CN115440716A - Circuit board module manufactured by RGB lamp beads with weld legs on multiple sides and manufacturing method thereof - Google Patents
Circuit board module manufactured by RGB lamp beads with weld legs on multiple sides and manufacturing method thereof Download PDFInfo
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- CN115440716A CN115440716A CN202110248379.8A CN202110248379A CN115440716A CN 115440716 A CN115440716 A CN 115440716A CN 202110248379 A CN202110248379 A CN 202110248379A CN 115440716 A CN115440716 A CN 115440716A
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- 238000003466 welding Methods 0.000 claims abstract description 44
- 238000004806 packaging method and process Methods 0.000 claims abstract description 19
- 239000011347 resin Substances 0.000 claims abstract description 12
- 229920005989 resin Polymers 0.000 claims abstract description 12
- 238000004021 metal welding Methods 0.000 claims description 38
- 229910000679 solder Inorganic materials 0.000 claims description 31
- 239000003292 glue Substances 0.000 claims description 15
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 6
- 238000001514 detection method Methods 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 1
- 238000012360 testing method Methods 0.000 abstract description 5
- 239000011049 pearl Substances 0.000 description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000004080 punching Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
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- Led Device Packages (AREA)
Abstract
The invention relates to a circuit board module manufactured by RGB lamp beads with weld legs on multiple sides and a manufacturing method thereof, in particular to a circuit board module manufactured by welding RGB lamp beads on a circuit board, wherein the RGB lamp beads are manufactured by packaging three chips respectively emitting red light, green light and blue light in a support, the support of the lamp beads is an LED support formed by embedding metal in resin, 4 weld legs are arranged on 4 sides of the bottom of the support of the RGB lamp beads, the weld legs are exposed out of the side surface of the support, metal contacts are also extended from the side surface of the support and used for testing and sorting the lamp beads, low-cost RGB small lamp beads can be manufactured by using the support, and the circuit board module manufactured by using the RGB small lamp beads is a low-cost circuit board module.
Description
Technical Field
The invention relates to the field of LEDs and application thereof, in particular to a circuit board module manufactured by RGB lamp beads with welding legs on multiple sides and a manufacturing method thereof.
Background
The circuit board module of prior art preparation, what adopted is that the leg all distributes and forms in the preparation of the LED lamp pearl of two sides, for example, 4 foot lamp pearls that RGB lamp pearl was used, 4 feet are respectively on two limits of lamp pearl, 2 feet on a limit, and the problem of existence is as follows:
(1) one side 2 feet weld on the circuit board when using lamp pearl, lead to one of them leg rosin joint easily, even tin short circuit easily between two legs moreover, also tin short circuit easily when the back leg maintenance is welded to the leg rosin joint moreover.
(2) The foot that 2 every limit of lamp pearl need switch on, the rosin joint is few when guaranteeing the welding, the maintenance of being convenient for again, must bend into three-dimensional multiaspect leg, so, when the leg of planar single face welding, the yield is very low during the welding, why will pursue and do flat leg worsted? The main reason is that when the flat welding foot is made, because no metal is bent and more metal is needed, the utilization rate of the material for manufacturing the lamp bead support is improved by more than 25%, the flat welding foot support is also thinner than the bent support by more than 40%, the total cost can be saved by 30%, and the support is thin, and when the lamp bead is packaged by the support, the packaging glue can be saved by 50%.
(3) 4 foot distribute on two limits, do littleer when RGB lamp pearl size, leg density is higher, changes the tin short circuit, leads to doing small-size lamp pearl more difficult, leads to making for the circuit board module big size lamp pearl cost can not fall again.
(4) RGB lamp pearl size can not be done for a short time, and supporting circuit board also can not be done for a short time, leads to the cost of preparation circuit board module to also not fall.
(5) 4 when traditional lamp pearl preparation module on 2 limits, because every limit has 2 weld beads, the easy even tin short circuit of even, so adopt the very precious paster equipment subsides LED investment of high accuracy during SMT big, the return on investment rate is low, with 4 weld bead designs behind 4 limits, with the paster equipment that the precision is low, the equipment that pastes simultaneously is got to many lamp pearls just can reach the requirement.
In order to solve the problem which is not solved in the industry all the time, the LED lamp beads can be made small, the circuit board can be made narrow, the cost of a circuit board module is reduced, and a good using effect can be achieved, the circuit board module which is manufactured by the RGB lamp beads with the 4 sides provided with the welding feet is manufactured by the following method, and the technology is overcome:
the specific method is that the circuit board module is made by welding RGB lamp beads or RGB lamp beads and a control element on a circuit board, the RGB lamp beads are made by packaging three chips respectively emitting red light, green light and blue light in an LED bracket, the bracket of the RGB lamp beads is an LED bracket formed by embedding metal in resin, the bottom of the LED bracket is provided with a side, a is more than or equal to 4 and less than or equal to 8, the bracket is provided with b metal welding feet, b =4, the bracket is provided with c side faces, c is more than or equal to 4 and less than or equal to 8, the metal welding feet are exposed at the bottom face, all the metal welding feet are exposed from the side faces of the bracket, the welding feet exposed from the side faces of the bracket are distributed on d sides of the bottom, d is more than or equal to 4 and less than or equal to 4, e metal contacts extend from the side faces of the bracket, e is more than or equal to 2 and less than or equal to 4, on the bracket, a part of the metal contacts are connected with the metal welding feet to form conduction, or all the metal contacts are connected with the metal welding feet to form conduction, the support is a cup-shaped support, f metal electrodes are arranged in the cup, f is more than or equal to 4 and less than or equal to 8, a part of the metal electrodes are connected with metal welding feet to form conduction, or all the metal electrodes are connected with the metal welding feet to form conduction, the metal electrodes are at least connected with the welding feet arranged on 4 sides, the support is designed into a connecting piece support of a plurality of supports, three chips which respectively emit red light, green light and blue light are respectively and fixedly crystallized on the metal electrodes in the support cup, after wire welding is carried out by a wire welding machine, each chip of a plurality of chips is respectively communicated with the electrodes on the support, packaging glue is applied to the support cup to seal the chips and the electrodes, the packaging glue is heated to be solidified, the packaging glue is split into a plurality of RGB lamp beads by the splitting machine, then the RGB lamp beads are lightened on a light-splitting machine for detection and sorting, when in detection, the detector clamps two sides of the lamp beads, a plurality of electrodes of the clamp testing machine touch the exposed welding feet on the two side surfaces and the exposed metal contacts on the two side surfaces simultaneously, so that RGB lamp beads are lightened to detect and sort, the RGB lamp beads with the welding feet on a plurality of sides are manufactured after sorting, three chips of the manufactured RGB lamp beads and the exposed welding feet on the 4 side surfaces form conduction, and the lamp beads or the lamp beads and the control element are welded on a circuit board by the SMT machine, and the RGB lamp beads are manufactured into an RGB circuit board module.
Disclosure of Invention
The invention relates to a circuit board module manufactured by RGB lamp beads with weld legs on multiple sides and a manufacturing method thereof, in particular to a circuit board module manufactured by welding the RGB lamp beads on a circuit board, wherein the RGB lamp beads are formed by packaging three chips respectively emitting red light, green light and blue light in a support, the support of the lamp beads is an LED support formed by embedding metal in resin, 4 weld legs are arranged on 4 sides of the bottom of the support of the RGB lamp beads, are exposed out of the side surface of the support, and metal contacts are extended from the side surface of the support and used for lamp bead test and sorting.
