CN112993125A - Processing technology for packaging large-angle LED bracket - Google Patents
Processing technology for packaging large-angle LED bracket Download PDFInfo
- Publication number
- CN112993125A CN112993125A CN202110174400.4A CN202110174400A CN112993125A CN 112993125 A CN112993125 A CN 112993125A CN 202110174400 A CN202110174400 A CN 202110174400A CN 112993125 A CN112993125 A CN 112993125A
- Authority
- CN
- China
- Prior art keywords
- bracket
- processing technology
- treatment
- silver
- angle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005516 engineering process Methods 0.000 title claims abstract description 23
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 11
- 238000001746 injection moulding Methods 0.000 claims abstract description 19
- 239000011324 bead Substances 0.000 claims abstract description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 14
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910052709 silver Inorganic materials 0.000 claims abstract description 14
- 239000004332 silver Substances 0.000 claims abstract description 14
- 238000007747 plating Methods 0.000 claims abstract description 13
- 239000003292 glue Substances 0.000 claims abstract description 11
- 239000012778 molding material Substances 0.000 claims abstract description 9
- 239000002184 metal Substances 0.000 claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims abstract description 7
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 7
- 239000002245 particle Substances 0.000 claims abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052802 copper Inorganic materials 0.000 claims abstract description 5
- 239000010949 copper Substances 0.000 claims abstract description 5
- 239000011248 coating agent Substances 0.000 claims abstract description 4
- 238000000576 coating method Methods 0.000 claims abstract description 4
- 238000002347 injection Methods 0.000 claims abstract description 4
- 239000007924 injection Substances 0.000 claims abstract description 4
- 238000003754 machining Methods 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims abstract description 4
- 238000000465 moulding Methods 0.000 claims abstract description 4
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000010956 nickel silver Substances 0.000 claims abstract description 4
- 238000007493 shaping process Methods 0.000 claims abstract description 4
- 238000003466 welding Methods 0.000 claims abstract description 4
- 238000009713 electroplating Methods 0.000 claims description 9
- VEMHQNXVHVAHDN-UHFFFAOYSA-J [Cu+2].[Cu+2].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O Chemical compound [Cu+2].[Cu+2].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O VEMHQNXVHVAHDN-UHFFFAOYSA-J 0.000 claims description 3
- JKEOXMAHHRTVEX-UHFFFAOYSA-J [Ni++].[Ni++].NS([O-])(=O)=O.NS([O-])(=O)=O.NS([O-])(=O)=O.NS([O-])(=O)=O Chemical compound [Ni++].[Ni++].NS([O-])(=O)=O.NS([O-])(=O)=O.NS([O-])(=O)=O.NS([O-])(=O)=O JKEOXMAHHRTVEX-UHFFFAOYSA-J 0.000 claims description 3
- LEKPFOXEZRZPGW-UHFFFAOYSA-N copper;dicyanide Chemical compound [Cu+2].N#[C-].N#[C-] LEKPFOXEZRZPGW-UHFFFAOYSA-N 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000004090 dissolution Methods 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 3
- LFAGQMCIGQNPJG-UHFFFAOYSA-N silver cyanide Chemical compound [Ag+].N#[C-] LFAGQMCIGQNPJG-UHFFFAOYSA-N 0.000 claims description 3
- 238000004381 surface treatment Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 239000013078 crystal Substances 0.000 abstract 1
- 238000001125 extrusion Methods 0.000 abstract 1
- 239000007787 solid Substances 0.000 abstract 1
- 238000000748 compression moulding Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Abstract
The invention discloses a processing technology for packaging a large-angle LED bracket, wherein a metal belt is punched into a bracket shape through a die, the surface of the bracket is subjected to nickel-silver coating treatment, firstly, the treatment is performed before plating, then, a copper plating layer, a nickel plating layer and a silver plating layer are sequentially performed, finally, after silver protection treatment, the bracket is placed and dried, plastic particles are melted to obtain an injection molding material, the melted injection molding material is placed into a screw rod by a stirrer, the injection molding material is injected into a bracket die cavity through screw rod extrusion to form a bowl cup, the injection molded bracket is subjected to finish machining and shaping treatment, a solid crystal welding wire and an LED lamp bead chip are welded in the bowl cup, and high-viscosity molding glue is selected to perform glue dispensing treatment on the. The invention has the beneficial effects that: the LED lamp is simple in process and good in heat dissipation effect, and because the height of the chip is higher than that of the support bowl cup, the light emitting angle of the support can reach 159 degrees, and the light emitting angle of the LED lamp bead can reach 180 degrees.
Description
Technical Field
The invention relates to the technical field of LEDs, in particular to a processing technology for packaging a large-angle LED bracket.
Background
Along with the gradual and extensive application of LEDs, the OD distance of a backlight module is shortened, the light emitting angle of an original support cannot meet the requirement, the conventional SMD LED support is formed by plastic particles through injection molding or compression molding, the height of the support is generally 0.7mm-1.2mm, the height of a bowl cup is generally 0.45mm-0.8mm, a chip is packaged in the bowl cup of the support, the light emitting angle of the support is 102 degrees, the light emitting angle of a lamp bead is 120 degrees, in order to solve the problem of large angle, the mode of injection molding or compression molding of the BT plate plastic particles is adopted in the industry, and a BT plate is not self heat conducting, so that the long-time lighting heat dissipation is poor, and the reliability of.
Disclosure of Invention
The invention aims to provide a processing technology for packaging a large-angle LED bracket, which aims to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: a processing technology for packaging a large-angle LED bracket is characterized by comprising the following steps:
the method comprises the following steps: punching the metal belt into a required bracket shape by a die;
step two: carrying out nickel-silver surface treatment on the surface of the punched bracket, firstly carrying out pre-plating treatment, then sequentially carrying out cyanide copper plating, copper sulfate copper electroplating, nickel sulfamate nickel electroplating, cyanide silver plating and silver electroplating, and finally carrying out silver protection treatment;
step three: placing and drying the bracket after the silver treatment on the nickel;
step four: melting the plastic particles to obtain an injection molding material;
step five: the melted injection molding material is placed into a screw rod by a stirrer, is extruded by the screw rod and is injected into a bracket mold cavity after being subjected to nickel and silver coating treatment, and a bowl is formed after injection molding;
step six: performing finish machining on the injection molded bracket, and performing shaping treatment after cutting off redundant parts;
step seven: welding the die bond bonding wire and the LED lamp bead chip in the bracket bowl;
step eight: and selecting high-viscosity molding glue for dispensing treatment on the top end of the welded LED lamp bead chip, and then completing packaging.
Preferably, in the fourth step, the dissolution temperature of the plastic example is 330 ℃ to 340 ℃.
Preferably, in the sixth step, the size of the bracket finished after injection molding is 3.19mm in length, 2.76mm in width and 0.4mm in width.
Preferably, in the seventh step, the bonding wire is a chip die bonding wire with a height of 200um, and the height of the LED lamp bead is higher than that of the support bowl.
Preferably, in the step eight, the glue surface obtained after glue dispensing is a spherical surface.
Preferably, the metal strip is a thermally conductive copper strip.
Preferably, the luminous angle of the bracket can reach 159 degrees, and the luminous angle of the LED lamp bead can reach 180 degrees.
Advantageous effects
Compared with a BT plate, the processing technology of the large-angle LED support package has the advantages that the heat dissipation effect of the copper support is better, the manufacturing technology is the same as that of an SMD support, the operation is simple and convenient, an SMT application end does not need to change a circuit and a PAD PAD and can be directly replaced for use, and the light emitting angle of an LED lamp bead can reach 180 degrees as the height of a chip is higher than that of a support bowl cup and the light emitting angle of the support is 159 degrees.
Drawings
FIG. 1 is a schematic view of an arrangement punch structure of the present invention;
FIG. 2 is an enlarged view of a single punch of the present invention;
FIG. 3 is a schematic view of an arrangement injection molding structure of the present invention;
FIG. 4 is an enlarged schematic view of a single shot injection molding structure of the present invention;
FIG. 5 is a schematic view of the structure of the arrangement of the present invention;
FIG. 6 is an enlarged schematic view of a single finished product of the present invention.
Detailed Description
The following are specific embodiments of the present invention and are further described with reference to the drawings, but the present invention is not limited to these embodiments.
Examples
A processing technology for packaging a large-angle LED bracket is characterized by comprising the following steps:
the method comprises the following steps: punching the metal belt into a required bracket shape by a die;
step two: carrying out nickel-silver surface treatment on the surface of the punched bracket, firstly carrying out pre-plating treatment, then sequentially carrying out cyanide copper plating, copper sulfate copper electroplating, nickel sulfamate nickel electroplating, cyanide silver plating and silver electroplating, and finally carrying out silver protection treatment;
step three: placing and drying the bracket after the silver treatment on the nickel;
step four: melting the plastic particles to obtain an injection molding material;
step five: the melted injection molding material is placed into a screw rod by a stirrer, is extruded by the screw rod and is injected into a bracket mold cavity after being subjected to nickel and silver coating treatment, and a bowl is formed after injection molding;
step six: performing finish machining on the injection molded bracket, and performing shaping treatment after cutting off redundant parts;
step seven: welding the die bond bonding wire and the LED lamp bead chip in the bracket bowl;
step eight: and selecting high-viscosity molding glue for dispensing treatment on the top end of the welded LED lamp bead chip, and then completing packaging.
Preferably, in the fourth step, the dissolution temperature of the plastic example is 330 ℃ to 340 ℃.
Preferably, in the sixth step, the size of the bracket finished after injection molding is 3.19mm in length, 2.76mm in width and 0.4mm in width.
Preferably, in the seventh step, the bonding wire is a chip die bonding wire with a height of 200um, and the height of the LED lamp bead is higher than that of the support bowl.
Preferably, in the step eight, the glue surface obtained after glue dispensing is a spherical surface.
Preferably, the metal strip is a thermally conductive copper strip.
Preferably, the luminous angle of the bracket can reach 159 degrees, and the luminous angle of the LED lamp bead can reach 180 degrees.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the content of the present invention within the scope of the protection of the present invention.
Claims (7)
1. A processing technology for packaging a large-angle LED bracket is characterized by comprising the following steps:
the method comprises the following steps: punching the metal belt into a required bracket shape by a die;
step two: carrying out nickel-silver surface treatment on the surface of the punched bracket, firstly carrying out pre-plating treatment, then sequentially carrying out cyanide copper plating, copper sulfate copper electroplating, nickel sulfamate nickel electroplating, cyanide silver plating and silver electroplating, and finally carrying out silver protection treatment;
step three: placing and drying the bracket after the silver treatment on the nickel;
step four: melting the plastic particles to obtain an injection molding material;
step five: the melted injection molding material is placed into a screw rod by a stirrer, is extruded by the screw rod and is injected into a bracket mold cavity after being subjected to nickel and silver coating treatment, and a bowl is formed after injection molding;
step six: performing finish machining on the injection molded bracket, and performing shaping treatment after cutting off redundant parts;
step seven: welding the die bond bonding wire and the LED lamp bead chip in the bracket bowl;
step eight: and selecting high-viscosity molding glue for dispensing treatment on the top end of the welded LED lamp bead chip, and then completing packaging.
2. The processing technology for the large-angle LED support package according to claim 1, wherein the processing technology comprises the following steps: in the fourth step, the dissolution temperature of the plastic example is 330 ℃ and 340 ℃.
3. The processing technology for the large-angle LED support package according to claim 1, wherein the processing technology comprises the following steps: in the sixth step, the size of the bracket finished after injection molding is 3.19mm in length, 2.76mm in width and 0.4mm in width.
4. The processing technology for the large-angle LED support package according to claim 1, wherein the processing technology comprises the following steps: and in the seventh step, the bonding wire is a chip die bonding wire with the height of 200um, and the height of the LED lamp bead is higher than that of the support bowl.
5. The processing technology for the large-angle LED support package according to claim 1, wherein the processing technology comprises the following steps: and in the step eight, the glue surface obtained after glue dispensing is a spherical surface.
6. The processing technology for the large-angle LED support package according to claim 1, wherein the processing technology comprises the following steps: the metal belt is a heat-conductive copper belt.
7. The processing technology for the large-angle LED support package according to claim 1, wherein the processing technology comprises the following steps: the luminous angle of the bracket can reach 159 degrees, and the luminous angle of the LED lamp bead can reach 180 degrees.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110174400.4A CN112993125A (en) | 2021-02-07 | 2021-02-07 | Processing technology for packaging large-angle LED bracket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110174400.4A CN112993125A (en) | 2021-02-07 | 2021-02-07 | Processing technology for packaging large-angle LED bracket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112993125A true CN112993125A (en) | 2021-06-18 |
Family
ID=76347780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110174400.4A Pending CN112993125A (en) | 2021-02-07 | 2021-02-07 | Processing technology for packaging large-angle LED bracket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112993125A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113707791A (en) * | 2021-09-02 | 2021-11-26 | 鸿利智汇集团股份有限公司 | LED manufacturing process |
-
2021
- 2021-02-07 CN CN202110174400.4A patent/CN112993125A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113707791A (en) * | 2021-09-02 | 2021-11-26 | 鸿利智汇集团股份有限公司 | LED manufacturing process |
| CN113707791B (en) * | 2021-09-02 | 2023-05-26 | 鸿利智汇集团股份有限公司 | LED manufacturing process |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |