CN113707791A - LED manufacturing process - Google Patents
LED manufacturing process Download PDFInfo
- Publication number
- CN113707791A CN113707791A CN202111023923.5A CN202111023923A CN113707791A CN 113707791 A CN113707791 A CN 113707791A CN 202111023923 A CN202111023923 A CN 202111023923A CN 113707791 A CN113707791 A CN 113707791A
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- Prior art keywords
- pad
- metal connecting
- connecting part
- transverse
- copper sheet
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Abstract
An LED manufacturing process comprising the steps of: (1) stamping, namely stamping a plurality of single pad supports on the copper sheet coiled material, wherein longitudinal material belts are arranged on the two longitudinal sides of each single pad support, transverse material belts are arranged on the two transverse sides of each single pad support, the longitudinal material belts and the transverse material belts are connected with each other to form a material rack, and the pads are connected with the transverse material belts through metal connecting parts; (2) electroplating; (3) performing injection molding, namely performing injection molding on the position of a single pad support on the copper sheet coiled material to form a plastic bowl cup; (4) appearance, blacking out marks at the positions of poor plastics; (5) packaging, namely winding the copper sheet coiled material with the pad bracket and the plastic bowl on a reel; (6) packaging, namely unreeling a copper sheet through a reel, and carrying out die bonding, wire bonding and dispensing in a plastic bowl; (7) and stripping materials, continuously stamping the material-wound copper sheet, cutting off the first metal connecting part, the second metal connecting part and the injection molding guide groove, and separating the single LED from the material rack.
Description
Technical Field
The invention relates to the field of LEDs, in particular to an LED manufacturing process.
Background
The existing LED manufacturing process flow is as follows: stamping, namely stamping a plurality of single pad supports, longitudinal material belts and transverse material belts on a copper sheet, wherein the single pad supports are arranged between the adjacent transverse material belts and the adjacent longitudinal material belts, each single pad support comprises an anode pad and a cathode pad, the anode pad and the cathode pad are connected with the transverse material belts through metal connecting belts, and one side of each longitudinal material belt, which faces towards the corresponding pad support, is provided with a raised clamping point; electroplating, namely performing electroplating treatment on the surface of the copper sheet; injection molding, namely injection molding a plastic bowl cup at the position of the pad support, and embedding the metal connecting belt and the clamping points into the plastic bowl cup to form connection; appearance, finding out the plastic bowl with poor injection molding through appearance detection and separating the plastic bowl by a stamping mode; stamping, namely cutting off the metal connecting belt and the injection molding guide groove in a stamping mode, and only remaining clamping points for fixedly supporting the plastic bowl cup; packaging, cutting the copper sheet coiled material into pieces; packaging, namely die bonding, wire bonding and dispensing in a plastic bowl on the chip mounting bracket; and (4) stripping, namely stripping the material by using a roller, and turning the edge of the material belt to separate the clamping point from the single LED. The LED manufacturing process has the following defects: the clamp point control is too shallow and easy to drop particles, the clamp point is too deep, the material is stripped and the support structure is easy to damage, and the particles are easy to drop due to deformation or dropping in the packaging process; the fluorescent agent at the particle dropping position dirties the dispensing bottom plate and the bonding pad adhesive; as shown in FIG. 4, due to the existence of the clamping points, grooves 11 are formed on two sides of the plastic bowl 10, which affects the flatness of two sides of a single LED, so that the LED is clamped at the track of the light splitting machine.
Disclosure of Invention
The invention aims to solve the technical problem of providing an LED manufacturing process, wherein the situation of falling off and falling particles cannot occur in the packaging process; the process flow is reduced, and the production cost is reduced.
