CN114388681A - RGB lamp band manufactured by single-layer circuit board and manufacturing method thereof - Google Patents
RGB lamp band manufactured by single-layer circuit board and manufacturing method thereof Download PDFInfo
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- CN114388681A CN114388681A CN202011175196.XA CN202011175196A CN114388681A CN 114388681 A CN114388681 A CN 114388681A CN 202011175196 A CN202011175196 A CN 202011175196A CN 114388681 A CN114388681 A CN 114388681A
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- 239000002356 single layer Substances 0.000 title claims abstract description 48
- 238000004519 manufacturing process Methods 0.000 title abstract description 29
- 239000011324 bead Substances 0.000 claims abstract description 109
- 239000002184 metal Substances 0.000 claims abstract description 81
- 229910052751 metal Inorganic materials 0.000 claims abstract description 81
- 238000003466 welding Methods 0.000 claims abstract description 41
- 238000004806 packaging method and process Methods 0.000 claims abstract description 18
- 239000011347 resin Substances 0.000 claims abstract description 11
- 229920005989 resin Polymers 0.000 claims abstract description 11
- 238000012360 testing method Methods 0.000 claims abstract description 6
- 229910000679 solder Inorganic materials 0.000 claims description 41
- 238000004021 metal welding Methods 0.000 claims description 18
- 239000003292 glue Substances 0.000 claims description 15
- 238000001514 detection method Methods 0.000 claims description 12
- 238000002360 preparation method Methods 0.000 claims description 7
- 238000000926 separation method Methods 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 239000010410 layer Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000011049 pearl Substances 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000005476 soldering Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The invention relates to an RGB lamp strip manufactured by a single-layer circuit board and a manufacturing method thereof, in particular to a lamp strip manufactured by welding RGB lamp beads on a flexible circuit board of a single-layer circuit, wherein the flexible circuit board is a flexible circuit board of the single-layer circuit board, the RGB lamp beads are manufactured by packaging three chips respectively emitting red light, green light and blue light in a support, the support of the lamp beads is an LED support formed by embedding metal in resin, at least 4 sides of the bottom of the support of the RGB lamp beads are provided with 6 welding feet, the welding feet are exposed from the side surface of the support, metal contacts are also extended from the side surface of the support and used for testing and sorting the lamp beads, the support can be used for manufacturing low-cost RGB small lamp beads, and the lamp strip manufactured by the RGB small lamp beads is the low-cost lamp strip.
Description
Technical Field
The invention relates to an LED lamp strip and the application field thereof, in particular to an RGB lamp strip manufactured by a single-layer circuit board and a manufacturing method thereof.
Background
The lamp area of prior art preparation, what adopted is that the leg all distributes and forms at the LED lamp pearl preparation of two sides, for example, 6 foot lamp pearls that RGB lamp pearl was used, 6 feet are respectively on two limits of lamp pearl, the three foot in a limit, the problem of existence as follows:
the lamp beads are welded on the circuit board when the three pins on one side are used, particularly when the lamp beads are welded on a flexible circuit board, one of the pins is easy to be subjected to insufficient soldering, the density of the pins is high, the short circuit of tin is easy to be connected, and the density of the pins after the insufficient soldering is high, and the short circuit of tin is easy to be connected when the maintenance is carried out.
Secondly, three pins which need to be conducted on each side of the lamp bead are required to ensure that insufficient solder joint is generated during welding and the lamp bead is convenient to maintain and needs to be bent into a three-dimensional multi-surface solder pin, so that when the lamp bead is used as a planar single-surface solder pin, the yield is low during welding, particularly the insufficient solder joint of the middle solder pin is serious, many enterprises in the industry have six flat solder pins on two sides, and three flat solder pins on two sides all fail due to the above problems, so that six pins currently made in the industry are three-dimensional multi-surface solder pins on two sides and three pins on one side, and why the lamp bead is required to be made as a flat solder pin? The main reason is that when the flat welding foot is made, because no metal is bent and more metal is needed, the utilization rate of the material for manufacturing the lamp bead support is improved by more than 25%, the flat welding foot support is also thinner than the bent support by more than 40%, the total cost can be saved by 30%, and the support is thin, and when the lamp bead is packaged by the support, the packaging glue can be saved by 50%.
