CN101630716A - Platy LED metal substrate, platy LED light emitting device and manufacturing method thereof - Google Patents
Platy LED metal substrate, platy LED light emitting device and manufacturing method thereof Download PDFInfo
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- CN101630716A CN101630716A CN 200910305686 CN200910305686A CN101630716A CN 101630716 A CN101630716 A CN 101630716A CN 200910305686 CN200910305686 CN 200910305686 CN 200910305686 A CN200910305686 A CN 200910305686A CN 101630716 A CN101630716 A CN 101630716A
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- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H01L2224/732—Location after the connecting process
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- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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Abstract
The invention relates to a platy LED metal substrate, a platy LED light emitting device and a manufacturing method thereof. The substrate is formed by elementary units which are provided with an upper hole part and a lower hole part opposite to each other, two lead connecting parts respectively connected with the inner sides of the upper hole part and the lower hole part, a chip placing part connected with the lead connecting part in connection with the upper hole part, two welding parts respectively connected with the outer sides of the upper hole part and the lower hole part, and two reinforcing ribs respectively located at two sides of the chip placing part and connected with the upper hole part and the lower hole part. The invention also relates to a method for manufacturing the platy LED light emitting device, comprising the steps of die cutting metal substrate, plating, printing ink, placing LED chip, bonding lead, packaging stamp, cutting wafer saw and testing package. The invention also relates to the metal substrate and a platy LED light emitting device manufactured by the method. The invention is simple in the process and improves the consistency and reliability of products; in addition, the manufactured platy LED light emitting device is featured by excellent performance and favorable consistency.
Description
Technical field
Patent of the present invention relates to a kind of light-emitting diode (LED) technology, particularly relates to a kind of sheet-shaped LED metal substrate and sheet-shaped LED light-emitting device and manufacture method thereof.
Background technology
Along with improving constantly of LED production technology, the LED range of application constantly enlarges, and makes the brightness of LED and photoelectricity stability characteristic (quality) require constantly to promote.The flat type LED production technology is quite ripe at present, as Chinese patent application number is 01131330.7, the applying date is on 04 10th, 2002, denomination of invention is flat type LED and manufacture method thereof, comprise the base that possesses face one side that is installed in main printed circuit board, extend and connect the body part that is arranged on the hole on the main printed circuit board and disposes from above-mentioned base, be arranged on this body part and at the luminous luminous component of another face one side of main printed circuit board, be provided with to be connected with the pair of outer of luminous component electrical connection on base and use electrode, luminous component is with resin-sealed sealing.When base being installed to the back side one side of main printed circuit board, the configuration luminous component make be configured in main printed circuit board on liquid crystal to carry on the back the light conducting direction of irradiation consistent.The manufacture method of flat type LED is to form a plurality of flat type LEDs through a plurality of operations on a slice aggregate circuit substrate, cuts apart the feasible flat type LED one by one of making of aggregate circuit substrate in final operation.
Flat type LED is widely used with its superior performance, along with the high-level requirement of application to luminous efficiency and useful life, a kind ofly begins to occur as the sheet-shaped LED of the bearing substrate of chip with metal.It as application number 00137787.7 patent of invention, a kind of " chip-type LED and manufacture method thereof " disclosed, relate to a kind of chip-type LED and manufacture method thereof, it is silver-plated in a metallic substrate surfaces, form several coil holders after etching, this coil holder is sticking brilliant in an end, and is connected to the relative other end by routing, carry out after the sealing and cut promptly constituting a chip-type LED, its coil holder that is exposed to the bottom promptly constitutes electric terminal.It is a kind of with the light-emitting diode of metal as the chip bearing substrate that this patent of invention provides, and heat dispersion and life of product are improved significantly.But the problems such as reliability that are easy to generate distortion, monomer device in the adhesive strength between encapsulating material and the substrate, the substrate package process are not settled properly.
In addition, also have a kind of plastic packaging lead frame posture LED, its manufacture process forms a plurality of unit for adopting metal lead wire frame after the punching press, for each unit injection encapsulation one plastic frame, carries out the encapsulation of led chip more then.Its advantage is that luminous intensity obviously is superior to common sheet-shaped LED, but the manufacturing cost height, complex manufacturing.
Summary of the invention
One object of the present invention is to provide a kind of sheet-shaped LED metal substrate, described substrate can overcome the problem that is easy to generate distortion of prior art, substrate of the present invention has relative last hole portion in two positions and following hole portion, two respectively with last hole portion, the inboard lead-in wire connecting portion that links to each other of hole portion down, the chip mount portion of the lead-in wire connecting portion that hole portion is connected in connection, two respectively with last hole portion, the weld part that links to each other of the hole portion outside, and two reinforcements that lay respectively at chip mount portion both sides and connect the hole portion of going up, following hole portion down.This substrate adopts the metal material of hardness height, good toughness to make.Because board structure of the present invention is in encapsulation process, can bear the influence of clamping pressure and indeformable.
Another object of the present invention is to provide the sheet-shaped LED light-emitting device of a kind of encapsulating material and metal substrate strong bonded, have last hole portion and following hole portion on the substrate of this light-emitting device, in moulding process, capsulation material passes the perforation of upper and lower hole portion and substrate is wrapped up, and forms firm combination; Simultaneously, the reinforcement on the metal substrate remains in packaging inside after mold pressing encapsulation cutting, thereby has increased the bonded area of packing colloid and substrate, makes encapsulating material more firm with combining of substrate.
The sheet-shaped LED device encapsulation structure that provides a kind of reliability high is provided a further object of the present invention, reinforcement on the substrate of this sheet-shaped LED can be fixed the relative position of hole portion, following hole portion and positive and negative electrode, promptly, in the mold pressing encapsulation process, this reinforcement can guarantee that the upper and lower hole portion and the positive and negative electrode of substrate are on the same horizontal plane all the time, have guaranteed reliability of products and consistency; In addition, the weld part upper surface of laying portion's homonymy at led chip is printed with printing ink, in the device use, this ink lay can prevent that device encapsulation structure is inner to destroy structure such as metal lead wire owing to scolding tin that high temperature melts enters, thereby has improved the reliability of device effectively.
A further object of the present invention is to provide a kind of metal substrate structure making process and utilizes this metal substrate structure to make the manufacture method of high reliability metal substrate sheet-shaped LED light-emitting device.In the method, utilize the metal substrate of hardness height, good toughness to prepare the sheet-shaped LED device, and by reinforcement is set on metal substrate, and make reinforcement and upper and lower hole portion connect into certain radian or angle of inclination, thereby make cutting machine vertically just can realize separation to the LED device, this method not only makes technology simple, and has improved consistency of product and reliability, obtains the sheet-shaped LED light-emitting device of function admirable, high conformity thus; In addition, utilize metallic substrate surfaces to electroplate the technology of one deck or multiple layer metal in this method, not only improved the solderability and the corrosion resistance of the die-cut section of light-emitting device, improved the reflector efficiency of substrate simultaneously, and then improved the light extraction efficiency of device; In addition, in the method, by adopting technology at the weld part upper surface printing-ink of chip mount portion homonymy, not only prevented to enter the inner phenomenon generation that destroys metal lead wire of device encapsulation structure owing to the scolding tin that high temperature melts, improved the reliability of device, the operation for downstream application producer subsequent technique simultaneously provides convenience.
Description of drawings
The present invention will be described in more detail below with reference to accompanying drawings, wherein:
Fig. 1 (Figure 1A and 1B) is the schematic diagram of metal substrate first embodiment of the present invention;
Fig. 2 (Fig. 2 A and 2B) is the schematic diagram of metal substrate second embodiment of the present invention;
Fig. 3 is the flow chart of sheet-shaped LED method for producing light-emitting device of the present invention;
Fig. 4 (Fig. 4 A 4E) is the sheet-shaped LED light-emitting device after the mold pressing encapsulation in Fig. 3 flow chart;
Fig. 5 (Fig. 5 A 5D) is the scribing cutting step schematic diagram of Fig. 3 flow chart and the independent sheet-shaped LED light-emitting device after the cutting.
Reference numeral:
1, metal substrate; 2, chip; 3, lead-in wire; 4, packing colloid; 5, scribing machine; 11, base board unit; 12, separate the line of rabbet joint; 13, location hole; 14, cutting datum hole; 111, go up hole portion; 112, following hole portion; 113, lead-in wire connecting portion; 114, chip mount portion; 115, weld part; 116, reinforcement; 117, reinforcement remainder; 1101, little perforation; 1102, bar shaped perforation;
Embodiment
According to above-mentioned accompanying drawing 1 and accompanying drawing 2, sheet-shaped LED light-emitting device encapsulating structure of the present invention and manufacture method thereof are described further.
In the present embodiment, metal substrate 1 structure of the present invention comprise M capable * the base board unit array of N row, wherein M, N do not equal 1 at least simultaneously, in the capable both sides of described each base board unit the separation line of rabbet joint is set, be total to the M+1 bar, with the capable separation of each base board unit, the both ends of corresponding described base board unit row are provided with N+1 cutting datum hole respectively, corresponding to the side of each base board unit row; Metal substrate 1 structure shown in accompanying drawing 1,2 comprises: base board unit 11 arrays of 3 row * 7 row, 4 separation 12,4 location holes 13 of the line of rabbet joint and 16 cutting datum holes 14.
The base board unit structure of the metal substrate 1 shown in accompanying drawing 1, accompanying drawing 2, accompanying drawing 5C, base board unit 11 is provided with relative last hole portion 111 in two positions and following hole portion 112, two respectively with last hole portion 111 and the following hole portion 112 inboard lead-in wire connecting portions 113 that link to each other, the chip mount portion 114 of the lead-in wire connecting portion 113 that hole portion 111 is connected in connection, two weld parts 115 that link to each other with following hole portion 112 outsides with last hole portion 111 respectively, and two lay respectively at chip mount portion 114 both sides and connect the reinforcement 116 of going up hole portion 111 and following hole portion 112.
The a plurality of little perforation 1101 that the last hole portion 111 of each base board unit and following hole portion 112 can be provided with as shown in Figure 1, perhaps a bar shaped as shown in Figure 2 bores a hole 1102.
Except the diagram of present embodiment, chip mount portion 114 can also be provided with circular or square reflector.
Separate the line of rabbet joint 12 and be separately positioned on the capable both sides of each base board unit, vertically separate the capable base board unit of each base board unit 11.
The end of each cell columns both sides of corresponding described substrate is respectively equipped with cutting datum hole 14, and cutting datum hole 14 is for long narrow shape and be parallel to each other, and corresponding with the position of each reinforcement row.
Described metal substrate 1 outside one or more layers metal of plating is as Ni, Au, Ag.
Described weld part 115 upper surfaces have one deck printing ink, and printing ink does not cover the edge and the lower surface of this weld part 115.
Shown in 35, sheet-shaped LED light-emitting device and the manufacture method thereof based on said metal substrates 1 of the present invention is described further with reference to the accompanying drawings.
As shown in Figure 3, present embodiment also discloses a kind of sheet-shaped LED method for producing light-emitting device based on said metal substrates 1 structure, and its step comprises: S1, metal substrate are die-cut; S2, plating; S3, printing-ink; S4, the led chip bonding of laying and go between; S5, mold pressing encapsulation; S6, scribing cutting; S7, testing package.Wherein, S3 printing-ink step is selectable, nonessential step.
In the die-cut step of S1 metal substrate, with sheet metal strip by clicking technique form M capable * the base board unit array of N row, M, N do not equal 1 at least simultaneously, be provided with the separation line of rabbet joint in the capable both sides of described each base board unit, be total to the M+1 bar, with the capable separation of each base board unit, the both ends of corresponding described base board unit row are provided with N+1 cutting datum hole respectively, corresponding to the side of each base board unit row; Referring to shown in Figure 4, the base board unit array of formation is 3 row * 7 row, separates 12,4 location holes 13 of the line of rabbet joint and 16 cutting datum holes 14 for 4.
For base board unit 11, form by clicking technique: last hole portion 111 that two positions are relative and following hole portion 112, two respectively with last hole portion 111 and the following hole portion 112 inboard lead-in wire connecting portions 113 that link to each other, the chip mount portion 114 of the lead-in wire connecting portion 113 that hole portion 111 is connected in connection, two weld parts 115 that link to each other with following hole portion 112 outsides with last hole portion 111 respectively, and two lay respectively at chip mount portion 114 both sides and connect the reinforcement 116 of going up hole portion 111 and following hole portion 112.
The last hole portion 111 of base board unit and following hole portion 112 form a plurality of little perforation 1101 (as shown in Figure 1) or a bar shaped was bored a hole for 1102 (as shown in Figure 2) by die-cut mode on metal substrate 1.
In a further embodiment, described chip mount portion 114 can form circular or square reflector in the above by process for stamping.
The described separation line of rabbet joint 12 forms by clicking technique, divides to be listed in the capable both sides of each base board unit.
Described location hole 13 by clicking technique be formed on metal substrate 1 around; Except clicking technique, location hole 13 can also form by bore process.
Described cutting datum hole 14 is by the narrow shape perforation of the length of the end formation of clicking technique corresponding described base board unit row dual-side on substrate 1, and is parallel to each other, and is corresponding one by one with the position of reinforcement row.
In the S2 plating step, the S1 step is finished metacoxal plate 1 place plating bath (electricity or chemical plating fluid), at substrate 1 outside one or more layers metal of plating, as Ni, Au, Ag (selecting a kind of) etc., clean surface spot after plating is finished is finished the preparation of substrate 1.Plating improves the solderability and the decay resistance of plane of thrust on the one hand on substrate, is the reflector efficiency that improves substrate on the other hand, and then improves the light extraction efficiency of device.
In the process of electroplating, one or more layers metal is all plated on whole base plate 1 surface, compare with the mode of electroplating the back punching press earlier, owing to be provided with the separation line of rabbet joint between the capable array of base board unit array and the row array, in the process of plating, plated one or more layers metal, improved the solderability and the decay resistance of the die-cut section of light-emitting device for weld part 115 both sides of light-emitting device.
In S3 printing-ink step, print one deck printing ink at described weld part 115 upper surfaces with the chip mount homonymy, printing ink does not cover the edge and the lower surface of this weld part 115.
The purpose of above-mentioned printing-ink is, stops in the device use scolding tin to flow to device and destroy structure such as gold thread along Copper Foil, and to guarantee device reliability, it is for considering that some technologies that downstream application producer takes exist.Therefore after whole operation was finished, printing ink can not erased.
In S4LED chip mount and lead-in wire bonding step, with led chip 2 usefulness adhesive in the chip mount portion 114 of metal substrate 1, and the lead-in wire connecting portion 113 on employing metal lead wire 3 connection-core plate electrodes and the substrate, realize being electrically connected of chip electrode and outer electrode.
In S5 mold pressing encapsulation step, be the die cavity that above-mentioned semi-finished product is placed mold center, inject packing colloid 4 from gum-injecting port.Packing colloid 4 is filled whole die cavity, and heating simultaneously makes it to solidify.
Shown in accompanying drawing 4A, packing colloid 4 plastic packagings are in the both sides up and down of metal substrate 1, cover described chip 2, lead-in wire 3 and fill described a plurality of little perforation 1101 of going up hole portion 111 and following hole portion 112, and weld part 115 is retained in the outside of packing colloid 4; Described packing colloid 4 has the optical lens effect, and its cross section can be rectangle (accompanying drawing 4B, 4D) or trapezoidal (accompanying drawing 4C, 4E).
In S6 scribing cutting step, shown in accompanying drawing 5A, scribing machine 5 along described cutting datum hole 14 with metal substrate 1 be partitioned into M capable * N row sheet-shaped LED light-emitting device independently, shown in accompanying drawing 5B.
Shown in accompanying drawing 5C and accompanying drawing 5D, in described cutting process, the reinforcement 116 of described base board unit 11 both sides is cut off, and realizes that the both positive and negative polarity of device cell separates, and is retained in to be reinforcement remainder 117 on the base board unit 11; Described reinforcement remainder 117 and last hole portion 111 and following hole portion 112 connect into certain radian or angle of inclination necessarily.
In S7 testing package step, to product test, braid, finish the manufacture process of product, can obtain the sheet-shaped LED light-emitting device of function admirable, high conformity thus.
Shown in above-mentioned accompanying drawing 4, accompanying drawing 5, an alternative embodiment of the invention is the sheet-shaped LED light-emitting device of making according to the manufacture method of metal substrate structure of the foregoing description and LED light-emitting device.In the present embodiment, the structure of described sheet-shaped LED light-emitting device comprises a metal substrate 1, at least one is placed in chip 2 on the described metal substrate, connect the metal lead wire 3 of described chip 2 and metal substrate 1, and the packing colloid 4 that covers metal substrate 1; The structure of wherein said metal substrate 1 such as the described board structure of above-mentioned embodiment, include relative last hole portion 111 in two positions and following hole portion 112, last hole portion 111 and following hole portion 112 are provided with at least 1 perforation, two respectively with last hole portion 111 and the following hole portion 112 inboard lead-in wire connecting portions 113 that link to each other, the chip mount portion 114 of the lead-in wire connecting portion 113 that hole portion 111 is connected in connection, two weld parts 115 that link to each other with following hole portion 112 outsides with last hole portion 111 respectively, reinforcement remainder and be coated in the printing ink on described weld part 115 surfaces.Described reinforcement remainder is reinforcement cut remaining part in segmentation process, realizes that the both positive and negative polarity of device cell separates; Described reinforcement remainder respectively with last hole portion 111 and following hole portion 112 connect into certain radian or angle of inclination necessarily.Described packing colloid 4 is encapsulated in the both sides up and down of metal substrate, covers described chip 2, lead-in wire 3, and is filled in the perforation of large and small hole portion.
Obviously, the present invention described here can have many variations, and this variation can not be thought and departs from the spirit and scope of the present invention.Therefore, the change that all it will be apparent to those skilled in the art all is included within the covering scope of these claims.
Claims (25)
1. a sheet-shaped LED metal substrate (1) structure, it is characterized in that: described metal substrate (1) structure is made up of base board unit (11), described base board unit (11) structure comprises: two last hole portion (111) and following hole portions (112) that the position is relative, two lead-in wire connecting portions (113) that link to each other with last hole portion (111) and following hole portion (112) inboard respectively, the chip mount portion (114) of the lead-in wire connecting portion (113) that hole portion (111) is connected in connection, two weld parts (115) that link to each other with last hole portion (111) and following hole portion (112) outside respectively, and two reinforcements (116) that lay respectively at chip mount portion both sides and connect hole portion (111) and following hole portion (112).
2. sheet-shaped LED metal substrate as claimed in claim 1 (1) structure is characterized in that: the last hole portion (111) and the following hole portion (112) of described base board unit (11) have a perforation respectively at least.
3. sheet-shaped LED metal substrate as claimed in claim 1 (1) structure is characterized in that: there are circular or square reflector in the chip mount portion (114) of described base board unit (11).
4. sheet-shaped LED metal substrate as claimed in claim 1 (1) structure, what it is characterized in that described reinforcement and last hole portion (111) and following hole portion (112) connects into certain radian or certain angle of inclination.
5. sheet-shaped LED metal substrate as claimed in claim 1 (1) structure, it is characterized in that: described metal substrate (1) also comprises: corresponding described base board unit (11) is gone up the cutting datum hole (14) of metal substrate (1) end of hole portion (111) and following hole portion (112) both sides, and corresponding with the position of described reinforcement (116).
6. sheet-shaped LED metal substrate as claimed in claim 5 (1) structure is characterized in that: described cutting datum hole (14) is set to long narrow shape and is parallel to each other.
7. sheet-shaped LED metal substrate as claimed in claim 1 (1) structure is characterized in that: described metal substrate (1) structure also is included in the location hole (13) around the described sheet metal strip.
8. sheet-shaped LED metal substrate as claimed in claim 1 (1) structure is characterized in that: described metal substrate (1) structure have M capable * a N row described base board unit (11), M, N do not equal 1 at least simultaneously; The separation line of rabbet joint (12) is set in the capable both sides of described each base board unit, is total to the M+1 bar, with the capable separation of each base board unit, the both ends of corresponding described base board unit row are provided with N+1 cutting datum hole respectively, corresponding to the side of each base board unit row.
9. as the described sheet-shaped LED metal substrate of claim 1 to 8 (1) structure, it is characterized in that: described metal substrate (1) surface is coated with one or more layers metal.
10. sheet-shaped LED metal substrate as claimed in claim 9 (1) structure is characterized in that: described weld part (115) upper surface has one deck printing ink, and printing ink does not cover the edge and the lower surface of this weld part (115).
11. the manufacture method of a sheet-shaped LED light-emitting device, it comprises following procedure of processing:
A) the die-cut step of metal substrate (1): sheet metal strip is formed base board unit by clicking technique, comprise two last hole portion (111) and the following hole portions (112) that the position is relative that are formed with, two lead-in wire connecting portions (113) that link to each other with last hole portion (111) and following hole portion (112) inboard respectively, the chip mount portion (114) of the lead-in wire connecting portion (113) that hole portion is connected in connection, two weld parts (115) that link to each other with last hole portion (111) and following hole portion (112) outside respectively, and two reinforcements (116) that lay respectively at chip mount portion (114) both sides and connect last hole portion (111) and following hole portion (112), described reinforcement (116) connects into certain radian or certain angle of inclination with last hole portion (111) and following hole portion (112), metal substrate (1) end of hole portion (111) and following hole portion (112) both sides forms cutting datum hole (14) on correspondence is described, and described cutting datum hole (14) is corresponding with the position of described reinforcement (116);
B) plating step: substrate is placed plating bath, at one or more layers metal of the outside plating of substrate; C) chip mount and lead-in wire bonding step: use adhesive in the chip mount portion (114) of metal substrate (1) led chip, and the lead-in wire connecting portion (113) on employing metal lead wire (3) connection-core plate electrode and the substrate, realize being electrically connected of chip electrode and outer electrode;
D) mold pressing encapsulation step:, cover described chip, lead-in wire and fill described perforation of going up hole portion (111) and following hole portion (112), and weld part (115) is retained in the outside of colloid with the both sides up and down of packing colloid plastic packaging at metal substrate (1):
E) scribing cutting step, respectively with the reinforcement (116) of described base board unit and the cutting and separating that is connected of last hole portion (111) and following hole portion (112), the reinforcement remainder (117) that is retained in described base board unit only is connected along cutting datum hole (14) with last hole portion (111) or following hole portion (112).
F) testing package step: this step to product test, braid, finish the manufacture process of product.
12. a kind of sheet-shaped LED method for producing light-emitting device as claimed in claim 11 is characterized in that: be formed with at least one perforation respectively in the last hole portion (111) of the base board unit that the die-cut step of described a) metal substrate (1) punches out and the following hole portion (112).
13. a kind of sheet-shaped LED method for producing light-emitting device as claimed in claim 11 is characterized in that: the die-cut step of described a) metal substrate (1) also comprises by process for stamping form circular or square reflector on described chip mount portion.
14. a kind of sheet-shaped LED method for producing light-emitting device as claimed in claim 11 is characterized in that: described cutting datum hole is punched to long narrow shape and is parallel to each other.
15. a kind of sheet-shaped LED method for producing light-emitting device as claimed in claim 11 is characterized in that: the die-cut step of described a) metal substrate (1) also comprises: form location hole by clicking technique around described sheet metal strip
16. a kind of sheet-shaped LED method for producing light-emitting device as claimed in claim 11, it is characterized in that: the die-cut step of described a) metal substrate (1) also comprises: in described sheet metal strip by clicking technique form M capable * a N row base board unit, M, N do not equal 1 at least simultaneously; In the capable both sides of described each base board unit 1 line of rabbet joint is arranged, be total to the M+1 bar, with the capable separation of each base board unit, the both ends of corresponding described base board unit row are provided with N+1 cutting datum hole respectively, corresponding to the side of each base board unit row.
17. a kind of sheet-shaped LED method for producing light-emitting device as claimed in claim 11 is characterized in that: described b) plating step is Ni, Au, Ag at the metal of the outside plating of substrate.
18. a kind of sheet-shaped LED method for producing light-emitting device as claimed in claim 11, it is characterized in that: at described b) after plating step finishes, the processing step that also has printing-ink, print one deck printing ink at the described weld part upper surface with the chip mount homonymy, printing ink does not cover the edge and the lower surface of this weld part.
19. a kind of sheet-shaped LED method for producing light-emitting device as claimed in claim 18 is characterized in that: described c) chip mount and lead-in wire bonding step are directly to carry out after substrate punching press, plating, printing-ink are finished.
20. as the described a kind of sheet-shaped LED method for producing light-emitting device of claim 11 to 19, it is characterized in that: described d) the mold pressing encapsulation step comprises and will finish the die cavity of the semi-finished product of above-mentioned processing step as for mold center, inject packing colloid from gum-injecting port, packing colloid is filled whole die cavity, and heating simultaneously makes it to solidify.
21. a kind of sheet-shaped LED method for producing light-emitting device as claimed in claim 20, it is characterized in that: described e) the scribing cutting step also is included in the cutting process, and scribing machine is partitioned into M * N independently sheet-shaped LED light-emitting device along described cutting datum hole with the base board unit of array.
22. sheet-shaped LED light-emitting device that utilizes the manufacturing of above-mentioned sheet-shaped LED method for producing light-emitting device, comprise: a metal substrate (1), at least one is placed in chip (2) on the described metal substrate (1), connect the metal lead wire (3) of described chip (2) and metal substrate (1), and the packing colloid (4) that covers metal substrate (1); Wherein said metal substrate (1) includes two last hole portion (111) and following hole portions (112) that the position is relative, two lead-in wire connecting portions (113) that link to each other with last hole portion (111) and following hole portion (112) inboard respectively, the chip mount portion (114) of the lead-in wire connecting portion (113) that hole portion (111) is connected in connection, two weld parts (115) that link to each other with last hole portion (111) and following hole portion (112) outside respectively, reinforcement remainder (117) and be coated in the surperficial printing ink of described weld part (115).
23. sheet-shaped LED light-emitting device as claimed in claim 11 is characterized in that described upward hole portion (111) and following hole portion (112) are provided with at least 1 perforation.
24. sheet-shaped LED light-emitting device as claimed in claim 11 is characterized in that described reinforcement remainder (117) is reinforcement (116) cut remaining part in segmentation process, realizes that the both positive and negative polarity of device cell separates; Described reinforcement remainder (117) not with last hole portion (111) and following hole portion (112) connect into certain radian or angle of inclination necessarily.
25. sheet-shaped LED light-emitting device as claimed in claim 11 is characterized in that described packing colloid (4) is encapsulated in the both sides up and down of metal substrate (1), covers described chip, lead-in wire and is filled in the perforation of large and small hole portion.
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| CN 200910305686 CN101630716B (en) | 2009-08-17 | 2009-08-17 | Platy LED metal substrate, platy LED light emitting device and manufacturing method thereof |
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| CN102304747A (en) * | 2010-04-23 | 2012-01-04 | 广东聚科照明股份有限公司 | Process for producing high-power light emitting diode (LED) substrate |
| CN102570237A (en) * | 2012-02-08 | 2012-07-11 | 黎明 | Automatic welding method and system for LED module connecting lead |
| CN102931332A (en) * | 2012-11-07 | 2013-02-13 | 苏州东山精密制造股份有限公司 | Substrate type light-emitting diode (LED) integrated packaging method |
| CN106328640A (en) * | 2016-10-27 | 2017-01-11 | 深圳市彩立德照明光电科技有限公司 | LED packaging base material, packaging method and LED packaged device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102304747A (en) * | 2010-04-23 | 2012-01-04 | 广东聚科照明股份有限公司 | Process for producing high-power light emitting diode (LED) substrate |
| CN102304747B (en) * | 2010-04-23 | 2014-03-05 | 广东聚科照明股份有限公司 | Process for producing high-power light emitting diode (LED) substrate |
| CN102570237A (en) * | 2012-02-08 | 2012-07-11 | 黎明 | Automatic welding method and system for LED module connecting lead |
| CN102570237B (en) * | 2012-02-08 | 2014-04-16 | 黎明 | Automatic welding method and system for LED module connecting lead |
| CN102931332A (en) * | 2012-11-07 | 2013-02-13 | 苏州东山精密制造股份有限公司 | Substrate type light-emitting diode (LED) integrated packaging method |
| CN106558567A (en) * | 2015-09-29 | 2017-04-05 | 比亚迪股份有限公司 | SPM and preparation method thereof |
| CN106328640A (en) * | 2016-10-27 | 2017-01-11 | 深圳市彩立德照明光电科技有限公司 | LED packaging base material, packaging method and LED packaged device |
| CN106571419A (en) * | 2016-11-07 | 2017-04-19 | 深圳市源磊科技有限公司 | Method for manufacturing flashlight |
| CN106571419B (en) * | 2016-11-07 | 2019-04-30 | 深圳市源磊科技有限公司 | A kind of production method of flash lamp |
| WO2020125262A1 (en) * | 2018-12-17 | 2020-06-25 | 深圳市瑞丰光电子股份有限公司 | Led packaging structure and led lamp assembly |
| CN114698244A (en) * | 2020-12-30 | 2022-07-01 | 深南电路股份有限公司 | Method for spreading copper on positioning hole of packaging substrate and circuit board |
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| CN101630716B (en) | 2011-06-01 |
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