In order to solve the technical problems, the technical scheme of the invention is as follows: an LED manufacturing process comprising the steps of:
(1) stamping, namely stamping a plurality of single pad supports on a copper sheet coiled material, wherein longitudinal material belts are arranged on the two longitudinal sides of each single pad support, transverse material belts are arranged on the two transverse sides of each single pad support, the longitudinal material belts and the transverse material belts are connected with each other to form a material rack, each single pad support comprises an anode pad and a cathode pad, an isolation groove is arranged between each anode pad and each cathode pad, a stamping empty groove is arranged between each single pad support and the two longitudinal material belts on the two sides, the isolation grooves are communicated with the stamping empty grooves, one end of each anode pad is connected with the transverse material belt on one side of each single pad support through a first metal connecting part, and one end of each cathode pad is connected with the transverse material belt on the other side of each single pad support through a second metal connecting part;
(2) electroplating, namely electroplating the surface of the copper sheet coiled material;
(3) performing injection molding, namely performing injection molding on a single pad support on the copper sheet coiled material to form a plastic bowl cup, wherein the positive pad and the negative pad are embedded at the bottom of the plastic bowl cup, the longitudinal two sides of the plastic bowl cup are separated from the longitudinal material belt, and the transverse two sides of the plastic bowl cup are connected with the transverse material belt only through the first metal connecting part and the second metal connecting part;
(4) appearance, painting black marks on the positions of the plastic defects through appearance detection;
(5) packaging, namely winding the copper sheet coiled material with the pad bracket and the plastic bowl on a reel;
(6) packaging, namely unreeling a copper sheet through a reel, and carrying out die bonding, wire bonding and dispensing in a plastic bowl;
(7) and stripping materials, continuously stamping the material-wound copper sheet, cutting off the first metal connecting part, the second metal connecting part and the injection molding guide groove, and separating the single LED from the material rack.
According to the invention, the LED manufacturing process flow is changed, the clamping points on the edge of the longitudinal material belt are removed, and the plastic bowl and the bonding pad are supported only by the metal connecting part, so that the problems of damage and easy falling of the inverted bracket due to the clamping points are solved; in the packaging process, bad plastic bowls and pad supports do not need to be washed away, so that the process flow can be saved; in the material stripping process, continuous operation is performed in the material rolling unreeling and stamping modes, the operation efficiency is high, and the material is stored in the material rolling mode, so that the package can be saved; in the light splitting process, due to the fact that two sides of a single LED are flat, materials cannot be clamped at the track of the light splitting machine.
As an improvement, the first metal connecting part is arranged in the middle of one end of the positive electrode bonding pad; the second metal connecting part is arranged in the middle of one end of the negative electrode bonding pad.
As an improvement, the positive electrode bonding pad, the negative electrode bonding pad, the first metal connecting part, the second metal connecting part, the longitudinal material belt and the transverse material belt are integrally formed in a punching mode.
As an improvement, the middle position of one end of the positive electrode bonding pad corresponding to the first metal connecting part is convex; and the middle position of one end of the negative electrode bonding pad corresponding to the second metal connecting part is convex.
As an improvement, during stripping, the root part of the first metal connecting part connected with the positive electrode bonding pad is broken, and the root part of the second metal connecting part connected with the negative electrode bonding pad is broken.
As the improvement, a plurality of cutting grooves are punched on two sides of the material rack in the length direction corresponding to the transverse material belt.
As an improvement, the width of the two ends of the transverse material belt is narrowed to form an on-line extraction measurement anode and cathode disconnection point.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, the LED manufacturing process flow is changed, the clamping points on the edge of the longitudinal material belt are removed, and the plastic bowl and the bonding pad are supported only by the metal connecting part, so that the problems of damage and easy falling of the inverted bracket due to the clamping points are solved; in the packaging process, bad plastic bowls and pad supports do not need to be washed away, so that the process flow can be saved; in the material stripping process, continuous operation is performed in the material rolling unreeling and stamping modes, the operation efficiency is high, and the material is stored in the material rolling mode, so that the package can be saved; in the light splitting process, due to the fact that two sides of a single LED are flat, materials cannot be clamped at the track of the light splitting machine.
