CN102931332A - Substrate type light-emitting diode (LED) integrated packaging method - Google Patents
Substrate type light-emitting diode (LED) integrated packaging method Download PDFInfo
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- CN102931332A CN102931332A CN2012104410383A CN201210441038A CN102931332A CN 102931332 A CN102931332 A CN 102931332A CN 2012104410383 A CN2012104410383 A CN 2012104410383A CN 201210441038 A CN201210441038 A CN 201210441038A CN 102931332 A CN102931332 A CN 102931332A
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- insulated substrate
- type led
- base plate
- sheet metal
- plate type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Abstract
The invention provides a substrate type light-emitting diode (LED) integrated packaging method. The substrate type LED integrated packaging method comprises the following steps: 1) an insulated substrate and a metal sheet are selected, and glass transition temperature of the insulated substrate is at least 180 DEG C; 2) the insulated substrate is provided with an installation through hole, and the metal sheet is fixed in the installation through hole; 3) the front face and the back face of the insulated substrate are respectively provided with coatings; 4) a chip is fixed on the metal sheet; 5) a bonding wire is welded on the coating of the front face of the insulated substrate; and 6) the chip is molded in a mold pressing method, and a substrate type LED is obtained after solidification. According to the substrate type LED integrated packaging method, a substrate is changed, the mold pressing method is adopted for molding, molding of the chip is quickened, and therefore integrated packaging of the substrate type LED is quickened, and integrated packaging efficiency of the substrate type LED is improved.
Description
Technical field
The present invention relates to base plate type chip encapsulation technology field, more particularly, relate to the integrated encapsulation method of a kind of base plate type LED.
Background technology
In base plate type LED integration packaging technology, in order to use than the small area implementation relatively high power, usually adopt COB(Chip On Board at present, COB, chip on board encapsulation) integration packaging.The roughly flow process of COB encapsulation is:
At COB substrate point box dam glue; Baking box dam glue; After the baking of box dam glue is finished, the some packaging plastic; The baking packaging plastic.
Wherein, the purpose of some box dam glue is to flow out the COB substrate for fear of packaging plastic, so the COB encapsulation needs twice glue, also needs baking glue twice, then required encapsulation time of COB encapsulation longer, packaging efficiency is lower; And the box dam point gum machine production efficiency of existing COB encapsulation is lower, and it is longer further to have prolonged the required encapsulation time of COB encapsulation, causes the packaging efficiency of COB encapsulation lower, so that the integration packaging efficient of base plate type LED is lower.
In addition, the COB substrate mostly is greatly ceramic substrate, because the thermal conductivity of ceramic substrate is higher, but ceramic substrate is more crisp, especially have relatively high expectations for the cutting processing procedure, so that the efficient of ceramic substrate cutting processing procedure is lower, cause the integration packaging efficient of base plate type LED lower; And the cost of ceramic substrate is higher, so that the integration packaging cost of base plate type LED is higher.
In sum, how providing the integrated encapsulation method of a kind of base plate type LED, to improve the integration packaging efficient of base plate type LED, is present those skilled in the art's problem demanding prompt solution.
Summary of the invention
The integrated encapsulation method that the purpose of this invention is to provide a kind of base plate type LED is to improve the integration packaging efficient of base plate type LED.
To achieve these goals, the invention provides following technical scheme:
The integrated encapsulation method of a kind of base plate type LED comprises step:
1) choose insulated substrate and sheet metal, the glass transition temperature of described insulated substrate is greater than or equal to 180 °;
2) at described insulated substrate the installation through hole is set, and described sheet metal is fixed in the described installation through hole;
3) at the front and back of described insulated substrate coating is set respectively;
4) chip is fixed on the described sheet metal;
5) the described coating in described insulated substrate front welds bonding wire;
6) adopt press moulding mode with described chip sealing, obtain base plate type LED after solidifying.
