment
With reference to figure 1 and Fig. 2.A metallic support tablet 10 that is used for LED shown in the figure is comprising the original materials (framework ejection formation encapsulation steps refers to insulate as yet) that many group led supports are arranged.The original material of each led support mainly includes a frame 11, a carrying tablet 12, a positive electrode pin 13, reaches a negative electrode pin 14.Offer a plurality of location holes 20 on the frame 11, for the usefulness that adds the location in man-hour.
Similarly, negative electrode pin 14 includes the one first outer section of drawing 141, a dozen line segments 142 in regular turn, reaches the one second outer section of drawing 143, negative electrode pin 14 promptly is connected in frame 11 with the first outer section of drawing 141 and the second outer section of drawing 143, wherein routing section 142 includes one first protrusion 142a, reaches one second protrusion 142c, defines a recess 142b between two protrusion 142a, the 142c.In the present embodiment, the recess 132b of positive electrode pin 13 is not corresponding with the position of the recess 142b of negative electrode pin 14, but at opposition side.Recess 132b, the 142b of electrode pin 13,14 can be used to place Zener diode.
Specifically, above-mentioned carrying tablet 12 and two electrode pins 13,14 are all from a tablet, the tool same thickness, above-mentioned protrusion 132a, 132c, 142a, 142c can punching press bending mode form, and are in that 10 punching out go out in the same step of gap 21-24 and just can apply to the metal tablet.Therefore, utilize the present invention not only can select thin material to use to reach the product slimming, more can allow integrated artistic speed up.
In addition, in this example, carrying tablet 12 offers the two auxiliary material grasping holes 16 that allow the insulation framework insert.Auxiliary material grasping hole 16 includes a continuous conical section 161, reaches one isometrical section 162 (being plotted in Fig. 5), and the two is opened on the bottom and the top of carrying tablet 12 respectively.Can allow the insulation framework more firmly be coated and fixed by such structure at carrying tablet 12.Carrying tablet 12 all is formed with reduction inclined-plane 121 in the side position near two electrode pins 13,14, these reduction inclined-plane 121 structures are brought into play the effect that promotes the plastic overmold ability too.
With reference to figure 3 and Fig. 4.One has finished insulation framework ejection formation step, solid brilliant step, routing step, and LED encapsulating structure that frame is removed shown in the figure.This LED encapsulating structure comprises carrying tablet 12, positive electrode pin, negative electrode pin, an insulation framework 15, reaches a led chip 19.Insulation framework 15 parts are coated and fixed at carrying tablet 12, reach two electrode pins, and the outer portion 133,141,143 of drawing of two electrode pins is outstanding from framework 15 sides of insulating.
It should be noted that, because protrusion 132a, 142a have a difference in height with respect to carrying tablet 12, and when led chip 19 is fixed on the carrying tablet 12, led chip 19 is more a little bit smaller with the more aforesaid difference in height of difference in height of protrusion 132a, 142a, therefore the more known person of material requested more reduces during routing, and thickening is more known not good especially and LED structure heat-conducting effect of the present invention is also because of the chip bearing position.
The foregoing description only is to give an example for convenience of description, and the interest field that the present invention advocated should be as the criterion so that the claim scope is described certainly, but not only limits to the foregoing description.
Claims (7)
1. LED support tablet structure comprises:
One frame;
One carrying tablet is connected in this frame; And
One first electrode pin;
It is characterized in that:
This first electrode pin be positioned at this carrying tablet side other and with this carrying tablet separately, this carrying tablet, identical with this first electrode pin thickness, and this first electrode pin includes in regular turn the one first outer section of drawing that connects, a dozen line segments, and one second section of drawing outward, this first outer section of drawing all is connected in this frame with this second outer section of drawing, and this routing section includes one first protrusion.
2. LED support tablet structure as claimed in claim 1, wherein, this carrying tablet includes a reduction inclined-plane.
3. LED support tablet structure as claimed in claim 1, wherein, this routing section also includes one second protrusion, defines a recess jointly with this first protrusion.
4. tablet structure as claimed in claim 1 also includes one second electrode pin, is positioned at other opposite with this first electrode pin side of this carrying tablet side, and with this carrying tablet separately, this carrying tablet, identical with this second electrode pin thickness.
5. tablet structure as claimed in claim 1, wherein, this carrying tablet includes an auxiliary material grasping hole.
6. LED support tablet structure as claimed in claim 5, wherein, this auxiliary material grasping hole includes a continuous conical section, reaches one isometrical section bottom and top that is opened on this carrying tablet respectively.
7. LED support tablet structure as claimed in claim 1, wherein, this frame includes a location hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101169860A CN102163685A (en) | 2010-02-21 | 2010-02-21 | Material sheet structure of support of light-emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101169860A CN102163685A (en) | 2010-02-21 | 2010-02-21 | Material sheet structure of support of light-emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102163685A true CN102163685A (en) | 2011-08-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101169860A Pending CN102163685A (en) | 2010-02-21 | 2010-02-21 | Material sheet structure of support of light-emitting diode |
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| Country | Link |
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| CN (1) | CN102163685A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1638160A (en) * | 2003-12-26 | 2005-07-13 | 三洋电机株式会社 | Package for light emitting element and process for fabricating same |
| CN2720645Y (en) * | 2004-07-29 | 2005-08-24 | 亿光电子工业股份有限公司 | Anti-electrostatic package structure for light-emitting diode |
| CN1679179A (en) * | 2002-09-02 | 2005-10-05 | 帝希欧有限公社 | A surface mounting type light emitting diode |
| CN1992362A (en) * | 2005-12-27 | 2007-07-04 | 株式会社东芝 | Luminescent semiconductor device and method for manufacturing the same |
| US20070278511A1 (en) * | 2004-03-24 | 2007-12-06 | Ejiji Ohno | Light-Emitting Device Manufacturing Method and Light-Emitting Device |
| CN201060870Y (en) * | 2007-06-18 | 2008-05-14 | 佛山市国星光电股份有限公司 | Side light-emitting diode device |
-
2010
- 2010-02-21 CN CN2010101169860A patent/CN102163685A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1679179A (en) * | 2002-09-02 | 2005-10-05 | 帝希欧有限公社 | A surface mounting type light emitting diode |
| CN1638160A (en) * | 2003-12-26 | 2005-07-13 | 三洋电机株式会社 | Package for light emitting element and process for fabricating same |
| US20070278511A1 (en) * | 2004-03-24 | 2007-12-06 | Ejiji Ohno | Light-Emitting Device Manufacturing Method and Light-Emitting Device |
| CN2720645Y (en) * | 2004-07-29 | 2005-08-24 | 亿光电子工业股份有限公司 | Anti-electrostatic package structure for light-emitting diode |
| CN1992362A (en) * | 2005-12-27 | 2007-07-04 | 株式会社东芝 | Luminescent semiconductor device and method for manufacturing the same |
| CN201060870Y (en) * | 2007-06-18 | 2008-05-14 | 佛山市国星光电股份有限公司 | Side light-emitting diode device |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110824 |