Drawings
FIG. 1 is a process diagram of the manufacturing process of the present invention.
Fig. 2 is a schematic diagram of a copper sheet after a stamping process.
FIG. 3 is a schematic diagram of a copper sheet after injection molding process.
Fig. 4 is a schematic diagram of a single LED manufactured by a conventional process.
FIG. 5 is a schematic view of a single LED manufactured by the process of the present invention.
Detailed Description
The invention is further described below with reference to the accompanying drawings.
As shown in fig. 1, an LED manufacturing process includes the following steps:
(1) stamping, as shown in fig. 2, stamping a plurality of single pad supports on a copper sheet coiled material, wherein longitudinal material belts 1 are arranged on two longitudinal sides of each single pad support, transverse material belts 2 are arranged on two transverse sides of each single pad support, the longitudinal material belts 1 and the transverse material belts 2 are connected with each other to form a material rack, each single pad support comprises an anode pad 4 and a cathode pad 5, an isolation groove is arranged between the anode pad 4 and the cathode pad 5, a stamping empty groove is arranged between each single pad support and the longitudinal material belts 1 on the two sides, the isolation groove is communicated with the stamping empty groove, one end of the anode pad 4 is connected with the transverse material belt 2 on one side of each single pad support through a first metal connecting part 7, and one end of the cathode pad 5 is connected with the transverse material belt 2 on the other side of each single pad support through a second metal connecting part 6; the positive electrode bonding pad 4, the negative electrode bonding pad 5, the first metal connecting part 7, the second metal connecting part 6, the longitudinal material belt 1 and the transverse material belt 2 are integrally formed in a punching mode; the middle position of one end of the positive electrode bonding pad 4 corresponding to the first metal connecting part 7 is convex; the middle position of one end of the negative electrode bonding pad 5, which corresponds to the second metal connecting part 6, is convex, and the first metal connecting part 7 is arranged at the middle position of one end of the positive electrode bonding pad 4; the second metal connecting part 6 is arranged in the middle of one end of the negative electrode bonding pad 5;
(2) electroplating, namely electroplating the surface of the copper sheet coiled material;
(3) performing injection molding, namely performing injection molding on a single pad support on the copper sheet coiled material to form a plastic bowl cup 10, wherein the positive pad 4 and the negative pad 5 are embedded at the bottom of the plastic bowl cup 10, the longitudinal two sides of the plastic bowl cup 10 are separated from the longitudinal material belt 1, and the transverse two sides of the plastic bowl cup 10 are connected with the transverse material belt 2 only through the first metal connecting part 7 and the second metal connecting part 6;
(4) appearance, painting black marks on the positions of the plastic defects through appearance detection;
(5) packaging, namely winding the copper sheet coiled material with the pad bracket and the plastic bowl 10 on a reel;
(6) packaging, namely unreeling the copper sheet through a reel, and carrying out die bonding, wire bonding and dispensing in the plastic bowl 10;
(7) and stripping, continuously punching the copper sheet wound on the material roll, punching at the root part of the first metal connecting part 7 connected with the positive electrode bonding pad 4, punching at the root part of the second metal connecting part 6 connected with the negative electrode bonding pad 5, and cutting off the injection molding guide groove to separate the single LED from the material rack.
According to the invention, the LED manufacturing process flow is changed, the clamping points on the edge of the longitudinal material belt 1 are removed, and the plastic bowl 10 and the bonding pad are supported only by the metal connecting part, so that the problems of damage and easy falling of the inverted bracket due to the clamping points are solved; in the packaging process, the defective plastic bowl 10 and the pad bracket do not need to be washed away, so that the process flow can be saved; in the material stripping process, continuous operation is performed in the material rolling unreeling and stamping modes, the operation efficiency is high, and the material is stored in the material rolling mode, so that the package can be saved; as shown in fig. 5, in the light splitting process, since two sides of a single LED are flat, the material is not blocked at the track of the light splitter.
