CN116978883B - Side-mounted semiconductor lead frame and blanking equipment thereof - Google Patents
Side-mounted semiconductor lead frame and blanking equipment thereof Download PDFInfo
- Publication number
- CN116978883B CN116978883B CN202311241344.7A CN202311241344A CN116978883B CN 116978883 B CN116978883 B CN 116978883B CN 202311241344 A CN202311241344 A CN 202311241344A CN 116978883 B CN116978883 B CN 116978883B
- Authority
- CN
- China
- Prior art keywords
- lead frame
- plate
- plastic
- mounted semiconductor
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 49
- 238000003466 welding Methods 0.000 claims abstract description 17
- 229910000679 solder Inorganic materials 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims description 83
- 229910052751 metal Inorganic materials 0.000 claims description 48
- 239000002184 metal Substances 0.000 claims description 48
- 238000001746 injection moulding Methods 0.000 claims description 11
- 239000002952 polymeric resin Substances 0.000 claims description 11
- 229920003002 synthetic resin Polymers 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 7
- 238000007667 floating Methods 0.000 claims description 3
- 230000002349 favourable effect Effects 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 3
- 238000005476 soldering Methods 0.000 abstract description 3
- 238000004080 punching Methods 0.000 description 7
- 238000005452 bending Methods 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
- 230000002159 abnormal effect Effects 0.000 description 3
- 239000011324 bead Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- BSIDXUHWUKTRQL-UHFFFAOYSA-N nickel palladium Chemical compound [Ni].[Pd] BSIDXUHWUKTRQL-UHFFFAOYSA-N 0.000 description 1
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 1
- 239000010956 nickel silver Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D28/00—Shaping by press-cutting; Perforating
- B21D28/02—Punching blanks or articles with or without obtaining scrap; Notching
- B21D28/14—Dies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D45/00—Ejecting or stripping-off devices arranged in machines or tools dealt with in this subclass
- B21D45/06—Stripping-off devices
- B21D45/08—Stripping-off devices interrelated with motion of tool
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention discloses a side-mounted semiconductor lead frame and blanking equipment thereof, which relate to the technical field of lead frames, and the side-mounted semiconductor lead frame comprises a plurality of lead frames; the PCB substrate is laterally attached below the lead frame and used for installing a plurality of lead frames, solder paste used for welding the PCB substrate and the lead frames is arranged between the PCB substrate and the lead frames, and one side of the lead frame is a plastic rear cover with a supporting part; the bonding pads are located in the plastic rear cover, the height from the bottommost end of the bonding pads at the bottommost part in the lead frame to the PCB substrate after being connected with the PCB substrate is higher than the height from the bottommost end of the lead frame to the PCB substrate, namely, a certain interval is reserved between the bonding pads at the bottom of the lead frame and the bottom of the PCB substrate, so that the welding space of rear-end soldering tin is provided, and the welding yield of products is improved.
Description
Technical Field
The invention relates to the technical field of lead frames, in particular to a side-mounted semiconductor lead frame and blanking equipment thereof.
Background
The lead frame is used as a chip carrier of an integrated circuit, and is a key structural member for realizing the electric connection between an internal circuit lead-out end of the chip and an external lead by means of bonding materials (gold wires, aluminum wires and copper wires) to form an electric loop, and the lead frame is required to be used in most of semiconductor integrated blocks and is an important basic material in the electronic information industry, in the production process, a material plate for producing the lead frame is placed into blanking processing equipment on a machine tool, after the material plate is processed and molded, high polymer resin is subjected to injection molding by an injection mold, then an injection molded single lead frame is welded on a PCB substrate plate by solder paste, and then connection conduction test and the like are carried out, and at least the following defects exist in the process:
when a single lead frame is welded on a PCB substrate board through solder paste, the solder paste is in a paste shape, namely, the shape is soft and variable, and because the lead frame is small in size, when the welding is carried out, the small operation offset can enable the lead frame to be greatly offset when the lead frame is welded on the substrate board, so that the welding position of the lead frame is inaccurate, and the welding yield of products is affected;
when the blanking process is carried out on the material plate, the material plate is stretched into blanking equipment to operate, when a blanking tool of the blanking equipment, namely a punch, moves downwards, the position of the material plate is deviated, so that the hole position, the groove, the bending length angle and the like of the whole material plate can be deviated, and the blanking yield of products is affected.
For this purpose, a side-mounted semiconductor leadframe and a punching device therefor are proposed.
Disclosure of Invention
The invention aims to provide a side-mounted semiconductor lead frame and blanking equipment thereof, which are used for solving the problems in the background technology.
In order to achieve the above purpose, the present invention provides the following technical solutions: a side-mounted semiconductor lead frame comprises a plurality of lead frames;
a PCB substrate which is laterally attached below the lead frame and used for installing a plurality of lead frames, wherein solder paste used for welding the PCB substrate and the lead frames is arranged between the PCB substrate and the lead frames;
one side of the lead frame is a plastic rear cover with a supporting part;
the bonding pads are arranged in the lead frame, the bonding pads are arranged in the plastic rear cover, and the height from the bottommost end of the bonding pads in the lead frame to the PCB base material after the lead frame is connected with the PCB base material is higher than the height from the bottommost end of the plastic rear cover to the PCB base material.
Preferably, the supporting part of lid behind the plastic comprises three be the article style of calligraphy stand, stand integrated into one piece is covered behind the plastic and is located the lateral wall edge of lid behind the plastic, the stand is used for the lead frame supports the lead frame in production process, the material of stand is the plastic, just lid junction front end lateral wall sets up to straight portion behind stand and the plastic, makes lid behind the plastic on the lead frame is the vertical angle that the lid was stable behind the plastic when lid side was pasted on the PCB substrate behind the plastic, lid junction rear end lateral wall sets up to be favorable to resisting the tilting part of the angle deviation that the deformation that the product produced in the welding process brought behind stand and the plastic to increase the lead frame and weld steadiness and reliability on the PCB substrate.
Preferably, the inclined part is provided with a suction nozzle platform, and one end face of the suction nozzle platform is flush with the straight part.
Preferably, the lead frame further comprises a metal substrate, the metal substrate is fixedly connected with the plastic rear cover, and a plurality of holes are formed in the metal substrate; and the connecting surface of the plastic rear cover and the connecting surface of the metal base material are larger than the connecting surface of the metal base material.
Preferably, two metal rods are arranged at the bonding pads of the head part of the lead frame, one ends of the metal rods are connected to the metal base material of the lead frame, the other ends of the metal rods extend into the bonding pad area of the head part of the lead frame, the number of the bonding pads is three, the bonding pads are positioned at the bottom of the insulating reflecting cup of the lead frame, and the three bonding pads are mutually insulated and separated through high-insulativity polymer resin.
Preferably, the connection mode of the metal substrate and the plastic rear cover of the lead frame is injection molding by injecting high polymer resin, and the glue inlet point of the injection molding is one end of the upright post on the plastic rear cover, which is far away from the metal substrate, and the glue inlet point is concave and is positioned at the thickest part of the plastic on the lead frame.
Preferably, the blanking device for the side-mounted semiconductor lead frame comprises an upper die holder, wherein a plurality of U-shaped insulating grooves are formed in the upper die holder, an upper base plate for protecting the upper die holder is connected to the bottom of the upper die holder through a strong spring, a blanking structure is arranged at the bottom of the upper base plate, an upper clamping plate serving as a plane for mounting a part is arranged at the bottom of the upper base plate, a stripping base plate is arranged at the bottom of the upper clamping plate, a stripping plate is arranged at the bottom of the stripping base plate, and the upper base plate, the upper clamping plate, the stripping base plate and the stripping plate are fixed through screw threads;
the stripper plate is characterized in that a lower template is arranged below the stripper plate, a lifting piece is arranged in the lower template, the lower template is used for placing a tablet, a lower base plate is fixedly connected below the lower template, and a lower die holder is movably connected below the lower base plate.
Preferably, the blanking structure comprises a clamping plate insert, a plurality of hole grooves are formed in the upper clamping plate, the clamping plate insert is arranged in the hole grooves, insert cushion blocks are arranged at the openings of the hole grooves, the upper ends of the insert cushion blocks are fixedly connected to the upper die holder, a punch is fixedly connected to the center of the bottom of each insert cushion block, and the punch penetrates through and stretches into the stripper plate and is movably connected with the stripper plate.
Preferably, the stripper plate is provided with a plurality of through empty slots, one end of the punch extends into and is movably connected with the empty slots, one end of the punch extending into the empty slots is fixedly connected with a stripper feeding block, and a knife edge is arranged on the lower die plate corresponding to the punch in an embedded manner.
Preferably, the buoyancy element comprises a buoyancy block, a cavity is formed in the lower die plate, and the buoyancy block is elastically connected in the cavity in a telescopic manner.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, the corresponding pins are arranged on the bonding pads, one ends of the pins are welded on the corresponding PCB base materials at the bottom through solder paste, the corresponding wafers are arranged in the bonding pads, when the wafers control the LED lamp beads, current finally enters the LED lamp beads through the pins, the LED lamp beads can normally emit light, the bonding pads are positioned in the plastic rear cover, the height from the bottommost end of the bonding pads at the bottommost part of the lead frame in the lead frame to the PCB base materials is higher than the height from the bottommost end of the plastic rear cover to the PCB base materials after the lead frame is connected with the PCB base materials, namely, a certain interval is reserved between the bonding pads at the bottom of the lead frame and the bottom of the PCB base materials, so that the welding space of the soldering tin at the rear end is provided, and the welding yield of products is improved;
the suction nozzle platform is designed to facilitate clamping, transferring and the like of the lead frame through the clamping tool, so that the problems that the abnormal shape at the inclined part of the lead frame is unfavorable for being clamped or is easy to deviate and fall off when being clamped can be prevented, the lead frame can be well clamped, transferred and the like only by using a conventional general clamping tool, the production efficiency of products can be improved, and the problems that the production and the transfer of the abnormal shape products are unsmooth, more abnormality occur and the like are solved;
according to the invention, one end of the metal rod is connected to the metal base material of the lead frame, and the other end of the metal rod extends into the bonding pad area of the head part of the lead frame, so that the metal rod can fix the bonding pad position of the head part to make the bonding pad position difficult to deviate in an injection molding stage, various injection molding problems caused by the position deviation of the bonding pad position are reduced, the yield of products is increased, two metal rods can be blanked and bent in a bending stage, three bonding pads are positioned at the cup bottom of an insulating reflection cup of the lead frame, and the three bonding pads are mutually isolated by high-insulation polymer resin so as to prevent interference between the three bonding pads;
the upper base plate is made of a deformation-resistant hard material, is used as a support piece of parts such as a punch and an insert, can bear stress back of the parts such as the punch and the insert in the stamping process, ensures normal work of the parts such as the punch and the insert, and can protect an upper die holder from concave deformation, the bottom of the upper base plate is provided with an upper clamping plate serving as a plane for installing the parts, the parts such as the punch and the insert are limited and fixed through the upper clamping plate, so that the action position accuracy and precision of the parts such as the punch and the insert in work are ensured, and the bottom of the upper clamping plate is provided with a stripping base plate used for bearing concentrated stress generated in blanking the material plate where the lead frame is positioned;
according to the invention, the U-shaped insulating grooves are also formed in the lower die holder, the U-shaped insulating grooves in the upper die holder and the lower die holder are used for being matched with the mounting and fixing structure in the machine tool, so that the upper die holder and the lower die holder can be firmly mounted on the machine tool, after the upper die holder and the lower die holder are respectively correspondingly mounted at corresponding mounting positions in the machine tool, a material plate for punching out a metal base material of a lead frame is placed between the stripper plate and the lower die plate, the material plate is positioned on the lower die plate, and because the upper die holder is fixed on the machine tool, the upper die holder is elastically connected with the upper die plate through a powerful spring, the four fixed plates of the upper die plate can move in a direction far away from the upper die holder under the action of the powerful spring, so that the material plate placed on the lower die plate is pressed tightly and pre-tightened, the material plate is prevented from sliding, then a control driving device on the machine tool controls the upper die holder to move downwards, the stripper plate on the punch block on the punch moves downwards, and finally the lower die plate on the lower die plate is extruded, so that the corresponding lower die plate is punched and bent, and the material plate is punched and bent under the condition that the punching operation is performed accurately;
according to the blanking device, after blanking is finished, the blanking plate can be pressed under the action of the powerful spring, so that when the upper die holder moves back, the blanking plates in the four fixed plates still press the blanking plate, the upper die holder moves back to drive the insert cushion block to move back, the punch fixedly connected with the insert cushion block moves back, the blanked punch and the blanking block thereof leave the blanking plate firstly, and the acting area of the knife edge is larger than that of the empty groove and the blanking block thereof, and therefore waste generated by punching and cutting the blanking plate by the knife edge is pressed by the blanking plate and cannot be stuck with the blanking block, so that the waste is prevented from being carried out from the knife edge on the lower die plate;
according to the invention, when the upper die holder moves back after blanking and forming the material plate, after the punch and the stripping feeding block leave the material plate, the material plate finally moves along with the upper die holder after the powerful spring moves back to the longest length along with the upward movement of the upper die holder, at the moment, the stripping plate leaves the material plate, and the floating block is elastically connected in a telescopic manner, so that the floating block can lift the material plate at the moment, and the material plate is separated from the knife edge, so that the knife edge can be prevented from clamping the material plate, and the material plate can be conveniently moved and taken out after forming.
