CN204424308U - A kind of LED support and LED lamp bead - Google Patents
A kind of LED support and LED lamp bead Download PDFInfo
- Publication number
- CN204424308U CN204424308U CN201420864107.6U CN201420864107U CN204424308U CN 204424308 U CN204424308 U CN 204424308U CN 201420864107 U CN201420864107 U CN 201420864107U CN 204424308 U CN204424308 U CN 204424308U
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- China
- Prior art keywords
- led
- reflector
- substrate
- base plate
- led support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011324 bead Substances 0.000 title claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 49
- 239000002184 metal Substances 0.000 claims abstract description 19
- 229910052751 metal Inorganic materials 0.000 claims abstract description 19
- 239000000084 colloidal system Substances 0.000 claims abstract description 8
- 238000012856 packing Methods 0.000 claims abstract description 8
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 5
- 241000218202 Coptis Species 0.000 abstract description 6
- 235000002991 Coptis groenlandica Nutrition 0.000 abstract description 6
- 239000006185 dispersion Substances 0.000 abstract description 6
- 238000004806 packaging method and process Methods 0.000 abstract description 4
- 230000003287 optical effect Effects 0.000 abstract description 3
- 239000004033 plastic Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 12
- 238000010586 diagram Methods 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 206010061245 Internal injury Diseases 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The utility model discloses a kind of LED support and LED lamp bead, the utility model LED support comprises substrate, upper surface of base plate and lower surface are provided with corresponding multiple pads, the surrounding of all pads of upper surface of base plate is provided with the reflector of bottomless ring-type, and the pad that upper surface of base plate is corresponding with lower surface is connected by metal vias.The pad of metal vias connection substrate upper surface and lower surface, therefore the heat of upper surface of base plate can conduct to base lower surface fast, thus quick heat radiating.The utility model LED lamp bead is based on above-mentioned LED support; therefore heat dispersion is strong; and reflector can reflect the some light that LED grain sends; prevent optical crosstalk; improve out light consistency; packing colloid in reflector covers LED grain and metal wire, and packaging plastic physical efficiency protection LED grain and gold thread, can improve the propagation of light simultaneously.
Description
Technical field
The utility model relates to LED technology field, more specifically, relates to a kind of LED support and LED lamp bead.
Background technology
Current LED display industry is towards high density point apart from future development, the lamp pearl that tradition LED display uses adopts Chip SMD LED(PCB package surface attachment LED) and Top SMD LED(end face light-emitting area mount LED), but the equal defectiveness of this two series products at present.
Chip SMD LED comprises substrate, after carrying out the operations such as die bond bonding wire again on substrate, carry out molding(mold pressing more afterwards) sealing operation, finally cutting forms single lamp pearl, this class wrapper is not owing to having reflector, and the light-out effect of LED in all directions has certain difference, goes out light consistency difference, and due to large-area packing colloid in atmosphere external, easily make moist and cause internal injury.This class wrapper also has the shortcoming of poor radiation.The current industry dimension limit 1.0*1.0mm of this series products.
Top SMD LED adopts conventional P PA support, the lead terminal of conventional P PA support adopts stalloy (as 0.2mm) to be stamped to form at press machine, re-using injection molding machine filling lead terminal inside makes it fix, and be injection molded into reflector, the method, due to the limited precision of lead terminal punching press, is difficult to the pad realizing below 1mm; The precision of conventional injection molding machine is also limited, and the dimension limit of current this series products of industry is 1.5*1.5mm;
Current LED display industry, towards highly dense point apart from future development, needs the LED of smaller szie to occur, but at present the LED display that makes of industry conventional packaging method when put apart from little to a certain extent after by hard to carry on.Extra small apart from LED display for realizing, need a kind of new LED support to occur.
Utility model content
The utility model is intended to solve the problems of the technologies described above at least to a certain extent.
Primary and foremost purpose of the present utility model overcomes the defect that prior art heat dispersion is poor, go out light consistency difference, provide a kind of heat dispersion strong, go out the good LED support of light consistency.
Further object of the present utility model be to provide a kind of heat dispersion strong, go out the good LED lamp bead of light consistency.
For solving the problems of the technologies described above, the technical solution of the utility model is as follows:
A kind of LED support, described LED support comprises substrate, upper surface of base plate and lower surface are provided with corresponding multiple pads, and the region surrounding that upper surface of base plate arranges pad is provided with the reflector of bottomless ring-type, and the pad that upper surface of base plate is corresponding with lower surface is connected by metal vias.
A LED lamp bead for above-mentioned LED support, described LED lamp bead comprises above-mentioned LED support, and the upper surface of base plate in reflector is provided with LED grain, and LED grain is linked by the pad of metal wire with upper surface of base plate, and reflector inside is filled with packing colloid.
