JP6322828B2 - Light emitting module and light emitting device - Google Patents

Description

The present invention relates to a light emitting module and a light-emitting device.

  Patent Document 1 discloses an example of a conventional light emitting module. The light emitting module includes a base material, a wiring pattern, and a light emitting element. A concave portion having a bottom surface as a mounting surface is formed on the base material. The said wiring pattern is formed so that the predetermined area | region including the said mounting surface may be covered among the said base materials. The light emitting element is mounted on the mounting surface via the wiring pattern. The light from the light emitting element is emitted with the direction in which the mounting surface is directed as the main emission direction.

  When the light emitting module is mounted on a mounting board of an electronic device, a part of the wiring pattern and the mounting board are joined by, for example, solder. The direction of the main emission direction with respect to the mounting substrate is appropriately set according to the use of the light emitting module in the electronic device. For this reason, the said light emitting module needs to be a thing which can be mounted appropriately according to a mounting direction.

Japanese Patent No. 2914097

  The present invention has been conceived under the circumstances described above, and an object thereof is to provide a light emitting module, a light emitting device, and a light emitting module that can be more appropriately mounted.

  The light emitting module provided by the first aspect of the present invention includes a light emitting element, a mounting surface facing the first direction on which the light emitting element is mounted, and a mounting facing the second direction perpendicular to the first direction. A light emitting module comprising: a base material having a surface; and a wiring pattern formed on the base material and electrically connected to the light emitting element, wherein the base material is recessed from the mounting surface, and the first A pair of mounting recesses spaced apart from each other in a third direction perpendicular to both the direction and the second direction, and the wiring pattern covers a pair of at least a part of the pair of mounting recesses It has a mounting surface electrode.

  In a preferred embodiment of the present invention, each of the mounting recesses is open both outward in the first direction.

  In a preferred embodiment of the present invention, each mounting surface electrode covers all the mounting recesses.

  In a preferred embodiment of the present invention, all of the mounting surface is exposed from the wiring pattern.

  In a preferred embodiment of the present invention, each of the mounting recesses opens outward in the third direction of the base material.

  In a preferred embodiment of the present invention, the base material has a pair of side surfaces facing each other in the third direction, and the wiring pattern covers at least a part of the pair of side surfaces. It has a pair of side electrodes.

  In a preferred embodiment of the present invention, each side electrode covers all of the side surfaces.

  In a preferred embodiment of the present invention, the side electrodes and the mounting surface electrodes are connected to each other.

  In a preferred embodiment of the present invention, the base material has a back surface facing away from the mounting surface in the first direction, and the wiring pattern covers a part of the back surface, And it has a pair of back surface electrodes spaced apart from each other in the third direction.

  In a preferred embodiment of the present invention, each back electrode and each mounting surface electrode are connected to each other.

  In a preferred embodiment of the present invention, the back electrodes and the bottom side electrodes are connected to each other.

  In a preferred embodiment of the present invention, the substrate has a back surface protrusion protruding from the back surface and exposed from the wiring pattern.

  In a preferred embodiment of the present invention, each mounting recess has a mounting recess top surface facing the second direction, and a mounting recess facing the mounting surface and the mounting recess top surface facing outward in the third direction. And a side.

  In a preferred embodiment of the present invention, each mounting recess includes a mounting recess top surface facing the second direction, a mounting recess side surface facing outward in the third direction, a mounting recess top surface, and a mounting recess side surface. And a mounting recess inclined surface that is interposed therebetween and is inclined with respect to the third direction.

  In a preferred embodiment of the present invention, the mounting recess inclined surface is a curved surface.

  In a preferred embodiment of the present invention, each mounting recess includes a mounting recess top surface facing the second direction, and a mounting inclined to the third direction and connected to the mounting surface and the mounting recess top surface. A recess side surface.

  In a preferred embodiment of the present invention, the mounting recess side surface is a curved surface.

  In a preferred embodiment of the present invention, each mounting recess is connected to the mounting surface, and the mounting recess is inwardly spaced from the mounting surface in the second direction as the mounting recess is further away from the mounting surface in the third direction. It has a concave inclined top surface.

  In a preferred embodiment of the present invention, each mounting recess is closed outward in the third direction of the substrate.

  In a preferred embodiment of the present invention, each side electrode covers all of the side surfaces.

  In a preferred embodiment of the present invention, the base material has a pair of side surfaces facing each other in the third direction, and the wiring pattern covers at least a part of the pair of side surfaces. It has a pair of side electrodes.

  In a preferred embodiment of the present invention, the base material has a back surface facing away from the mounting surface in the first direction, and the wiring pattern covers a part of the back surface, And it has a pair of back surface electrodes spaced apart from each other in the third direction.

  In a preferred embodiment of the present invention, each back electrode and each mounting surface electrode are connected to each other.

  In a preferred embodiment of the present invention, the back electrodes and the bottom side electrodes are connected to each other.

  In a preferred embodiment of the present invention, the substrate has a back surface protrusion protruding from the back surface and exposed from the wiring pattern.

  In a preferred embodiment of the present invention, each mounting recess has a mounting recess top surface facing the second direction and a pair of mountings facing outward in the third direction and connected to the mounting surface and the mounting recess top surface. It has a concave side surface.

  In a preferred embodiment of the present invention, each of the mounting recesses includes a mounting recess top surface facing the second direction, a pair of mounting recess side surfaces facing each other in the third direction, the mounting surface, and the pair of mounting recess tops. A pair of mounting recess inclined surfaces are interposed between the surfaces and inclined with respect to the third direction.

  In a preferred embodiment of the present invention, each mounting recess inclined surface is a curved surface.

  In a preferred embodiment of the present invention, each of the mounting recesses is a pair of mounting recess top surfaces facing the second direction and a pair inclined to the third direction and connected to the mounting surfaces and the mounting recess top surfaces. It has a mounting recess side surface.

  In a preferred embodiment of the present invention, each mounting recess side surface is a curved surface.

  In a preferred embodiment of the present invention, each of the mounting recesses is connected to the mounting surface, and a pair that is spaced inward from the mounting surface in the second direction as it is separated from the mounting surface in the third direction. The mounting recess has an inclined top surface.

  In a preferred embodiment of the present invention, the substrate has a surface facing the first direction and a first receiving recess recessed from the surface, and the first receiving recess is the mounting surface. Having a first bottom surface;

  In a preferred embodiment of the present invention, the first receiving recess has a first side surface that connects the surface and the first bottom surface.

  In a preferred embodiment of the present invention, the base material has a second receiving recess that is recessed from the surface and has a second bottom surface and a second side surface that connects the second bottom surface and the surface, The second bottom surface is located closer to the surface in the first direction than the first bottom surface, and the second bottom surface and the first side surface through a portion of the first side surface that does not reach the surface. Are connected.

  In a preferred embodiment of the present invention, the first accommodation recess and the second accommodation recess are aligned in the third direction.

  In a preferred embodiment of the present invention, the wiring pattern has a first bottom surface portion covering the first bottom surface.

  In a preferred embodiment of the present invention, the wiring pattern has a first side surface portion connected to the first bottom surface portion and covering the first side surface.

  In a preferred embodiment of the present invention, the wiring pattern has a first connection portion that is formed on the surface and connects the first side surface portion and one of the pair of mounting surface electrodes.

  In a preferred embodiment of the present invention, the wiring pattern has a first annular portion formed on the surface, connected to the first side surface portion and the first connection portion, and surrounding the first accommodation recess. .

  In a preferred embodiment of the present invention, the wiring pattern has a second bottom surface portion that is separated from the first side surface portion and covers the second bottom surface.

  In a preferred embodiment of the present invention, the wiring pattern has a second side surface portion that is separated from the first side surface portion and is connected to the second bottom surface portion and covers the second side surface.

  In a preferred embodiment of the present invention, the wiring pattern has a second connection portion that is formed on the surface and connects the second side surface portion and the other of the pair of mounting surface electrodes.

  In a preferred embodiment of the present invention, the first connection portion is located between the first accommodation recess and one of the pair of mounting recesses, and is less wettable with respect to solder than the remaining portions. A first solder blocking portion is included.

  In a preferred embodiment of the present invention, the second connection portion is located between the second accommodation recess and the other of the pair of mounting recesses, and has less wettability with respect to solder than the remaining portions. A second solder blocking portion;

  In a preferred embodiment of the present invention, the wiring pattern has a lower layer located on the substrate side and an upper layer laminated on the lower layer, and the lower layer is wettable with respect to solder than the upper layer. The first solder blocking portion and the second solder blocking portion are formed by exposing the lower layer from the upper layer.

  The light emitting device provided by the second aspect of the present invention includes the light emitting module provided by the first aspect of the present invention and the pair of mountings facing the second direction and spaced apart from each other in the third direction. And a mounting substrate having a pair of pad portions to which surface electrodes are bonded and the pair of pad portions, and having the second direction as a thickness direction.

  In a preferred embodiment of the present invention, each pad portion includes each mounting surface electrode in the second direction view.

  In a preferred embodiment of the present invention, the difference between the dimension of each pad in the third direction and the dimension of each mounting surface electrode in the third direction is the same as the dimension of each pad in the first direction. It is larger than the difference with the dimension in said 1st direction of each mounting surface electrode.

  The method for manufacturing a light emitting module provided by the third aspect of the present invention includes a plurality of mounting regions facing a first direction, a pair of side surfaces facing opposite to each other in a second direction perpendicular to the first direction, and A base material having a back surface facing away from the plurality of mounting regions in the first direction and extending long in a third direction perpendicular to both the first direction and the second direction. The plurality of mounting regions are arranged in the third direction, and are recessed from the pair of side surfaces and have a plurality of pairs of preliminary recesses positioned between the plurality of mounting regions in the third direction. A step of forming a conductor layer covering at least a part of each of the plurality of pairs of preliminary recesses, a step of separately mounting a plurality of light emitting elements in the plurality of mounting regions, and A pair of spare recesses Is characterized by comprising the step of cutting the substrate material along a plurality of cutting lines which over-the.

  The method for manufacturing a light emitting module provided by the fourth aspect of the present invention includes a plurality of mounting regions facing a first direction, a pair of side surfaces facing opposite to each other in a second direction perpendicular to the first direction, and A base material having a back surface facing away from the plurality of mounting regions in the first direction and extending long in a third direction perpendicular to both the first direction and the second direction. The plurality of mounting regions are arranged in the third direction and have a plurality of pairs of through-holes that penetrate in the first direction and are positioned between the plurality of mounting regions in the third direction. A step of preparing a material, a step of forming a conductor layer covering at least a part of each of the plurality of pairs of through holes, a step of separately mounting a plurality of light emitting elements in the plurality of mounting regions, Pass through each pair of through holes It is characterized by and a step of cutting the substrate material along a plurality of cutting lines.

  According to such a configuration, the light emitting module has the pair of mounting surface electrodes. The pair of mounting surface electrodes are spaced apart in the third direction across the mounting surface. When these mounting surface electrodes are joined to the mounting substrate by, for example, solder, the light emitting module can be mounted on the mounting substrate stably and reliably. Therefore, the light emitting module can be more appropriately mounted.

  Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

It is a principal part perspective view which shows the light emitting module based on 1st Embodiment of this invention. It is a principal part front view which shows the light emitting module of FIG. It is a bottom view which shows the light emitting module of FIG. It is a side view which shows the light emitting module of FIG. It is a rear view which shows the light emitting module of FIG. It is sectional drawing which follows the VI-VI line of FIG. It is sectional drawing which follows the VII-VII line of FIG. It is a principal part perspective view which shows the light-emitting device based on 1st Embodiment of this invention. It is a top view which shows the light-emitting device of FIG. It is sectional drawing which follows the XX line of FIG. It is a principal part expanded sectional view in alignment with the XX line of FIG. It is a principal part front view which shows the manufacturing method of the light-emitting device of FIG. It is a principal part front view which shows the manufacturing method of the light-emitting device of FIG. It is a principal part side view which shows the manufacturing method of the light-emitting device of FIG. It is a principal part rear view which shows the manufacturing method of the light-emitting device of FIG. It is a principal part front view which shows the manufacturing method of the light-emitting device of FIG. It is a principal part rear view which shows the manufacturing method of the light-emitting device of FIG. It is a principal part front view which shows the manufacturing method of the light-emitting device of FIG. It is a principal part rear view which shows the manufacturing method of the light-emitting device of FIG. It is a principal part front view which shows the manufacturing method of the light-emitting device of FIG. It is a principal part rear view which shows the manufacturing method of the light-emitting device of FIG. It is a principal part front view which shows the manufacturing method of the light-emitting device of FIG. It is a principal part front view which shows the manufacturing method of the light-emitting device of FIG. It is a principal part expanded sectional view which shows the modification of the light emitting module based on 1st Embodiment of this invention. It is a principal part expanded sectional view which shows the modification of the light emitting module based on 1st Embodiment of this invention. It is a principal part expanded sectional view which shows the modification of the light emitting module based on 1st Embodiment of this invention. It is a principal part expanded sectional view which shows the modification of the light emitting module based on 1st Embodiment of this invention. It is a principal part front view which shows the modification of the light emitting module based on 1st Embodiment of this invention. It is a principal part front view which shows the modification of the light emitting module based on 1st Embodiment of this invention. It is a perspective view which shows the modification of the light emitting module and light-emitting device based on 1st Embodiment of this invention. It is a principal part perspective view which shows the light emitting module based on 2nd Embodiment of this invention. It is a principal part front view which shows the light emitting module of FIG. FIG. 32 is a bottom view showing the light emitting module of FIG. 31. FIG. 32 is a side view showing the light emitting module of FIG. 31. It is a rear view which shows the light emitting module of FIG. It is sectional drawing which shows the light-emitting device based on 2nd Embodiment of this invention. It is a principal part expanded sectional view which shows the light-emitting device and light-emitting module based on 2nd Embodiment of this invention. FIG. 32 is a front view of relevant parts showing a method for manufacturing the light emitting device of FIG. 31. FIG. 32 is a front view of relevant parts showing a method for manufacturing the light emitting device of FIG. 31. It is a principal part expanded sectional view which shows the modification of the light emitting module based on 2nd Embodiment of this invention. It is a principal part expanded sectional view which shows the modification of the light emitting module based on 2nd Embodiment of this invention. It is a principal part expanded sectional view which shows the modification of the light emitting module based on 2nd Embodiment of this invention. It is a principal part expanded sectional view which shows the modification of the light emitting module based on 2nd Embodiment of this invention. It is a principal part perspective view which shows the light emitting module based on 3rd Embodiment of this invention. It is a principal part front view which shows the light emitting module of FIG. It is a bottom view which shows the light emitting module of FIG. It is a side view which shows the light emitting module of FIG. It is a rear view which shows the light emitting module of FIG. It is sectional drawing which follows the XLIX-XLIX line | wire of FIG. It is sectional drawing which follows the LL line | wire of FIG. It is a principal part perspective view which shows the light-emitting device based on 3rd Embodiment of this invention. It is a top view which shows the light-emitting device of FIG. It is sectional drawing which follows the LIII-LIII line | wire of FIG. It is a principal part expanded sectional view which follows the LIV-LIV line | wire of FIG. It is a principal part front view which shows the manufacturing method of the light emitting module of FIG. It is a principal part front view which shows the manufacturing method of the light emitting module of FIG. It is principal part sectional drawing which follows the LVII-LVII line | wire of FIG. It is a principal part rear view which shows the manufacturing method of the light emitting module of FIG. It is a principal part front view which shows the manufacturing method of the light emitting module of FIG. It is principal part sectional drawing in alignment with the LX-LX line | wire of FIG. It is a principal part rear view which shows the manufacturing method of the light emitting module of FIG. It is a principal part front view which shows the manufacturing method of the light emitting module of FIG. FIG. 63 is a main-portion cross-sectional view along the line LXIII-LXIII in FIG. 62; It is a principal part rear view which shows the manufacturing method of the light emitting module of FIG. It is a principal part front view which shows the manufacturing method of the light emitting module of FIG. FIG. 66 is a main-portion cross-sectional view along the line LXVI-LXVI in FIG. 65; It is a principal part rear view which shows the manufacturing method of the light emitting module of FIG. It is a principal part front view which shows the manufacturing method of the light emitting module of FIG. FIG. 69 is a main-portion cross-sectional view along the line LXIX-LXIX in FIG. It is a principal part rear view which shows the manufacturing method of the light emitting module of FIG. It is a principal part front view which shows the manufacturing method of the light emitting module of FIG. It is a principal part front view which shows the modification of the light emitting module based on 3rd Embodiment of this invention. It is a principal part front view which shows the modification of the light emitting module based on 3rd Embodiment of this invention. It is a perspective view which shows the modification of the light emitting module and light emitting device based on 3rd Embodiment of this invention. It is a principal part perspective view which shows the light emitting module based on 4th Embodiment of this invention. FIG. 76 is a main part front view showing the light emitting module of FIG. 75; FIG. 76 is a bottom view showing the light emitting module of FIG. 75. FIG. 76 is a side view showing the light emitting module of FIG. 75. FIG. 76 is a rear view showing the light emitting module of FIG. 75. It is sectional drawing which shows the light-emitting device based on 4th Embodiment of this invention. It is a principal part expanded sectional view which shows the light-emitting device based on 4th Embodiment of this invention. FIG. 76 is a main part front view showing a method for manufacturing the light emitting module of FIG. 75; FIG. 76 is a main part front view showing a method for manufacturing the light emitting module of FIG. 75; It is a principal part expanded sectional view which shows the modification of the light emitting module based on 4th Embodiment of this invention. It is a principal part expanded sectional view which shows the modification of the light emitting module based on 4th Embodiment of this invention. It is a principal part expanded sectional view which shows the modification of the light emitting module based on 4th Embodiment of this invention. It is a principal part expanded sectional view which shows the modification of the light emitting module based on 4th Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be specifically described with reference to the drawings.

  1 to 7 show a light emitting module according to a first embodiment of the present invention. The light emitting module A1 of the present embodiment includes a base material 1, a wiring pattern 2, a light emitting element 4, a wire 5, and a translucent resin 6. 8 to 11 show a light emitting device using the light emitting module A1. B1 of this embodiment includes a light emitting module A1 and a mounting substrate 7.

  FIG. 1 is a perspective view showing a main part of the light emitting module A1. FIG. 2 is a main part front view showing the light emitting module A1. FIG. 3 is a bottom view showing the light emitting module A1. FIG. 4 is a side view showing the light emitting module A1. FIG. 5 is a rear view showing the light emitting module A1. 6 is a cross-sectional view taken along the line VI-VI in FIG. 7 is a cross-sectional view taken along line VII-VII in FIG. FIG. 8 is a main part perspective view showing the light emitting device B1. FIG. 9 is a plan view showing the light emitting device B1. 10 is a cross-sectional view taken along line XX of FIG. 11 is an enlarged cross-sectional view of a main part taken along line XX in FIG. For convenience of understanding, the translucent resin 6 is omitted in FIGS. 1, 2, and 8. In these drawings, the y direction corresponds to the first direction in the present invention, the z direction corresponds to the second direction in the present invention, and the x direction corresponds to the third direction in the present invention.

  The light emitting module A1 functions as a light source of the light emitting device B1. For example, the x direction dimension is about 3.1 mm, the y direction dimension is about 1.6 mm, and the z direction dimension is about 2.3 mm. The light emitting device B1 is mounted on, for example, a mobile phone and is used as a transmitter that transmits a signal using infrared rays.

  The base material 1 has a rectangular parallelepiped shape as a whole, and is made of, for example, a plating adhesive insulating resin such as LCP (liquid crystal polymer). The substrate 1 has a front surface 11, a back surface 12, a mounting surface 13, a pair of side surfaces 14, a pair of mounting recesses 17, a first storage recess 15 and a second storage recess 16.

  The surface 11 is a surface facing in the y direction. The back surface 12 is a surface that faces away from the front surface 11 in the y direction. The mounting surface 13 faces the z direction and is connected to the front surface 11 and the back surface 12. The pair of side surfaces 14 face the x direction and face opposite sides. As shown in FIG. 10, the light emitting module A <b> 1 is configured so that the mounting surface 13 is mounted in a posture facing the mounting substrate 7.

  Each of the pair of mounting recesses 17 is recessed in the z direction from the mounting surface 13 and is separated from each other in the x direction. The mounting surface 13 is located between the pair of mounting recesses 17. In the present embodiment, each mounting recess 17 opens outward in the x direction. Further, the mounting recess 17 is open to both outer sides in the y direction. Each mounting recess 17 is rectangular when viewed in the x direction.

  As shown in FIG. 11, the mounting recess 17 has a mounting recess top surface 171 and a mounting recess side surface 172. The mounting recess top surface 171 faces downward in the z-direction diagram. The mounting recess side surface 172 faces outward in the x direction, and is interposed between the mounting surface 13 and the mounting recess top surface 171 and is connected to each other. In the present embodiment, the depth in the z direction of the mounting recess 17 is a depth obtained by adding the thickness of the wiring pattern 2 to a depth of about 0.08 mm, for example.

  The first housing recess 15 is recessed from the surface 11 in the y direction. The first accommodating recess 15 has a parabolic shape and has a first bottom surface 151 and a first side surface 152. The first bottom surface 151 has a circular shape and is a surface on which the light emitting element 4 is mounted. That is, in the present embodiment, the first bottom surface 151 corresponds to the mounting surface referred to in the present invention.

  The second accommodation recess 16 is recessed from the surface 11 in the y direction. The second accommodating recess 16 is rectangular when viewed in the y direction, and has a second bottom surface 161 and a second side surface 162. The second bottom surface 161 has a rectangular shape as viewed in the y direction and faces the y direction. The second side surface 162 is connected to the second bottom surface 161 and the surface 11.

  As shown in FIG. 6, the second bottom surface 161 is located closer to the surface 11 in the y direction than the first bottom surface 151. As shown in FIG. 2, most of the first side surface 152 is connected to the surface 11, a part is connected to the second bottom surface 161, and the other part is connected to the second side surface 162.

  A back surface protrusion 19 is formed on the back surface 12 side portion of the substrate 1. The back surface protrusion 19 is a portion slightly protruding from the back surface 12 and has, for example, a substantially rectangular shape in the y direction.

  The wiring pattern 2 is formed on the base material 1, constitutes a conduction path to the light emitting element 4, and realizes mounting of the light emitting module A1 on the mounting substrate 7. In the present embodiment, as shown in FIG. 11, the wiring pattern 2 has a structure in which a base layer 200, a first layer 201, a second layer 202, and a third layer 203 are laminated in order from the base material 1. .

  The underlayer 200 is a layer made of Cu formed by electroless plating, for example, and has a thickness of about 0.1 to 1.0 μm, for example. The first layer 201 is a layer made of Cu formed by, for example, electrolytic plating, and has a thickness of, for example, about 5 to 30 μm. The second layer 202 is a layer made of Ni formed by, for example, electrolytic plating, and has a thickness of, for example, 1 to 5 μm. The third layer 203 is a layer made of, for example, Au formed by electrolytic plating, and has a thickness of, for example, about 0.01 to 0.3 μm. In the present embodiment, the second layer 202 corresponds to the lower layer referred to in the present invention, and the third layer 203 corresponds to the upper layer referred to in the present invention. The second layer 202 made of Ni has lower wettability to solder than the third layer 203 made of Au.

  The wiring pattern 2 includes a pair of mounting surface electrodes 24, a pair of side surface electrodes 25, a pair of back surface electrodes 26, a first bottom surface portion 211, a first side surface portion 212, a first connection portion 213, a first annular portion 214, a second It has a bottom surface part 221, a second side surface part 222, and a second connection part 223.

  The pair of mounting surface electrodes 24 cover a part of each of the pair of mounting recesses 17 of the substrate 1, and in the present embodiment, each mounting surface electrode 24 covers all of the mounting recesses 17. In the present embodiment, the distance in the z direction between the surface of the mounting surface electrode 24 that covers the mounting recess top surface 171 and the surface that extends the mounting surface 13 is, for example, about 0.08 mm.

  The pair of side electrodes 25 is a part that covers a part of each of the pair of side surfaces 14 of the substrate 1. In the present embodiment, each side electrode 25 covers all the side surfaces 14. Each side electrode 25 and each mounting surface electrode 24 are connected to each other.

  The pair of back surface electrodes 26 is a part that covers a part of the back surface 12 of the substrate 1. In the present embodiment, each back electrode 26 is formed in a strip shape along the side surfaces 14 and the edges of the pair of mounting recesses 17.

  The first bottom surface portion 211 is a portion that covers at least a part of the first bottom surface 151 of the first accommodating recess 15, and in the present embodiment, the first bottom surface portion 211 covers the entire first bottom surface 151. . The first side surface portion 212 is a portion that is connected to the first bottom surface portion 211 and covers a part of the first side surface 152 of the first housing recess 15.

  The first connection portion 213 is formed on the surface 11, and connects the first side surface portion 212 and one of the pair of mounting surface electrodes 24 (the mounting surface electrode 24 on the left side in the x-direction diagram in FIG. 1). Yes. The first annular portion 214 is formed on the surface 11 and is formed in an annular shape surrounding the first accommodating recess 15. The first annular portion 214 is connected to the first side surface portion 212 and the first connection portion 213.

  The second bottom surface portion 221 covers at least a part of the second bottom surface 161 of the second accommodation recess 16, and covers almost all of the second bottom surface 161 in the present embodiment. As shown in FIG. 2, the second bottom surface portion 221 is separated from the first side surface portion 212.

  The 2nd side part 222 is a part which covers at least one part of the 2nd side 162 of the 2nd accommodation recessed part 16, and has covered almost all the 2nd side 162 in this embodiment. The second side surface portion 222 is separated from the first side surface portion 212.

  The second connection portion 223 is formed on the surface 11 and connects the second side surface portion 222 and the other of the pair of mounting surface electrodes 24 (the mounting surface electrode 24 on the right side in the x-direction diagram in FIG. 1). Yes.

  In the present embodiment, the constituent parts similar to those indicated by the reference numerals of the mounting surface 13, the pair of mounting recesses 17, the pair of mounting surface electrodes 24 and the back surface electrode 26 in the figure are the substrate 1 and the wiring. Each pattern 2 is provided on the opposite side in the z direction. These portions are formed for the convenience of the manufacturing process of the light emitting module A1, but may be used as the mounting surface 13, the pair of mounting recesses 17, the pair of mounting surface electrodes 24, and the back electrode 26.

  The light emitting element 4 is, for example, an LED element that can emit infrared light. Depending on the application, for example, a light emitting element 4 that can emit visible light or the like may be used. The light emitting element 4 is provided with electrodes (not shown) on both sides in the y direction, and is mounted on the first bottom surface 151 of the first housing recess 15. More specifically, one of the electrodes of the light emitting element 4 is bonded to the first bottom surface portion 211 formed on the first bottom surface 151 via a conductive bonding material (not shown). The other electrode of the light emitting element 4 is joined to the second side surface portion 222 by a wire 5.

  The translucent resin 6 covers the light emitting element 4 and is filled in the first housing recess 15 and the second housing recess 16. The translucent resin 6 is made of, for example, a resin that transmits infrared rays from the light emitting element 4. In the present embodiment, the translucent resin 6 fills most of the first accommodation recess 15 and the second accommodation recess 16, but does not protrude from the first accommodation recess 15 and the second accommodation recess 16. That is, the surface of the translucent resin 6 is slightly recessed.

  As shown in FIGS. 8 to 11, the light emitting device B <b> 1 is configured by mounting the light emitting module A <b> 1 on the mounting substrate 7. The mounting substrate 7 has a pair of pad portions 71 and a pair of terminal portions 72. The mounting substrate 7 is a wiring substrate in which a wiring pattern is formed on a base material made of, for example, an epoxy resin.

  The pair of pad portions 71 are portions where the light emitting module A1 is mounted. Each pad portion 71 and each mounting surface electrode 24 of the light emitting module A <b> 1 are joined via the solder 3. FIG. 9 is a view of the light emitting device B1 as viewed from above in the z direction, and shows a pair of mounting surface electrodes 24 through for convenience of understanding. As shown in the figure, in the present embodiment, each pad portion 71 includes the mounting surface electrode 24 as viewed in the z direction. The difference between the dimension in the x direction of each pad portion 71 and the dimension in the x direction of each mounting surface electrode 24 is the difference between the dimension in the y direction of each pad portion 71 and the dimension in the y direction of each mounting surface electrode 24. Is bigger than. In particular, each pad portion 71 is configured to protrude greatly outward in the x direction with respect to each mounting surface electrode 24.

  The pair of terminal portions 72 are electrically connected to the pair of pad portions 71 separately. The pair of terminal portions 72 are portions to which, for example, a terminal (not shown) on the portable telephone side in which the light emitting device B1 is incorporated is joined.

  Next, an example of a method for manufacturing the light emitting module A1 will be described below with reference to FIGS.

  First, as shown in FIG. 12, a base material 1A is prepared. The base material 1A has a shape that extends long in the z direction, and has a front surface 11A, a pair of side surfaces 14A, and a back surface 12A (see FIG. 15). The base material 1A has a plurality of first receiving recesses 15, a plurality of second receiving recesses 16, and a plurality of pairs of preliminary recesses 17A. Each first accommodating recess 15 and each second accommodating recess 16 are coupled to each other. The plurality of first receiving recesses 15 and the plurality of second receiving recesses 16 are arranged at an equal pitch in the z direction. Thereby, the plurality of first bottom surfaces 151 are arranged at an equal pitch in the z direction. As described above, each first bottom surface 151 is a portion on which the light emitting element 4 is mounted, and corresponds to the mounting region referred to in the present invention in the base material 1A.

  Each pair of preliminary recesses 17A includes two preliminary recesses 17A whose positions in the z direction coincide with each other and are spaced apart from each other in the x direction. Each preliminary recess 17A is recessed in the z direction from the side surface 14A. Each preliminary recess 17A reaches the front surface 11A and the back surface 12A in the y direction. Each pair of preliminary recesses 17A is arranged between the first receiving recess 15 and the second receiving recess 16 adjacent to each other in the z direction, that is, between the first bottom surfaces 151 adjacent in the z direction. The base material 1A is formed, for example, by molding a liquid crystal polymer material using a mold.

