CN204011475U - LED paster - Google Patents
LED paster Download PDFInfo
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- CN204011475U CN204011475U CN201420437001.8U CN201420437001U CN204011475U CN 204011475 U CN204011475 U CN 204011475U CN 201420437001 U CN201420437001 U CN 201420437001U CN 204011475 U CN204011475 U CN 204011475U
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- pin
- support
- fin
- led paster
- paster
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Abstract
The utility model discloses a kind of LED paster, comprise support, support is provided with pin and fin, fin is located at support one side, pin is fixedly attached to cradle back and stretches out, pin extension is rectangular, by increasing fin, make LED paster except passing through pin, also can increase heat by fin and disperse face, pin is changed the technique of in the past binding foot in addition, adopt right angle form, the paster that is not only more conducive to LED paster is used, and due to the contact-making surface with support still less, therefore be more conducive to the heat conduction of pin, thereby make LED paster can support more powerful use.
Description
Technical field
The utility model relates to a kind of LED paster, particularly a kind of 5050 type LED pasters.
Background technology
Existing LED paster, especially 5050 paster series, are to improve the Novel LED pasted of three times based on designing brightness on 3528 serial bases.5050 paster series are generally square, and its wiring board is wider than other serial pasters, and therefore this paster has single high brightness, high-power feature.
Because the design original intention of 5050 paster series is high brightness, and along with advantages such as its lighting angle are large, weatherability is strong, purposes expands just gradually.Paster is mainly realized radiating effect by the circuit board on pin and pin or aluminium base at present.The pin production technology of present 5050 paster series is to be all made as one to bind foot, and this pin of binding foot exists surface irregularity, is unfavorable for the shortcoming of heat conduction.Current 5050 pasters series on the market, the maximum 0.18W of the power that generally can support, luminous flux is not higher than 30lm.Due to the high brightness demand of 5050 paster series, the heat dispersion of current 5050 paster series is limited, is still not enough to support more high power, therefore can not be for high-power products such as vehicle-mounted illuminations.
Utility model content
Thereby the purpose of this utility model be to provide a kind of by improve heat dispersion can support in, the 5050 type LED pasters that use of high-power product.
According to an aspect of the present utility model, a kind of LED paster is provided, be provided with support, support is provided with pin and fin, and fin is located at support one side, and pin is fixedly attached to cradle back and stretches out, and pin extension is rectangular.
Its beneficial effect is, by increasing fin, make LED paster except by pin, also can increase heat by fin and disperse face, pin is changed the technique of in the past binding foot in addition, adopt right angle form, the paster that is not only more conducive to LED paster is used, and due to the contact-making surface with support still less, therefore be more conducive to the heat conduction of pin, thereby make LED paster can support more powerful use.
In some embodiments, the lateral surface of pin is flat surface.
Its beneficial effect is, smooth pin is not only more conducive to paster and uses, and due to the contact-making surface having increased with pasting circuit board, is therefore more conducive to heat radiation.
In some embodiments, cradle back is a plane, and the lateral surface of pin and cradle back are positioned at same plane.
Its beneficial effect is, is different from the technique of binding foot, and right angle pin has strengthened the rule planarization of pin lateral surface, so cradle back can directly be designed to plane, with pin together completely and circuit board fit to improve heat dispersion.
In some embodiments, fin is embedded in rack surface.
Its beneficial effect is, fin is embedded in support, increases the contact-making surface of fin and support, makes the heat of the support fin that can lead more, and by fin, heat diffused to the external world.
In some embodiments, fin is embedded in cradle back, and fin lateral surface and cradle back are positioned at same plane.
Its beneficial effect is, by heat sink design in cradle back, can make fin contact with circuit board, rely on circuit board more fast heat to be derived, in addition because fin is embedded in support, therefore can at an easy rate fin and cradle back be designed to smooth plane, make to guarantee support can with the more large-area laminating of circuit board, improve heat dispersion.
Accompanying drawing explanation
Fig. 1 is the overall structure schematic diagram of the LED paster of the utility model one execution mode.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in further detail.
Fig. 1 has schematically shown the 5050 type LED pasters according to a kind of execution mode of the present utility model.
LED paster is provided with support 1, and the back side 11 of support 1 is fixedly connected with pin 2 and fin 3.The back side 11 of support 1 is for the circuit board with product or aluminium base laminating turning circuit.
Pin 2 is attached to the side at support 1 back side 11, and stretches out and be angular moment shape always.Fin 3 is embedded in the back side 11 mid portions of support 1.The back side 11 of support 1 together with the lateral surface 21 of pin 2, the lateral surface of fin 3 is positioned at same smooth plane.
The support 1 of LED paster is semiconductor material, itself has heat sinking function, because the pin 2 of 5050 pasters in the past adopts the technique of binding foot, be difficult to guarantee the rule planarization of the lateral surface 21 of pin 2, therefore the back side 11 of 5050 pasters is all generally that mid portion is outstanding, recessed with the lateral section that pin 2 is connected, to guarantee that support 1 contacts to improve heat radiation as far as possible with circuit board.
The pin 2 of the present embodiment is different from the technique of binding foot, and pin 2 is rectangular-shaped toward extension, therefore can control well the planarization of the lateral surface 21 of pin 2.Fin 3 is embedded in the contact-making surface that can increase support 1 and fin 3 in support 1 in addition, and fin 3 is arranged at mid portion, can make the heat of support 1 fin 3 that leads better.
Therefore support 1 back side 11 can directly be designed to plane, the design of combined radiating sheet 3, right angle pin 2, and making support 1 back side 11 is a smooth plane, maximizes the contact-making surface of LED paster and circuit board, effectively strengthens the heat dispersion of LED paster.
Below by the performance abridged table of the designed a 5050 type LED pasters of the present embodiment:
Only a kind of execution mode of the present utility model in sum; should be understood that for the person of ordinary skill of the art; without departing from the concept of the premise utility, can also make some improvement, within these also should be considered as protection range of the present utility model.
Claims (5)
1.LED paster, it is characterized in that, comprise support (1), described support (1) is provided with pin (2) and fin (3), described fin (3) is located at support (1) one side, described pin (2) is fixedly attached to the back side (11) of support (1) and stretches out, and described pin (2) extension is rectangular.
2. LED paster according to claim 1, is characterized in that, the lateral surface (21) of described pin (2) is flat surface.
3. LED paster according to claim 2, is characterized in that, the described back side (11) are a plane, and the lateral surface (21) of described pin (2) is positioned at same plane with the back side (11).
4. LED paster according to claim 1, is characterized in that, described fin (3) is embedded in support (1) surface.
5. LED paster according to claim 4, is characterized in that, described fin (3) is embedded in the back side (11), and described fin (3) lateral surface and the described back side (11) are positioned at same plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420437001.8U CN204011475U (en) | 2014-08-04 | 2014-08-04 | LED paster |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420437001.8U CN204011475U (en) | 2014-08-04 | 2014-08-04 | LED paster |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204011475U true CN204011475U (en) | 2014-12-10 |
Family
ID=52051433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420437001.8U Active CN204011475U (en) | 2014-08-04 | 2014-08-04 | LED paster |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204011475U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106851962A (en) * | 2017-02-23 | 2017-06-13 | 深圳市华星光电技术有限公司 | A kind of encapsulating structure of linear voltage regulator |
-
2014
- 2014-08-04 CN CN201420437001.8U patent/CN204011475U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106851962A (en) * | 2017-02-23 | 2017-06-13 | 深圳市华星光电技术有限公司 | A kind of encapsulating structure of linear voltage regulator |
| CN106851962B (en) * | 2017-02-23 | 2019-04-05 | 深圳市华星光电技术有限公司 | A kind of encapsulating structure of linear voltage regulator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |