CN114373855A - Lamp strip made of LED lamp beads and manufacturing method thereof - Google Patents
Lamp strip made of LED lamp beads and manufacturing method thereof Download PDFInfo
- Publication number
- CN114373855A CN114373855A CN202011128278.9A CN202011128278A CN114373855A CN 114373855 A CN114373855 A CN 114373855A CN 202011128278 A CN202011128278 A CN 202011128278A CN 114373855 A CN114373855 A CN 114373855A
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- lamp beads
- metal
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- 239000011324 bead Substances 0.000 title claims abstract description 87
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 238000003466 welding Methods 0.000 claims abstract description 40
- 239000002184 metal Substances 0.000 claims abstract description 33
- 229910052751 metal Inorganic materials 0.000 claims abstract description 33
- 239000011347 resin Substances 0.000 claims abstract description 11
- 229920005989 resin Polymers 0.000 claims abstract description 11
- 229910000679 solder Inorganic materials 0.000 claims description 21
- 238000004021 metal welding Methods 0.000 claims description 19
- 238000004806 packaging method and process Methods 0.000 claims description 18
- 239000003292 glue Substances 0.000 claims description 12
- 238000001514 detection method Methods 0.000 claims description 8
- 238000002360 preparation method Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000011049 pearl Substances 0.000 description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
- F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
- F21S4/24—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of ribbon or tape form, e.g. LED tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to a lamp strip made of LED lamp beads and a manufacturing method thereof, in particular to a lamp strip made of LED lamp beads welded on a flexible circuit board, wherein the LED lamp beads are made of a plurality of chips packaged in a support, the support of the lamp beads is an LED support formed by embedding metal in resin, at least three sides of the bottom of the support of the LED lamp beads are provided with a plurality of welding feet, and the total number of the welding feet on the support is b: b is more than or equal to 4 and less than or equal to 16, the welding leg is exposed from the side surface of the support, the support can be used for manufacturing low-cost LED small lamp beads, and the lamp strip manufactured by the LED small lamp beads is the low-cost lamp strip.
Description
Technical Field
The invention relates to an LED lamp strip and the application field thereof, in particular to a lamp strip made of LED lamp beads and a manufacturing method thereof.
Background
The lamp area of prior art preparation, what adopted is that the leg all distributes and forms at the LED lamp pearl preparation of two sides, for example, 6 foot lamp pearls that RGB lamp pearl was used, 6 feet are respectively on two limits of lamp pearl, the three foot in a limit, the problem of existence as follows:
the lamp beads are welded on the circuit board when the three pins on one side are used, particularly when the lamp beads are welded on a flexible circuit board, one of the pins is easy to be subjected to insufficient soldering, the density of the pins is high, the short circuit of tin is easy to be connected, and the density of the pins after the insufficient soldering is high, and the short circuit of tin is easy to be connected when the maintenance is carried out.
Secondly, three pins which need to be conducted on each side of the lamp bead are required to ensure that insufficient solder joint is generated during welding and the lamp bead is convenient to maintain and needs to be bent into a three-dimensional multi-surface solder pin, so that when the lamp bead is used as a planar single-surface solder pin, the yield is low during welding, particularly the insufficient solder joint of the middle solder pin is serious, many enterprises in the industry have six flat solder pins on two sides, and three flat solder pins on two sides all fail due to the above problems, so that six pins currently made in the industry are three-dimensional multi-surface solder pins on two sides and three pins on one side, and why the lamp bead is required to be made as a flat solder pin? The main reason is that when the flat welding foot is made, because no metal is bent and more metal is needed, the utilization rate of the material for manufacturing the lamp bead support is improved by more than 25%, the flat welding foot support is also thinner than the bent support by more than 40%, the total cost can be saved by 30%, and the support is thin, and when the lamp bead is packaged by the support, the packaging glue can be saved by 50%.
And thirdly, 6 pins are distributed on two edges, when the size of the LED lamp bead is smaller, the density of the welding pins is higher, the tin connection short circuit is easier, the small-size lamp bead is more difficult to use, and the cost of manufacturing the large-size lamp bead for the lamp strip cannot be reduced.
And fourthly, the size of the LED lamp bead cannot be reduced, and the matched flexible circuit board cannot be reduced, so that the cost for manufacturing the lamp strip cannot be reduced.
In order to solve the problem which is not solved in the industry all the time, the LED lamp bead can be made small, the circuit board can be made narrow, the cost of the lamp strip is reduced, and a good using effect can be achieved, the lamp strip made of the LED lamp bead is manufactured by the following method, and the technology is overcome:
the method comprises manufacturing lamp beads with a support having welding feet on multiple sides, designing and manufacturing the welding feet of the lamp bead support having multiple welding feet on three or more sides of the bottom of the support, exposing metal on the side of the support, arranging multiple metal electrodes at the bottom of the support cup for packaging chips, respectively connecting and communicating with multiple welding feet outside the support, respectively fixing multiple chips on the metal electrodes in the support cup, bonding wires with a wire bonding machine, respectively communicating each chip with the electrode on the support, applying packaging glue on the support, sealing the chips and electrodes, heating to solidify the glue, lighting on a light splitter for detection and sorting, wherein during detection, the multiple electrodes of the detector simultaneously touch the welding feet at the bottom of the lamp beads, lighting the LED lamp beads for detection and sorting, and manufacturing at least three welding feet exposed on the side and LED with the chips, the LED lamp beads or the LED lamp beads and the control element are welded on the flexible circuit board by an SMT machine to manufacture the LED lamp strip.
Disclosure of Invention
The invention relates to a lamp strip made of LED lamp beads and a manufacturing method thereof, in particular to a lamp strip made of LED lamp beads welded on a flexible circuit board, wherein the LED lamp beads are made of a plurality of chips packaged in a support, the support of the lamp beads is an LED support formed by embedding metal in resin, at least three sides of the bottom of the support of the LED lamp beads are provided with a plurality of welding feet, and the total number of the welding feet on the support is b: b is more than or equal to 4 and less than or equal to 16, the welding leg is exposed from the side surface of the support, the support can be used for manufacturing low-cost LED small lamp beads, and the lamp strip manufactured by the LED small lamp beads is the low-cost lamp strip.
The invention provides a method for manufacturing a lamp strip manufactured by LED lamp beads, in particular to a lamp strip manufactured by welding LED lamp beads or LED lamp beads and a control element on a flexible circuit board, wherein the LED lamp beads are manufactured by packaging an LED chip in an LED bracket, the bracket of the LED lamp beads is an LED bracket formed by embedding metal in resin, the bottom of the LED bracket is provided with a side, a is more than or equal to 4 and less than or equal to 8, the bracket is provided with b metal welding feet, b is more than or equal to 4 and less than or equal to 16, the bracket is provided with c side surfaces, c is more than or equal to 4 and less than or equal to 8, the metal welding feet are exposed at the bottom surface, part or all the metal welding feet are exposed from the side surfaces of the bracket, the welding feet exposed from the side surfaces of the bracket are distributed on d sides of the bottom, d is more than or equal to 3 and less than or equal to 16, the bracket is a cup-shaped bracket, the cup is provided with e metal electrodes, e is more than or equal to 4 and less than or equal to 16, wherein a part of the metal welding feet are connected to form conduction, and the metal electrode is conducted with at least the welding feet exposed from the three side surfaces, the support is designed into a connecting piece support of a plurality of supports, a plurality of chips are respectively fixed on the metal electrode in the support cup, after the wires are welded by a wire welding machine, each chip of the plurality of chips is respectively communicated with the electrode on the bracket, packaging glue is applied in the bracket cup to seal the chip and the electrode, the packaging glue is solidified by heating, and is split into a plurality of LED lamp beads by a splitting machine, then light on the beam-splitting machine and detect and select separately, during the detection, a plurality of electrodes of detection machine touch the leg of lamp pearl bottom simultaneously, make LED lamp pearl light and detect and select separately, make the leg that at least three side exposes and the LED lamp pearl that the chip switched on after selecting separately, will LED lamp pearl or LED lamp pearl and for the control element SMT machine weld the flexible line way board on, make LED lamp area.