  Next, as shown in FIGS. 13 to 15, the base layer 200 </ b> A is formed. The formation of the base layer 200A is performed, for example, by electroless plating. As a result, a base layer 200A made of Cu, for example, is formed on the entire exposed surface of the base material 1A. The thickness of the underlayer 200A is, for example, about 0.1 to 1.0 μm.

  Next, as shown in FIGS. 16 and 17, slits 205 and 206 are formed in the base layer 200A. The slit 205 and the slit 206 are formed, for example, by removing a part of the base layer 200A in a linear shape using a laser. By forming the illustrated slit 205 and slit 206, the base layer 200A has a portion that is long in the z direction on the upper side in the x direction view of the base material 1A and a lower portion in the x direction view of the base material 1A. It is divided into a part that is long in the z direction on the side and a plurality of parts that are isolated from these parts.

  Next, as shown in FIGS. 18 and 19, a first layer 201A is formed. The first layer 201A is formed by, for example, electrolytic plating. That is, by connecting electrodes for plating (not shown) to the vicinity of both ends in the x direction of the portion extending long in the z direction on the upper side and the lower side in the figure of the base material 1A in the base layer 200A. Do. In forming the first layer 201A, for example, a layer made of Cu is formed to a thickness of about 5 to 30 μm. In FIG. 18 and FIG. 19, a region colored in a relatively dark color tone is a region where the first layer 201 </ b> A is formed, and a region colored in a relatively light color tone is a region where the base layer 200 </ b> A is exposed. .

  Next, the exposed underlayer 200A is removed by performing, for example, soft etching. Thereby, the states shown in FIGS. 20 and 21 are obtained. In this state, the exposed underlayer 200A is removed, and only the first layer 201A is present.

  Next, as shown in FIG. 22, the second layer 202A and the third layer 203A are formed. This figure shows a state in which the formation of the third layer 203A is completed. The formation of the second layer 202A and the third layer 203A is performed, for example, by electrolytic plating similar to that used when the first layer 201A is formed. In forming the second layer 202A, for example, a layer made of Ni is formed to a thickness of about 1 to 5 μm. In forming the third layer 203A, for example, a layer made of Au is formed to a thickness of about 0.01 to 0.3 μm, for example. Thereby, the conductor layer 2A is obtained.

  Next, as shown in FIG. 23, the plurality of light emitting elements 4 are respectively mounted on the plurality of first bottom surfaces 151. Then, a wire 5 is bonded to each light emitting element 4 and the conductor layer 2A. Although omitted for convenience of understanding, the plurality of first housing recesses 15 and the plurality of second housing recesses 16 are filled with, for example, a liquid resin material so as to cover the plurality of light emitting elements 4 and are cured. . Thereby, the some translucent resin 6 (not shown) is obtained. Thereafter, the base material 1A is cut along, for example, a dicing blade along the illustrated cutting lines CL. Each cutting line CL is included in the xy plane, and passes through each pair of preliminary recesses 17A in the x direction. By this cutting, the preliminary recesses 17A are separated from each other on both sides in the z direction to form the mounting recesses 17 shown in FIGS. Further, the conductor layer 2A including the base layer 200A, the first layer 201A, the second layer 202A, and the third layer 203A includes a plurality of base layers 200, the first layer 201, the second layer 202, and the third layer 203. The wiring pattern 2 is obtained. By going through the above steps, a plurality of light emitting modules A1 are obtained.

  Next, the operation of the light emitting module A1 and the light emitting device B1 will be described.

  According to the present embodiment, the light emitting module A1 has a pair of mounting surface electrodes 24. The pair of mounting surface electrodes 24 are spaced apart in the x direction across the mounting surface 13. When these mounting surface electrodes 24 are joined to the mounting substrate 7 by, for example, solder 3, the light emitting module A1 can be mounted on the mounting substrate 7 stably and reliably. Therefore, the light emitting module A1 can be more appropriately mounted.

  Since the mounting surface electrode 24 covers all of the mounting recesses 17, it is possible to increase the bonding area between the mounting surface electrode 24 and the mounting substrate 7, and to mount the light emitting module A1 more firmly. .

  Since the light emitting module A1 has the side electrode 25, it can be expected that the solder 3 adheres to the side electrode 25 as well. Thereby, the mounting strength of the light emitting module A1 can be further increased.

  Since the mounting surface electrode 24 and the side surface electrode 25 are connected, it can be expected that the solder 3 is formed so as to surround the corner of the light emitting module A1.

  By having the back surface electrode 26, the back surface 12 side of the light emitting module A 1 can also contribute to the bonding to the mounting substrate 7.

  By having the first housing recess 15 and covering the first side surface 152 with the first side surface portion 212, the light from the light emitting element 4 mounted on the first bottom surface 151 can be reflected by the first side surface portion 212. It is. Thereby, the emission efficiency of the light emitting module A1 can be increased.

  By providing the second accommodation recess 16, it is possible to avoid the wire 5 from protruding from the base material 1.

  In the light emitting device B <b> 1, the mounting surface electrode 24 of the light emitting module A <b> 1 is included in the pad portion 71 of the mounting substrate 7, so that the solder 3 can be attached to the front surface of the mounting surface electrode 24. The difference between the x direction dimension of the pad portion 71 and the x direction dimension of the mounting surface electrode 24 is larger than the difference between the y direction size of the pad portion 71 and the y direction dimension of the mounting surface electrode 24. Accordingly, when the light emitting module A1 is mounted on the mounting substrate 7, it is possible to prevent the light emitting module A1 from rotating around the axis extending in the z direction.

  24 to 87 show a modified example and other embodiments of the present invention. In these drawings, the same or similar elements as those in the above embodiment are denoted by the same reference numerals as those in the above embodiment.

  24 to 30 show modifications of the light emitting module A1 and the light emitting device B1.

  24 to 27 show modifications of the mounting recess 17 and the mounting surface electrode 24. In the modification shown in FIG. 24, the mounting recess 17 has a mounting recess top surface 171, a mounting recess side surface 172, and a mounting recess inclined surface 173. The mounting recess top surface 171 faces downward in the z-direction diagram. The mounting recess side surface 172 faces outward in the x direction. The mounting recess inclined surface 173 is interposed between and connected to the mounting recess top surface 171 and the mounting recess side surface 172. The mounting recess inclined surface 173 is inclined with respect to the x direction, in other words, with respect to the mounting recess top surface 171 and the mounting recess side surface 172. The mounting surface electrode 24 covers three surfaces of the mounting recess top surface 171, the mounting recess side surface 172, and the mounting recess inclined surface 173.

  In the modification shown in FIG. 25, the mounting recess 17 has a mounting recess top surface 171, a mounting recess side surface 172, and a mounting recess inclined surface 173. The mounting recess inclined surface 173 is a curved surface.

  In the modification shown in FIG. 26, the mounting recess 17 has a mounting recess top surface 171 and a mounting recess inclined surface 173. The mounting recess inclined surface 173 is interposed between the mounting recess top surface 171 and the mounting surface 13 and is connected thereto. The mounting recess inclined surface 173 is inclined with respect to the x direction, in other words, with respect to the mounting recess top surface 171 and the mounting surface 13. Furthermore, in the present modification, the mounting recess inclined surface 173 is a curved surface.

  In the modification shown in FIG. 27, the mounting recess 17 has only a mounting recess inclined top surface 174. The mounting recess inclined top surface 174 is connected to the side surface 14 and the mounting surface 13. The mounting recess inclined top surface 174 is inclined so as to be separated inward from the mounting surface 13 in the z direction as it is separated from the mounting surface 13 in the x direction.

  In the modification shown in FIGS. 28 and 29, a first solder blocking portion 231 and a second solder blocking portion 232 are formed in the wiring pattern 2.

  In the modification shown in FIG. 28, two first solder blocking portions 231 and two second solder blocking portions 232 are provided. The first solder blocking portion 231 is provided in the first connection portion 213 and is located between the first accommodation recess 15 and the mounting recess 17. More specifically, the first solder blocking portion 231 has a circular arc shape along the outer circle of the first housing recess 15. Further, the first solder blocking portion 231 is formed by exposing a part of the second layer 202 from the third layer 203 in the first connection portion 213. As a method of exposing the second layer 202, for example, a method of selectively removing only the third layer 203 (third layer 203A) using a laser after forming the third layer 203 (third layer 203A). Can be mentioned. The first solder blocking portion 231 formed in this way has less wettability with respect to solder than the portion of the first connecting portion 213 other than the first solder blocking portion 231.

  The second solder blocking portion 232 is provided in the second connection portion 223 and is located between the second accommodation recess 16 and the mounting recess 17. More specifically, the second solder blocking portion 232 has a linear strip shape along the outer side of the second housing recess 16. The second solder blocking portion 232 is formed by exposing a part of the second layer 202 from the third layer 203 in the second connection portion 223. As a method of exposing the second layer 202, for example, a method of selectively removing only the third layer 203 (third layer 203A) using a laser after forming the third layer 203 (third layer 203A). Can be mentioned. The second solder blocking portion 232 formed in this way has less wettability with respect to solder than the portion of the second connecting portion 223 other than the second solder blocking portion 232.

  In the modification shown in FIG. 29, the first solder blocking portion 231 is formed by exposing the surface 11 of the base material 1 from the first connection portion 213. In such a configuration, the first solder blocking portion 231 is a portion surrounded by the first connection portion 213, but in the present invention, it is a portion defined by the presence of the first connection portion 213. Suppose that the first solder blocking portion 231 is formed in the first connection portion 213. Even in such a configuration, the first solder blocking portion 231 is less wettable with respect to solder than the portion of the first connecting portion 213 other than the first solder blocking portion 231.

  The second solder blocking portion 232 is formed by exposing the surface 11 of the base material 1 from the second connection portion 223. In such a configuration, the second solder blocking portion 232 is a portion surrounded by the second connection portion 223, but in the present invention, it is a portion defined by the presence of the second connection portion 223. Suppose that the second solder blocking portion 232 is formed in the second connection portion 223. Even in such a configuration, the second solder blocking portion 232 has lower wettability with respect to solder than the portion of the second connecting portion 223 other than the second solder blocking portion 232.