Drawings
Fig. 1 is a bonding view of a leadframe and PCB substrate of the present invention;
FIG. 2 is a position diagram of the column of the present invention;
fig. 3 is a side view of a leadframe of the present invention;
fig. 4 is a front view of the lead frame of the present invention at a stage of bending;
fig. 5 is a front view of the leadframe of the present invention at an injection stage;
fig. 6 is a front view of the blanking apparatus of the present invention;
FIG. 7 is an enlarged view of a portion of FIG. 6A in accordance with the present invention;
fig. 8 is a partial enlarged view of fig. 6B in accordance with the present invention.
In the figure:
1. a lead frame; 2. a PCB substrate; 3. solder paste; 4. a plastic rear cover; 5. a column; 6. a straight portion; 7. an inclined portion; 8. a suction nozzle platform; 9. a metal rod; 10. a hole; 11. an upper die holder; 12. an upper backing plate; 13. an upper clamping plate; 14. a stripping backing plate; 15. a stripper plate; 16. a lower template; 17. a lower backing plate; 18. a lower die holder; 19. a U-shaped insulating groove; 20. a hole groove; 21. clamping the insert; 22. a seed filling cushion block; 23. a punch; 24. a hollow groove; 25. removing materials and feeding blocks; 26. a knife edge; 27. and a buoyancy block.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1 to 8, the present invention provides a technical solution:
a side-mounted semiconductor lead frame, comprising a plurality of lead frames 1, wherein the lead frames 1 are arranged in a plurality;
a PCB substrate 2 which is laterally attached below the lead frame 1 and used for installing a plurality of lead frames 1, wherein solder paste 3 used for welding the PCB substrate 2 and the lead frame 1 is arranged between the PCB substrate 2 and the lead frame 1;
one side of the lead frame 1 is provided with a plastic rear cover 4 with a supporting part;
locate a plurality of pads in the lead frame 1, be equipped with corresponding pin on the pad, pass through solder paste 3 with pin one end and weld on the PCB substrate 2 of corresponding bottom, be provided with corresponding wafer in the pad, when wafer control LED lamp pearl, the electric current finally gets into the LED lamp pearl through the pin, can make the LED lamp pearl normally give out light, the pad is located plastic back lid 4, just lead frame 1 is being connected back with PCB substrate 2 the bottom of the pad of bottom in the lead frame 1 to the height of PCB substrate 2 is higher than the height of lid 4 bottom to PCB substrate 2 behind the plastic, and certain interval is left apart from PCB substrate 2 bottom to lead frame 1 bottom pad promptly to give back end soldering tin welding space, in order to promote product welding yield.
As an embodiment of the present invention, the supporting portion of the plastic back cover 4 is formed by three inverted-v-shaped pillars 5, the three pillars 5 are configured to support the lead frame 1 when the lead frame 1 side where the plastic back cover 4 is located is attached to the PCB substrate 2, so as to reduce the position error of the lead frame 1 side attached to the PCB substrate 2, and further stabilize the side-attached lead frame 1, the pillars 5 are integrally formed on the plastic back cover 4 and located at the edge of the side wall of the plastic back cover 4, the pillars 5 are used for supporting the lead frame 1 during the production process of the lead frame 1, the front end side wall of the joint between the pillars 5 and the plastic back cover 4 is made of plastic, so that the plastic back cover 4 on the lead frame 1 is made of a vertical angle that is convenient for the plastic back cover 4 to stabilize when the plastic back cover 4 is attached to the PCB substrate 2, the joint between the pillars 5 and the plastic back cover 4 is set to resist the deviation of the angle of the lead frame 1 in the production process of increasing the welding reliability of the lead frame 1 and the welding reliability of the PCB substrate 2.
As an embodiment of the invention, the inclined part 7 is provided with the suction nozzle platform 8, one end surface of the suction nozzle platform 8 is flush with the straight part 6, the suction nozzle platform 8 is designed to facilitate clamping, transferring and the like of the lead frame 1 through a clamping tool, so that the problems that the special shape at the inclined part 7 of the lead frame 1 is unfavorable for being clamped or easily deviates and falls off when being clamped can be prevented, the lead frame 1 can be better clamped, transferred and the like only by a conventional and universal clamping tool, the production efficiency of products can be improved, and the problems that the production and the transfer of special-shaped products are unsmooth, more anomalies occur and the like can be solved.
As an embodiment of the present invention, the lead frame 1 further includes a metal substrate, the metal substrate is fixedly connected with the plastic rear cover 4, the metal substrate is provided with a plurality of holes 10, and the holes 10 are designed such that the polymer resin flows into the holes 10 and is finally solidified when the polymer resin is injection molded by a mold, so that the bonding property and the tensile capability of the metal substrate and the polymer resin can be enhanced; and after the connection of the plastic rear cover 4 and the metal substrate, the connection surface of the plastic rear cover 4 is larger than the connection surface of the metal substrate, namely, after the plastic rear cover 4 is connected with the metal substrate for forming, the plastic with a certain width exceeds the metal boundary, so that the phenomena of plastic metal dislocation, product loosening and the like caused by abnormal appearance sizes such as shrinkage, slight left-right deviation and the like of the plastic can be prevented.
During operation, two metal rods 9 are arranged at the bonding pad of the head part of the lead frame 1, one ends of the metal rods 9 are connected to the metal base material of the lead frame 1, the other ends of the metal rods 9 extend into the bonding pad area of the head part of the lead frame 1, the bonding pad positions of the metal rods 9 can be fixed to be difficult to deviate during an injection molding stage, various injection molding problems caused by the position deviation of the bonding pad positions are reduced, and accordingly the product yield is increased, two metal rods 9 can be punched and bent during a bending stage, the number of bonding pads is three, the bonding pads are positioned at the cup bottom of an insulating reflecting cup of the lead frame 1, and the three bonding pads are isolated from each other in an insulating manner through high-insulation polymer resin, so that interference is prevented from being formed between the three bonding pads.
As an embodiment of the invention, the metal substrate of the lead frame 1 and the plastic rear cover 4 are connected by injection molding through injecting high polymer resin, and the glue inlet point of the injection molding is one end of the upright post 5 on the plastic rear cover 4 far away from the metal substrate, and the glue inlet point is concave in shape, so that appearance defects caused by that the plastic fracture position is higher than the product surface due to poor material pulling of a water gap can be effectively reduced, and the plastic fracture position is positioned at the thickest position of the plastic on the lead frame 1, so that the most difficult glue inlet position is the most advanced, and phenomena of product surface dent, glue shortage, shrinkage and the like are reduced after the plastic fracture position is molded;
the product is arranged on a material sheet with the thickness of less than 0.20mm and the width of less than 61mm, and 12 products are arranged on the material sheet. The distance between every two products in the horizontal direction is less than 7.0mm, the distance between every two products in the vertical direction is less than 6.0mm, resources are fully utilized, the strength of a material rod is enough to support the weight of the products after dispensing without large deformation, in order to increase the weldability of the products and the reflectivity of the bottoms of the bonding pads to the light rays of the wafers, the luminous flux is improved, the service life of the products is prolonged, and the electroplating scheme of the functional area of the metal base material is selectable: nickel palladium gold, nickel silver process.
The blanking equipment for side-mounted semiconductor lead frames comprises an upper die holder 11, wherein a plurality of U-shaped insulating grooves 19 are formed in the upper die holder 11, an upper base plate 12 for protecting the upper die holder 11 is connected to the bottom of the upper base plate 11 through a strong spring, a blanking structure is arranged at the bottom of the upper base plate 12, the upper base plate 12 is made of a deformation-resistant hard material, the upper base plate is used as a supporting piece for parts such as a punch 23 and inserts, the parts such as the punch 23 and inserts can bear stress back in the punching process, normal operation of the parts such as the punch 23 and inserts is ensured, the upper die holder 11 can be protected from being deformed in a sinking manner, an upper clamping plate 13 serving as a plane for installing the parts is arranged at the bottom of the upper base plate 12, the parts such as the punch 23 and inserts are limited and fixed through the upper clamping plate 13, a material removing base plate 14 is arranged at the bottom of the upper clamping plate 13, the material removing base plate 14 is used for bearing the material collecting plate produced in blanking of the lead frames 1, the material collecting plate 14 is arranged at the bottom of the upper clamping plate 13, the material removing base plate 15 is fixed through bolts 15,
the stripper plate 15 below is provided with lower bolster 16, be provided with the buoyancy lift in the lower bolster 16, lower bolster 16 is used for placing the tablet, lower bolster 17 is fixedly connected with below the lower bolster 16, lower bolster 17 below swing joint has die holder 18.
The blanking structure comprises a clamping plate insert 21, a plurality of hole grooves 20 are formed in the upper clamping plate 13, the clamping plate insert 21 is arranged in the hole grooves 20, insert cushion blocks 22 are arranged at the opening positions of the hole grooves 20, a punch 23 is fixedly connected to the center of the bottom of each insert cushion block 22, the upper ends of the insert cushion blocks 22 are fixedly connected to the upper die holder 11, and the punch 23 penetrates through the insert stripping plate 15 and is movably connected.
The stripper plate 15 is provided with a plurality of through empty slots 24, one end of a punch 23 extends into and is movably connected in the empty slots 24, one end of the punch 23 extending into the empty slots 24 is fixedly connected with a stripper plate 25, a knife edge 26 is arranged on the lower die plate 16 in an embedded manner corresponding to the punch 23, the lower die plate 18 is also provided with a U-shaped insulating slot 19, the U-shaped insulating slots 19 on the upper die plate 11 and the lower die plate 18 are matched with a mounting and fixing structure on a machine tool, so that the stripper plate can be firmly mounted on the machine tool, a stripper plate for punching out a metal substrate of the lead frame 1 is placed between the stripper plate 15 and the lower die plate 16 after the upper die plate 11 and the lower die plate 18 are respectively correspondingly mounted on the corresponding mounting positions of the machine tool, the stripper plate is positioned on the lower die plate 16, and because the upper die plate 11 is fixed on the machine tool, the upper die plate 11 is elastically connected with the upper die plate 12 through a powerful spring, the acting force of the powerful spring can enable the four fixed die plate 12 to move away from the upper die plate 11 in a direction away from the upper die plate 11, thus the punch plate 11 is tightly pressed tightly, the punch plate 23 is prevented from being clamped by the die plate 23, and the punch plate 23 is tightly pressed by the die plate 23 is tightly arranged under the die plate 23, and the die plate is prevented from being punched and the die plate is tightly placed under the conditions, and the die plate is tightly pressed by the die plate 23, and the die plate is conveniently and the die plate is tightly pressed by the die plate 23, and the die plate 23 is conveniently and the punch plate is tightly pressed by the die plate, and is conveniently and tightly pressed;
after blanking is finished, the material plate can be pressed under the action of a powerful spring, so that when the upper die holder 11 moves back, the material plate 15 in the four fixed plates still presses the material plate, the upper die holder 11 moves back to drive the insert cushion block 22 to move back, the punch 23 fixedly connected with the insert cushion block 22 moves back, the punched punch 23 and the material plate 25 leave the material plate firstly, and the acting area of the knife edge 26 is larger than that of the empty groove 24 and the material plate 25, and therefore, the waste generated by punching and cutting the material plate by the knife edge 26 is pressed by the material plate 15 and cannot be stuck with the material plate 25, so as to prevent the waste from being carried out from the knife edge 26 on the lower die plate 16;
more preferably, the knife edge 26 can be set into different dies, the cutting and clipping dies can cut the corresponding positions of the material plate, and the bending dies can bend the corresponding positions of the material plate;
the lifting piece comprises a lifting block 27, a cavity is formed in the lower die plate 16, the lifting block 27 is elastically and telescopically connected in the cavity, when the upper die holder 11 moves back after blanking forming is carried out on the material plate, after the punch 23 and the stripping and feeding block 25 leave the material plate, the powerful spring moves back to the longest length along with the upward movement of the upper die holder 11, and finally the stripping plate 15 moves along with the upper die holder 11, at the moment, the stripping plate 15 leaves the material plate, and the lifting block 27 is elastically and telescopically connected, so that the lifting block 27 can lift the material plate at the moment, the material plate is separated from the knife edge 26, and the knife edge 26 can be prevented from clamping the material plate, thereby facilitating the movement and the extraction after the material plate forming.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. A side-mounted semiconductor lead frame, comprising:
a plurality of lead frames (1), each lead frame (1);
a PCB substrate (2) which is laterally attached below the lead frames (1) and used for installing a plurality of lead frames (1), wherein solder paste (3) used for welding the PCB substrate (2) and the lead frames (1) is arranged between the PCB substrate (2) and the lead frames (1);
one side of the lead frame (1) is provided with a plastic rear cover (4) with a supporting part;
the bonding pads are arranged in the lead frame (1), are positioned in the plastic rear cover (4), and the height from the bottommost end of the bonding pad in the lead frame (1) to the PCB base material (2) after the bonding pad is connected with the PCB base material (2) is higher than the height from the bottommost end of the plastic rear cover (4) to the PCB base material (2);
the supporting part of lid (4) behind plastic comprises three stand (5) that are the article style of calligraphy, stand (5) integrated into one piece is lid (4) behind the plastic and is located the lateral wall edge of lid (4) behind the plastic, stand (5) are used for lead frame (1) supports lead frame (1) in the production process, the material of stand (5) is the plastic, just stand (5) and plastic lid (4) junction front end lateral wall set up to straight portion (6), make lid (4) side is the vertical angle that lid (4) are stable behind the plastic when pasting on PCB substrate (2) behind the plastic on lead frame (1), stand (5) and lid (4) junction rear end lateral wall are set up as slope (7) that are favorable to resisting the angle deviation that the deformation that the product produced in the welding process brought to increase lead frame (1) and weld steadiness and reliability on PCB substrate (2).
2. A side-mounted semiconductor lead frame as defined in claim 1, wherein: the suction nozzle platform (8) is arranged on the inclined part (7), and one end face of the suction nozzle platform (8) is flush with the straight part (6).
3. A side-mounted semiconductor lead frame as defined in claim 2, wherein: the lead frame (1) further comprises a metal base material, the metal base material is fixedly connected with the plastic rear cover (4), and a plurality of holes (10) are formed in the metal base material; and the connecting surface of the plastic rear cover (4) and the connecting surface of the metal base material are larger than the connecting surface of the metal base material.
4. A side-mounted semiconductor lead frame as defined in claim 3, wherein: two metal rods (9) are arranged at bonding pads of the head of the lead frame (1), one ends of the metal rods (9) are connected to a metal base material of the lead frame (1), the other ends of the metal rods extend into bonding pad areas of the head of the lead frame (1), the number of the bonding pads is three, the bonding pads are located at the bottom of an insulating reflecting cup of the lead frame (1), and the bonding pads are isolated from each other in an insulating manner through high-polymer resin with high insulativity.
5. The side-mounted semiconductor lead frame as defined in claim 4, wherein: the connection mode of the metal base material of the lead frame (1) and the plastic rear cover (4) is injection molding by injecting high polymer resin, the glue inlet point of the injection molding is one end of the upright post (5) on the plastic rear cover (4) far away from the metal base material, the glue inlet point is concave and is positioned at the thickest plastic thickness part of the lead frame (1).
6. The blanking equipment for the side-mounted semiconductor lead frame is applied to the side-mounted semiconductor lead frame disclosed in claim 5 and is characterized by comprising an upper die holder (11), wherein a plurality of U-shaped insulating grooves (19) are formed in the upper die holder (11), an upper base plate (12) for protecting the upper die holder (11) is connected to the bottom of the upper die holder (11) through a strong spring, a blanking structure is arranged at the bottom of the upper base plate (12), an upper clamping plate (13) serving as a plane of a mounting part is arranged at the bottom of the upper base plate (12), a stripping base plate (14) is arranged at the bottom of the upper clamping plate (13), a stripping plate (15) is arranged at the bottom of the stripping base plate (14), and the upper base plate (12), the upper clamping plate (13), the stripping base plate (14) and the stripping plate (15) are fixed through screw threads of bolts;
the material removing plate is characterized in that a lower template (16) is arranged below the material removing plate (15), a floating piece is arranged in the lower template (16), the lower template (16) is used for placing a material sheet, a lower base plate (17) is fixedly connected below the lower template (16), and a lower die holder (18) is movably connected below the lower base plate (17).
7. The blanking apparatus of a side-mounted semiconductor lead frame as claimed in claim 6, wherein: the blanking structure comprises a clamping plate insert (21), a plurality of hole grooves (20) are formed in the upper clamping plate (13), the clamping plate insert (21) is arranged in the hole grooves (20), insert cushion blocks (22) are arranged at the openings of the hole grooves (20), the upper ends of the insert cushion blocks (22) are fixedly connected to the upper die holder (11), a punch (23) is fixedly connected to the center of the bottom of the insert cushion blocks (22), and the punch (23) penetrates through and stretches into the stripper plate (15) and is movably connected.
8. The blanking apparatus of a side-mounted semiconductor lead frame as claimed in claim 7, wherein: a plurality of through empty slots (24) are formed in the stripping plate (15), one end of the punch (23) extends into the empty slots (24) and is movably connected with the empty slots, one end of the punch (23) extending into the empty slots (24) is fixedly connected with a stripping feeding block (25), and a knife edge (26) is arranged on the lower die plate (16) in an embedded mode corresponding to the punch (23).