According to the invention, the invention also provides a lamp strip made of the LED lamp beads, which comprises: LED lamp beads or LED lamp beads and control elements; a flexible circuit board; the LED lamp strip is characterized in that the lamp strip is composed of LED lamp beads or LED lamp beads, a control element and a flexible circuit board, the LED lamp beads are made by packaging LED chips by using an LED support, the LED support is an LED support formed by embedding metal in resin, the bottom of the LED support is provided with a side, a is not less than 4 and not more than 8, the support is provided with b metal welding feet, b is not less than 4 and not more than 16, the support is provided with c side surfaces, c is not less than 4 and not more than 8, the metal welding feet are exposed at the bottom, part or all the metal welding feet are exposed from the side surfaces of the support, the welding feet exposed from the side surfaces of the support are distributed on d sides of the bottom, d is not less than 3 and not more than a, the support is a cup-shaped support, the cup is internally provided with e metal electrodes, e is not less than 4 and not more than 16, one part of the metal electrodes are connected with the metal welding feet to form conduction, or all the metal electrodes are connected with the metal welding feet to form conduction, a crystal-fixed on the metal electrodes in the cup of the support, each chip of the plurality of chips is respectively communicated with the metal electrode on the support, the packaging adhesive is bonded in the support cup and seals the chip and the metal electrode, the chips in the LED lamp beads are communicated with the welding feet exposed from at least three side surfaces, and the LED lamp beads or the LED lamp beads and the control element are welded on the flexible circuit board.
According to a preferred embodiment of the invention, the lamp strip made of the LED lamp beads is characterized in that the welding legs are three-dimensional roll leg welding legs, and the welding legs extend out of the side surfaces of the lamp beads and are rolled and attached to the outer surfaces of the side surfaces and the bottom surface.
According to a preferred embodiment of the invention, the lamp strip made of the LED lamp beads is characterized in that the solder legs are planar solder legs exposed at the bottom.
According to a preferred embodiment of the invention, the lamp strip manufactured by the LED lamp beads is characterized in that the flexible circuit board is a soft and hard combined circuit board, and the soft and hard combined circuit board is formed by arranging a soft and hard combined circuit board adhered with hard resin at a local position on the circuit board.
The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.
Drawings
The features, objects, and advantages of the present invention will become more apparent from the description set forth below when taken in conjunction with the drawings, a brief description of which follows.
FIG. 1 is a schematic circuit plan view of a cup shaped holder with solder fillets on four sides.
Fig. 2 is a top plan view of a cup shaped holder with fillets on four sides.
Fig. 3 is a bottom plan view of a cup shaped holder with fillets on four sides.
Fig. 4 is a schematic cross-sectional view of a cup shaped holder with fillets on four sides.
FIG. 5 is a schematic view of the upper and lower equiangular axes of a cup shaped holder having fillets on four sides.
Fig. 6 is a plan view of a plurality of holder cups of a cup holder having fillets on four sides.
FIG. 7 is a top view of a plurality of frame cups of a cup shaped frame with fillets on four sides for die bonding wires.
FIG. 8 is a schematic cross-sectional view of an LED lamp bead with fillets on multiple sides.
Fig. 9 is a schematic top view of an LED lamp bead with fillets on multiple sides.
Fig. 10 is a schematic plan view of a connected strip lamp made of lamp beads with welding legs on multiple sides.
Fig. 11 is a schematic plan view of a lamp strip made of lamp beads with solder tails on multiple sides.
Detailed Description
The present invention will be described in detail below by taking preferred embodiments as examples.
It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.
Example one
Manufacturing of die cutting die
The 2835LED support that contains 6 feet, the cuboid support of 2.8mmx3.5mm of design preparation respectively in the design of two limits of width 2.8mm weld leg 1.1, two respectively designs on two limits in addition weld leg 1.1, 6 total weld legs 1.1.
Two, die-cut support circuit rudiment
Preparing a 0.20mm copper strip, punching the 0.20mm copper strip 1.1 into a support circuit prototype on a punch press by using a punching die, and electroplating silver on the support circuit prototype to plate a layer of silver on the surface of the copper strip.
Preparation of PPA resin
PPA resin 2.1 is injected on the copper strip by an injection mould on an injection molding machine to form a plurality of bracket cups, and the copper prototype circuit is embedded in the PPA resin.
Fourthly, 6 welding feet are made by punching the bracket
The connecting piece support containing a plurality of LED supports is manufactured by die cutting, each support is provided with 6 welding feet 1.1, two sides of 2.8mm are respectively provided with one welding foot 1.1, and two sides of 3.5mm are respectively provided with two welding feet 1.1. Six metal electrodes are arranged in the support cup and are respectively connected and conducted with six welding feet at the outer bottom of the support to manufacture a cup-shaped support with welding feet on four sides (shown in figures 1, 2, 3, 4, 5 and 6).
Fifth, packaging LED lamp bead
Firstly, die bonding
Fixing red, green and blue chips 3.1 on three electrodes in the cup by a crystal fixing machine, fixing the red chip on one electrode at the bottom of the cup by silver glue, fixing the blue and green chips on the other two electrodes by crystal fixing glue, and baking to solidify the glue.
② bonding wires
The positive and negative electrodes of the three chips were connected to the metal electrodes of the cup bottom by welding with alloy wires 4.1, respectively, by a wire bonder (shown in fig. 7).
Thirdly, dispensing
And (5) dispensing the packaging glue 5.1 by using a dispenser in the cup, and baking to solidify the packaging glue.
Peeling material
The LED lamp beads with welding feet on multiple sides are manufactured by splitting the single RGB lamp beads on a splitting machine by using a mold (shown in figures 8 and 9).
Spectroscopic detection
Put on the ray apparatus at 2835 RGB lamp pearl, through the pad that the bottom of detecting RGB lamp pearl exposes, make the lamp pearl light, divide and elect LED lamp pearl of a plurality of categories and divide into a plurality of boxes in, remove the defective products simultaneously and make LED lamp pearl 7.1.
Sixthly, packaging
And (4) weaving the LED lamp beads 7.1 on a packaging tape by using a braider.
Sixth, manufacturing of lamp strip
Printing solder paste
The prepared flexible circuit board 6.1 is placed on a printer, and then solder paste is printed on the solder position of the flexible circuit board by using a special steel mesh.
② sticking sheet
And (3) pasting the LED lamp beads 7.1 and the resistors 8.1 packaged on the packaging tape to the flexible circuit board printed with the solder paste by using an easy-to-pass chip mounter to manufacture the flexible circuit board with the lamp beads.
Thirdly, reflow soldering
The flexible circuit board with the lamp beads is placed in a debugged reflow soldering machine, after reflow soldering, the lamp beads and the resistors are soldered on the flexible circuit board and cut into single strips, and then the lamp strip made of the lamp beads with the welding legs at multiple sides is manufactured (as shown in figures 10 and 11).
The invention is described in detail with reference to the drawings by using specific embodiments of a lamp strip made of LED lamp beads and a manufacturing method thereof. It will be understood by those skilled in the art, however, that the foregoing is merely illustrative and descriptive of some specific embodiments and is not to be construed as limiting the scope of the invention, especially the scope of the claims.
Claims (5)
1. A method for manufacturing a lamp strip made of LED lamp beads includes the steps that LED lamp beads or LED lamp beads and a control element are welded on a flexible circuit board, LED chips are packaged in LED supports to manufacture the lamp strip, supports of the LED lamp beads are LED supports formed by embedding the LED supports in resin in metal, a sides are arranged at the bottoms of the LED supports, a is larger than or equal to 4 and smaller than or equal to 8, b metal welding feet are arranged on the supports, b is larger than or equal to 4 and smaller than or equal to 16, c side faces are arranged on the supports, c is larger than or equal to 4 and smaller than or equal to 8, the metal welding feet are exposed out of the bottom faces, part of or all the metal welding feet are exposed out of the side faces of the supports and distributed on d sides of the bottoms, d is larger than or equal to 3 and smaller than or equal to 16, the supports are cup-shaped supports, e metal electrodes are arranged in cups, e is larger than or equal to 4 and smaller than or equal to 16, a part of the metal electrodes are connected with the metal welding feet to form conduction, or all the metal electrodes are connected with the metal welding feet to form conduction, and the metal electrode is conducted with at least the welding feet exposed from the three side surfaces, the support is designed into a connecting piece support of a plurality of supports, a plurality of chips are respectively fixed on the metal electrode in the support cup, after the wires are welded by a wire welding machine, each chip of the plurality of chips is respectively communicated with the electrode on the bracket, packaging glue is applied in the bracket cup to seal the chip and the electrode, the packaging glue is solidified by heating, and is split into a plurality of LED lamp beads by a splitting machine, then light on the beam-splitting machine and detect and select separately, during the detection, a plurality of electrodes of detection machine touch the leg of lamp pearl bottom simultaneously, make LED lamp pearl light and detect and select separately, make the leg that at least three side exposes and the LED lamp pearl that the chip switched on after selecting separately, will LED lamp pearl or LED lamp pearl and for the control element SMT machine weld the flexible line way board on, make LED lamp area.
2. A lamp area of LED lamp pearl preparation includes:
LED lamp beads or LED lamp beads and control elements;
a flexible circuit board;
the LED lamp strip is characterized in that the lamp strip is composed of LED lamp beads or LED lamp beads, a control element and a flexible circuit board, the LED lamp beads are made by packaging LED chips by using an LED support, the LED support is an LED support formed by embedding metal in resin, the bottom of the LED support is provided with a side, a is not less than 4 and not more than 8, the support is provided with b metal welding feet, b is not less than 4 and not more than 16, the support is provided with c side surfaces, c is not less than 4 and not more than 8, the metal welding feet are exposed at the bottom, part or all the metal welding feet are exposed from the side surfaces of the support, the welding feet exposed from the side surfaces of the support are distributed on d sides of the bottom, d is not less than 3 and not more than a, the support is a cup-shaped support, the cup is internally provided with e metal electrodes, e is not less than 4 and not more than 16, one part of the metal electrodes are connected with the metal welding feet to form conduction, or all the metal electrodes are connected with the metal welding feet to form conduction, a crystal-fixed on the metal electrodes in the cup of the support, each chip of the plurality of chips is respectively communicated with the metal electrode on the support, the packaging adhesive is bonded in the support cup and seals the chip and the metal electrode, the chips in the LED lamp beads are communicated with the welding feet exposed from at least three side surfaces, and the LED lamp beads or the LED lamp beads and the control element are welded on the flexible circuit board.
3. A light strip made of LED lamp beads according to claim 1 or 2, wherein said solder legs are three-dimensional roll-leg solder legs, which extend from the side surfaces of the lamp beads and are rolled and attached to the outer surfaces of the side surfaces and the bottom surface.
4. A light strip made of LED lamp beads according to claim 1 or 2, wherein said solder tails are planar solder tails exposed at the bottom.
5. A light strip made of LED lamp beads according to claim 1 or 2, wherein the flexible circuit board is a hard-soft combined circuit board, and the hard-soft combined circuit board is formed by arranging a hard resin on a local position of the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011128278.9A CN114373855A (en) | 2020-10-14 | 2020-10-14 | Lamp strip made of LED lamp beads and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011128278.9A CN114373855A (en) | 2020-10-14 | 2020-10-14 | Lamp strip made of LED lamp beads and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114373855A true CN114373855A (en) | 2022-04-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011128278.9A Pending CN114373855A (en) | 2020-10-14 | 2020-10-14 | Lamp strip made of LED lamp beads and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114373855A (en) |
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2020
- 2020-10-14 CN CN202011128278.9A patent/CN114373855A/en active Pending
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Application publication date: 20220419 |
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| WD01 | Invention patent application deemed withdrawn after publication |