As shown in fig. 2, a plurality of cutting grooves 8 are punched on two sides of the rack in the length direction corresponding to the transverse material belt 2, and the material roll is cut at the positions of the cutting grooves 8 to obtain the material roll with the required length.
As shown in fig. 2, the width of the two ends of the transverse material tape 2 is narrowed to form an on-line spot for measuring the positive and negative break points 3, and when a single LED needs to be measured, the on-line spot for measuring the positive and negative break points is broken, so that the positive and negative of the single LED are broken, and the narrowed copper sheet is more easily broken.
Claims (7)
1. An LED manufacturing process, comprising the steps of:
(1) stamping, namely stamping a plurality of single pad supports on a copper sheet coiled material, wherein longitudinal material belts are arranged on the two longitudinal sides of each single pad support, transverse material belts are arranged on the two transverse sides of each single pad support, the longitudinal material belts and the transverse material belts are connected with each other to form a material rack, each single pad support comprises an anode pad and a cathode pad, an isolation groove is arranged between each anode pad and each cathode pad, a stamping empty groove is arranged between each single pad support and the two longitudinal material belts on the two sides, the isolation grooves are communicated with the stamping empty grooves, one end of each anode pad is connected with the transverse material belt on one side of each single pad support through a first metal connecting part, and one end of each cathode pad is connected with the transverse material belt on the other side of each single pad support through a second metal connecting part;
(2) electroplating, namely electroplating the surface of the copper sheet coiled material;
(3) performing injection molding, namely performing injection molding on a single pad support on the copper sheet coiled material to form a plastic bowl cup, wherein the positive pad and the negative pad are embedded at the bottom of the plastic bowl cup, the longitudinal two sides of the plastic bowl cup are separated from the longitudinal material belt, and the transverse two sides of the plastic bowl cup are connected with the transverse material belt only through the first metal connecting part and the second metal connecting part;
(4) appearance, painting black marks on the positions of the plastic defects through appearance detection;
(5) packaging, namely winding the copper sheet coiled material with the pad bracket and the plastic bowl on a reel;
(6) packaging, namely unreeling a copper sheet through a reel, and carrying out die bonding, wire bonding and dispensing in a plastic bowl;
(7) and stripping materials, continuously stamping the material-wound copper sheet, cutting off the first metal connecting part, the second metal connecting part and the injection molding guide groove, and separating the single LED from the material rack.
2. An LED manufacturing process according to claim 1, wherein: the first metal connecting part is arranged in the middle of one end of the positive electrode bonding pad; the second metal connecting part is arranged in the middle of one end of the negative electrode bonding pad.
3. An LED manufacturing process according to claim 1, wherein: the positive electrode bonding pad, the negative electrode bonding pad, the first metal connecting portion, the second metal connecting portion, the longitudinal material belt and the transverse material belt are integrally formed in a punching mode.
4. An LED manufacturing process according to claim 1, wherein: the middle position of one end of the positive bonding pad, which corresponds to the first metal connecting part, is convex; and the middle position of one end of the negative electrode bonding pad corresponding to the second metal connecting part is convex.
5. An LED manufacturing process according to claim 4, wherein: when stripping the material, the root part of the first metal connecting part connected with the positive electrode bonding pad is broken, and the root part of the second metal connecting part connected with the negative electrode bonding pad is broken.
6. An LED manufacturing process according to claim 1, wherein: the two sides of the material rack in the length direction correspond to the transverse material belt and are punched with a plurality of cutting grooves.
7. An LED manufacturing process according to claim 1, wherein: and the widths of the two ends of the transverse material belt are narrowed to form on-line extraction measurement anode and cathode disconnection points.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111023923.5A CN113707791B (en) | 2021-09-02 | 2021-09-02 | LED manufacturing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111023923.5A CN113707791B (en) | 2021-09-02 | 2021-09-02 | LED manufacturing process |
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| CN113707791A true CN113707791A (en) | 2021-11-26 |
| CN113707791B CN113707791B (en) | 2023-05-26 |
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Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201994337U (en) * | 2011-02-22 | 2011-09-28 | 广东德豪润达电气股份有限公司 | LED (Light Emitting Diode) packaging support structure and LED device |
| CN103594604A (en) * | 2013-10-30 | 2014-02-19 | 王定锋 | LED support with electrodes being fully wrapped and packaged, SMD LED lamp and manufacturing method thereof |
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| CN204289506U (en) * | 2014-09-02 | 2015-04-22 | 木林森股份有限公司 | Can the electrically-conductive backing plate of injection mo(u)lding LED support and high density LED support module |
| CN204289515U (en) * | 2014-12-05 | 2015-04-22 | 博罗承创精密工业有限公司 | LED support material-strap structure |
| CN106784251A (en) * | 2017-01-09 | 2017-05-31 | 宜昌惠科科技有限公司 | A kind of SMC plastic-packageds LED support structure |
| CN206558538U (en) * | 2017-02-17 | 2017-10-13 | 东莞市纳博科精密模具有限公司 | A kind of flat cup supporting structures of LED |
| CN111916435A (en) * | 2020-08-14 | 2020-11-10 | 盐城东山精密制造有限公司 | Flip LED packaging device and preparation method and application thereof |
| CN112151656A (en) * | 2020-09-10 | 2020-12-29 | 深圳市中顺半导体照明有限公司 | LED support machining method |
| CN112993125A (en) * | 2021-02-07 | 2021-06-18 | 盐城东山精密制造有限公司 | Processing technology for packaging large-angle LED bracket |
| CN213958947U (en) * | 2020-12-21 | 2021-08-13 | 山西高科华兴电子科技有限公司 | Do benefit to high density TOP structure LED frame of cutting |
-
2021
- 2021-09-02 CN CN202111023923.5A patent/CN113707791B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201994337U (en) * | 2011-02-22 | 2011-09-28 | 广东德豪润达电气股份有限公司 | LED (Light Emitting Diode) packaging support structure and LED device |
| CN103594604A (en) * | 2013-10-30 | 2014-02-19 | 王定锋 | LED support with electrodes being fully wrapped and packaged, SMD LED lamp and manufacturing method thereof |
| CN104201273A (en) * | 2014-09-02 | 2014-12-10 | 木林森股份有限公司 | Efficient LED (Light Emitting Diode) lamp bead manufacturing method, conductive substrate of LED supports allowing injection forming and high intensity LED support module |
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| CN204289515U (en) * | 2014-12-05 | 2015-04-22 | 博罗承创精密工业有限公司 | LED support material-strap structure |
| CN106784251A (en) * | 2017-01-09 | 2017-05-31 | 宜昌惠科科技有限公司 | A kind of SMC plastic-packageds LED support structure |
| CN206558538U (en) * | 2017-02-17 | 2017-10-13 | 东莞市纳博科精密模具有限公司 | A kind of flat cup supporting structures of LED |
| CN111916435A (en) * | 2020-08-14 | 2020-11-10 | 盐城东山精密制造有限公司 | Flip LED packaging device and preparation method and application thereof |
| CN112151656A (en) * | 2020-09-10 | 2020-12-29 | 深圳市中顺半导体照明有限公司 | LED support machining method |
| CN213958947U (en) * | 2020-12-21 | 2021-08-13 | 山西高科华兴电子科技有限公司 | Do benefit to high density TOP structure LED frame of cutting |
| CN112993125A (en) * | 2021-02-07 | 2021-06-18 | 盐城东山精密制造有限公司 | Processing technology for packaging large-angle LED bracket |
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| CN113707791B (en) | 2023-05-26 |
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