Compared with prior art, the beneficial effect of technical solutions of the utility model is: the utility model LED support comprises substrate, upper surface of base plate and lower surface are provided with corresponding multiple pads, the surrounding of all pads of upper surface of base plate is provided with the reflector of bottomless ring-type, and the pad that upper surface of base plate is corresponding with lower surface is connected by metal vias.The pad of metal vias connection substrate upper surface and lower surface, therefore the heat of upper surface of base plate can conduct to base lower surface fast, thus quick heat radiating.
The utility model LED lamp bead is based on above-mentioned LED support; therefore heat dispersion is strong; and reflector can reflect the some light that LED grain sends; prevent optical crosstalk; improve out light consistency; packing colloid in reflector covers LED grain and metal wire, and packaging plastic physical efficiency protection LED grain and metal wire, can improve the propagation of light simultaneously.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of LED support of the present utility model.
Fig. 2 is the substrate schematic diagram of LED support of the present utility model.
Fig. 3 is the reflector schematic diagram of LED support of the present utility model.
Fig. 4 is the schematic diagram of LED lamp bead of the present utility model.
Fig. 5 is the schematic diagram of the utility model LED lamp bead batch production.
Wherein: 1, LED support; 2, substrate; 3, reflector; 4, LED lamp bead; 5, LED grain; 6, metal wire.
Embodiment
Accompanying drawing, only for exemplary illustration, can not be interpreted as the restriction to this patent;
In order to better the present embodiment is described, some parts of accompanying drawing have omission, zoom in or out, and do not represent the size of actual product;
To those skilled in the art, in accompanying drawing, some known features and explanation thereof may be omitted is understandable.
Below in conjunction with drawings and Examples, the technical solution of the utility model is described further.
embodiment 1
A kind of LED support, as Figure 1-3, described LED support 1 comprises substrate 2, substrate 2 upper surface and lower surface are provided with corresponding multiple pads, the region surrounding that substrate 2 upper surface arranges pad is provided with the reflector 3 of bottomless ring-type, and the pad that substrate 2 upper surface is corresponding with lower surface is connected by metal vias.
The utility model LED support 1 comprises substrate 2, substrate 2 upper surface and lower surface are provided with corresponding multiple pads, the surrounding of all pads of substrate 2 upper surface is provided with the reflector 3 of bottomless ring-type, and the pad that substrate 2 upper surface is corresponding with lower surface is connected by metal vias.The pad of metal vias connection substrate 2 upper surface and lower surface, therefore the heat of substrate 2 upper surface can conduct to substrate 2 lower surface fast, thus quick heat radiating.
In specific implementation process, described reflector 3 is opaque reflector, and color is black or white.White increases the brightness that reflection improves LED finished product, is applicable to the series products that throws light on; Black absorption scattered light improves the contrast of LED finished product, is applicable to display screen series products.
In specific implementation process, described reflector 3 ultrasonic thermocompression is at the upper surface of described substrate 2.
In specific implementation process, described reflector 3 scribbles glue layer with the contact-making surface of substrate 2.The glue used in the present embodiment is heat curing-type glue, material is epoxy resin, when reflector 3 closes with substrate 2 ultrasonic thermocompression, the transfer of ultrasonic energy produced by pressing machine is to the faying face of reflector 3 and substrate 2, and make reflector 3 and substrate 2 produce larger heat in faying face friction, make glue curing, strengthen reflector 3 and the degree of adhesion of substrate 2, prevent gap from producing.
In specific implementation process, described reflector 3 is shaped in the upper surface of described substrate 2.After substrate 2 completes, again substrate 2 is placed in the mould of moulding press, mould on a substrate 2 surface reserves corresponding injection moulding groove, again to Epoxy Resin For Automatic Pressure Gelation Process in mould, be heating and curing shaping, the mould high accuracy of moulding press processes again, therefore its making precision of reflector 3 that mold pressing makes is very high, ultra-narrow limit reflector 3 can be realized, and reflector 3 and substrate 2 contraposition accurate; Moulding press has the clamping pressure of up to a hundred tons, therefore has goodish guarantor's type ability, and the reflector 3 of the LED support 1 of compression molding has good consistency; The reflector 3 of compression molding is combined completely with substrate 2, therefore has good bond strength and sealing; Reflector 3 in the present embodiment adopts epoxy resin, and its thermal endurance is better than PPA.
In specific implementation process, described substrate 2 is BT resin substrate.It has very high high glass transition temperature (Tg), the performances such as outstanding dielectric property, low-thermal-expansion rate, good mechanical characteristics.BT resin substrate can double-deck or multilayer circuit wiring, thus realizes more complicated circuit.
embodiment 2
A kind of LED lamp bead of above-mentioned LED support, as shown in Figure 4, described LED lamp bead 4 comprises above-mentioned LED support 1, and substrate 2 upper surface in reflector 3 is provided with LED grain 5, LED grain 5 is linked with the pad of substrate 2 upper surface by metal wire 6, and reflector 3 inside is filled with packing colloid.
The utility model LED lamp bead 4 is based on above-mentioned LED support 1; therefore heat dispersion is strong; and reflector 3 can reflect the some light that LED grain 5 sends; prevent optical crosstalk; improve out light consistency; packing colloid in reflector 3 covers LED grain 5 and metal wire 6, and packaging plastic physical efficiency protection LED grain 5 and metal wire 6, can improve the propagation of light simultaneously.
In specific implementation process, it is characterized in that, described reflector 3 is opaque reflector, and color is black or white.White increases the brightness that reflection improves LED finished product, is applicable to the series products that throws light on; Black absorption scattered light improves the contrast of LED finished product, is applicable to display screen series products.
In specific implementation process, described substrate 2 is BT resin substrate, and metal wire 6 adopts gold thread.It has very high high glass transition temperature (Tg), the performances such as outstanding dielectric property, low-thermal-expansion rate, good mechanical characteristics.LED grain 5 is connected by gold thread with the pad of substrate 2 upper surface; BT resin substrate can double-deck or multilayer circuit wiring; thus realize more complicated circuit; use epoxy resin or silica gel etc. to cover LED grain 5 and gold thread in reflector 3, packing colloid can protect the propagation of LED grain 5 and gold thread and change light.
In specific implementation process, described LED grain 5 is 3, comprises redness, yellow and blue, represents a pixel.
As shown in Figure 5, in order to produce in batches, LED support 1 is carried out matrix arrangement, in LED support 1, LED grain 5 after carrying out circuit connection by elargol or gold thread is installed, re-use epoxy resin and cover LED grain 5, again the cutting of the substrate 2 of LED support 1 is come after curing molding, form the LED lamp bead 4 of single.
The corresponding same or analogous parts of same or analogous label; The term describing position relationship in accompanying drawing, only for exemplary illustration, can not be interpreted as the restriction to this patent; Obviously, above-described embodiment of the present utility model is only for the utility model example is clearly described, and is not the restriction to execution mode of the present utility model.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all execution modes.All do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., within the protection range that all should be included in the utility model claim.
Claims (8)
1. a LED support, it is characterized in that, described LED support comprises substrate, upper surface of base plate and lower surface are provided with corresponding multiple pads, the region surrounding that upper surface of base plate arranges pad is provided with the reflector of bottomless ring-type, and the pad that upper surface of base plate is corresponding with lower surface is connected by metal vias.
2. LED support according to claim 1, is characterized in that, it is characterized in that, described reflector is opaque reflector.
3. LED support according to claim 1, is characterized in that, the contact-making surface of described reflector and substrate scribbles glue layer.
4. LED support according to claim 1, is characterized in that, described reflector is shaped in the upper surface of described substrate.
5. LED support according to claim 1, is characterized in that, described substrate is BT resin substrate.
6. the LED lamp bead based on LED support described in claim 1, it is characterized in that, described LED lamp bead comprises above-mentioned LED support, and the upper surface of base plate in reflector is provided with LED grain, LED grain is linked by the pad of metal wire with upper surface of base plate, and reflector inside is filled with packing colloid.
7. LED lamp bead according to claim 6, is characterized in that, it is characterized in that, described reflector is opaque reflector.
8. LED lamp bead according to claim 6, is characterized in that, described substrate is BT resin substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420864107.6U CN204424308U (en) | 2014-12-31 | 2014-12-31 | A kind of LED support and LED lamp bead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420864107.6U CN204424308U (en) | 2014-12-31 | 2014-12-31 | A kind of LED support and LED lamp bead |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204424308U true CN204424308U (en) | 2015-06-24 |
Family
ID=53474652
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420864107.6U Expired - Fee Related CN204424308U (en) | 2014-12-31 | 2014-12-31 | A kind of LED support and LED lamp bead |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204424308U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106932879A (en) * | 2015-11-12 | 2017-07-07 | 日月光半导体制造股份有限公司 | Optical device package and method of manufacturing the same |
| CN110649009A (en) * | 2019-10-12 | 2020-01-03 | 东莞市欧思科光电科技有限公司 | A double-molded LED product and manufacturing process |
-
2014
- 2014-12-31 CN CN201420864107.6U patent/CN204424308U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106932879A (en) * | 2015-11-12 | 2017-07-07 | 日月光半导体制造股份有限公司 | Optical device package and method of manufacturing the same |
| CN110649009A (en) * | 2019-10-12 | 2020-01-03 | 东莞市欧思科光电科技有限公司 | A double-molded LED product and manufacturing process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150624 Termination date: 20191231 |