CN203398160U - LED light source packaging structure - Google Patents

LED light source packaging structure Download PDF

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Publication number
CN203398160U
CN203398160U CN201320471388.4U CN201320471388U CN203398160U CN 203398160 U CN203398160 U CN 203398160U CN 201320471388 U CN201320471388 U CN 201320471388U CN 203398160 U CN203398160 U CN 203398160U
Authority
CN
China
Prior art keywords
light source
led light
led
packaging structure
resin layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201320471388.4U
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Chinese (zh)
Inventor
李高武
金亦君
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fenghua City Jin Yuan Electronics Co Ltd
Original Assignee
Fenghua City Jin Yuan Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fenghua City Jin Yuan Electronics Co Ltd filed Critical Fenghua City Jin Yuan Electronics Co Ltd
Priority to CN201320471388.4U priority Critical patent/CN203398160U/en
Application granted granted Critical
Publication of CN203398160U publication Critical patent/CN203398160U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to the technical field of LED lamps and particularly relates to an LED light source packaging structure. The LED light source packaging structure comprises a substrate, an LED light source is arranged on the substrate, and the surface of a packaging resin layer of the LED light source is provided with plural micro lenses. According to the LED light source packaging structure, the packaging resin layer at the surface of the LED light source is flat, light through the micro lenses can be scattered, then light emitted by an LED chip is scattered due to functions of the surface resin and the micro lenses, so that the total reflection loss caused by the secondary light distribution of a lamp is prevented, and the lighting effect when the LED lamp is applied is improved.

Description

A kind of LED light source encapsulating structure
Technical field
The utility model relates to LED lamp technical field, particularly a kind of LED light source encapsulating structure.
Background technology
LED is as the light source of new generation getting most of the attention, and has that volume is little, luminous flux is large, all solid state work, compact conformation, green non-pollution, a plurality of advantages such as efficient, energy-conservation.But it is half space Lambertian source that its typical case goes out light characteristic, on common LED light fixture owing to using the lens of plane, because the relation of total reflection is understood some light and is being lost when the lens, and easily cause the shortcomings such as Luminance Distribution is unreasonable, dazzle, therefore traditional planar light source lens can not meet the requirement of LED light fixture, so be necessary current technology to improve, the light source that LED is sent is redistributed, thus the illumination usefulness of raising LED.
Utility model content
The purpose of this utility model is for the defect of prior art and deficiency, and a kind of rational in infrastructure, reflectivity is low, light efficiency is higher LED light source encapsulating structure is provided.
For achieving the above object, the utility model is by the following technical solutions:
An encapsulating structure, comprises substrate, and substrate is provided with LED light source, and the potting resin layer surface of described LED light source is provided with some lenticules.
Further, the evenly distributed potting resin layer surface that is arranged at LED light source of described some lenticules.
Further, described lenticule is the semiglobe setting of decile, and lenticular ball section is attached on LED light source.
Further, mutual conflict close-packed arrays between described some lenticules.
The utility model beneficial effect is: the potting resin layer on LED light source of the present utility model surface is plane, and can there is scattering process through lenticular light, and then be that the light that sends of LED chip is through top layer resin and lenticular effect, there is scattering phenomenon, with the total reflection loss of avoiding the secondary light-distribution of light fixture to produce, the light efficiency while improving LED lamp applications.
Accompanying drawing explanation
Fig. 1 is plan structure schematic diagram of the present utility model;
Fig. 2 is the structural representation of facing of the present utility model.
In figure:
1, substrate; 2, LED light source; 3, lenticule.
Embodiment
Below in conjunction with accompanying drawing, the utility model is further described.
A kind of LED light source encapsulating structure, comprise substrate 1, substrate 1 is provided with LED light source 2, the potting resin layer surface of described LED light source 2 is provided with some lenticules 3, the light that LED light source 2 sends sends after top layer potting resin and lenticule 3, through the spherical convex lens effect of lenticule 3, make light produce scattering effect, to reduce the total reflection loss after the secondary light-distribution of light fixture.
The evenly distributed potting resin layer surface that is arranged at LED light source 2 of described some lenticules 3, mutual conflict close-packed arrays between some lenticules 3; Lenticule 3 covers the rising angle of LED light source 2 with maximum efficiency, to improve scattered power and the light efficiency utilance of lenticule 3.
Described lenticule 3 is the semiglobe setting of decile, be that lenticule 3 is convex lens, the ball section of lenticule 3 is attached on LED light source 2, the integrative-structure that the potting resin layer of lenticule 3 and LED light source 2 is homogeneity, light can be directly by so that avoid reflection loss, and the scattering effect of lenticule 3 makes to avoid total reflection phenomenon to cause the loss of light efficiency by most of light of LED light source 2.
The above is only better embodiment of the present utility model, and the equivalence of doing according to structure, feature and principle described in the utility model patent claim therefore all changes or modifies, and is included in the utility model patent claim.

Claims (4)

1. a LED light source encapsulating structure, is characterized in that: comprise substrate (1), substrate (1) is provided with LED light source (2), and the potting resin layer surface of described LED light source (2) is provided with some lenticules (3).
2. LED light source encapsulating structure according to claim 1, is characterized in that: the evenly distributed potting resin layer surface that is arranged at LED light source (2) of described some lenticules (3).
3. LED light source encapsulating structure according to claim 1, it is characterized in that: described lenticule (3) is the semiglobe setting of decile, and the ball section of lenticule (3) is attached on LED light source (2).
4. LED light source encapsulating structure according to claim 1, is characterized in that: mutual conflict close-packed arrays between described some lenticules (3).
CN201320471388.4U 2013-08-02 2013-08-02 LED light source packaging structure Expired - Fee Related CN203398160U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320471388.4U CN203398160U (en) 2013-08-02 2013-08-02 LED light source packaging structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320471388.4U CN203398160U (en) 2013-08-02 2013-08-02 LED light source packaging structure

Publications (1)

Publication Number Publication Date
CN203398160U true CN203398160U (en) 2014-01-15

Family

ID=49909668

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320471388.4U Expired - Fee Related CN203398160U (en) 2013-08-02 2013-08-02 LED light source packaging structure

Country Status (1)

Country Link
CN (1) CN203398160U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104465964A (en) * 2014-11-14 2015-03-25 司红康 LED packaging structure
CN108011011A (en) * 2017-11-28 2018-05-08 西安科锐盛创新科技有限公司 A kind of encapsulating structure of LED

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104465964A (en) * 2014-11-14 2015-03-25 司红康 LED packaging structure
CN104465964B (en) * 2014-11-14 2017-01-25 安徽康力节能电器科技有限公司 LED packaging structure
CN108011011A (en) * 2017-11-28 2018-05-08 西安科锐盛创新科技有限公司 A kind of encapsulating structure of LED

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140115

Termination date: 20170802

CF01 Termination of patent right due to non-payment of annual fee