  According to these modified examples, when the light emitting module A1 is mounted on the mounting substrate 7 by having the first solder blocking portion 231 and the second solder blocking portion 232, the molten solder 3 can be It is possible to prevent the first solder blocking portion 231 and the second solder blocking portion 232 from proceeding to the second housing recess 16.

  FIG. 30 shows a light emitting module A1 as a modification of the substrate 1, the wiring pattern 2, and the translucent resin 6, and a light emitting device B1 on which the light emitting module A1 is mounted. In the present modified example, the first accommodation recess 15 and the second accommodation recess 16 are not formed in the base material 1. The light emitting element 4 is mounted on the surface 11. For this reason, in this modification, the surface 11 corresponds to the mounting surface referred to in the present invention. The wiring pattern 2 is formed so as to cover an appropriate place on the surface 11. The translucent resin 6 covers the light emitting element 4 on the surface 11 and protrudes from the surface 11.

  31 to 35 show a light emitting module according to the second embodiment of the present invention. 36 and 37 show a light emitting device according to the second embodiment of the present invention. In the light emitting module A2 of the present embodiment, the configuration of the mounting recess 17 is mainly different from the light emitting module A1 described above.

  In the present embodiment, the mounting recess 17 has a shape closed on both sides in the x direction. With this configuration, in the present embodiment, the mounting surface 13 is partitioned into three regions arranged in the x direction with the pair of mounting recesses 17 interposed therebetween.

  Specifically, as illustrated in FIG. 37, the mounting recess 17 includes a mounting recess top surface 171 and a pair of mounting recess inclined surfaces 173. The mounting recess top surface 171 faces downward in the z direction. The pair of mounting recess inclined surfaces 173 are connected to both ends of the mounting recess top surface 171 in the x direction. Each mounting recess inclined surface 173 is interposed between the mounting recess inclined surface 173 and the mounting surface 13 and is inclined with respect to the x direction. Further, each mounting recess inclined surface 173 is a curved surface.

  The mounting surface electrode 24 covers at least a part of the mounting recess 17 and covers all of the mounting recess 17 in this embodiment. The mounting surface electrode 24 is not connected to the side surface electrode 25.

  Next, the manufacturing method of light emitting module A2 is demonstrated below, referring FIG. 38 and FIG.

  First, the base material 1A shown in FIG. 38 is required. Instead of a plurality of pairs of preliminary recesses 17A in the method for manufacturing the light emitting module A1, the base material 1A has a plurality of pairs of through holes 17B. Each pair of through-holes 17B includes two through-holes 17B whose positions in the z direction coincide with each other and are spaced apart from each other in the x direction. Each through-hole 17B is provided at a slightly affected position inward in the z direction from the side surface 14A, and penetrates the base material 1A in the y direction. Each pair of through-holes 17B is disposed between the couplings of the first accommodation recess 15 and the second accommodation recess 16 adjacent in the z direction, that is, between the first bottom surfaces 151 adjacent in the z direction.

  The steps described with reference to FIGS. 13 to 22 are sequentially performed on the base material 1A. Then, a state shown in FIG. 39 is obtained by mounting a plurality of light emitting elements 4, bonding a plurality of wires 5, and forming a translucent resin 6 (not shown). Thereafter, the base material 1A is cut along, for example, a dicing blade along the illustrated cutting lines CL. Each cutting line CL is included in the xy plane, and passes through each pair of through holes 17B in the x direction. By this cutting, the through holes 17B are separated from each other on both sides in the z direction to form the mounting recesses 17 shown in FIGS. Further, the conductor layer 2A including the base layer 200A, the first layer 201A, the second layer 202A, and the third layer 203A includes a plurality of base layers 200, the first layer 201, the second layer 202, and the third layer 203. The wiring pattern 2 is obtained. A plurality of light emitting modules A2 are obtained through the above steps.

  Next, the operation of the light emitting module A2 and the light emitting device B2 will be described.

  Also according to this embodiment, the light emitting module A2 can be appropriately mounted. The mounting recess 17 is connected to the mounting surface 13 at two locations on both ends in the x direction. The mounting surface electrode 24 covers all the mounting recesses 17. For this reason, when the light emitting module A2 is mounted on the mounting substrate 7, it can be expected that the molten solder 3 spreads over the entire mounting surface electrode 24 from at least one of both ends of the mounting surface electrode 24 in the x direction.

  40 to 43 show modified examples of the light emitting module A2 and the light emitting device B2.

  In the modification shown in FIG. 24, the mounting recess 17 has a mounting recess top surface 171, a pair of mounting recess side surfaces 172, and a pair of mounting recess inclined surfaces 173. The mounting recess top surface 171 faces downward in the z-direction diagram. The pair of mounting recess side surfaces 172 face each other in the x direction. The pair of mounting recess inclined surfaces 173 are interposed between and connected to the mounting recess top surface 171 and the pair of mounting recess side surfaces 172. Each mounting recess inclined surface 173 is inclined with respect to the x direction, in other words, with respect to the mounting recess top surface 171 and the mounting recess side surface 172. Each mounting recess inclined surface 173 is a curved surface. The mounting surface electrode 24 covers five surfaces of the mounting recess top surface 171, the pair of mounting recess side surfaces 172, and the pair of mounting recess inclined surfaces 173.

  In the modification shown in FIG. 41, the mounting recess 17 has a mounting recess top surface 171, a pair of mounting recess side surfaces 172, and a pair of mounting recess inclined surfaces 173. The mounting recess inclined surface 173 is a flat surface.

  In the modification shown in FIG. 42, the mounting recess 17 has a pair of mounting recess inclined top surfaces 174. The pair of mounting recess inclined top surfaces 174 are connected to each other at one end, and the other ends are connected to the mounting surface 13. Each mounting recess inclined top surface 174 is inclined so as to be separated inward from the mounting surface 13 in the z direction as it is separated from the mounting surface 13 in the x direction.

  In the modification shown in FIG. 43, the mounting recess 17 has a mounting recess top surface 171 and a pair of mounting recess side surfaces 172. The mounting recess top surface 171 faces downward in the z-direction diagram. The pair of mounting recess side surfaces 172 are connected to both ends in the x direction of the mounting recess top surface 171 and face each other in the x direction. Each mounting recess side surface 172 is connected to the mounting surface 13.

  Note that the first solder blocking portion 231 and the second solder blocking portion 232 described in the light emitting module A1 may be appropriately employed in the light emitting module A2. Moreover, you may employ | adopt suitably the structure of the base material 1, the wiring pattern 2, and the translucent resin 6 which were shown by FIG. 30 for light emitting module A2.

  44 to 50 show a light emitting module according to a third embodiment of the present invention. The light emitting module A3 of the present embodiment includes a base material 1, a wiring pattern 2, a light emitting element 4, a wire 5, and a translucent resin 6. 51 to 54 show a light emitting device using the light emitting module A3. B3 of this embodiment includes a light emitting module A3 and a mounting substrate 7.

FIG. 44 is a perspective view showing a main part of the light emitting module A3. FIG. 45 is a main part front view showing the light emitting device A3. FIG. 46 is a bottom view showing the light emitting device A3. FIG. 47 is a side view showing the light emitting device A3. FIG. 48 is a rear view showing the light emitting device A3. 49 is a cross-sectional view taken along the line XLIX-XLIX in FIG. 50 is a cross-sectional view taken along line LL in FIG. FIG. 51 is a main part perspective view showing the light emitting device B3. FIG. 52 is a plan view showing the light emitting device B3. 53 is a cross-sectional view taken along line LIII-LIII in FIG.
54 is an enlarged cross-sectional view of a main part taken along line LIV-LIV in FIG. For convenience of understanding, the translucent resin 6 is omitted in FIGS. 44, 45, and 51. In these drawings, the y direction corresponds to the first direction in the present invention, the z direction corresponds to the second direction in the present invention, and the x direction corresponds to the third direction in the present invention.

  The light emitting module A3 functions as a light source of the light emitting device B3. For example, the x direction dimension is about 3.1 mm, the y direction dimension is about 1.6 mm, and the z direction dimension is about 2.3 mm. The light emitting device B3 is mounted on, for example, a mobile phone and used as a transmitter that transmits a signal using infrared rays.

  The base material 1 has a rectangular parallelepiped shape as a whole, and is made of, for example, a plating adhesive insulating resin such as LCP (liquid crystal polymer). The substrate 1 has a front surface 11, a back surface 12, a mounting surface 13, a pair of side surfaces 14, a first storage recess 15 and a second storage recess 16.

  The surface 11 is a surface facing in the y direction. The back surface 12 is a surface that faces away from the front surface 11 in the y direction. The mounting surface 13 faces the z direction, and is connected to the front surface 11, the back surface 12, and the pair of side surfaces 14. The pair of side surfaces 14 face the x direction and face opposite sides. As shown in FIG. 53, the light emitting module A3 is configured such that the mounting surface 13 is mounted in a posture facing the mounting substrate 7.

  The first housing recess 15 is recessed from the surface 11 in the y direction. The first accommodating recess 15 has a parabolic shape and has a first bottom surface 151 and a first side surface 152. The first bottom surface 151 has a circular shape and is a surface on which the light emitting element 4 is mounted. That is, in the present embodiment, the first bottom surface 151 corresponds to the mounting surface referred to in the present invention.

  The second accommodation recess 16 is recessed from the surface 11 in the y direction. The second accommodating recess 16 is rectangular when viewed in the y direction, and has a second bottom surface 161 and a second side surface 162. The second bottom surface 161 has a rectangular shape as viewed in the y direction and faces the y direction. The second side surface 162 is connected to the second bottom surface 161 and the surface 11.

  As shown in FIG. 49, the second bottom surface 161 is located closer to the surface 11 in the y direction than the first bottom surface 151. As shown in FIG. 2, most of the first side surface 152 is connected to the surface 11, a part is connected to the second bottom surface 161, and the other part is connected to the second side surface 162.

  A back surface protrusion 19 is formed on the back surface 12 side portion of the substrate 1. The back surface protrusion 19 is a portion slightly protruding from the back surface 12 and has, for example, a substantially rectangular shape in the y direction.

  The wiring pattern 2 is formed on the base material 1, constitutes a conduction path to the light emitting element 4, and realizes mounting of the light emitting module A3 on the mounting substrate 7. In the present embodiment, as shown in FIG. 54, the wiring pattern 2 has a structure in which a base layer 200, a first layer 201, a second layer 202, and a third layer 203 are laminated in order from the base material 1. .

  The underlayer 200 is a layer made of Cu formed by electroless plating, for example, and has a thickness of about 0.1 to 1.0 μm, for example. The first layer 201 is a layer made of Cu formed by, for example, electrolytic plating, and has a thickness of, for example, about 5 to 30 μm. The second layer 202 is a layer made of Ni formed by, for example, electrolytic plating, and has a thickness of, for example, 1 to 5 μm. The third layer 203 is a layer made of, for example, Au formed by electrolytic plating, and has a thickness of, for example, about 0.01 to 0.3 μm. In the present embodiment, the second layer 202 corresponds to the lower layer referred to in the present invention, and the third layer 203 corresponds to the upper layer referred to in the present invention. The second layer 202 made of Ni has lower wettability to solder than the third layer 203 made of Au.

  The wiring pattern 2 includes a pair of mounting surface electrodes 24, a pair of side surface electrodes 25, a pair of back surface electrodes 26, a first bottom surface portion 211, a first side surface portion 212, a first connection portion 213, a first annular portion 214, a second It has a bottom surface part 221, a second side surface part 222, and a second connection part 223.

  The pair of mounting surface electrodes 24 are spaced apart from each other in the x direction, and each covers a part of the mounting surface 13 of the substrate 1. In the present embodiment, each mounting surface electrode 24 reaches the end edge in the x direction of the mounting surface 13. Each mounting surface electrode 24 reaches both ends of the mounting surface 13 in the y direction. Each mounting surface electrode 24 has a rectangular shape when viewed in the z direction.

  The pair of side electrodes 25 is a part that covers a part of each of the pair of side surfaces 14 of the substrate 1. In the present embodiment, each side electrode 25 covers all the side surfaces 14. Each side electrode 25 and each mounting surface electrode 24 are connected to each other.

  The pair of back surface electrodes 26 is a part that covers a part of the back surface 12 of the substrate 1. In the present embodiment, each back electrode 26 is formed in a strip shape along the side surfaces 14 and the edges of the pair of mounting recesses 17.

  The first bottom surface portion 211 is a portion that covers at least a part of the first bottom surface 151 of the first accommodating recess 15, and in the present embodiment, the first bottom surface portion 211 covers the entire first bottom surface 151. . The first side surface portion 212 is a portion that is connected to the first bottom surface portion 211 and covers a part of the first side surface 152 of the first housing recess 15.

  The first connection portion 213 is formed on the surface 11, and connects the first side surface portion 212 and one of the pair of mounting surface electrodes 24 (the mounting surface electrode 24 on the left side in the x-direction diagram in FIG. 44). Yes. The first annular portion 214 is formed on the surface 11 and is formed in an annular shape surrounding the first accommodating recess 15. The first annular portion 214 is connected to the first side surface portion 212 and the first connection portion 213.

  The second bottom surface portion 221 covers at least a part of the second bottom surface 161 of the second accommodation recess 16, and covers almost all of the second bottom surface 161 in the present embodiment. As shown in FIG. 45, the second bottom surface portion 221 is separated from the first side surface portion 212.

  The 2nd side part 222 is a part which covers at least one part of the 2nd side 162 of the 2nd accommodation recessed part 16, and has covered almost all the 2nd side 162 in this embodiment. The second side surface portion 222 is separated from the first side surface portion 212.

  The second connection portion 223 is formed on the surface 11, and connects the second side surface portion 222 and the other of the pair of mounting surface electrodes 24 (the mounting surface electrode 24 on the right side in the x-direction diagram in FIG. 44). Yes.

  In the present embodiment, the same constituent parts as those indicated by the reference numerals of the mounting surface 13, the pair of mounting surface electrodes 24, and the back surface electrode 26 in the drawing are the z of the substrate 1 and the wiring pattern 2, respectively. It is provided on the opposite side. These portions are formed for the convenience of the manufacturing process of the light emitting module A3, but may be used as the mounting surface 13, the pair of mounting surface electrodes 24, and the back surface electrode 26.

  The light emitting element 4 is, for example, an LED element that can emit infrared light. Depending on the application, for example, a light emitting element 4 that can emit visible light or the like may be used. The light emitting element 4 is provided with electrodes (not shown) on both sides in the y direction, and is mounted on the first bottom surface 151 of the first housing recess 15. More specifically, one of the electrodes of the light emitting element 4 is bonded to the first bottom surface portion 211 formed on the first bottom surface 151 via a conductive bonding material (not shown). The other electrode of the light emitting element 4 is joined to the second side surface portion 222 by a wire 5.

  The translucent resin 6 covers the light emitting element 4 and is filled in the first housing recess 15 and the second housing recess 16. The translucent resin 6 is made of, for example, a resin that transmits infrared rays from the light emitting element 4. In the present embodiment, the translucent resin 6 fills most of the first accommodation recess 15 and the second accommodation recess 16, but does not protrude from the first accommodation recess 15 and the second accommodation recess 16. That is, the surface of the translucent resin 6 is slightly recessed.

  As shown in FIGS. 51 to 54, the light emitting device B <b> 3 is configured by mounting the light emitting module A <b> 3 on the mounting substrate 7. The mounting substrate 7 has a pair of pad portions 71 and a pair of terminal portions 72. The mounting substrate 7 is a wiring substrate in which a wiring pattern is formed on a base material made of, for example, an epoxy resin.

  The pair of pad portions 71 are portions where the light emitting module A1 is mounted. Each pad portion 71 and each mounting surface electrode 24 of the light emitting module A <b> 1 are joined via the solder 3. FIG. 52 is a view of the light emitting device B3 as viewed from above in the z direction, and shows the pair of mounting surface electrodes 24 through for convenience of understanding. As shown in the figure, in the present embodiment, each pad portion 71 includes the mounting surface electrode 24 as viewed in the z direction. The difference between the dimension in the x direction of each pad portion 71 and the dimension in the x direction of each mounting surface electrode 24 is the difference between the dimension in the y direction of each pad portion 71 and the dimension in the y direction of each mounting surface electrode 24. Is bigger than. In particular, each pad portion 71 is configured to protrude greatly outward in the x direction with respect to each mounting surface electrode 24.

  The pair of terminal portions 72 are electrically connected to the pair of pad portions 71 separately. The pair of terminal portions 72 are portions to which, for example, a terminal (not shown) on the mobile phone side in which the light emitting device B3 is incorporated is joined.

  Next, an example of a method for manufacturing the light emitting module A3 will be described below with reference to FIGS.

  First, as shown in FIG. 55, a base material 1A is prepared. The base material 1A spreads along the x direction and the x direction, and has a front surface 11A and a back surface 12A (see FIG. 57). The base material 1 </ b> A has a plurality of first accommodation recesses 15, a plurality of second accommodation recesses 16, and a plurality of through holes 13 </ b> B. Each first accommodating recess 15 and each second accommodating recess 16 are coupled to each other. The plurality of first housing recesses 15 and the plurality of second housing recesses 16 are arranged in a matrix along the z direction and the x direction. Thereby, the plurality of first bottom surfaces 151 are arranged in a matrix in the z direction and the x direction. As described above, each first bottom surface 151 is a portion on which the light emitting element 4 is mounted, and corresponds to the mounting region referred to in the present invention in the base material 1A.

  Each of the plurality of through-holes 13B penetrates the base material 1A in the y direction, and is arranged in a matrix along the z direction and the x direction. Each through-hole 13B is disposed between the adjacent first accommodating recess 15 and the second accommodating recess 16 (adjacent first bottom surface 151). Each through-hole 13B has a rectangular shape as viewed in the y direction and has a pair of inwardly facing surfaces 13A. The pair of inward surfaces 13A face each other in the z direction. The base material 1A is formed, for example, by molding a liquid crystal polymer material using a mold.

  Next, as shown in FIGS. 56 to 58, an underlayer 200A is formed. The formation of the base layer 200A is performed, for example, by electroless plating. As a result, a base layer 200A made of Cu, for example, is formed on the entire exposed surface of the base material 1A. The thickness of the underlayer 200A is, for example, about 0.1 to 1.0 μm.

  Next, as shown in FIGS. 59 to 61, slits 205, 206, and 207 are formed in the base layer 200A. The slit 205, the slit 206, and the slit 207 are formed, for example, by removing a part of the base layer 200A in a linear shape using a laser. Due to the formation of the slit 205, the portion of the base layer 200A that covers the surface 11A includes a strip-like portion that extends long in the z direction between the adjacent through holes 13B in the x direction, and a portion that covers the first receiving recess 15 and The first housing recess 15 has an integral part integrally connected to a portion covering the second housing recess 16 located on the opposite side in the x direction across the belt-like part. Due to the formation of the slits 207, the portion of the base layer 200A that covers the inwardly facing surface 13A has a rectangular strip portion that is connected to the integrated portion. By forming the slit 206, the portion of the base layer 200 that covers the back surface 12 </ b> A has a strip-shaped portion that is connected to the rectangular strip-shaped portion. Then, the base layer 200A is divided into a portion isolated from the integral portion and the rectangular strip portion.

  Next, as shown in FIGS. 62 to 64, a first layer 201A is formed. The first layer 201A is formed by, for example, electrolytic plating. That is, it is performed by connecting plating electrodes (not shown) in the vicinity of both ends in the x direction of the integrated portion in the base layer 200A. In forming the first layer 201A, for example, a layer made of Cu is formed to a thickness of about 5 to 30 μm. 62 to 64, a region colored in a relatively dark color tone is a region where the first layer 201A is formed, and a region colored in a relatively light color tone is a region where the base layer 200A is exposed. .

  Next, the exposed underlayer 200A is removed by performing, for example, soft etching. Thereby, the states shown in FIGS. 65 to 67 are obtained. In this state, the exposed underlayer 200A is removed, and only the first layer 201A is present.

  Next, the second layer 202A and the third layer 203A are formed. 68 to 70 show a state where the formation of the third layer 203A is completed. The formation of the second layer 202A and the third layer 203A is performed, for example, by electrolytic plating similar to that used when the first layer 201A is formed. In forming the second layer 202A, for example, a layer made of Ni is formed to a thickness of about 1 to 5 μm. In forming the third layer 203A, for example, a layer made of Au is formed to a thickness of about 0.01 to 0.3 μm. Thereby, the conductor layer 2A is obtained.

  Next, as shown in FIG. 71, the plurality of light emitting elements 4 are mounted on the plurality of first bottom surfaces 151, respectively. Then, a wire 5 is bonded to each light emitting element 4 and the conductor layer 2A. Although omitted for convenience of understanding, the plurality of first housing recesses 15 and the plurality of second housing recesses 16 are filled with, for example, a liquid resin material so as to cover the plurality of light emitting elements 4 and are cured. . Thereby, the some translucent resin 6 (not shown) is obtained. Thereafter, the base material 1A is cut along, for example, a dicing blade along the illustrated cutting lines CL. Each cutting line CL is included in the yz plane, and passes through a portion of the conductor layer 2A that covers the inward surface 13A. By this cutting, the inward surface 13A becomes the mounting surface 13, and the portion of the conductor layer 2A that covers the inward surface 13A becomes the mounting surface electrode 24. Further, the conductor layer 2A including the base layer 200A, the first layer 201A, the second layer 202A, and the third layer 203A includes a plurality of base layers 200, the first layer 201, the second layer 202, and the third layer 203. The wiring pattern 2 is obtained. By going through the above steps, a plurality of light emitting modules A3 are obtained.

  Next, the operation of the light emitting module A3 and the light emitting device B3 will be described.

  According to the present embodiment, the light emitting module A3 has a pair of mounting surface electrodes 24. The pair of mounting surface electrodes 24 are spaced apart in the x direction across the mounting surface 13. When these mounting surface electrodes 24 are joined to the mounting substrate 7 by, for example, solder 3, the light emitting module A3 can be mounted on the mounting substrate 7 stably and reliably. Therefore, the light emitting module A3 can be more appropriately mounted. The mounting surface electrode 24 is formed on the mounting surface 13 and protrudes from the mounting surface 13 by the thickness of the mounting surface electrode 24. For this reason, when mounting light emitting module A3, the mounting surface electrode 24 can be reliably made to contact the molten solder 3. FIG.

  By having the back electrode 26, the back surface 12 side of the light emitting module A 3 can also contribute to the bonding to the mounting substrate 7.

  By having the first housing recess 15 and covering the first side surface 152 with the first side surface portion 212, the light from the light emitting element 4 mounted on the first bottom surface 151 can be reflected by the first side surface portion 212. It is. Thereby, the emission efficiency of the light emitting module A1 can be increased.

  By providing the second accommodation recess 16, it is possible to avoid the wire 5 from protruding from the base material 1.

  In the light emitting device B3, the mounting surface electrode 24 of the light emitting module A3 is included in the pad portion 71 of the mounting substrate 7, so that the solder 3 can be attached to the front surface of the mounting surface electrode 24. The difference between the x direction dimension of the pad portion 71 and the x direction dimension of the mounting surface electrode 24 is larger than the difference between the y direction size of the pad portion 71 and the y direction dimension of the mounting surface electrode 24. Accordingly, when the light emitting module A3 is mounted on the mounting substrate 7, it is possible to prevent the light emitting module A3 from rotating around the axis extending in the z direction.

  72 to 74 show modifications of the light emitting module A3.

  72 and 73, the wiring pattern 2 has a first solder blocking portion 231 and a second solder blocking portion 232 formed therein.

  In the modification shown in FIG. 72, two first solder blocking portions 231 and two second solder blocking portions 232 are provided. The first solder blocking portion 231 is provided in the first connection portion 213 and is located between the first housing recess 15 and the mounting surface electrode 24. More specifically, the first solder blocking portion 231 has a circular arc shape along the outer circle of the first housing recess 15. Further, the first solder blocking portion 231 is formed by exposing a part of the second layer 202 from the third layer 203 in the first connection portion 213. As a method of exposing the second layer 202, for example, a method of selectively removing only the third layer 203 (third layer 203A) using a laser after forming the third layer 203 (third layer 203A). Can be mentioned. The first solder blocking portion 231 formed in this way has less wettability with respect to solder than the portion of the first connecting portion 213 other than the first solder blocking portion 231.

  The second solder blocking portion 232 is provided in the second connection portion 223 and is located between the second housing recess 16 and the mounting surface electrode 24. More specifically, the second solder blocking portion 232 has a linear strip shape along the outer side of the second housing recess 16. The second solder blocking portion 232 is formed by exposing a part of the second layer 202 from the third layer 203 in the second connection portion 223. As a method of exposing the second layer 202, for example, a method of selectively removing only the third layer 203 (third layer 203A) using a laser after forming the third layer 203 (third layer 203A). Can be mentioned. The second solder blocking portion 232 formed in this way has less wettability with respect to solder than the portion of the second connecting portion 223 other than the second solder blocking portion 232.

  In the modification shown in FIG. 73, the first solder blocking portion 231 is formed by exposing the surface 11 of the base material 1 from the first connection portion 213. In such a configuration, the first solder blocking portion 231 is a portion surrounded by the first connection portion 213, but in the present invention, it is a portion defined by the presence of the first connection portion 213. Suppose that the first solder blocking portion 231 is formed in the first connection portion 213. Even in such a configuration, the first solder blocking portion 231 is less wettable with respect to solder than the portion of the first connecting portion 213 other than the first solder blocking portion 231.

  The second solder blocking portion 232 is formed by exposing the surface 11 of the base material 1 from the second connection portion 223. In such a configuration, the second solder blocking portion 232 is a portion surrounded by the second connection portion 223, but in the present invention, it is a portion defined by the presence of the second connection portion 223. Suppose that the second solder blocking portion 232 is formed in the second connection portion 223. Even in such a configuration, the second solder blocking portion 232 has lower wettability with respect to solder than the portion of the second connecting portion 223 other than the second solder blocking portion 232.

  According to these modified examples, when the light emitting module A3 is mounted on the mounting substrate 7 by having the first solder blocking portion 231 and the second solder blocking portion 232, the molten solder 3 can be It is possible to prevent the first solder blocking portion 231 and the second solder blocking portion 232 from proceeding to the second housing recess 16.

  FIG. 74 shows a light emitting module A3 as a modification of the substrate 1, the wiring pattern 2, and the translucent resin 6, and a light emitting device B3 on which the light emitting module A3 is mounted. In the present modified example, the first accommodation recess 15 and the second accommodation recess 16 are not formed in the base material 1. The light emitting element 4 is mounted on the surface 11. For this reason, in this modification, the surface 11 corresponds to the mounting surface referred to in the present invention. The wiring pattern 2 is formed so as to cover an appropriate place on the surface 11. The translucent resin 6 covers the light emitting element 4 on the surface 11 and protrudes from the surface 11.

  75 to 79 show a light emitting module according to a fourth embodiment of the present invention. 80 and 81 show a light emitting device according to the fourth embodiment of the present invention. The light emitting module A4 of the present embodiment is different from the light emitting module A3 described above in that a pair of side recesses 18 are mainly formed in the base material 1.

  In the present embodiment, the base material 1 is provided with a pair of side recesses 18. The pair of side recesses 18 are provided at both ends of the base material 1 in the x direction. Each side recess 18 is recessed from the side surface 14 and opens to the side where the mounting surface 13 is located in the z direction. Each side recess 18 is open on both sides in the y direction and reaches the front surface 11 and the back surface 12.

  The wiring pattern 2 has a pair of side recess electrodes 27. Each side recess electrode 27 covers at least a part of the side recess 18. In this embodiment, each side recess electrode 27 covers all of the side recesses 18. Further, the side recess electrode 27 is connected to the mounting surface electrode 24 and the back surface electrode 26.

  As shown in FIG. 81, the side recess 18 has a side recess side surface 181 and a side recess top surface 182. The side recess side surface 181 faces outward in the x direction and is connected to the mounting surface 13. The side concave top surface 182 faces outward, which is the lower side in the figure in the z direction, and is connected to the side surface 14 and the side concave side surface 181.

  Next, the manufacturing method of light emitting module A4 is demonstrated below, referring FIG. 82 and FIG.

  First, the base material 1A shown in FIG. 82 is required. Unlike the plurality of through holes 13B in the method for manufacturing the light emitting module A3, the through hole 13B of the present embodiment has four preliminary recesses 18A. The four preliminary recesses 18A are provided at both ends of the through hole 13B in the x direction. That is, two preliminary recesses 18A are arranged at one end in the x direction of the through hole 13B. Each preliminary recess 18A is recessed from the inward surface 13A in the z direction.

  The steps described with reference to FIGS. 56 to 70 are sequentially performed on the base material 1A. Then, the state shown in FIG. 83 is obtained by mounting a plurality of light emitting elements 4, bonding a plurality of wires 5, and forming a translucent resin 6 (not shown). Thereafter, the base material 1A is cut along, for example, a dicing blade along the illustrated cutting lines CL. Each cutting line CL is included in the yz plane and passes through the preliminary recess 18A. By this cutting, each preliminary recess 18A has a side recess 18 shown in FIGS. 75 to 81 at a portion on one side in the x direction. Further, the conductor layer 2A including the base layer 200A, the first layer 201A, the second layer 202A, and the third layer 203A includes a plurality of base layers 200, the first layer 201, the second layer 202, and the third layer 203. The wiring pattern 2 is obtained. Through the above steps, a plurality of light emitting modules A4 are obtained.

  Next, the operation of the light emitting module A4 and the light emitting device B4 will be described.

  Also according to the present embodiment, A4 can be more appropriately mounted. Moreover, it can be expected that the solder 3 adheres to the side recessed electrode 27 because the light emitting module A4 has the side recessed electrode 27. Thereby, the mounting strength of the light emitting module A4 can be further increased.

  By connecting the mounting surface electrode 24 and the side recessed electrode 27, it can be expected that the solder 3 is formed so as to surround the corner of the light emitting module A4.

  84 to 87 show modifications of the light emitting module A4 and the light emitting device B4.

