CN101303980B - Surface adhesion type diode support and method for manufacturing the same - Google Patents
Surface adhesion type diode support and method for manufacturing the same Download PDFInfo
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- CN101303980B CN101303980B CN2007101068444A CN200710106844A CN101303980B CN 101303980 B CN101303980 B CN 101303980B CN 2007101068444 A CN2007101068444 A CN 2007101068444A CN 200710106844 A CN200710106844 A CN 200710106844A CN 101303980 B CN101303980 B CN 101303980B
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- pin
- rubber base
- metal
- adhesion type
- type diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Abstract
The invention relates to a surface-adhesion type diode metal support and a manufacturing method thereof; wherein, the diode metal support comprises a rubber base and a plurality of metal pins; wherein, one end face of the rubber base is provided with an internally concave function area and the other end face opposite to the function area forms a plurality of internally concave reserved holes; the function area and the reserved holes are formed by a molding pin and a positioning pin inside a die. By adopting the design that the molding pin and the positioning pin can respectively push against the metal pins, the method ensures the size of the molded function area to be more precise, thereby lowering the flash probability of the rubber base and improving the qualification rate of the product.
Description
Technical field
The present invention relates to a kind of surface adhesion type diode support and manufacture method thereof, particularly a kind of surface adhesion type diode support of the method made with alignment pin and shaping pin contact metal pin.
Background technology
(Light Emitting Diode LED) has that volume is little, vibration strength is high, a power saving, advantage such as reaction speed is fast and the life-span is long, thereby the aspect of using is more and more wider because light-emitting diode.In recent years, because the efficient of light-emitting diode is more and more higher, therefore be used in more widely in the backlight of general lighting device and various products.
Existing surface-mounting LED (Surface Mount Device, SMD), in general, be that light-emitting diode chip for backlight unit is fixed in the diode support of SMD LED surface-mount device LED, pass through subsequent techniques such as wire bond and sealing again, thereby constitute a surface-mounting LED.Wherein, this diode support has a rubber base, and one end has the functional areas of indent, and two metal pins that are provided with at interval, and it is affixed with rubber base respectively, and by extending out to the rubber base outside in the functional areas.
The production method of above-mentioned existing diode support, as shown in Figure 1, be earlier with a metal substrate (figure slightly) punch forming, to form metal pin 11 ', insert afterwards in the mould 20 ', and the die cavity that places stamping forming metal pin 11 ' mould 20 ' to have, with a shaping pin 21 ' contact metal pin 11 ', the macromolecule raw material 3 ' that reinjects solidifies forming rubber base 30 ' it, and above-mentioned functional areas are that the existence by shaping pin 21 ' forms.In this case, because metal pin 11 ' is not suitably gripped, add the influence that macromolecule raw material 3 ' flows in mould 20 ', will cause metal pin 11 ' to produce displacement, thereby make macromolecule raw material 3 ' produce the situation of flash in the contact place mutually at shaping pin 21 ' and metal pin 11 ', not only can make size produce deviation by shaping pin 21 ' formed functional areas, also can make the qualification rate of subsequent technique descend, the quality of product is unstable and can relatively cause the raising of manufacturing cost.
Therefore, a kind of surface adhesion type diode support that can solve weak point in the prior art of exigence on the market.
Summary of the invention
Main purpose of the present invention, be to provide a kind of surface adhesion type diode support and manufacture method thereof, to solve traditional surface adhesion type diode support, because when forming rubber base, flowing of macromolecule raw material produces displacement to support, thereby causes the problem of flash, makes the size of functional areas more accurate, the qualification rate of subsequent technique increases and reduces effectively manufacturing cost, improves the stability of product.
To achieve these goals, the invention provides a kind of manufacture method of surface adhesion type diode support, may further comprise the steps: a metal substrate is provided, and this metal substrate of punching press has a plurality of intervals with formation and is provided with and disconnected metal pin; One mould is provided, and this mould has the die cavity of reservation shape, and has a shaping pin and a plurality of alignment pin that is oppositely arranged in this die cavity; This metal substrate is positioned this mould, makes this metal pin be arranged in this die cavity, and this shaping pin relatively is resisted against the relative both ends of the surface of this metal pin respectively with this alignment pin; One macromolecule raw material is provided, this macromolecule raw material is injected this die cavity, to coat this shaping pin, this alignment pin and this metal pin; Curing molding to be cooled, affixed this metal pin of the macromolecule raw material of solidifying and setting, the rubber base that has insulating properties with formation; Remove this shaping pin and this alignment pin, from this mould, take out this metal substrate, by this shaping pin so that an end face of this rubber base forms the functional areas of an indent, by this alignment pin so that the relative other end of this rubber base forms a plurality of preformed holes, this metal pin is respectively by extending out to this rubber base outside in these functional areas, and this preformed hole is communicated to the end face of this metal pin.
The present invention also provides a kind of made surface mount diode support of manufacture method as above-mentioned surface adhesion type diode support, comprise: a rubber base, one end has the functional areas of an indent, and the other end relative with these functional areas has the preformed hole of a plurality of indents; A plurality of metal pins, adjacent at interval respectively is affixed with this rubber base, and extends out to this rubber base outside in the functional areas by this rubber base respectively, and this preformed hole is communicated to this metal pin respectively.
The present invention has following beneficial effect:
One, shaping pin among the present invention and alignment pin can effective respectively contact be fixed the opposite end surface of this metal pin, thereby make this metal pin in this die cavity, can be owing to flowing of this macromolecule raw material produces displacement.
Two, the rubber base among the present invention has more accurate size, thereby can effectively promote the rate of finished products of subsequent technique, and then production cost is reduced and suitable a large amount of production.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Description of drawings
Fig. 1 is the making schematic diagram of surface adhesion type diode support of the prior art;
Fig. 2 is a manufacture method flow chart of the present invention;
Fig. 3 forms the schematic perspective view of metal pin for metal substrate of the present invention;
Fig. 4 is the fixedly schematic diagram of metal pin of the present invention;
Fig. 5 forms the schematic diagram of rubber base for the present invention;
Fig. 6 forms the stereogram of functional areas for rubber base of the present invention;
Fig. 7 forms the stereogram of preformed hole for rubber base of the present invention;
Fig. 8 forms the stereogram of pin portion for metal pin of the present invention;
Fig. 9 is the stereogram of the present invention through solid crystalline substance and wire bond.
Wherein, Reference numeral:
11 '-metal pin
20 '-mould
21 '-shaping pin
3 '-macromolecule raw material
30 '-rubber base
10-metal substrate
11-metal pin
111-base portion
112-pin portion
20-mould
21-die cavity
22-shaping pin
23-alignment pin
3-macromolecule raw material
30-rubber base
31-functional areas
32-preformed hole
40-light-emitting diode chip for backlight unit
41-lead
Embodiment
See also Fig. 2 to Fig. 5, the invention provides a kind of surface adhesion type diode support and manufacture method thereof, wherein this manufacture method comprises the following steps:
Step S100 a: metal substrate 10 is provided, this metal substrate 10 can be a sheet member, the mode that can use continuous feed is with metal stamping formed, be provided with at interval and disconnected metal pin 11 thereby obtain having in a plurality of stent area, the quantity of this metal pin 11 can be according to actual demand setting, in accompanying drawing of the present invention, be example with two, but certainly also punching press form three or more metal pins 11.
Step S101 a: mould 20 is provided, it can be two mutual involutory male models and master mold, the inside of this mould 20 has the die cavity 21 corresponding to above-mentioned stent area quantity, this die cavity 21 is processed into predetermined shape in advance, this processing mode can be as processing methods such as edm methods, relatively being provided with in formed this die cavity 21 can upper and lower mobile a shaping pin 22 and a plurality of alignment pin 23, this shaping pin 22 can be circle, square, rectangle or polygon, is example in the present invention with the oblong.
Step S102: this metal substrate 11 is positioned in this mould 20, and make this metal pin 11 be arranged in this die cavity 21 accordingly, the setting that these two metal pins 11 are adjacent at interval respectively, and relatively the upper/lower terminal face is respectively by this shaping pin 22 and this alignment pin 23 contact relatively, thereby can firmly be clamped this metal pin 11, avoid producing displacement because of the operation of subsequent technique.
Step S103 a: macromolecule raw material 3 is provided, use as ejection formation (Molding) or cast molding technical approach such as (Casting), this macromolecule raw material 3 of fusion also is injected in this die cavity 21, to coat this shaping pin 22, this alignment pin 23 and this metal pin 11 and to fill up this die cavity 21; Wherein, this macromolecule raw material 3 can be as polyphthalamide resin (Polyphthalamide, PPA), or other any known thermoplastic resin.
Step S104: after treating these macromolecule raw material 3 cooling curing moulding, this macromolecule raw material 3 of solidifying and setting can be affixed with this metal pin 11, and according to the reservation shape of this die cavity 21, form the rubber base 30 with insulating properties.
Step S105: remove this shaping pin 22 and this alignment pin 23, and from this mould 20, take out this metal substrate 10; Wherein, take out this metal substrate 10, can use as technical approach such as ejecting; Simultaneously, please cooperate and consult Fig. 6 and Fig. 7, because the existence of this shaping pin 22, inwardly obliquely be formed with the functional areas 31 of an indent at an end face of this rubber base 30, its external form is corresponding to the external form of this shaping pin 22, simultaneously, by this alignment pin 23, make this rubber base 30 be formed with the preformed hole 32 of a plurality of indents with respect to the other end that forms these functional areas 31, this preformed hole 32 is communicated to the end face of this metal pin 11, and this metal pin 11 is respectively by the outside that extends out to this rubber base 30 in these functional areas 31.
Preferable, for making this metal pin 11 have better light reflectivity, can also be in above-mentioned steps S100, before with these metal substrate 10 punching presses or after the punching press, further form a metallic reflector by electroplating deposition, make this metal substrate 11 and this metal pin 11 end faces (surface) respectively have metallic reflector (not icon), the material of this metallic reflector can be the metal that has high reflectance as silver etc.
Pass through above-mentioned steps, can form the structure of surface adhesion type diode support of the present invention, promptly form a rubber base 30, and a plurality of metal pins 11, end face indent at this rubber base 30 forms this functional areas 31, relative other end then forms this preformed hole 32, and each metal pin 11 is respectively by extending out to this rubber base 30 outsides in these functional areas 31.Each preformed hole 32 forms by each set alignment pin 23 in this mould 20, and on the end face that is formed at this rubber base 30 separately.
In addition, above-mentioned each metal pin 11 respectively has a base portion 111 and a pin portion 112.This base portion 111 is arranged in this functional areas 31, and this pin portion 112 extends to this rubber base 30 outsides by these base portion 111 1 end one, with as follow-up pad.Wherein, this pin portion 112 can lay respectively at two relative lateral margin faces of this rubber base 30, and bent preformed hole 32 ends (as shown in Figure 8) to this rubber base 30, can constitute a forward type (Top view) diode support (being that forward is luminous) like this.Perhaps, this pin portion 112 can be positioned at the same lateral margin face (not icon) of this rubber base 30, can constitute a lateral type (Sideview) diode support (being lateral direction light emission) like this.
By above-mentioned steps, the present invention can produce the more accurate diode support of size, as shown in Figure 9.Then, can in rubber base 30, carry out subsequent technique operations such as solid crystalline substance, wire bond and sealing, and then constitute a surface-mounting LED.Wherein, admittedly brilliant operation, the i.e. installation of carrying out light-emitting diode chip for backlight unit 40 on the base portion 111 of a metal pin 11 of this rubber base 30 is adhered to, can use as technical approach such as sticking together, this light-emitting diode chip for backlight unit 40 is affixed, then, carry out the wire bond operation again, be about to this base portion 111 of this metal pin 11 in this light-emitting diode chip for backlight unit 40 and this functional areas 31, link mutually to realize electric connection with lead (as gold thread) 41, at last, carry out the sealing operation, promptly in these functional areas 31 of this rubber base 30, cover the adhesive layer (not icon) that one deck has light transmission, as epoxy resin or thermoplastic resin etc., to encapsulate this light-emitting diode chip for backlight unit 40 and this lead 41, thereby constitute a surface-mounting LED, in use, by this pin portion 112 (can be welded on the circuit board) making current, make this light-emitting diode chip for backlight unit 40 discharge light at this metal pin 11.
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.
Claims (11)
1. the manufacture method of a surface adhesion type diode support is characterized in that, may further comprise the steps:
Provide a metal substrate, and this metal substrate of punching press is provided with and disconnected metal pin to form a plurality of intervals;
One mould is provided, and this mould has the die cavity of reservation shape, has the shaping pin and a plurality of alignment pin that are oppositely arranged in this die cavity;
This metal substrate is positioned this mould, makes this metal pin be arranged in this die cavity, and this shaping pin and this alignment pin are resisted against the relative both ends of the surface of this metal pin respectively;
One macromolecule raw material is provided, this macromolecule raw material is injected in this die cavity, to coat this shaping pin, this alignment pin and this metal pin;
Treat this macromolecule raw material cooling curing moulding, affixed this metal pin of the macromolecule raw material of solidifying and setting, the rubber base that has insulating properties with formation;
Remove this shaping pin and this alignment pin, from this mould, take out this metal substrate, existence by this shaping pin, make an end face of this rubber base be formed with the functional areas of an indent, existence by this alignment pin, make the relative other end of this rubber base be formed with a plurality of preformed holes, this metal pin is respectively by extending out to this rubber base outside in these functional areas, and this preformed hole is communicated to the end face of this metal pin.
2. the manufacture method of surface adhesion type diode support as claimed in claim 1 is characterized in that, the injection mode of this macromolecule raw material is an ejection formation.
3. the manufacture method of surface adhesion type diode support as claimed in claim 1 is characterized in that, the injection mode of this macromolecule raw material is cast molding.
4. the manufacture method of surface adhesion type diode support as claimed in claim 1 is characterized in that, before this metal substrate is carried out punching press, also further comprises a plating step, so that the end face of this metal pin has metallic reflector.
5. the manufacture method of surface adhesion type diode support as claimed in claim 1 is characterized in that, after this metal substrate is carried out punching press, also further comprises a plating step, so that the end face of this metal pin has metallic reflector.
6. the made surface adhesion type diode support of the manufacture method of a surface adhesion type diode support as claimed in claim 1 is characterized in that, comprising:
One rubber base, one end have the functional areas of an indent, and the other end relative with these functional areas has the preformed hole of a plurality of indents;
A plurality of metal pins, adjacent at interval respectively is affixed with this rubber base, and extends out to this rubber base outside in the functional areas by this rubber base respectively, and this preformed hole is communicated to this metal pin respectively.
7. surface adhesion type diode support as claimed in claim 6 is characterized in that, on this preformed hole this end face that is arranged on this rubber base separately.
8. surface adhesion type diode support as claimed in claim 6 is characterized in that the surface of this metal pin has metallic reflector.
9. surface adhesion type diode support as claimed in claim 6 is characterized in that, this metal pin has a base portion that is arranged in these functional areas respectively, and one extends to the pin portion of this rubber base outside by this base portion one end.
10. surface adhesion type diode support as claimed in claim 9 is characterized in that, this pin portion is positioned at two relative lateral margin faces of this rubber base respectively.
11. surface adhesion type diode support as claimed in claim 9 is characterized in that, this pin portion is positioned at the same lateral margin face of this rubber base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101068444A CN101303980B (en) | 2007-05-10 | 2007-05-10 | Surface adhesion type diode support and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101068444A CN101303980B (en) | 2007-05-10 | 2007-05-10 | Surface adhesion type diode support and method for manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101303980A CN101303980A (en) | 2008-11-12 |
| CN101303980B true CN101303980B (en) | 2010-09-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101068444A Expired - Fee Related CN101303980B (en) | 2007-05-10 | 2007-05-10 | Surface adhesion type diode support and method for manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101303980B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102403393B (en) * | 2010-09-09 | 2014-12-17 | 前源科技股份有限公司 | Fabricating method for photoelectric element base |
| CN103378281B (en) * | 2012-04-23 | 2016-01-20 | 长华科技股份有限公司 | The front processing procedure of LED conducting wire frame and structure thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6608334B1 (en) * | 1999-12-09 | 2003-08-19 | Rohm Co., Ltd. | Light-emitting chip device with case and method of manufacture thereof |
| CN1897262A (en) * | 2005-07-12 | 2007-01-17 | 周万顺 | Light-emitting diodes surface-adhered foundation support and its production |
-
2007
- 2007-05-10 CN CN2007101068444A patent/CN101303980B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6608334B1 (en) * | 1999-12-09 | 2003-08-19 | Rohm Co., Ltd. | Light-emitting chip device with case and method of manufacture thereof |
| CN1897262A (en) * | 2005-07-12 | 2007-01-17 | 周万顺 | Light-emitting diodes surface-adhered foundation support and its production |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2001-36154A 2001.02.09 |
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| Publication number | Publication date |
|---|---|
| CN101303980A (en) | 2008-11-12 |
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Granted publication date: 20100901 Termination date: 20110510 |