WO2020125262A1

WO2020125262A1 - Led packaging structure and led lamp assembly

Info

Publication number: WO2020125262A1
Application number: PCT/CN2019/116466
Authority: WO
Inventors: 游志; 裴小明
Original assignee: 深圳市瑞丰光电子股份有限公司
Priority date: 2018-12-17
Filing date: 2019-11-08
Publication date: 2020-06-25
Also published as: CN209344124U

Abstract

An LED packaging structure (100) and an LED lamp assembly, the LED packaging structure (100) comprising an LED chip (110) and metal lead frames connected to the LED chip (110), and further comprising an encapsulating colloid (130) that wraps the metal lead frames and the LED chip (110), wherein the encapsulating colloid (130) is filled between wires of the metal lead frames and supports the metal lead frames. The metal lead frames in the LED packaging structure (100) comprise a required circuit structure, and the encapsulating colloid (130) integrally encapsulates the LED chip (110) and the metal lead frames at one time. The encapsulating colloid (130) is filled between the metal lead frames, and the encapsulating colloid (130) fixes and supports the metal lead frames. No additional insulating material is needed to support and fix the metal lead frames, and the molded LED packaging structure (100) comprises a plurality of light exit surfaces and has a wide light-emitting angle.

Description

LED packaging structure and LED lamp assembly

Technical field

The invention belongs to the technical field of LED packaging, and particularly relates to an LED packaging structure and an LED lamp assembly.

Background technique

The general LED packaging method is to fix the bowl and the bracket first, and then fix the wafer and encapsulate the encapsulant. In order to support the bracket structure, an insulating material is also needed to support the fixed bracket structure, and the encapsulation gel is separate for each bowl and cup It is made by potting, which has low operation efficiency and increased working intensity; and the LED packaging structure obtained by the above method has only one light emitting surface, and the light emitting angle is small. Therefore, it is necessary to provide an LED package structure that does not require insulating material support and has multiple light exit surfaces.

Summary of the invention

The technical problem to be solved by the present invention is to provide an LED packaging structure. The metal is directly formed to form a metal lead frame including required circuits, and no longer needs to be supported and fixed by insulating materials. After solid-welding the LED chip, the metal leads are directly packaged with packaging gel Frame and LED chip.

The invention also provides an LED lamp assembly.

The technical solutions adopted by the present invention to solve the above technical problems are:

An LED packaging structure includes an LED chip and a metal lead frame connected to the LED chip, and further includes an encapsulating colloid that wraps the metal lead frame and the LED chip, and the encapsulating colloid is filled in the circuit of the metal lead frame And support the metal lead frame.

As an improvement of the above technical solution, the metal lead frame is made of a metal material by punching or etching.

As an improvement of the above technical solution, the LED packaging structure is fabricated by integral packaging molding.

As an improvement of the above technical solution, the encapsulating colloid is one of silica gel and epoxy resin.

As an improvement of the above technical solution, a protective layer is further provided on the surface of the metal lead frame, and the protective layer is formed by one or more types of plating of Cu, Ni, Ag, Au, and Pd.

As an improvement of the above technical solution, the metal lead frame includes a positive electrode and a negative electrode, the positive electrode has a first reinforcing portion extending toward the negative electrode at a disconnection from the negative electrode, and an extending direction of the first reinforcing portion It is different from the long axis direction of the positive electrode.

As a further improvement of the above technical solution, the first reinforcing portion has a “V”-shaped structure that semi-encloses the end of the negative electrode.

As an improvement of the above technical solution, the metal lead frame includes a positive electrode and a negative electrode, a gap is formed between the positive electrode and the negative electrode, and a second reinforcement portion is provided on the outer side of the positive electrode and the negative electrode, and the first The two reinforcing portions intersect the axis of the slit, and at least one end of the second reinforcing portion exceeds the edge of the slit.

As a further improvement of the above technical solution, the second reinforcing portion is provided in a direction perpendicular to the slit, the second reinforcing portion includes at least one reinforcing rib provided on the outer side of the positive electrode and the negative electrode, and Both ends of the reinforcing rib exceed the edge of the gap.

An LED lamp includes a housing, and the above-mentioned LED packaging structure is provided in the housing.

The beneficial effects of the present invention are: the LED packaging structure of the present invention includes an LED chip, a metal lead frame and a packaging gel, the metal lead frame contains the required circuit structure, the packaging gel integrally encapsulates the LED chip and the metal lead frame in one piece, and the metal lead frame Filled with encapsulating colloid, the encapsulating colloid fixes and supports the metal lead frame, and no additional insulating material is needed to support and fix the metal lead frame; and the obtained LED package structure has multiple light emitting surfaces, which can increase the light emitting angle.

BRIEF DESCRIPTION

The present invention is further described below with reference to the drawings and embodiments.

1 is a top view of an LED package structure according to an embodiment of the invention;

2 is a cross-sectional view of an LED packaging structure according to an embodiment of the invention;

3 is a top view of an LED package structure according to an embodiment of the invention.

detailed description

The concept, specific structure, and technical effects of the present invention will be described clearly and completely in conjunction with the embodiments and drawings to fully understand the purpose, features, and effects of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all the embodiments. Based on the embodiments of the present invention, other embodiments obtained by those skilled in the art without paying creative efforts belong to The scope of protection of the present invention. In addition, all the connection/connection relationships involved in the patent are not directly connected by single-finger members, but refer to that a more optimal connection structure can be formed by adding or reducing connection accessories according to the specific implementation. The various technical features in the present invention can be combined interactively on the premise that they do not contradict each other.

FIGS. 1 and 2 show an LED package structure 100, including an LED chip 110, a metal lead frame, and an encapsulant 130. The LED chip 110 is connected to the metal lead frame through a bonding wire 140. Specifically, the metal lead frame is made of a metal material by removing materials such as stamping or etching. The metal material for making the metal lead frame may be a copper-based alloy or other materials that can be used for punching or etching to make the metal lead frame metallic material. The metal lead frame has the required wiring structure, and the LED chip 110 is electrically connected to the metal lead frame through the bonding wire 140. The encapsulant 130 encapsulates the LED chip 110, the bonding wire 140 and the metal lead frame as a whole.

Specifically, after the LED chip is fixedly welded on the metal lead frame, the packaging gel is integrally molded, and the wiring between the metal lead frame is also filled with the packaging gel to fix and support the metal lead frame.

When the LED package structure is produced by integral molding, the LED package structure 100 is arranged in a matrix, and the LED chip and the metal lead frame are encapsulated in the overall package molded with encapsulant, and a single LED package structure is obtained by laser cutting or mechanical cutting. Each LED packaging structure is individually packaged, which can effectively improve packaging efficiency and increase productivity.

In this embodiment, the encapsulation gel obtained after the integral molding and cutting is a cubic structure that wraps the LED chip and the metal lead frame and other components. The resulting LED encapsulation structure has a wide luminous angle, and the light can be emitted from multiple surfaces. In the technology, there is only one light-emitting surface when the bowl is used for packaging.

A protective layer is also provided on the surface of the metal lead frame. Preferably, the metal lead frame is a metal alloy, which can be used to both carry the LED chip and conduct heat generated by the LED chip; specifically, the protective layer is a layer of metal formed by electroplating on the surface of the metal lead frame, and the metal of the protective layer is Cu , Ni, Ag, Au, Pd one or more.

The encapsulating colloid is generally selected from transparent thermosetting polymer materials, such as silica gel and epoxy resin. The encapsulating colloid can also be doped with at least one of phosphor powder and diffusion powder as needed.

In this embodiment, the metal lead frame includes a positive electrode 122 and a negative electrode 121. An LED chip 110 is fixedly welded on one surface of the negative electrode 121, and the other end extends to the axial end of the LED package structure 100. To facilitate mass production, the LED package The positive electrode 122 and the negative electrode 121 of the structure 100 are layout-designed to support the entire structure. The end of the positive electrode facing away from the negative electrode also extends to the end of the LED package structure 100, and the areas 150 for welding on the back of the positive electrode and the negative electrode are all directed toward the LED package structure 100 Extends on both sides.

Because the strength of the disconnection between the positive electrode and the negative electrode is weak, the LED lamp when it is packaged or packaged easily breaks or cracks during use, which affects the normal use of the LED lamp. The positive electrode 122 of the LED packaging structure 100 has a first reinforcing portion 123 extending toward the negative electrode at a disconnection from the negative electrode 121, and the extending direction of the first reinforcing portion is different from the long axis direction of the positive electrode, that is, the first reinforcing portion 123 is located on the negative electrode. The outer side extends to strengthen the entire LED packaging structure. Preferably, the first reinforcing portion has a semi-enclosed structure to the end of the negative metal lead frame, specifically a “V”-shaped structure.