The invention provides a method for manufacturing a circuit board module manufactured by RGB lamp beads with welding feet on multiple sides, and particularly relates to a circuit board module manufactured by RGB lamp beads or RGB lamp beads and a control element welded on a circuit board, wherein the RGB lamp beads are manufactured by packaging three chips respectively emitting red light, green light and blue light in an LED bracket, the bracket of the RGB lamp beads is an LED bracket formed by embedding metal in resin, the bottom of the LED bracket is provided with a side, a is not less than 4 and not more than 8, the bracket is provided with b metal welding feet, b =4, the bracket is provided with c side faces, c is not less than 4 and not more than 8, the metal welding feet are exposed at the bottom, all the metal welding feet are exposed from the side faces of the bracket, the welding feet exposed from the side faces of the bracket are distributed on d sides of the bottom, d is not less than 4 and not more than a, the side faces of the bracket are also provided with e metal contacts, e is not less than 2 and not more than 4, and on the bracket, wherein a part of the metal contacts are connected with the metal welding feet to form conduction, or all the metal contacts are connected with the metal welding feet to form conduction, the support is a cup-shaped support, f metal electrodes are arranged in the cup, f is more than or equal to 4 and less than or equal to 8, a part of the metal electrodes are connected with the metal welding feet to form conduction, or all the metal electrodes are connected with the metal welding feet to form conduction, and the metal electrodes are at least connected with the welding feet arranged on 4 sides, the support is designed and manufactured into a connecting piece support of a plurality of supports, three chips which respectively emit red light, green light and blue light are respectively and fixedly crystallized on the metal electrodes in the cup of the support, after wire welding is carried out by a wire welding machine, each chip of a plurality of chips is respectively and electrically connected with the electrodes on the support, packaging glue is applied in the cup of the support to seal the chips and the electrodes, the packaging glue is solidified by heating, and is split into a plurality of RGB lamp beads by a splitting machine, then light on the beam-splitting machine and detect the separation, during the detection, two sides that the detector pressed from both sides survey the lamp pearl, press from both sides a plurality of electrodes of surveying the machine and touch the leg that these two sides expose simultaneously and the metal contact that these two sides expose, make RGB lamp pearl light and detect the separation, make a plurality of limits after the separation all have the RGB lamp pearl of leg, three kinds of chips of the RGB lamp pearl of making and the leg that 4 sides expose form to switch on, will the lamp pearl perhaps on lamp pearl and the circuit board is welded to SMT machine for the control element, RGB circuit board module is made to the RGB lamp pearl.
The invention also provides a circuit board module manufactured by RGB lamp beads with welding feet on multiple sides, which comprises: RGB lamp beads or RGB lamp beads, control elements and a circuit board, which is characterized in that a circuit board module is composed of the RGB lamp beads or RGB lamp beads, the control elements and the circuit board, the RGB lamp beads are made by packaging three chips respectively emitting red light, green light and blue light by an LED support, the LED support is an LED support formed by embedding metal in resin, the bottom of the LED support is provided with a side, a is more than or equal to 4 and less than or equal to 8, the support is provided with b metal welding feet, b =4, the support is provided with c side faces, c is more than or equal to 4 and less than or equal to 8, the metal welding feet are exposed at the bottom face, all the metal welding feet are exposed from the side faces of the support, the welding feet exposed from the side faces of the support are distributed on d sides of the bottom, d is more than or equal to 4 and less than or equal to a, e metal contacts extend from the side faces of the support, e is more than or equal to 2 and less than or equal to 4, and on the support, a part of the metal contacts are connected with the metal welding feet to form conduction, or all the metal contacts are connected with the metal welding feet to form conduction, the support is a cup-shaped support, f metal electrodes are arranged in the cup, f is more than or equal to 4 and less than or equal to 8, a part of the metal electrodes are connected with the metal welding feet to form conduction, or all the metal electrodes are connected with the metal welding feet to form conduction, three chips respectively emitting red light, green light and blue light are fixedly crystallized on the metal electrodes in the support cup, each chip respectively emitting red light, green light and blue light is respectively connected with the metal electrodes on the support cup, the packaging glue is bonded in the support cup and seals the chips and the metal electrodes, the three chips of RGB lamp beads are connected with the welding feet exposed from 4 side surfaces, the RGB lamp beads or the RGB lamp beads and the control element are welded on the circuit board, and the welding feet of the RGB lamp beads on the module are completely or partially covered by tin.
According to a preferred embodiment of the invention, the circuit board module manufactured by the RGB lamp beads with the solder legs on all sides is characterized in that the solder legs are three-dimensional roll leg solder legs, and the solder legs extend out of the side surfaces of the lamp beads and are rolled and pasted on the outer surfaces of the side surfaces and the bottom surface.
According to a preferred embodiment of the present invention, the circuit board module manufactured by RGB lamp beads having solder legs on multiple sides is characterized in that the solder legs are planar solder legs exposed at the bottom.
According to a preferred embodiment of the present invention, the circuit board module manufactured by RGB lamp beads having solder fillets on multiple sides is characterized in that the metal contact is only used for detecting contact conduction when the sorted lamp beads are inspected, and the metal contact for detection is not only conducted with the solder fillets of the lamp beads, but also conducted with the chip.
According to a preferred embodiment of the present invention, the circuit board module manufactured by RGB lamp beads having solder fillets on multiple sides is characterized in that the metal contacts are disposed on two opposite side surfaces of the lamp bead and exposed, the two side surfaces have the metal contacts, each surface has the metal contact and the solder fillet, and the metal contacts and the solder fillets on the two side surfaces are used for detecting the lamp bead simultaneously.
According to a preferred embodiment of the present invention, the circuit board module manufactured by RGB lamp beads having solder fillets on multiple sides is characterized in that the metal contact is disposed on one side surface of the lamp bead and exposed outwards, the side surface having the metal contact has both the metal contact and the solder fillet, or only the metal contact, and the metal contact and the solder fillet on two opposite side surfaces are used for detecting the lamp bead.
According to a preferred embodiment of the present invention, the circuit board module manufactured by RGB lamp beads having solder tails on multiple sides is characterized in that a red chip of the RGB lamp beads is fixed on a metal electrode by conductive silver paste, and two types of blue and green chips are fixed on the metal electrode by insulating glue.
According to a preferred embodiment of the present invention, the circuit board module manufactured by RGB lamp beads having solder legs on multiple sides is characterized in that the circuit board is a rigid-flex circuit board, and the rigid-flex circuit board is formed by arranging a rigid-flex circuit board adhered with a hard resin at a local position on the circuit board.
The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.
Drawings
The features, objects, and advantages of the present invention will become more apparent from the description set forth below when taken in conjunction with the drawings, a brief description of which follows.
FIG. 1 is a schematic circuit plan view of a cup shaped holder with solder tails on four sides.
Fig. 2 is a top plan view of a cup shaped holder with fillets on four sides.
FIG. 3 is a bottom plan view of a cup shaped holder with fillets on four sides.
FIG. 4 is a cross-sectional view of a cup shaped holder with fillets on four sides.
Fig. 5 is a plan view of a plurality of holder cups of a cup holder having fillets on four sides.
FIG. 6 is a top view of a plurality of frame cups of a cup-shaped frame with fillets on four sides for die bonding wires.
FIG. 7 is a schematic cross-sectional view of an RGB lamp bead with four sides provided with solder fillets.
Fig. 8 is a schematic top view of an RGB lamp bead with four sides provided with solder fillets.
Fig. 9 is a schematic plan view of a connected circuit board module made of RGB lamp beads.
Fig. 10 is a schematic plan view of a circuit board module made of RGB lamp beads.
Detailed Description
The present invention will be described in detail below by taking preferred embodiments as examples.
It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.
Example one
1. Manufacture of die-cutting die
A2835 LED support containing 4 weld legs and a cuboid support with the size of 2.8mx3.5mm are designed and manufactured, wherein two sides with the width of 2.8mm are respectively provided with one weld leg 1.1 and 1 metal contact 1.2, the other two sides are respectively provided with 1 weld leg 1.1, and the total number of the weld legs is 4, namely 1.1, and 1 metal contact 1.2.
2. Punching support circuit prototype
Preparing a 0.20mm copper strip, punching the 0.20mm copper strip 1.1 into a support circuit prototype on a punch press by using a punching die, and electroplating silver on the support circuit prototype to plate a layer of silver on the surface of the copper strip.
3. Production of PPA resin
PPA resin 2.1 is injected on the copper strip by an injection mould on an injection molding machine to form a plurality of bracket cups, and the copper prototype circuit is embedded in the PPA resin.
4. Punching support
A connecting piece support containing a plurality of LED supports is manufactured by die cutting, each support is provided with 4 welding feet 1.1, two sides of 2 testing metal contacts 1.2,2.8mm are respectively provided with one welding foot 1.1, and two sides of 1 testing metal contact 1.2,3.5mm are respectively provided with 1 welding foot 1.1. The cup-shaped support with the four sides provided with the welding feet is manufactured by arranging 2 metal contacts in the support cup, and respectively connecting and communicating the metal contacts with the 2 welding feet at the outer bottom of the support cup, and connecting and communicating the metal contacts with the metal welding feet in the cup (shown in figures 1, 2,3, 4 and 5).
5. Encapsulation RGB lamp pearl
(1) And solidifying the crystal
Fixing red, green and blue chips 3.1 on three electrodes in the cup by a crystal fixing machine, fixing the red chip on one electrode at the bottom of the cup by silver glue, fixing the blue and green chips on the other two electrodes by crystal fixing glue, and baking to solidify the glue.
(2) And a bonding wire
The positive and negative electrodes of the three chips were connected to the metal electrodes of the cup bottom by welding with alloy wires 4.1, respectively, by a wire bonder (shown in fig. 6).
(3) Dispensing glue
And (5) dispensing the packaging glue 5.1 by using a dispenser in the cup, and baking to solidify the packaging glue.
(4) Stripping the materials
The single RGB lamp beads are split by a mold on a splitting machine to form RGB lamp beads with welding feet arranged on four sides (shown in figures 7 and 8).
(5) Spectroscopic detection
On 2835 RGB's clamp survey spectrophotometer, through pressing from both sides 2 metal contact and 2 fillets of surveying two limits, these 2 metal contact have communicated 2 fillets on two limits of 3.5mm respectively, have also communicated the electrode of chip, press from both sides to survey to select out RGB lamp pearl of a plurality of categories and divide and arrive a plurality of boxes in, clear away the defective products simultaneously and make RGB lamp pearl 7.1.
(6) And a package
The RGB lamp beads 7.1 are woven on a packaging tape by a braider.
6. Manufacturing method of circuit board module
(1) Solder paste
The prepared flexible circuit board 6.1 is placed on a printing machine, and then a special steel mesh is used for printing solder paste on the soldering position of the circuit board.
(2) Paster
And (3) pasting the RGB lamp beads 7.1 packaged on the packaging tape to a circuit board printed with solder paste by using an easy-to-pass chip mounter to form the circuit board with the lamp beads.
(3) Reflow soldering
And (3) placing the circuit board with the lamp beads in a debugged reflow soldering machine, after reflow soldering, welding the lamp beads on the circuit board, and cutting into single strips to manufacture the circuit board module made of the RGB lamp beads (as shown in figures 9 and 10).
The present invention is described in detail with reference to the accompanying drawings by using a specific embodiment of a circuit board module manufactured by RGB lamp beads having solder fillets on multiple sides and a manufacturing method thereof. It will be understood by those skilled in the art, however, that the foregoing is merely illustrative and descriptive of some specific embodiments and is not to be construed as limiting the scope of the invention, especially the scope of the claims.
Claims (9)
1. A circuit board module made of RGB lamp beads with welding feet on multiple sides is prepared as welding RGB lamp beads or RGB lamp beads and control element on circuit board, using three chips to be packaged in LED support to form RGB lamp beads, forming LED support by embedding metal in resin, setting a side at bottom of LED support, setting a side at 4-8, setting b metal welding feet on support, b =4, setting c side on support, c is 4-8, exposing metal welding feet on bottom surface, exposing all metal welding feet from side of support, distributing welding feet exposed from side of support on d sides at bottom, d is 4-d, extending e metal contacts on side of support, 2-e is 4, connecting all metal contacts with metal welding feet to form conduction, connecting metal contact with metal welding feet to form conduction, connecting metal welding feet with metal cup-shaped support, setting f metal electrodes in cup, 4-8, connecting metal contact with metal welding feet to metal welding feet and forming multiple metal welding feet separately, forming multiple welding feet, heating and sealing chip, forming multiple welding feet by using light-emitting machine, separating chip and packaging chip, forming multiple light-emitting chip, and separating chip, when detecting, two sides that detect the machine and press from both sides and survey the lamp pearl press from both sides a plurality of electrodes that survey the machine and touch the leg that these two sides expose and the metal contact that these two sides expose simultaneously, make RGB lamp pearl light and detect and select separately, make the RGB lamp pearl that a plurality of limits all had the leg after selecting separately, three kinds of chips of the RGB lamp pearl of making and the leg that 4 sides expose form and switch on, will the lamp pearl perhaps on lamp pearl and control element weld the circuit board with SMT machine, RGB circuit board module is made to the RGB lamp pearl.
2. The utility model provides a circuit board module of RGB lamp pearl preparation that multilateral all has leg, includes:
RGB lamp beads or RGB lamp beads and control elements;
a circuit board;
the LED lamp is characterized in that the circuit board module is composed of RGB lamp beads or RGB lamp beads, a control element and a circuit board, the RGB lamp beads are manufactured by packaging three chips respectively emitting red light, green light and blue light by using an LED support, the LED support is an LED support formed by embedding metal in resin, the bottom of the LED support is provided with a side, a is more than or equal to 4 and less than or equal to 8, the support is provided with b metal welding feet, b =4, the support is provided with c side faces, c is more than or equal to 4 and less than or equal to 8, the metal welding feet are exposed out of the bottom face, all the metal welding feet are exposed out of the side faces of the support, the welding feet exposed out of the side faces of the support are distributed on d sides of the bottom, d is more than or equal to 4 and less than or equal to 4, e is more than or equal to 2 and less than or equal to 4, on the support, a part of the metal contacts are connected with the metal welding feet to form conduction, or all the metal contacts are connected with the metal welding feet to form conduction, the support is a cup-shaped support, f metal electrodes are arranged in the cup, f is more than or equal to 4 and less than or equal to 8, a part of the metal electrodes are connected with metal welding feet to form conduction, or all the metal electrodes are connected with the metal welding feet to form conduction, three chips which respectively emit red light, green light and blue light are fixedly crystallized on the metal electrodes in the cup of the support, each chip of the three chips which respectively emit the red light, the green light and the blue light is respectively connected with the metal electrodes on the support, packaging glue is bonded in the cup of the support and seals the chips and the metal electrodes, the three chips of RGB lamp beads and the welding feet exposed on 4 side surfaces are connected, the RGB lamp beads or the RGB lamp beads and the control element are welded on a circuit board, and the welding feet of the RGB lamp beads on the module are completely or partially covered by tin.
3. The circuit board module made of RGB lamp beads with weld legs on multiple sides as claimed in claim 1 or 2, wherein the weld legs are three-dimensional roll leg weld legs which extend out from the side surfaces of the lamp beads and are rolled and pasted on the outer surfaces of the side surfaces and the bottom surface.
4. The circuit board module made of RGB lamp beads with solder legs on multiple sides as claimed in claim 1 or 2, wherein the solder legs are planar solder legs exposed at the bottom.
5. The circuit board module as claimed in claim 1 or 2, wherein the metal contact is only used for detecting contact conduction when the sorted lamp beads are inspected, and the metal contact for detection is conducted with the lamp bead welding feet and the chip.
6. The circuit board module as claimed in claim 1 or 2, wherein the metal contacts are disposed on two opposite sides of the lamp bead and exposed, and each side has two metal contacts and a solder leg, and the two metal contacts and the solder legs are used for detecting the lamp bead.
7. The PCB module of claim 1 or 2, wherein the metal contact is disposed on one side of the lamp bead and exposed, and the side with the metal contact has both the metal contact and the solder bead, or only the metal contact, and the lamp bead is inspected by using the metal contact and the solder bead on two opposite sides.
8. The circuit board module of claim 1 or 2, wherein the red chip of the RGB bead is fixed to the metal electrode by conductive silver paste, and the blue and green chips are fixed to the metal electrode by insulating paste.
9. The circuit board module made of RGB lamp beads with weld legs on multiple sides according to claim 1 or 2, wherein the circuit board is a rigid-flexible circuit board, and the rigid-flexible circuit board is formed by arranging a rigid-flexible circuit board adhered with hard resin at a local position on the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110248379.8A CN115440716A (en) | 2021-02-27 | 2021-02-27 | Circuit board module manufactured by RGB lamp beads with weld legs on multiple sides and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110248379.8A CN115440716A (en) | 2021-02-27 | 2021-02-27 | Circuit board module manufactured by RGB lamp beads with weld legs on multiple sides and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115440716A true CN115440716A (en) | 2022-12-06 |
Family
ID=84239953
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110248379.8A Pending CN115440716A (en) | 2021-02-27 | 2021-02-27 | Circuit board module manufactured by RGB lamp beads with weld legs on multiple sides and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115440716A (en) |
-
2021
- 2021-02-27 CN CN202110248379.8A patent/CN115440716A/en active Pending
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