And thirdly, 6 pins are distributed on two edges, when the size of the RGB lamp bead is smaller, the density of the welding pins is higher, the short circuit of tin connection is easier, the small-size lamp bead is more difficult to use, and the cost of manufacturing the large-size lamp bead for the lamp strip cannot be reduced.
And fourthly, the size of the RGB lamp bead cannot be reduced, and the matched flexible circuit board cannot be reduced, so that the cost for manufacturing the lamp strip cannot be reduced.
In order to solve the problem which is not solved in the industry all the time, the LED lamp bead can be made small, the circuit board can be made narrow, the cost of the lamp strip is reduced, and a good using effect can be achieved, the invention adopts the following method to manufacture the RGB lamp strip manufactured by the single-layer circuit board, and overcomes the technology:
the method comprises manufacturing lamp beads with a support having multiple sides with solder feet, designing and manufacturing the solder feet of the lamp bead support with multiple solder feet on four or more sides of the bottom of the support, exposing metal on the side of the support, designing and manufacturing metal contacts on one or more sides of the support, exposing the metal contacts from the side of the support, forming conductive connection between the metal of the metal contacts and the solder feet in the support, forming multiple metal electrodes at the bottom of the support cup for packaging chips, respectively forming connection with multiple solder feet outside the support, respectively fixing three chips containing red light, green light and blue light on the metal electrodes in the support cup, respectively forming conduction between each chip and the electrode on the support after wire bonding by a wire bonding machine, applying packaging glue on the support, sealing the chips and the electrodes, heating to cure the glue, then lighting the light on the light splitting machine for detection and sorting, during detection, the light on two sides of the light bulb is clamped by the detector, a plurality of electrodes of the clamping detector simultaneously touch the exposed welding feet on the two sides and the exposed metal contacts on the two sides, so that the LED lights for detection and sorting, the RGB light bulb with welding feet on a plurality of sides is manufactured after sorting, then the RGB light bulb is welded on the flexible circuit board of the single-layer circuit to manufacture the light strip, the bracket is used for manufacturing the low-cost light bulb and the low-cost light bulb light strip, when the light bulb is manufactured, although the welding feet of the light bulb are distributed on four or more sides, the low-cost clamping detector can still be used for clamping and measuring two sides to finish the test of the light bulb, and the light strip is manufactured by the flexible circuit board which is suitable for the single-layer circuit, so the flexible circuit board of the single-layer circuit is designed into a long circuit board which is connected into a whole by a plurality of cycles of the same circuit design, the rectangular circuit board has 4 thread from beginning to end, and 4 thread are No. 1 thread, No. 2 thread, No. 3 thread and No. 4 thread respectively, and wherein No. 1 and No. 4 thread set up respectively on the long direction both sides of rectangular circuit board, and the shortest distance of thread and flange limit is L: l is more than or equal to 0 and less than or equal to 6.0MM, the No. 2 and No. 3 mainlines are arranged between the No. 1 and No. 4 mainlines, the No. 2 mainline penetrates through a gap between the welding pads of the first lamp beads welded in each period, the No. 3 mainline penetrates through a gap between the welding pads of the lamp beads at the tail end of welding in each period, and the RGB lamp beads or the RGB lamp beads and the control element are welded on the flexible circuit board to manufacture the RGB lamp strip with the single-layer circuit.
Disclosure of Invention
The invention relates to an RGB lamp belt manufactured by a single-layer circuit board and a manufacturing method thereof, the lamp belt is manufactured by welding RGB lamp beads on a flexible circuit board of a single-layer circuit, the flexible circuit board is a flexible circuit board of the single-layer circuit board, the RGB lamp beads are manufactured by packaging three chips respectively emitting red light, green light and blue light in a support, the support of the lamp beads is an LED support formed by embedding metal in resin, at least 4 sides of the bottom of the support of the RGB lamp beads are provided with 6 welding feet, the welding feet are exposed from the side surface of the support, metal contacts are also extended from the side surface of the support and used for testing and sorting the lamp beads, the support can be used for manufacturing low-cost RGB small lamp beads, and the lamp belt manufactured by the RGB small lamp beads is the low-cost lamp belt.
The invention provides a method for manufacturing an RGB lamp strip manufactured by a single-layer circuit board, and particularly the lamp strip is manufactured by welding RGB lamp beads or RGB lamp beads and a control element on a flexible circuit board of a single-layer circuit, the flexible circuit board of the single-layer circuit is characterized in that the lamp strip is a long-strip circuit board which is formed by connecting circuit boards of a plurality of periods with the same circuit design into a whole, the long-strip circuit board is provided with 4 main lines from head to tail, the 4 main lines are respectively a No. 1 main line, a No. 2 main line, a No. 3 main line and a No. 4 main line, wherein the No. 1 main line and the No. 4 main line are respectively arranged at two sides of the long direction of the long-strip circuit board, and the shortest distance between the main lines and the board edges is L: l is more than or equal to 0 and less than or equal to 6.0MM, the No. 2 and No. 3 mainlines are arranged between the No. 1 and No. 4 mainlines, the No. 2 mainline penetrates through a gap between bonding pads of the first lamp beads welded in each period, the No. 3 mainline penetrates through a gap between bonding pads of the lamp beads at the tail end of each period, the RGB lamp beads are manufactured by packaging three chips respectively emitting red light, green light and blue light in an LED bracket, the bracket of the RGB lamp beads is an LED bracket formed by embedding metal in resin, the bottom of the LED bracket is provided with at least 4 sides, the bracket is provided with 6 metal welding feet, at least 4 side surfaces of the bracket are exposed at the bottom surface, the metal welding feet are exposed from at least 4 side surfaces of the bracket, metal contacts are also extended from the side surfaces of the bracket, at least 2 metal contacts are arranged on the bracket, a part of the metal contacts are connected with the metal welding feet to form conduction, or all the metal contacts are connected with the metal welding feet to form conduction, the support is a cup-shaped support, 6 metal electrodes are arranged in a cup, the 6 metal electrodes and 6 metal welding feet are respectively connected to form conduction, the support is designed and manufactured into a connecting piece support of a plurality of supports, three chips which respectively emit red light, green light and blue light are respectively fixed and crystallized on the metal electrodes in the support cup, after wire bonding is carried out by a wire bonding machine, each chip of a plurality of chips is respectively communicated with the electrodes on the support, packaging glue is applied in the support cup, the chips and the electrodes are sealed, the packaging glue is solidified by heating, the chips are split into a plurality of RGB lamp beads by a splitting machine, then the RGB lamp beads are lightened on a light splitting machine for detection and separation, when in detection, the two side surfaces of the lamp beads are clamped by a detector, the electrodes of the clamping machine simultaneously touch the welding feet exposed from the two side surfaces and the metal contacts exposed from the two side surfaces, the RGB lamp beads are lightened for detection and separation, and the RGB lamp beads with the welding feet on all sides are manufactured into RGB after separation, three kinds of chips of the RGB lamp pearl of making form with the leg that 4 sides expose at least and switch on, will the lamp pearl or lamp pearl and control element are welded to flexible line way board with the SMT machine and are made RGB lamp area.
According to the present invention, there is also provided an RGB lamp strip manufactured by using a single-layer circuit board, comprising: RGB lamp beads or RGB lamp beads and control elements; a flexible circuit board of a single-layer circuit; its characterized in that, the lamp area is RGB lamp pearl or RGB lamp pearl and control element and the flexible line way board of individual layer circuit and constitutes, the flexible line way board's of individual layer circuit characteristic is, is the rectangular circuit board that is even as an organic whole by the circuit board of a plurality of cycles of same circuit design, and rectangular circuit board has 4 thread from beginning to end, and 4 thread are No. 1 thread, No. 2 thread, No. 3 thread and No. 4 thread respectively, and wherein No. 1 and No. 4 thread set up respectively on the both sides of the long direction of rectangular circuit board, and the shortest distance of thread and flange limit is L: l is more than or equal to 0 and less than or equal to 6.0MM, the No. 2 and No. 3 mainlines are arranged between the No. 1 and No. 4 mainlines, the No. 2 mainline penetrates through a gap between bonding pads of the first welding lamp beads in each period, the No. 3 mainline penetrates through a gap between bonding pads of the lamp beads at the tail of welding in each period, the RGB lamp beads are characterized in that the RGB lamp beads manufactured by respectively emitting red light, green light and blue light are packaged by an LED support, the LED support is an LED support formed by embedding metal in resin, at least 4 sides are arranged at the bottom of the LED support, 6 metal welding feet are arranged on the support, at least 4 side surfaces of the support are exposed out, metal contacts are also extended from the side surfaces of the support, at least 2 metal contacts are arranged on the support, and part of the metal contacts are connected with the metal welding feet to form conduction, or all the metal contacts are connected with the metal welding feet to form conduction, the support is a cup-shaped support, 6 metal electrodes are arranged in the cup, the 6 metal electrodes and the 6 metal welding feet are respectively connected to form conduction, three chips respectively emitting red light, green light and blue light are fixedly crystallized on the metal electrodes in the cup of the support, each chip of the three chips respectively emitting red light, green light and blue light is respectively communicated with the metal electrodes on the support, packaging glue is bonded in the cup of the support and seals the chips and the metal electrodes, the three chips of the RGB lamp beads are at least communicated with the welding feet exposed from 4 side faces, and the RGB lamp beads or the RGB lamp beads and the control element are welded on the flexible circuit board of the single-layer circuit.
According to a preferred embodiment of the present invention, the RGB lamp strip manufactured by using the single-layer circuit board is characterized in that the solder leg is a three-dimensional roll leg solder leg, and the solder leg extends from the side surface of the lamp bead and is rolled and attached to the outer surfaces of the side surface and the bottom surface.
According to a preferred embodiment of the present invention, the RGB lamp strip manufactured by using the single-layer circuit board is characterized in that the solder leg of the lamp bead is a planar solder leg exposed at the bottom of the lamp bead.
According to a preferred embodiment of the present invention, the RGB lamp strip manufactured by using the single-layer circuit board is characterized in that the metal contact is only used for detecting contact conduction when the sorting lamp beads are inspected, and the metal contact for detection is not only conducted with the welding feet of the lamp beads, but also conducted with the chip.
According to a preferred embodiment of the present invention, the RGB lamp strip manufactured by using the single-layer circuit board is characterized in that the metal contacts are disposed on two opposite side surfaces of the lamp bead and exposed, the two side surfaces have the metal contacts, each side surface has the metal contact and a solder leg, and the metal contacts and the solder legs on the two side surfaces are used for detecting the lamp bead simultaneously when detecting the lamp bead.
According to a preferred embodiment of the present invention, the RGB lamp strip manufactured by the single-layer circuit board is characterized in that a red chip of the RGB lamp bead is fixed on the metal electrode by using conductive silver paste, and two types of blue and green chips are fixed on the metal electrode by using insulating paste.
According to a preferred embodiment of the present invention, the RGB lamp strip manufactured by using the single-layer circuit board is characterized in that the flexible circuit board is a rigid-flex circuit board, and the rigid-flex circuit board is formed by arranging a rigid-flex circuit board adhered with a hard resin at a local position on the flexible circuit board.
According to a preferred embodiment of the present invention, the RGB lamp strip manufactured by using the single-layer circuit board is characterized in that the lamp strip is a long lamp strip formed by connecting a plurality of short lamp strips with the same period into a whole, and 3 RGB lamp beads and 3 resistors are welded in each period.
According to a preferred embodiment of the present invention, the RGB lamp strip manufactured by using the single-layer circuit board is characterized in that the lamp strip is a long lamp strip formed by connecting a plurality of short lamp strips with the same period into a whole, and 6, 7, 8 RGB lamp beads and 3 resistors are welded in each period.
According to a preferred embodiment of the present invention, the RGB lamp strip manufactured by the single-layer circuit board is characterized in that the metal fillets exposed from the side surfaces of the RGB lamp beads on the RGB lamp strip are partially covered by solder or completely covered by solder.
The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.
Drawings
The features, objects, and advantages of the present invention will become more apparent from the description set forth below when taken in conjunction with the drawings, a brief description of which follows.
FIG. 1 is a schematic circuit plan view of a cup shaped holder with solder fillets on four sides.
Fig. 2 is a top plan view of a cup shaped holder with fillets on four sides.
Fig. 3 is a bottom plan view of a cup shaped holder with fillets on four sides.
Fig. 4 is a schematic cross-sectional view of a cup shaped holder with fillets on four sides.
FIG. 5 is a schematic view of the upper and lower equiangular axes of a cup shaped holder having fillets on four sides.
Fig. 6 is a plan view of a plurality of holder cups of a cup holder having fillets on four sides.
FIG. 7 is a top view of a plurality of frame cups of a cup shaped frame with fillets on four sides for die bonding wires.
Fig. 8 is a schematic cross-sectional view of an RGB lamp bead having fillets on multiple sides.
Fig. 9 is a schematic top view of an RGB lamp bead having solder fillets on multiple edges.
FIG. 10 is a schematic diagram of a monocycle circuit cycle.
FIG. 11 is a schematic diagram of production data of the whole circuit board.
Fig. 12 is a schematic plan view of a connected lamp strip made of RGB lamp beads.
Fig. 13 is a schematic plan view of a lamp strip made of RGB lamp beads.
Detailed Description
The present invention will be described in detail below by taking preferred embodiments as examples.
It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.
Example one
Manufacturing of die cutting die
The 2835LED support that contains 6 feet, the cuboid support of 2.8mmx3.5mm of design preparation respectively in wide 2.8 mm's two limits design a leg 1.1 and two metal contact 1.2, two other limits respectively design two legs 1.1, 6 total legs 1.1 and 4 metal contact 1.2.
Two, die-cut support circuit rudiment
Preparing a 0.20mm copper strip, punching the 0.20mm copper strip 1.1 into a support circuit prototype on a punch press by using a punching die, and electroplating silver on the support circuit prototype to plate a layer of silver on the surface of the copper strip.
Preparation of PPA resin
PPA resin 2.1 is injected on the copper strip by an injection mould on an injection molding machine to form a plurality of bracket cups, and the copper prototype circuit is embedded in the PPA resin.
Fourthly, 6 welding feet are made by punching the bracket
A connecting piece support containing a plurality of LED supports is manufactured by die cutting, each support is provided with 6 welding feet 1.1, and 4 testing metal contacts 1.2, two sides of 2.8mm are respectively provided with one welding foot 1.1 and two sides of 2 testing metal contacts 1.2, 3.5mm are respectively provided with two welding feet 1.1. Six metal electrodes are arranged in the support cup and are respectively connected and conducted with six welding feet at the outer bottom of the support, and four metal contacts are connected and conducted with four metal electrodes in the cup to manufacture the cup-shaped support with the welding feet on four sides (shown in figures 1, 2, 3, 4, 5 and 6).
Fifth, encapsulation RGB lamp pearl
Firstly, die bonding
Fixing red, green and blue chips 3.1 on three electrodes in the cup by a crystal fixing machine, fixing the red chip on one electrode at the bottom of the cup by silver glue, fixing the blue and green chips on the other two electrodes by crystal fixing glue, and baking to solidify the glue.
② bonding wires
The positive and negative electrodes of the three chips were connected to the metal electrodes of the cup bottom by welding with alloy wires 4.1, respectively, by a wire bonder (shown in fig. 7).
Thirdly, dispensing
And (5) dispensing the packaging glue 5.1 by using a dispenser in the cup, and baking to solidify the packaging glue.
Peeling material
The single RGB lamp beads are split by a mold on a splitting machine to form the RGB lamp beads with welding feet on a plurality of sides (shown in figures 8 and 9).
Spectroscopic detection
On 2835 RGB's press from both sides survey beam splitter, through pressing from both sides four metal contact and two fillets of surveying two limits, these four metal contact have communicated four fillets on 3.5 mm's two limits respectively, have also communicated the electrode of chip, press from both sides survey to divide and select a plurality of categorised RGB lamp pearl to divide to a plurality of boxes in, remove the defective products simultaneously and make RGB lamp pearl 7.1.
Sixthly, packaging
The RGB lamp beads 7.1 are woven on a packaging tape by a braider.
Six, manufacturing of flexible circuit board of single-layer circuit
The circuit of the single-layer circuit flexible circuit board is designed into a schematic diagram 6.1a of a single-period circuit cycle, a No. 1 main line 6.11, a No. 2 main line 6.12, a No. 3 main line 6.13 and a No. 4 main line 6.14 respectively penetrate from the head end to the tail end of the circuit board, the No. 2 main line 6.12 penetrates through a gap 6.12a between 6 welding pads of a first lamp bead in each period, the No. 3 main line 6.13 penetrates through a gap 6.13a between 6 welding pads of a lamp bead at the tail end of each period, and then the circuit is spliced into a plurality of multi-period whole boards to input production data to manufacture a whole board circuit production data schematic diagram 6.1b (shown in figures 10 and 11).
The prepared single-layer flexible copper clad laminate is used for producing data by using the circuit of the whole board, and the flexible circuit board 6.1 of the single-layer circuit is manufactured by the traditional procedures of circuit printing, etching, film stripping, silk-screen solder mask and the like.
Manufacturing of seven-purpose lamp belt
Printing solder paste
The prepared flexible circuit board 6.1 is placed on a printer, and then solder paste is printed on the solder position of the flexible circuit board by using a special steel mesh.
② sticking sheet
And (3) pasting the RGB lamp beads 7.1 and the resistors 8.1 packaged on the packaging tape to a flexible circuit board printed with solder paste by using an easy-to-pass chip mounter to manufacture the flexible circuit board with the lamp beads.
Thirdly, reflow soldering
And (3) placing the flexible circuit board with the lamp beads in a debugged reflow soldering machine, after reflow soldering, welding the lamp beads and the resistors on the flexible circuit board, and cutting the flexible circuit board into single strips to manufacture the lamp strip made of the RGB lamp beads (as shown in figures 12 and 13).
The present invention is described in detail with reference to the accompanying drawings by using a specific embodiment of an RGB lamp strip manufactured by a single-layer circuit board and a manufacturing method thereof. It will be understood by those skilled in the art, however, that the foregoing is merely illustrative and descriptive of some specific embodiments and is not to be construed as limiting the scope of the invention, especially the scope of the claims.
Claims (11)
1. The utility model provides a preparation method of RGB lamp area of single-layer circuit board preparation, specifically, the lamp area is RGB lamp pearl or RGB lamp pearl and control element welding and makes on the flexible line board of single-layer circuit, the flexible line board of single-layer circuit is characterized by, is the rectangular circuit board that the circuit board of a plurality of cycles by the same circuit design links as an organic whole, and rectangular circuit board has 4 mainlines from beginning to end, and 4 mainlines are No. 1 mainline, No. 2 mainlines, No. 3 mainlines and No. 4 mainlines respectively, and wherein No. 1 and No. 4 mainlines set up respectively on the both sides of the long direction of rectangular circuit board, and the shortest distance of mainline and flange limit is L: l is more than or equal to 0 and less than or equal to 6.0MM, the No. 2 and No. 3 mainlines are arranged between the No. 1 and No. 4 mainlines, the No. 2 mainline penetrates through a gap between bonding pads of the first lamp beads welded in each period, the No. 3 mainline penetrates through a gap between bonding pads of the lamp beads at the tail end of each period, the RGB lamp beads are manufactured by packaging three chips respectively emitting red light, green light and blue light in an LED bracket, the bracket of the RGB lamp beads is an LED bracket formed by embedding metal in resin, the bottom of the LED bracket is provided with at least 4 sides, the bracket is provided with 6 metal welding feet, at least 4 side surfaces of the bracket are exposed at the bottom surface, the metal welding feet are exposed from at least 4 side surfaces of the bracket, metal contacts are also extended from the side surfaces of the bracket, at least 2 metal contacts are arranged on the bracket, a part of the metal contacts are connected with the metal welding feet to form conduction, or all the metal contacts are connected with the metal welding feet to form conduction, the support is a cup-shaped support, 6 metal electrodes are arranged in a cup, the 6 metal electrodes and 6 metal welding feet are respectively connected to form conduction, the support is designed and manufactured into a connecting piece support of a plurality of supports, three chips which respectively emit red light, green light and blue light are respectively fixed and crystallized on the metal electrodes in the support cup, after wire bonding is carried out by a wire bonding machine, each chip of a plurality of chips is respectively communicated with the electrodes on the support, packaging glue is applied in the support cup, the chips and the electrodes are sealed, the packaging glue is solidified by heating, the chips are split into a plurality of RGB lamp beads by a splitting machine, then the RGB lamp beads are lightened on a light splitting machine for detection and separation, when in detection, the two side surfaces of the lamp beads are clamped by a detector, the electrodes of the clamping machine simultaneously touch the welding feet exposed from the two side surfaces and the metal contacts exposed from the two side surfaces, the RGB lamp beads are lightened for detection and separation, and the RGB lamp beads with the welding feet on all sides are manufactured into RGB after separation, three kinds of chips of the RGB lamp pearl of making form with the leg that 4 sides expose at least and switch on, will the lamp pearl or lamp pearl and control element are welded to flexible line way board with the SMT machine and are made RGB lamp area.
2. An RGB lamp area of single-layer circuit board preparation includes:
RGB lamp beads or RGB lamp beads and control elements;
a flexible circuit board of a single-layer circuit;
its characterized in that, the lamp area is RGB lamp pearl or RGB lamp pearl and control element and the flexible line way board of individual layer circuit and constitutes, the flexible line way board's of individual layer circuit characteristic is, is the rectangular circuit board that is even as an organic whole by the circuit board of a plurality of cycles of same circuit design, and rectangular circuit board has 4 thread from beginning to end, and 4 thread are No. 1 thread, No. 2 thread, No. 3 thread and No. 4 thread respectively, and wherein No. 1 and No. 4 thread set up respectively on the both sides of the long direction of rectangular circuit board, and the shortest distance of thread and flange limit is L: l is more than or equal to 0 and less than or equal to 6.0MM, the No. 2 and No. 3 mainlines are arranged between the No. 1 and No. 4 mainlines, the No. 2 mainline penetrates through a gap between bonding pads of the first welding lamp beads in each period, the No. 3 mainline penetrates through a gap between bonding pads of the lamp beads at the tail of welding in each period, the RGB lamp beads are characterized in that the RGB lamp beads manufactured by respectively emitting red light, green light and blue light are packaged by an LED support, the LED support is an LED support formed by embedding metal in resin, at least 4 sides are arranged at the bottom of the LED support, 6 metal welding feet are arranged on the support, at least 4 side surfaces of the support are exposed out, metal contacts are also extended from the side surfaces of the support, at least 2 metal contacts are arranged on the support, and part of the metal contacts are connected with the metal welding feet to form conduction, or all the metal contacts are connected with the metal welding feet to form conduction, the support is a cup-shaped support, 6 metal electrodes are arranged in the cup, the 6 metal electrodes and the 6 metal welding feet are respectively connected to form conduction, three chips respectively emitting red light, green light and blue light are fixedly crystallized on the metal electrodes in the cup of the support, each chip of the three chips respectively emitting red light, green light and blue light is respectively communicated with the metal electrodes on the support, packaging glue is bonded in the cup of the support and seals the chips and the metal electrodes, the three chips of the RGB lamp beads are at least communicated with the welding feet exposed from 4 side faces, and the RGB lamp beads or the RGB lamp beads and the control element are welded on the flexible circuit board of the single-layer circuit.
3. A RGB lamp strip made of a single-layer circuit board as claimed in claim 1 or 2, wherein the solder legs are three-dimensional roll-leg solder legs, and the solder legs extend from the side surfaces of the lamp beads and are rolled and attached to the outer surfaces of the side surfaces and the bottom surface.
4. A RGB lamp strip made of a single-layer circuit board as claimed in claim 1 or 2, wherein the solder feet of the lamp beads are planar solder feet exposed at the bottom of the lamp beads.
5. The RGB lamp strip manufactured by the single-layer circuit board as claimed in claim 1 or 2, wherein the metal contact is only used for detecting contact conduction when the sorting lamp bead is inspected, and the metal contact for detection is conducted with the solder leg of the lamp bead and the chip.
6. The RGB lamp strip manufactured by the single-layer circuit board as claimed in claim 1 or 2, wherein the metal contacts are disposed on two opposite sides of the lamp bead to be exposed, two sides of the metal contacts are provided, each side of the metal contacts is provided with a metal contact and a solder foot, and the metal contacts and the solder feet on the two sides are used simultaneously to test the lamp bead when the lamp bead is tested.
7. The RGB lamp strip manufactured by the single-layer circuit board according to claim 1 or 2, wherein a red chip in the RGB lamp beads is fixed on the metal electrode by conductive silver paste, and a blue chip and a green chip are fixed on the metal electrode by insulating glue.
8. The RGB lamp strip as claimed in claim 1 or 2, wherein the flexible printed circuit board is a hard-soft combined circuit board, and the hard-soft combined circuit board is formed by adhering hard resin to a local position on the flexible printed circuit board.
9. The RGB lamp strip manufactured by the single-layer circuit board as claimed in claim 1 or 2, wherein the lamp strip is a long lamp strip formed by connecting a plurality of short lamp strips with the same period, and 3 RGB lamp beads and 3 resistors are welded in each period.
10. The RGB lamp strip manufactured by the single-layer circuit board as claimed in claim 1 or 2, wherein the lamp strip is a long lamp strip formed by connecting a plurality of short lamp strips with the same period, and 6, 7, or 8 RGB lamp beads and 3 resistors are welded in each period.
11. A RGB lamp strip manufactured by single-layer circuit board according to claim 1 or 2, wherein the metal solder feet exposed from the side surfaces of the RGB lamp beads on the RGB lamp strip are partially covered by solder or completely covered by solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011175196.XA CN114388681A (en) | 2020-10-21 | 2020-10-21 | RGB lamp band manufactured by single-layer circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011175196.XA CN114388681A (en) | 2020-10-21 | 2020-10-21 | RGB lamp band manufactured by single-layer circuit board and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114388681A true CN114388681A (en) | 2022-04-22 |
Family
ID=81194513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011175196.XA Pending CN114388681A (en) | 2020-10-21 | 2020-10-21 | RGB lamp band manufactured by single-layer circuit board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114388681A (en) |
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2020
- 2020-10-21 CN CN202011175196.XA patent/CN114388681A/en active Pending
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