As shown in FIG. 3, a schematic diagram of an LED package structure according to yet another embodiment of the present invention is shown. The metal lead frame includes a positive electrode 222 and a negative electrode 221, a gap 224 is formed between the positive electrode 222 and the negative electrode 221, and the outer sides of the positive electrode and the negative electrode A second reinforcement is provided, the second reinforcement intersects the axis of the slit, and at least one end of the second reinforcement exceeds the edge of the slit.

The second reinforcing portion is provided in a direction perpendicular to the slit. The second reinforcing portion includes at least one reinforcing rib 223 provided outside the positive electrode and the negative electrode, and both ends of the reinforcing rib 223 exceed the edge of the slit 224.

The function of the second reinforcement is to increase the strength of the gap as a whole, so the specific width and length of the second reinforcement can be adjusted as needed.

The reinforcing rib may be directly connected to the metal lead frame, or may not be connected, and only one of the ends exceeds the edge of the gap and is provided outside the positive electrode or the negative electrode. In one embodiment of the present invention, the reinforcing ribs are provided on one side of the positive electrode and the negative electrode, and are connected to the positive electrode or the negative electrode. In still another embodiment of the present invention, both sides of the positive electrode and the negative electrode are provided with reinforcing ribs, the two reinforcing ribs are connected to the positive electrode, or both are connected to the negative electrode, or one reinforcing rib is connected to the positive electrode, and the other reinforcing rib is connected to Negative connection. The reinforcing rib is integrally formed with the positive electrode or the negative electrode, and is electrically independent from the positive electrode and the negative electrode.

The specific shape and thickness of the ribs can be adjusted according to the positive and negative electrode needs of the lead frame, so that the overall strength of the LED package structure is improved without affecting the overall electrical structure.

When fabricating the above-mentioned LED package structure, the metal lead frame is first fabricated as required, and a protective layer is plated on the surface of the metal lead frame as required. A plurality of metal lead frames are arranged in a matrix according to the requirements. A plurality of metal lead frames welded with LED chips are integrally molded with encapsulating gel, and a separate LED encapsulation structure is obtained after cutting. It can effectively solve the problem of low packaging efficiency brought by individual packaging, the manufacturing process is simple, and the packaging structure is more compact.

An embodiment of the present invention also provides an LED lamp assembly, including a housing and the above-mentioned LED packaging structure provided in the housing.

The above is a specific description of the preferred embodiments of the present invention, but the present invention is not limited to the embodiments, and those skilled in the art can make various equivalent modifications or replacements without violating the spirit of the present invention These equivalent variations or replacements are included in the scope defined by the claims of this application.

Claims

An LED packaging structure is characterized in that it includes an LED chip and a metal lead frame connected to the LED chip, and further includes an encapsulating colloid that wraps the metal lead frame and the LED chip, and the encapsulating colloid is filled in the The metal lead frame is between the wires and supports the metal lead frame.
The LED package structure according to claim 1, wherein the metal lead frame is made of a metal material by punching or etching.
The LED packaging structure according to claim 1, wherein the LED packaging structure is fabricated by integral packaging molding.
The LED packaging structure according to claim 1, wherein the packaging colloid is one of silica gel and epoxy resin.
The LED packaging structure according to claim 1, wherein a protective layer is further provided on the surface of the metal lead frame, and the protective layer is made of one or more of Cu, Ni, Ag, Au, and Pd Electroplating.
The LED package structure according to claim 1, wherein the metal lead frame includes a positive electrode and a negative electrode, the positive electrode has a first reinforcement portion extending toward the negative electrode at a disconnection from the negative electrode, and the The extending direction of the first reinforcing portion is different from the long axis direction of the positive electrode.
The LED packaging structure according to claim 6, wherein the first reinforcing portion has a "V" shape structure that semi-encloses the end of the negative electrode.
The LED packaging structure according to claim 1, wherein the metal lead frame includes a positive electrode and a negative electrode, and a gap is formed between the positive electrode and the negative electrode, and the outer sides of the positive electrode and the negative electrode are provided A second reinforcement portion that intersects the axis of the slit, and at least one end of the second reinforcement portion exceeds the edge of the slit.
The LED packaging structure according to claim 8, wherein the second reinforcement portion is provided along a direction perpendicular to the slit, and the second reinforcement portion includes at least one of the positive electrode and the negative electrode The outer reinforcement ribs, and both ends of the reinforcement ribs exceed the edge of the gap.
An LED lamp assembly is characterized by comprising a housing, wherein the LED packaging structure according to any one of claims 1-9 is provided in the housing.