CN115440872A - RGB lamp bead with four welding feet and manufacturing method thereof - Google Patents
RGB lamp bead with four welding feet and manufacturing method thereof Download PDFInfo
- Publication number
- CN115440872A CN115440872A CN202110248602.9A CN202110248602A CN115440872A CN 115440872 A CN115440872 A CN 115440872A CN 202110248602 A CN202110248602 A CN 202110248602A CN 115440872 A CN115440872 A CN 115440872A
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- lamp bead
- feet
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- 239000011324 bead Substances 0.000 title claims abstract description 76
- 238000003466 welding Methods 0.000 title claims abstract description 57
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 239000002184 metal Substances 0.000 claims abstract description 85
- 229910052751 metal Inorganic materials 0.000 claims abstract description 85
- 238000004806 packaging method and process Methods 0.000 claims abstract description 21
- 239000011347 resin Substances 0.000 claims abstract description 10
- 229920005989 resin Polymers 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims abstract description 7
- 238000004021 metal welding Methods 0.000 claims description 40
- 239000003292 glue Substances 0.000 claims description 17
- 238000001514 detection method Methods 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 5
- 229910000679 solder Inorganic materials 0.000 description 12
- 239000011049 pearl Substances 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000004080 punching Methods 0.000 description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000009954 braiding Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/32—Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Abstract
The invention relates to an RGB lamp bead with four welding feet and a manufacturing method thereof, in particular to the RGB lamp bead which is manufactured by packaging three chips respectively emitting red light, green light and blue light in an LED bracket, wherein the bracket of the RGB lamp bead is an LED bracket formed by embedding metal in resin, 4 welding feet are arranged on 4 sides of the bottom surface of the RGB lamp bead bracket, the welding feet are exposed out of the side surface of the bracket, metal contacts are also extended from the side surface of the bracket and are used for testing and sorting the lamp beads, the LED bracket is packaged to manufacture the small-size RGB lamp bead with low cost, and the small-size RGB lamp bead is not easy to be connected with tin and is not easy to be subjected to false welding in the welding use process.
Description
Technical Field
The invention relates to the field of LED lamp beads and application thereof, in particular to an RGB lamp bead with four welding feet and a manufacturing method thereof.
Background
The lamp pearl of a plurality of feet of prior art, for example, 4 foot lamp pearls that RGB lamp pearl was used, 4 feet are respectively on two limits of lamp pearl, 2 feet on a limit, and the problem of existence is as follows:
(1) 2 foot on one side weld on the circuit board when using lamp pearl, lead to one of them leg rosin joint easily, lead to tin short circuit easily between two legs moreover, also easy tin short circuit when the leg maintenance after the leg rosin joint moreover.
(2) 2 feet that need to switch on every limit of lamp pearl, the rosin joint is few when guaranteeing the welding, the maintenance of being convenient for again, must bend into three-dimensional multiaspect leg, so, when the leg of the planar single face welding of making, the yield is very low during the welding, why will pursue and make flat leg woollen? The main reason is that when the flat welding foot is made, because no metal is bent and more metal is needed, the utilization rate of the material for manufacturing the lamp bead support is improved by more than 25%, the flat welding foot support is also thinner than the bent support by more than 40%, the total cost can be saved by 30%, and the support is thin, and when the lamp bead is packaged by the support, the packaging glue can be saved by 50%.
(3) 4 foot distribution is on two limits, and when RGB lamp pearl size done littleer, leg density is higher, changes the tin short circuit, leads to doing small-size lamp pearl more difficult.
In order to solve the problem which is not solved in the industry all the time, the RGB lamp bead can be made small, the cost is reduced, and a good using effect can be achieved, the invention adopts the following method to manufacture the RGB lamp bead with four welding feet at 4 sides, and the technology is overcome:
the specific method is that the RGB lamp bead is a lamp bead which is made by packaging three LED chips respectively emitting red light, green light and blue light in a support, the support is an LED support formed by embedding metal in resin, the bottom surface of the LED support is provided with a side, a is not less than 4 and not more than 8, the support is provided with b metal welding feet, b =4, the support is provided with c side surfaces, c is not less than 4 and not more than 8, the metal welding feet are exposed at the bottom surface, all the metal welding feet are exposed from the side surface of the support, the welding feet exposed from the side surface of the support are distributed at d sides of the bottom, d is not less than 4 and not more than a, e metal contacts are further extended from the side surface of the support, e is not less than 2 and not more than 4, on the support, a part of the metal contacts are connected with the metal welding feet to form conduction, or all the metal contacts are connected with the metal welding feet to form conduction, the support is a cup-shaped support, f metal electrodes are arranged in a cup, f is not less than 4 and not less than 8, wherein, a part of metal electrodes are connected with metal welding feet to form conduction, or all metal electrodes are connected with metal welding feet to form conduction, and the metal electrodes are at least connected with welding feet with exposed 4 side surfaces, the single support is spliced into a plurality of connected support frames, three chips with red light, green light and blue light are respectively fixed on the metal electrodes on the bottom surface of the support frames, after the wires are welded by a wire welding machine, each chip of the multiple chips is respectively connected with the electrodes on the support frames, packaging glue is applied in a support cup to seal the chips and the electrodes, the packaging glue is solidified by heating, the packaging glue is split into a plurality of RGB lamp beads by a splitting machine, then the RGB lamp beads are lightened on a light splitting machine for detection and separation, during the detection, the two side surfaces of the lamp beads are clamped by the detector, the electrodes of the clamping and detecting machine simultaneously touch the welding feet with exposed two side surfaces and the metal contacts with exposed two side surfaces, and (3) lighting the LEDs for detection and sorting, and making at least 4 welding feet exposed on the sides and chips to form conductive RGB lamp beads after sorting.
Disclosure of Invention
The invention relates to an RGB lamp bead with four welding feet and a manufacturing method thereof, in particular to the RGB lamp bead which is manufactured by packaging three chips respectively emitting red light, green light and blue light in an LED bracket, wherein the bracket of the RGB lamp bead is an LED bracket formed by embedding metal in resin, 4 welding feet are arranged on 4 sides of the bottom surface of the RGB lamp bead bracket, the welding feet are exposed out of the side surface of the bracket, metal contacts are also extended from the side surface of the bracket and are used for testing and sorting the lamp beads, the LED bracket is packaged to manufacture the small-size RGB lamp bead with low cost, and the small-size RGB lamp bead is not easy to be connected with tin and is not easy to be subjected to false welding in the welding use process.
The invention provides a method for manufacturing RGB lamp beads with four welding feet, in particular to a RGB lamp bead which is manufactured by packaging three LED chips respectively emitting red light, green light and blue light in a support, the support is an LED support formed by embedding metal in resin, the bottom surface of the LED support is provided with a side, a is more than or equal to 4 and less than or equal to 8, the support is provided with b metal welding feet, b =4, the support is provided with c side surfaces, c is more than or equal to 4 and less than or equal to 8, the metal welding feet are exposed at the bottom surface, all the metal welding feet are exposed from the side surfaces of the support, the welding feet exposed from the side surfaces of the support are distributed on d sides of the bottom, d is more than or equal to 4 and less than or equal to 4, e is more than or equal to 2 and less than or equal to 4, on the support, a part of the metal contacts are connected with the metal welding feet to form conduction, or all the metal contacts are connected with the metal welding feet to form conduction, the support is a cup-shaped support, f metal electrodes are arranged in a cup, f is more than or equal to 4 and less than or equal to 8, wherein, a part of metal electrodes are connected with metal welding feet to form conduction, or all metal electrodes are connected with metal welding feet to form conduction, and the metal electrodes are at least connected with welding feet with exposed 4 side surfaces, the single support is spliced into a plurality of connected support frames, three chips with red light, green light and blue light are respectively fixed on the metal electrodes on the bottom surface of the support frames, after the wires are welded by a wire welding machine, each chip of the multiple chips is respectively connected with the electrodes on the support frames, packaging glue is applied in a support cup to seal the chips and the electrodes, the packaging glue is solidified by heating, the packaging glue is split into a plurality of RGB lamp beads by a splitting machine, then the RGB lamp beads are lightened on a light splitting machine for detection and separation, during the detection, the two side surfaces of the lamp beads are clamped by the detector, the electrodes of the clamping and detecting machine simultaneously touch the welding feet with exposed two side surfaces and the metal contacts with exposed two side surfaces, and (3) lighting the LEDs for detection and sorting, and making at least 4 welding feet exposed on the sides and chips to form conductive RGB lamp beads after sorting.
The invention also provides an RGB lamp bead with four welding feet, which comprises: an LED support; three chips respectively emitting red light, green light and blue light; packaging glue; the LED lamp bead is characterized in that the RGB lamp bead is made by packaging three chips respectively emitting red light, green light and blue light in an LED bracket, the LED bracket is an LED bracket formed by embedding metal in resin, the bottom surface of the LED bracket is provided with a side, a is not less than 4 and not more than 8, the bracket is provided with b metal welding feet, b =4, the bracket is provided with c side surfaces, c is not less than 4 and not more than 8, the metal welding feet are exposed out of the bottom surface, all the metal welding feet are exposed out of the side surface of the bracket, the welding feet exposed out of the side surface of the bracket are distributed on d sides of the bottom, d is not less than 4 and not more than a, the side surface of the bracket is also extended with e metal contacts, e is not less than 2 and not more than 4, on the bracket, a part of the metal contacts are connected with the metal welding feet to form conduction, or all the metal contacts are connected with the metal welding feet to form conduction, the support is a cup-shaped support, f metal electrodes are arranged in the cup, f is more than or equal to 4 and less than or equal to 8, a part of the metal electrodes are connected with the metal welding feet to form conduction, or all the metal electrodes are connected with the metal welding feet to form conduction, the metal electrodes are at least communicated with the welding feet exposed from four side surfaces, three chips respectively emitting red light, green light and blue light are fixedly crystallized on the metal electrodes in the cup of the support, each chip of the three chips is respectively communicated with the metal electrodes on the support, packaging glue is bonded in the cup of the support and seals the chips and the metal electrodes, and the RGB lamp beads are at least provided with 4 welding feet exposed from the side surfaces to form conduction with the chips.
According to a preferred embodiment of the invention, the four-leg RGB lamp bead is characterized in that the leg is a three-dimensional leg-rolling leg, and the leg extends out of the side surface of the lamp bead and is rolled and stuck to the outer surface of the side surface and the bottom surface.
According to a preferred embodiment of the invention, the four-solder-leg RGB lamp bead is characterized in that the solder legs are planar solder legs exposed on the bottom surface.
According to a preferred embodiment of the invention, the four-leg RGB lamp bead is characterized in that the metal contact is only used for detecting contact conduction when the sorted lamp beads are inspected, and the metal contact for detection is not only conducted with the lamp bead leg but also conducted with the chip.
According to a preferred embodiment of the invention, the RGB lamp bead with four solder feet is characterized in that the metal contacts are arranged on two opposite side surfaces of the lamp bead to be exposed, two side surfaces with the metal contacts are provided, each side surface is provided with the metal contact and the solder foot, and the metal contacts and the solder feet on the two side surfaces are used for detecting the lamp bead simultaneously when the lamp bead is detected.
According to a preferred embodiment of the invention, the RGB lamp bead with four solder feet is characterized in that the metal contact is arranged on one side surface of the lamp bead and is exposed outwards, the side surface with the metal contact is provided with both the metal contact and the solder foot, or only the metal contact is provided, and the metal contact and the solder foot on two opposite side surfaces are used for detecting the lamp bead simultaneously when the lamp bead is detected.
The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.
Drawings
The features, objects, and advantages of the present invention will become more apparent from the description set forth below when taken in conjunction with the drawings, a brief description of which follows.
FIG. 1 is a schematic circuit plan view of a cup shaped holder with solder tails on four sides.
FIG. 2 is a top plan view of a cup shaped holder with fillets on four sides.
FIG. 3 is a bottom plan view of a cup shaped holder with fillets on four sides.
FIG. 4 is a cross-sectional view of a cup shaped holder with fillets on four sides.
Fig. 5 is a plan view of a plurality of holder cups of a cup holder having fillets on four sides.
FIG. 6 is a top view of a plurality of frame cups of a cup-shaped frame with fillets on four sides for die bonding wires.
Fig. 7 is a schematic cross-sectional view of an RGB lamp bead with four solder fillets.
Fig. 8 is a schematic top view of an RGB lamp bead with four solder fillets.
Detailed Description
The present invention will be described in detail below by taking preferred embodiments as examples.
It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.
Example one
1. Manufacture of die-cutting die
A2835 LED support containing 4 welding feet and a cuboid support with the width of 2.8mmx3.5mm are designed and manufactured, wherein two sides with the width of 2.8mm are respectively provided with one welding foot 1.1 and 1 metal contact 1.2, the other two sides are respectively provided with 1 welding foot 1.1, and the total number of the 4 welding feet 1.1 and 1 metal contact 1.2.
2. Punching support circuit prototype
Preparing a 0.20mm copper strip, punching the 0.20mm copper strip 1.1 into a support circuit prototype on a punch press by using a punching die, and electroplating silver on the support circuit prototype to plate a layer of silver on the surface of the copper strip.
3. Preparation of PPA resin
PPA resin 2.1 is injected on the copper strip by an injection mould on an injection molding machine to form a plurality of bracket cups, and the copper prototype circuit is embedded in the PPA resin.
4. Punching support
A connecting piece support containing a plurality of LED supports is manufactured by die cutting, each support is provided with 4 welding feet 1.1, two sides of 2 testing metal contacts 1.2,2.8mm are respectively provided with one welding foot 1.1, and two sides of 1 testing metal contact 1.2,3.5mm are respectively provided with 1 welding foot 1.1. The cup-shaped support with the four sides provided with the welding feet is manufactured by arranging 2 metal contacts in the support cup, and respectively connecting and communicating the metal contacts with the 2 welding feet at the outer bottom of the support cup, and connecting and communicating the metal contacts with the metal welding feet in the cup (shown in figures 1, 2,3, 4 and 5).
5. Encapsulation RGB lamp pearl
(1) And solidifying the crystal
Fixing red, green and blue chips 3.1 on three electrodes in the cup by a crystal fixing machine, fixing a red chip on one electrode in the cup by silver glue, fixing blue and green chips on the other two electrodes by crystal fixing glue, and baking to solidify the glue.
(2) And a bonding wire
The positive and negative electrodes of the three chips are respectively welded and connected to the metal electrode of the cup bottom by alloy wires 4.1 by a wire bonding machine (shown in figure 6).
(3) Dispensing glue
And (5) dispensing the packaging glue 5.1 by using a dispenser in the cup, and baking to solidify the packaging glue.
(4) Stripping the materials
The RGB lamp beads with four welding feet are manufactured by splitting the single RGB lamp beads on a splitting machine by using a mould (shown in figures 7 and 8).
(5) Spectroscopic detection
On 2835 RGB's clamp survey beam-splitting machine, through 2 metal contact and 2 fillets of pressing from both sides two limits of survey, these 2 metal contact have communicated 2 fillets on two limits of 3.5mm respectively, have also communicated the electrode of chip, press from both sides to survey to divide and select RGB lamp pearl of a plurality of categories to divide and to divide a plurality of boxes in, clear away the defective products simultaneously.
(6) And a package
And (4) weaving the RGB lamp beads on a packaging tape by using a braiding machine.
The invention has been described in detail with reference to the drawings for describing a specific embodiment of an RGB lamp bead with four solder tails and a method for manufacturing the same. It will be understood by those skilled in the art, however, that the foregoing descriptions are merely illustrative of and descriptive of certain embodiments and that the invention, including the claims, is not to be in any way limiting.
Claims (7)
1. A method for manufacturing RGB lamp beads with four welding feet includes using three LED chips with red light, green light and blue light to be packaged in a support to form a lamp bead, embedding metal in resin to form an LED support, setting a sides at bottom of LED support, setting b metal welding feet on support, setting c side faces 4 not more than 8, exposing metal welding feet on bottom, setting all metal welding feet on support side faces, setting d side faces 4 not more than a, extending e metal contacts 2 not more than 4 on support, connecting part of metal contacts with metal welding feet to form conduction or connecting all metal contacts with metal welding feet, setting support as cup-shaped support, setting f metal electrodes 4 not more than 8, connecting part of metal electrodes with metal welding feet to form conduction or connecting all metal welding feet with metal welding feet, exposing metal welding feet to form conduction on metal welding feet, setting multiple metal welding feet on support, heating and connecting chip on said support, forming multiple detection chip by using green light detection machine, heating and packaging chip, forming multiple detection chip by using green light detection machine, detecting chip, and detecting chip by using green light, and multiple detection machine, and (3) lighting the LEDs for detection and sorting, and making at least 4 welding feet exposed on the sides and chips to form conductive RGB lamp beads after sorting.
2. The utility model provides a RGB lamp pearl of four fillets, includes:
an LED support;
three chips respectively emitting red light, green light and blue light;
packaging glue;
the LED lamp bead is characterized in that the RGB lamp bead is manufactured by packaging three chips respectively emitting red light, green light and blue light in an LED support, the LED support is an LED support formed by embedding metal in resin, a sides are arranged on the bottom surface of the LED support, a is not less than 4 and not more than 8, b metal welding feet are arranged on the support, b =4, c side surfaces are arranged on the support, c is not less than 4 and not more than 8, the metal welding feet are exposed out of the bottom surface, all the metal welding feet are exposed out of the side surface of the support, the welding feet exposed out of the side surface of the support are distributed on d sides of the bottom, d is not less than 4 and not more than a, e metal contacts are further extended from the side surface of the support, e is not less than 2 and not more than 4, on the support, a part of the metal contacts are connected with the metal welding feet to form conduction, or all the metal contacts are connected with the metal welding feet to form conduction, the support is a cup-shaped support, f metal electrodes are arranged in the cup, f is more than or equal to 4 and less than or equal to 8, a part of the metal electrodes are connected with the metal welding feet to form conduction, or all the metal electrodes are connected with the metal welding feet to form conduction, the metal electrodes are at least communicated with the welding feet exposed from four side surfaces, three chips respectively emitting red light, green light and blue light are fixedly crystallized on the metal electrodes in the cup of the support, each chip of the three chips is respectively communicated with the metal electrodes on the support, packaging glue is bonded in the cup of the support and seals the chips and the metal electrodes, and the RGB lamp beads are at least provided with 4 welding feet exposed from the side surfaces to form conduction with the chips.
3. The RGB bead with four fillets according to claim 1 or 2, wherein said fillets are three-dimensional roll fillets, said fillets extending from the side of said bead and being rolled over the outer surface of the side and bottom surfaces.
4. The RGB lamp bead with four welding feet as claimed in claim 1 or 2, wherein the welding feet are plane welding feet exposed on the bottom surface.
5. The RGB lamp bead with four welding feet as claimed in claim 1 or 2, wherein the metal contact is only used for detecting contact conduction when the sorted lamp bead is inspected, and the metal contact for detection is conducted with the welding feet of the lamp bead and the chip.
6. The RGB lamp bead with four weld legs as claimed in claim 1 or 2, wherein the metal contacts are disposed on two opposite sides of the lamp bead to be exposed, two sides with metal contacts are provided, each side is provided with metal contacts and weld legs, and the metal contacts and the weld legs on the two sides are used simultaneously to detect the lamp bead.
7. The RGB lamp bead with four welding feet as claimed in claim 1 or 2, wherein the metal contact is arranged on one side of the lamp bead and exposed outwards, the side with the metal contact is provided with both the metal contact and the welding feet, or only the metal contact is provided, and the metal contact and the welding feet on two opposite sides are used for detecting the lamp bead simultaneously.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202110248602.9A CN115440872A (en) | 2021-02-27 | 2021-02-27 | RGB lamp bead with four welding feet and manufacturing method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202110248602.9A CN115440872A (en) | 2021-02-27 | 2021-02-27 | RGB lamp bead with four welding feet and manufacturing method thereof |
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Publication Number | Publication Date |
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CN115440872A true CN115440872A (en) | 2022-12-06 |
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CN202110248602.9A Pending CN115440872A (en) | 2021-02-27 | 2021-02-27 | RGB lamp bead with four welding feet and manufacturing method thereof |
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- 2021-02-27 CN CN202110248602.9A patent/CN115440872A/en active Pending
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