9. The blanking apparatus of a side-mounted semiconductor lead frame as claimed in claim 8, wherein: the buoyancy member comprises a buoyancy block (27), a cavity is formed in the lower die plate (16), and the buoyancy block (27) is elastically connected in the cavity in a telescopic mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311241344.7A CN116978883B (en) | 2023-09-25 | 2023-09-25 | Side-mounted semiconductor lead frame and blanking equipment thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311241344.7A CN116978883B (en) | 2023-09-25 | 2023-09-25 | Side-mounted semiconductor lead frame and blanking equipment thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116978883A CN116978883A (en) | 2023-10-31 |
| CN116978883B true CN116978883B (en) | 2023-12-12 |
Family
ID=88485399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311241344.7A Active CN116978883B (en) | 2023-09-25 | 2023-09-25 | Side-mounted semiconductor lead frame and blanking equipment thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116978883B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101049488B1 (en) * | 2010-06-28 | 2011-07-15 | 주식회사 루멘스 | Side view type light emitting device package and backlight module |
| KR20120066454A (en) * | 2010-12-14 | 2012-06-22 | 삼성엘이디 주식회사 | Led package |
| CN205383447U (en) * | 2016-02-18 | 2016-07-13 | 江苏欧密格光电科技股份有限公司 | Take lens can all -round paster chip LED |
| CN210245494U (en) * | 2019-08-15 | 2020-04-03 | 安徽盛烨电子有限公司 | Novel LED lead frame of cup-shaped structure |
| CN217507380U (en) * | 2022-06-22 | 2022-09-27 | 深圳市宇亮光电技术有限公司 | Square side-mounted lamp bead |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020113301A1 (en) * | 2001-02-20 | 2002-08-22 | Tai Pei Ling | Leadless semiconductor package |
-
2023
- 2023-09-25 CN CN202311241344.7A patent/CN116978883B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101049488B1 (en) * | 2010-06-28 | 2011-07-15 | 주식회사 루멘스 | Side view type light emitting device package and backlight module |
| KR20120066454A (en) * | 2010-12-14 | 2012-06-22 | 삼성엘이디 주식회사 | Led package |
| CN205383447U (en) * | 2016-02-18 | 2016-07-13 | 江苏欧密格光电科技股份有限公司 | Take lens can all -round paster chip LED |
| CN210245494U (en) * | 2019-08-15 | 2020-04-03 | 安徽盛烨电子有限公司 | Novel LED lead frame of cup-shaped structure |
| CN217507380U (en) * | 2022-06-22 | 2022-09-27 | 深圳市宇亮光电技术有限公司 | Square side-mounted lamp bead |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116978883A (en) | 2023-10-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR920010198B1 (en) | Leadframe and method of producing electronic components using such improved lead frame | |
| US6957898B2 (en) | Adhesive type LED lead frame | |
| JPH05144992A (en) | Semiconductor device and its production, lead frame used for semiconductor production and its production | |
| CN116978883B (en) | Side-mounted semiconductor lead frame and blanking equipment thereof | |
| CN216461182U (en) | Precise miniature shell punching die | |
| CN105097755A (en) | Method of singularizing packages and leadframe | |
| CN213401186U (en) | Lead frame with stress release structure and packaging material sheet | |
| CN213857775U (en) | Silver point cutting and welding device | |
| CN211539286U (en) | Stamping hardware of electronic equipment | |
| CN210705142U (en) | Secondary cuts module | |
| CN111112495A (en) | Flexible forming method and forming die for pins of SOT integrated circuit packaging products | |
| CN206076213U (en) | Lead frame feeding guide | |
| CN218395598U (en) | Punching die for lead frame | |
| CN212257347U (en) | Equipment for packaging full-automatic integrated circuit board | |
| CN206509407U (en) | The diel of self-feeding in a kind of mould | |
| CN202008986U (en) | Cutting device for semiconductor packaging defective product | |
| CN218079794U (en) | Anti-stamping die structure of LED support | |
| CN103700757A (en) | Surface-mounted LED (light-emitting diode) lead frame and manufacturing method thereof | |
| CN215430933U (en) | Automatic bending equipment for radiating fins | |
| CN113707791B (en) | LED manufacturing process | |
| CN219591390U (en) | Tool for preventing TOLL frame from deforming | |
| CN213968580U (en) | Display trilateral frame punching aperture cutting device | |
| CN213495966U (en) | Stamping structure of wiring fixing plate | |
| CN206677000U (en) | A kind of mould for being used to separate the series leads frame semiconductor-on-insulator products of SOT 89 | |
| CN218896642U (en) | Self-positioning packaging structure of Schottky diode |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |