CN205383447U - Take lens can all -round paster chip LED - Google Patents
Take lens can all -round paster chip LED Download PDFInfo
- Publication number
- CN205383447U CN205383447U CN201620128015.0U CN201620128015U CN205383447U CN 205383447 U CN205383447 U CN 205383447U CN 201620128015 U CN201620128015 U CN 201620128015U CN 205383447 U CN205383447 U CN 205383447U
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- copper foil
- pcb substrate
- base plate
- pcb base
- wafer
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Abstract
The utility model discloses a take lens can all -round paster chip LED, including PCB base plate, LED lamp pearl and wafer, LED lamp pearl is installed at the PCB base plate openly, and the wafer is installed inside the PCB base plate, fixes on the PCB base plate through crystal glue, and the PCB base plate sets up a plurality of copper foils for the tin cream that welds during the connected stick piece, PCB base plate openly set up first copper foil and second copper foil, and two copper foils are located PCB base plate both ends respectively, and the second copper foil covers the wafer, PCB back of the substrate sets up third copper foil, fourth copper foil and the 5th copper foil, and third copper foil and the 5th copper foil are located PCB base plate both ends respectively, and the fourth copper foil is located PCB base plate middle position. The utility model discloses a there is the copper foil PCB base plate side to be communicating with positive negative pole, the positive negative pole as the product when the side is pasted uses, also there is the copper foil at the back of product, can just paste, have the copper foil in the front of product, the back of the body that does pastes.
Description
Technical field
This utility model relate to a kind of with lens can the ChipLED of comprehensive paster, belong to LED technology field.
Background technology
It is little that the ChipLED with Lens in the market has lighting angle, optically focused, owing to being one-shot forming in process of production, therefore compared with the product of traditional ChipLED plane series, improve production efficiency, but product in the market, during use, can just paste or carry on the back patch, but without occurring what side was pasted.
Utility model content
In order to overcome above-mentioned deficiency, this utility model provide a kind of new structure with lens can the ChipLED of comprehensive paster.
The technical solution of the utility model is as follows:
A kind of with lens can the ChipLED of comprehensive paster, including PCB substrate, LED lamp bead and wafer, described LED lamp bead is arranged on PCB substrate front, wafer is arranged on inside PCB substrate, is fixed in PCB substrate by crystal glue, and described PCB substrate arranges some Copper Foils, the tin cream welded during for connecting paster, described PCB substrate front arranges the first Copper Foil and the second Copper Foil, and said two Copper Foil lays respectively at PCB substrate two ends, and described second Copper Foil covers wafer；The described PCB substrate back side arranges the 3rd Copper Foil, the 4th Copper Foil and the 5th Copper Foil, and described 3rd Copper Foil and the 5th Copper Foil lay respectively at PCB substrate two ends, and described 4th Copper Foil is positioned at PCB substrate middle position.
Above-mentioned 3rd Copper Foil and the 5th Copper Foil are symmetrical.
Above-mentioned 4th Copper Foil traverses the PCB substrate back side, and two ends are two symmetrical semicircles respectively, lays respectively on the horizontal edge of PCB substrate, is connected by rectangular-shaped Copper Foil.
The beneficial effect that this utility model reaches:
There is Copper Foil PCB substrate side of the present utility model, and communicates with both positive and negative polarity, uses as the both positive and negative polarity of product when pasting in side；Also there is Copper Foil at the back of product, it is possible to just paste；It is have Copper Foil equally in the front of product, also can carry on the back patch.
Accompanying drawing explanation
Fig. 1 is schematic diagram of the present utility model；
Fig. 2 is the top view of Fig. 1；
Fig. 3 is the upward view of Fig. 1；
Fig. 4 is this utility model schematic diagram when just pasting；
Fig. 5 is the top view of Fig. 4；
Fig. 6 is schematic diagram during this utility model back of the body patch；
Fig. 7 is the top view of Fig. 6；
Fig. 8 is the schematic diagram during patch of this utility model side；
Fig. 9 is the top view of Fig. 8.
Detailed description of the invention
Below in conjunction with accompanying drawing, this utility model is further described.Following example are only for clearly illustrating the technical solution of the utility model, and can not limit protection domain of the present utility model with this.
As shown in Figure 1, Figure 2, Figure 3 shows, a kind of with lens can the ChipLED of comprehensive paster, including PCB substrate 1, LED lamp bead 2 and wafer 3, LED lamp bead 2 is arranged on PCB substrate 1 front, and it is internal that wafer 3 is arranged on PCB substrate 1, it is fixed in PCB substrate 1 by crystal glue 4, PCB substrate 4 arranges some Copper Foils, the tin cream 11 welded during for connecting paster, and PCB substrate 1 front arranges the first Copper Foil 5 and the second Copper Foil 6, two Copper Foils lay respectively at PCB substrate 1 two ends, and the second Copper Foil 6 covers wafer 3；PCB substrate 1 back side arranges the 3rd Copper Foil the 7, the 4th Copper Foil 8 and the 5th Copper Foil 9, and the 3rd Copper Foil 8 and the 5th Copper Foil 9 lay respectively at PCB substrate 1 two ends, and the 4th Copper Foil 8 is positioned at PCB substrate 1 middle position.
Above-mentioned 3rd Copper Foil 7 and the 5th Copper Foil 9 are symmetrical.
Above-mentioned 4th Copper Foil 8 traverses PCB substrate 1 back side, and two ends are two symmetrical semicircles respectively, lays respectively on the horizontal edge of PCB substrate 1, is connected by rectangular-shaped Copper Foil.
Embodiment 1:
Schematic diagram when just pasting for utility model as shown in Figure 4, Figure 5, PCB substrate 1 is arranged on the front of wiring board 10, and the both sides tin cream 11 on wiring board 11 connects the first Copper Foil 5 and the second Copper Foil 6 respectively.
Embodiment 2:
Schematic diagram time as shown in Figure 6, Figure 7 for utility model back of the body patch, PCB substrate 1 is arranged on the back side of two wiring boards 10, and LED lamp bead 2 passes from two wiring boards 10, and both sides tin cream 11 is welded in the back side of wiring board 10, connects the first Copper Foil 5 and the second Copper Foil 6 respectively.
Embodiment 3:
Schematic diagram when pasting for utility model side as shown in Figure 8, Figure 9, PCB substrate 1 is mounted laterally the front at wiring board 10, and wiring board 11 arranges three place's tin creams 11, is welded in the 3rd Copper Foil the 7, the 4th Copper Foil 8 and the 5th Copper Foil 9 place respectively.
The above is only preferred implementation of the present utility model; should be understood that; for those skilled in the art; under the premise without departing from this utility model know-why; can also making some improvement and deformation, these improve and deformation also should be regarded as protection domain of the present utility model.
Claims (3)
1. one kind with lens can the ChipLED of comprehensive paster, including PCB substrate, LED lamp bead and wafer, described LED lamp bead is arranged on PCB substrate front, wafer is arranged on inside PCB substrate, is fixed in PCB substrate by crystal glue, it is characterised in that: described PCB substrate arranges some Copper Foils, the tin cream welded during for connecting paster, described PCB substrate front arranges the first Copper Foil and the second Copper Foil, and said two Copper Foil lays respectively at PCB substrate two ends, and described second Copper Foil covers wafer；The described PCB substrate back side arranges the 3rd Copper Foil, the 4th Copper Foil and the 5th Copper Foil, and described 3rd Copper Foil and the 5th Copper Foil lay respectively at PCB substrate two ends, and described 4th Copper Foil is positioned at PCB substrate middle position.
2. according to claim 1 with lens can the ChipLED of comprehensive paster, it is characterised in that: described 3rd Copper Foil and the 5th Copper Foil are symmetrical.
3. according to claim 1 with lens can the ChipLED of comprehensive paster, it is characterised in that: described 4th Copper Foil traverses the PCB substrate back side, and two ends are two symmetrical semicircles respectively, lays respectively on the horizontal edge of PCB substrate, is connected by rectangular-shaped Copper Foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620128015.0U CN205383447U (en) | 2016-02-18 | 2016-02-18 | Take lens can all -round paster chip LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620128015.0U CN205383447U (en) | 2016-02-18 | 2016-02-18 | Take lens can all -round paster chip LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205383447U true CN205383447U (en) | 2016-07-13 |
Family
ID=56350737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620128015.0U Active CN205383447U (en) | 2016-02-18 | 2016-02-18 | Take lens can all -round paster chip LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205383447U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116978883A (en) * | 2023-09-25 | 2023-10-31 | 安徽盛烨电子科技有限公司 | Side-mounted semiconductor lead frame and blanking equipment thereof |
-
2016
- 2016-02-18 CN CN201620128015.0U patent/CN205383447U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116978883A (en) * | 2023-09-25 | 2023-10-31 | 安徽盛烨电子科技有限公司 | Side-mounted semiconductor lead frame and blanking equipment thereof |
| CN116978883B (en) * | 2023-09-25 | 2023-12-12 | 安徽盛烨电子科技有限公司 | Side-mounted semiconductor lead frame and blanking equipment thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: 213000 No. 3, Longwo Road, Wujin hi tech Industrial Development Zone, Changzhou, Jiangsu Patentee after: JIANGSU AMICC OPTOELECTRONICS TECHNOLOGY CO., LTD. Address before: 213000 No. 98 South Central Road, Gulan Industrial Park, Wujin District, Changzhou, Jiangsu. Patentee before: JIANGSU AMICC OPTOELECTRONICS TECHNOLOGY CO., LTD. |