Preferably, by colloid described sheet metal is fixed in the described installation through hole in the above-mentioned integrated encapsulation method, described step 2).
Preferably, in the above-mentioned integrated encapsulation method, coating described in the described step 3) specifically comprises successively copper coating, nickel coating and silvering.
Preferably, in the above-mentioned integrated encapsulation method, after described step 6), also comprise step: described base plate type LED is cut into some LED integrated packages.
Preferably, in the above-mentioned integrated encapsulation method, described insulated substrate is the BT plate.
Preferably, in the above-mentioned integrated encapsulation method, the thickness of described insulated substrate and described sheet metal is respectively 0.4mm, and the thickness of described coating is 0.05mm.
Preferably, in the above-mentioned integrated encapsulation method, described sheet metal is specially copper sheet.
Preferably, in the above-mentioned integrated encapsulation method, described insulated substrate and described sheet metal are respectively cuboid.
The integrated encapsulation method of base plate type LED provided by the invention, sheet metal is arranged in the installation through hole of insulated substrate, front and back at insulated substrate arranges coating respectively, at sheet metal chip is set, weld bonding wire at coating, realized that the thermoelectricity of chip separates, also strengthened the heat radiation of chip simultaneously, then can adopt the press moulding mode sealing at last, finally obtain base plate type LED.
The integrated encapsulation method of base plate type LED provided by the invention by adopting the press moulding mode sealing, is compared with prior art COB encapsulation, only needs a sealing to get final product, and need not to carry out twice glue and twice baking glue; And the efficiency far of mold pressing sealing is greater than the efficient of point gum machine point glue, clearly, the integrated encapsulation method of base plate type LED provided by the invention has been accelerated the sealing of chip, thereby has accelerated the integration packaging of base plate type LED, has improved the integration packaging efficient of base plate type LED.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art, the below will do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art, apparently, accompanying drawing in the following describes only is some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing.
The schematic flow sheet of the integrated encapsulation method of the base plate type LED that Fig. 1 provides for the embodiment of the invention;
The relative position schematic diagram of insulated substrate, sheet metal and coating in the integrated encapsulation method of the base plate type LED that Fig. 2 provides for the embodiment of the invention;
The schematic perspective view of the base plate type LED that the integrated encapsulation method of the base plate type LED that Fig. 3 provides for the embodiment of the invention obtains;
The floor map of the base plate type LED that the integrated encapsulation method of the base plate type LED that Fig. 4 provides for the embodiment of the invention obtains.
Among upper Fig. 1-4:
Insulated substrate 1, installation through hole 11, groove 12, sheet metal 2, front coating 3, back side coating 4, chip 5, bonding wire 6.
Embodiment
The embodiment of the invention provides the integrated encapsulation method of a kind of base plate type LED, has improved the integration packaging efficient of base plate type LED.
Below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making the every other embodiment that obtains under the creative work prerequisite.
Please refer to accompanying drawing 1-4, the schematic flow sheet of the integrated encapsulation method of the base plate type LED that Fig. 1 provides for the embodiment of the invention; The relative position schematic diagram of insulated substrate, sheet metal and coating in the integrated encapsulation method of the base plate type LED that Fig. 2 provides for the embodiment of the invention; The schematic perspective view of the base plate type LED that the integrated encapsulation method of the base plate type LED that Fig. 3 provides for the embodiment of the invention obtains; The floor map of the base plate type LED that the integrated encapsulation method of the base plate type LED that Fig. 4 provides for the embodiment of the invention obtains.
The integrated encapsulation method of the base plate type LED that the embodiment of the invention provides specifically comprises step:
S01: choose insulated substrate and sheet metal;
In order to realize the press moulding mode sealing, need to improve the radiating efficiency of chip 5, so select to dispel the heat preferably new type of substrate, select sheet metal 2 and insulated substrate 1 combination.Preferential selection sheet metal 2 is copper sheet, certainly, also can select other dispel the heat preferably metal or alloys, such as aluminium, silver or aluminium alloy etc., the embodiment of the invention does not limit particularly to the particular type of sheet metal 2, as long as can improve the radiating efficiency of chip 5.Owing to need to coating and welding bonding wire 6 be set at insulated substrate 1, therefore require the glass transition temperature of insulated substrate 1 to be greater than or equal to 180 °, to guarantee at insulated substrate 1 coating and welding bonding wire 6 being set.Preferably, the glass transition temperature of insulated substrate 1 is 180-210 °.
S02: at insulated substrate the installation through hole is set, and sheet metal is fixed in the installation through hole;
For connection metal sheet 2 and insulated substrate 1, need to arrange at insulated substrate 1 through hole 11 is installed, namely sheet metal 2 will pass insulated substrate 1, as shown in Figure 2.Sheet metal 2 links to each other with insulated substrate 1, adopts copper insert process.General insulated substrate 1 and 2 bonding linking to each other of sheet metal namely are fixed on sheet metal 2 by colloid and install in the through hole 11.Certainly, also can adopt other modes that sheet metal 2 is fixed on and install in the through hole 11, for example realize the interference fit of the two by principle of expanding with heat and contracting with cold, and then realize being fixedly linked of the two.The embodiment of the invention does not limit particularly to this.Sheet metal 2 requires gapless between sheet metal 2 and the insulated substrate 1 with after insulated substrate 1 is connected, namely sheet metal 2 with through hole 11 be installed matched.
S03: the front and back at insulated substrate arranges coating respectively;
Need at the front and back with insulated substrate 1 coating to be set respectively, i.e. electroplating process.Here the front of insulated substrate 1 refers to that the one side that is provided with chip with sheet metal 2 is positioned at the face of homonymy; The back side of insulated substrate 1 is the one side with vis-a-vis.In the front of insulated substrate 1 front coating 3 is set, at the back side of insulated substrate 1 back side coating 4 is set, as shown in Figure 2.It is in order to weld the front gold thread that front coating 3 is set; It is for scolding tin that back side coating 4 is set, to realize conduction.Wherein, in order to guarantee the performance of base plate type LED, front coating 3 and back side coating 4 all comprise copper coating, nickel coating and silvering successively.Certainly, under the prerequisite of guaranteed performance, replaceable other coating.
S04: chip is fixed on the sheet metal;
S05: the coating in the insulated substrate front welds bonding wire;
S06: adopt press moulding mode with the chip sealing, obtain base plate type LED after solidifying.
Because chip 5 is arranged on the sheet metal 2, the radiating efficiency of chip 5 is higher, so can adopt press moulding mode with chip 5 sealings, concrete, the mold pressing sealing comprises that mainly step is as follows:
The base plate type led support that pressure welding is good is put into mould; Up and down two secondary moulds are with the hydraulic press matched moulds and vacuumize; Liquid-state silicon gel is put into the glue road entrance heating of injection molding tool; With hydraulic mandril with in the silica gel press-in die die cavity; Silica gel enters in the base plate type LED forming tank and curing along Jiao Dao.Wherein, the base plate type led support refers to and sets up chip 5, welded the base plate type led support behind the bonding wire 6, and the embodiment of the invention is not done concrete restriction to the making of base plate type led support.
The key step of mold pressing sealing as above certainly, also can be done suitable change on the basis of above-mentioned steps, as long as can realize the mold pressing sealing, the present invention does not limit particularly to the concrete steps of mold pressing sealing.
The integrated encapsulation method of the base plate type LED that the embodiment of the invention provides, sheet metal 2 is arranged in the installation through hole 11 of insulated substrate 1, front and back at insulated substrate 1 arranges coating respectively, at sheet metal 2 chip 5 is set, at coating welding bonding wire 6, realized that the thermoelectricity of chip 5 separates, also strengthened the heat radiation of chip 5 simultaneously, then can adopt the press moulding mode sealing at last, finally obtain base plate type LED.
The integrated encapsulation method of the base plate type LED that the embodiment of the invention provides by adopting the press moulding mode sealing, is compared with prior art COB encapsulation, only needs a sealing to get final product, and need not to carry out twice glue and twice baking glue; And the efficiency far of mold pressing sealing is greater than the efficient of point gum machine point glue, clearly, the integrated encapsulation method of base plate type LED provided by the invention has been accelerated the sealing of chip 5, thereby has accelerated the integration packaging of base plate type LED, has improved the integration packaging efficient of base plate type LED.
Be generally 150 ℃ of 1h(curing temperatures the curing time of box dam glue in the prior art); Encapsulation curing time is generally 120 ℃-125 ℃ of initial cure time 35-45min(curing temperatures), curing time in later stage, the 6-8h(curing temperature was 120 ℃) or 130 ℃ of 6h(curing temperatures).Because twice glue and twice baking required time of glue are far longer than insulated substrate and the time of sheet metal, connection metal sheet and insulated substrate and the time of mold pressing sealing selected, so the integrated encapsulation method of the base plate type LED that the embodiment of the invention provides has been accelerated the sealing of chip 5, thereby accelerated the integration packaging of base plate type LED, improved the integration packaging efficient of base plate type LED.
Preferably, the integrated encapsulation method of the base plate type LED that above-described embodiment provides also comprises step behind step S06: base plate type LED is cut into some LED integrated packages.Like this, can make corresponding base plate type LED to the demand of base plate type LED size according to reality.
In order further to optimize technique scheme, in the integrated encapsulation method of the base plate type LED that above-described embodiment provides, insulated substrate 1 is the BT plate, and full name is the BT resin substrate, and wherein the spelling of BT is Bismaleimide Triazine.The cost of BT plate is lower, draws materials convenient and easily processing, with respect to the ceramic substrate of prior art, selects the BT plate to reduce the integration packaging cost of base plate type LED, has also improved to a certain extent the integration packaging efficient of base plate type LED.Certainly, can select the insulated substrate 1 of other materials, the embodiment of the invention does not limit particularly to the type of insulated substrate 1 yet, as long as the glass transition temperature of insulated substrate 1 is at least 180 °.
In the integrated encapsulation method of the base plate type LED that above-described embodiment provides, preferentially select the thickness of insulated substrate 1 and sheet metal 2 to be respectively 0.4mm, the thickness of coating is 0.05mm.The thick end that is front coating 3 and back side coating 4, be 0.05mm.Certainly, can select insulated substrate 1, sheet metal 2 and the coating of other thickness, the embodiment of the invention does not limit particularly to this.
Preferably, in the integrated encapsulation method of the base plate type LED that above-described embodiment provides, insulated substrate 1 and sheet metal 2 are respectively cuboid, are convenient to the making of insulated substrate 1 and sheet metal 2, thereby are convenient to the integration packaging of base plate type LED.Certainly, can select according to demand insulated substrate 1 and the sheet metal 2 of other shapes, the embodiment of the invention does not limit particularly to this yet.
For the ease of subsequent probe base plate type LED, two relative grooves 12 need to be set at the edge of insulated substrate 1, groove 12 recessed centers to insulated substrate 1.The preferential selection, groove 12 is semicircle groove.
To the above-mentioned explanation of the disclosed embodiments, make this area professional and technical personnel can realize or use the present invention.Multiple modification to these embodiment will be apparent concerning those skilled in the art, and General Principle as defined herein can in the situation that does not break away from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention will can not be restricted to these embodiment shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (8)
1. the integrated encapsulation method of a base plate type LED is characterized in that, comprises step:
1) choose insulated substrate and sheet metal, the glass transition temperature of described insulated substrate is greater than or equal to 180 °;
2) at described insulated substrate the installation through hole is set, and described sheet metal is fixed in the described installation through hole;
3) at the front and back of described insulated substrate coating is set respectively;
4) chip is fixed on the described sheet metal;
5) the described coating in described insulated substrate front welds bonding wire;
6) adopt press moulding mode with described chip sealing, obtain base plate type LED after solidifying.
2. integrated encapsulation method according to claim 1 is characterized in that, described step 2) in by colloid described sheet metal is fixed in the described installation through hole.
3. integrated encapsulation method according to claim 1 is characterized in that, coating described in the described step 3) specifically comprises successively copper coating, nickel coating and silvering.
4. integrated encapsulation method according to claim 1 is characterized in that, also comprises step after described step 6): described base plate type LED is cut into some LED integrated packages.
5. integrated encapsulation method according to claim 1 is characterized in that, described insulated substrate is the BT plate.
6. integrated encapsulation method according to claim 5 is characterized in that, the thickness of described insulated substrate and described sheet metal is respectively 0.4mm, and the thickness of described coating is 0.05mm.
7. integrated encapsulation method according to claim 1 is characterized in that, described sheet metal is specially copper sheet.
8. the described integrated encapsulation method of any one is characterized in that according to claim 1-7, and described insulated substrate and described sheet metal are respectively cuboid.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2012104410383A CN102931332A (en) | 2012-11-07 | 2012-11-07 | Substrate type light-emitting diode (LED) integrated packaging method |
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| CN2012104410383A CN102931332A (en) | 2012-11-07 | 2012-11-07 | Substrate type light-emitting diode (LED) integrated packaging method |
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| CN102931332A true CN102931332A (en) | 2013-02-13 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104600184A (en) * | 2014-12-31 | 2015-05-06 | 东莞市凯昶德电子科技股份有限公司 | Ceramic substrate electroplated with gloss silver and method for electroplating gloss silver on ceramic substrate |
| CN106784254A (en) * | 2017-01-20 | 2017-05-31 | 深圳市润芯科技有限公司 | LED wafer packaging frame, component, technique and LED light source |
| CN108109533A (en) * | 2017-12-15 | 2018-06-01 | 深圳市晶台股份有限公司 | A kind of method for packing for realizing LED display modules |
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| CN202025750U (en) * | 2010-11-28 | 2011-11-02 | 晶诚（郑州）科技有限公司 | Large power LED packaging structure |
| US20120061716A1 (en) * | 2009-04-10 | 2012-03-15 | Nationstar Optoelectronics Co., Ltd. | Manufacturing method for power led head-dissipating substrate and power led product and the products thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20120061716A1 (en) * | 2009-04-10 | 2012-03-15 | Nationstar Optoelectronics Co., Ltd. | Manufacturing method for power led head-dissipating substrate and power led product and the products thereof |
| CN101630716A (en) * | 2009-08-17 | 2010-01-20 | 佛山市国星光电股份有限公司 | Platy LED metal substrate, platy LED light emitting device and manufacturing method thereof |
| CN202025750U (en) * | 2010-11-28 | 2011-11-02 | 晶诚（郑州）科技有限公司 | Large power LED packaging structure |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104600184A (en) * | 2014-12-31 | 2015-05-06 | 东莞市凯昶德电子科技股份有限公司 | Ceramic substrate electroplated with gloss silver and method for electroplating gloss silver on ceramic substrate |
| CN104600184B (en) * | 2014-12-31 | 2017-07-07 | 东莞市凯昶德电子科技股份有限公司 | A kind of method that silver lustre is electroplated on ceramic substrate |
| CN106784254A (en) * | 2017-01-20 | 2017-05-31 | 深圳市润芯科技有限公司 | LED wafer packaging frame, component, technique and LED light source |
| CN108109533A (en) * | 2017-12-15 | 2018-06-01 | 深圳市晶台股份有限公司 | A kind of method for packing for realizing LED display modules |
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Application publication date: 20130213 |