  In the modification shown in FIG. 84, 18 has a side recess side surface 181, a side recess top surface 182, and a side recess inclined surface 183. The side recess side surface 181 faces outward in the x direction and is connected to the mounting surface 13. The mounting recess side surface 172 faces downward in the z direction and is connected to the side surface 14. The side recess top surface 182 is interposed between and connected to the side recess side surface 181 and the side recess top surface 182. Further, the side recess inclined surface 183 is inclined with respect to the x direction, in other words, with respect to the side recess side surface 181 and the side recess top surface 182. Further, the side recess inclined surface 183 is a curved surface. The side recess electrode 27 covers three surfaces of the side recess side surface 181, the side recess top surface 182, and the side recess inclined surface 183.

  In the modification shown in FIG. 85, the side recess 18 has a side recess side 181, a side recess top surface 182, and a side recess inclined surface 183. And the side recessed part inclined surface 183 is made into the plane.

  In the modification shown in FIG. 86, the side recess 18 has a side recess side surface 181 and a side recess inclined surface 183. The side recess inclined surface 183 is interposed between the side recess side surface 181 and the side surface 14 and is connected thereto. The side recess inclined surface 183 is in the x direction, in other words, is inclined with respect to the side recess side surface 181 and the side surface 14. Furthermore, in this modification, the side recess inclined surface 183 is a curved surface.

  In the modification shown in FIG. 87, the side recess 18 has only the mounting recess inclined side surface 184. The mounting recess inclined side surface 184 is connected to the side surface 14 and the mounting surface 13. The mounting recess inclined side surface 184 is inclined so as to be separated inward from the side surface 14 in the x direction as it is separated from the side surface 14 in the z direction.

  The present invention is not limited to the embodiment described above. The specific configuration of each part of the present invention can be changed in various ways.

A1-A4 Light-emitting module B1-B4 Light-emitting device 1 Base material 11 Front surface 12 Back surface 13 Mounting surface 14 Side surface 15 First accommodating recess 151 First bottom surface 152 First side surface 16 Second accommodating recess 161 Second bottom surface 162 Second side surface 17 Mounting Recess 171 Mounting recess top surface 172 Mounting recess side surface 173 Mounting recess slope top surface 174 Mounting recess slope top surface 18 Side recess 181 Side recess side surface 182 Side recess top surface 183 Side recess slope surface 184 Mounting recess slope side surface 19 Back projection 2 Wiring pattern 200 Base layer 201 First layer 202 Second layer 203 Third layer 211 First bottom surface portion 212 First side surface portion 213 First connection portion 214 First annular portion 221 Second bottom surface portion 222 Second side surface portion 223 First Two connecting portions 231 First solder blocking portion 232 Second solder blocking portion 24 Mounting surface electrode 25 Side electrode 26 Back surface electrode 27 Side recess electrode 3 4 Light emitting element 5 Wire 6 Translucent resin 7 Mounting substrate 71 Pad portion 72 Terminal portion 1A Base material 11A Front surface 12A Back surface 14A Side surface 17A Preliminary recess 17B Through hole 13B Through hole 13A Inward surface 18A Preliminary recess 2A Conductor layer 200A Underlayer 201A First layer 202A Second layer 203A Third layer 205-207 Slit

Claims (28)

A light emitting element;
A substrate having a mounting surface facing the first direction on which the light emitting element is mounted and a mounting surface facing the second direction perpendicular to the first direction;
A wiring pattern formed on the substrate and conducting to the light emitting element;
A light emitting module comprising:
The base material has a pair of mounting recesses that are recessed from the mounting surface and that are separated from each other in a third direction that is perpendicular to both the first direction and the second direction,
The wiring pattern has a pair of mounting surfaces electrodes covering one by at least a portion of the pair of mounting recesses,
Each of the mounting recesses is open to both outer sides in the first direction,
Each mounting surface electrode covers all of each mounting recess,
All of the mounting surface is exposed from the wiring pattern,
Each of the mounting recesses is open outward in the third direction of the base material,
The substrate has a surface facing the first direction and a first receiving recess recessed from the surface;
The first accommodating recess has a first bottom surface that is the mounting surface, and a first side surface that connects the surface and the first bottom surface,
The base material has a second receiving recess that is recessed from the surface and has a second bottom surface and a second side surface that connects the second bottom surface and the surface;
The second bottom surface is located closer to the surface in the first direction than the first bottom surface;
Through the portion of the first side surface that does not reach the surface, the second bottom surface and the first side surface are connected,
The first accommodation recess and the second accommodation recess are aligned in the third direction,
The wiring pattern is formed on the surface by a first bottom surface portion covering the first bottom surface, a first side surface portion connected to the first bottom surface portion and covering the first side surface, and the first side surface portion. And a first connection part that connects one of the pair of mounting surface electrodes, and a first ring formed on the surface, connected to the first side part and the first connection part, and surrounding the first accommodation recess A second bottom surface portion that is spaced apart from the first side surface portion and covers the second bottom surface portion, and is spaced apart from the first side surface portion and is connected to the second bottom surface portion and covers the second side surface. A second side surface portion, and a second connection portion formed on the surface and connecting the second side surface portion and the other of the pair of mounting surface electrodes,
The first connecting portion has a first solder blocking portion that is located between the first receiving recess and one of the pair of mounting recesses and that has a lower wettability with respect to solder than the remaining portion. ,
The second connection portion has a second solder blocking portion that is located between the second accommodation recess and the other of the pair of mounting recesses and that has a lower wettability with respect to solder than the remaining portion. ,
The wiring pattern has a lower layer located on the substrate side and an upper layer laminated on the lower layer,
The lower layer has less wettability to solder than the upper layer,
Said first solder blocking portion and the second solder blocking portion is characterized that you have been formed by exposing said lower from the upper layer, the light emitting module. The base material has a pair of side surfaces facing each other in the third direction;
The light emitting module according to claim 1 , wherein the wiring pattern has a pair of side electrodes that cover at least a part of the pair of side surfaces. The light emitting module according to claim 2 , wherein each side electrode covers all of the side surfaces. The light emitting module according to the each side electrodes wherein the mounting surfaces electrodes are connected to each other, according to claim 2 or 3. The base material has a back surface facing the side opposite to the mounting surface in the first direction;
5. The light emitting module according to claim 4 , wherein the wiring pattern includes a pair of back electrodes that cover a part of the back surface and are spaced apart from each other in the third direction. The light emitting module according to claim 5 , wherein each back electrode and each mounting surface electrode are connected to each other. Wherein each back electrode wherein a respective side surface electrodes are connected to each other, the light emitting module according to claim 6. Wherein each mounting recess, and the second direction mounting recess top facing, said has a third outward orientation and mounting recess side leading to the mounting surface and the mounting recess top surface, and claims 1 8. The light emitting module according to any one of 7 . Each mounting recess is interposed between the mounting recess top surface facing the second direction, the mounting recess side surface facing the third direction outward, the mounting recess top surface and the mounting recess side surface, and in the third direction. having a mounting recess inclined surface inclined against light-emitting module according to any one of claims 1 to 7. The light emitting module according to claim 9 , wherein the mounting recess inclined surface is a curved surface. Wherein each mounting recess has a mounting recess top surface facing the second direction, and a mounting recess side leading to inclined and the mounting surface and the mounting recess top surface to said third direction, and claim 1 The light emitting module in any one of 7 thru | or 7 . The light emitting module according to claim 11 , wherein the mounting recess side surface is a curved surface. Wherein each mounting recess has the leads to the mounting surface, and mounting recesses inclined top away in the second direction as away from the mounting surface in the third direction inwardly from said mounting surface, according to claim 1 The light emitting module in any one of 7 thru | or 7 . The light emitting module according to claim 2 , wherein each mounting recess is closed outward in the third direction of the base material. The light emitting module according to claim 14 , wherein each side electrode covers all of each side surface. The base material has a pair of side surfaces facing each other in the third direction;
The light emitting module according to claim 15 , wherein the wiring pattern has a pair of side electrodes covering at least a part of the pair of side surfaces. The base material has a back surface facing the side opposite to the mounting surface in the first direction;
The light emitting module according to claim 16 , wherein the wiring pattern includes a pair of back electrodes that cover a part of the back surface and are spaced apart from each other in the third direction. The light emitting module according to claim 17 , wherein each back electrode and each mounting surface electrode are connected to each other. Wherein each back electrode and the respective side surface electrodes are connected to each other, the light emitting module according to claim 18.
Wherein each mounting recess has the second mounting recess top facing to directions and orientations of the third outward and a pair of mounting recesses sides leading to the mounting surface and the mounting recess top surface, to claims 14 19 The light emitting module in any one of. Each mounting recess is interposed between the mounting recess top surface facing the second direction, the pair of mounting recess side surfaces facing each other in the third direction, the mounting surface, and the pair of mounting recess top surfaces, and the third The light emitting module according to any one of claims 14 to 19 , comprising a pair of mounting recess inclined surfaces inclined with respect to a direction. The light emitting module according to claim 21 , wherein each mounting recess inclined surface is a curved surface. Wherein each mounting recess has a pair of mounting recesses sides leading to and and the mounting surface and the mounting recess top surface inclined with respect to the second mounting recess top and the third direction toward the direction, to claims 14 20. The light emitting module according to any one of 19 . The light emitting module according to claim 23 , wherein each of the mounting recess side surfaces is a curved surface. Each of the mounting recesses has a pair of mounting recess inclined top surfaces that are connected to the mounting surface and are spaced inward from the mounting surface in the second direction as they are separated from the mounting surface in the third direction. Item 20. The light emitting module according to any one of Items 14 to 19 . A light emitting module according to any one of claims 1 to 25 ;
It has a pair of pad portions and a pair of pad portions that face the second direction and are spaced apart from each other in the third direction to which the pair of mounting surface electrodes are joined, and the second direction is the thickness direction. A mounting board;
A light-emitting device comprising: 27. The light emitting device according to claim 26 , wherein each pad portion includes each mounting surface electrode in the second direction view. The difference between the dimension in the third direction of each pad and the dimension in the third direction of each mounting surface electrode is the dimension in the first direction of each pad and the first direction of each mounting surface electrode. 28. The light emitting device of claim 27 , wherein the light emitting device is greater than a difference from the dimension .

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