CN106851962B - A kind of encapsulating structure of linear voltage regulator - Google Patents
A kind of encapsulating structure of linear voltage regulator Download PDFInfo
- Publication number
- CN106851962B CN106851962B CN201710100560.8A CN201710100560A CN106851962B CN 106851962 B CN106851962 B CN 106851962B CN 201710100560 A CN201710100560 A CN 201710100560A CN 106851962 B CN106851962 B CN 106851962B
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- Prior art keywords
- opening
- voltage regulator
- pad
- linear voltage
- heat dissipation
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
Abstract
The embodiment of the present invention provides a kind of encapsulating structure of linear voltage regulator, including linear voltage regulator and printed circuit board, the printed circuit board includes the steel mesh and pad being cascading, opening is provided on the steel mesh, projection of the opening on the pad is contained in the pad, the linear voltage regulator includes heat dissipation pin, the projection of the heat dissipation pin over said opening is contained in the opening, the heat dissipation pin and being exposed between the opening portion for the pad are welded by welding compound, the welding compound is filled in being exposed between the opening portion of the heat dissipation pin and the pad.The present invention can to radiate can come into full contact between pin and pad, accelerate distributing for the heat of LDO chip, improve the heat dissipation effect of the encapsulating structure of linear voltage regulator, reach the technical effect for promoting linear voltage regulator service life.
Description
Technical field
The present invention relates to electronics technologies more particularly to a kind of encapsulating structures of voltage-releasing voltage stabilizer.
Background technique
Low pressure difference linear voltage regulator (Low Drop Out regulator, referred to as: LDO) is a kind of pressure stabilizing of micro energy lose
Device, it usually has extremely low own noise and higher power supply rejection ratio.
During manufacturing electronic product, need using surface mounting technology (SMT, Surface Mount
Technology) components such as LDO voltage stabilizer are welded on printed circuit board (PCB, Print Circuit Board).Compared with
For common surface mount process process are as follows: firstly the need of welding compound is coated in the one side of PCB, then again weld needs
In component attachment to the corresponding position of PCB, reflow soldering is carried out after completing the attachment of component, completes the patch of component
Dress.
During LDO is welded to PCB using SMT technology, the amount of welding compound is by the size of the opening of steel mesh on PCB
It determines.As shown in Figure 1, LDO 10 generally includes connection pin 11 and the pin 12 that radiates, pin 11 and heat dissipation pin 12 are connected
It is welded with the pad 21 on PCB 20 by welding compound 30.The amount of welding compound is controlled by the opening of steel mesh 40.Existing skill
Heat dissipation pin 12 and the joint face of pad 21 are small in art.Fail full of welding compound and between existing between heat dissipation pin 12 and pad 21
Gap.Due to the presence in gap, causes the heat on LDO 10 that cannot export in time and distribute, cause operating temperature higher, reduce
The stability of LDO work.
Summary of the invention
The purpose of the present invention is to provide a kind of encapsulating structure of linear voltage regulator, the linear voltage regulator of the encapsulating structure
The stability of good heat dispersion performance, work is high.
To achieve the goals above, embodiment of the present invention provides the following technical solutions:
The embodiment of the present invention provides a kind of encapsulating structure of linear voltage regulator, including linear voltage regulator and printed circuit board,
The printed circuit board includes the steel mesh and pad being cascading, and opening is provided on the steel mesh, the opening is in institute
It states the projection on pad and is contained in the pad, the linear voltage regulator includes heat dissipation pin, and the heat dissipation pin is opened described
Projection on mouth is contained in the opening, and the heat dissipation pin and being exposed between the opening portion for the pad pass through weldering
Connect agent welding, the welding compound is filled in being exposed between the opening portion of the heat dissipation pin and the pad.
Wherein, one end width of the opening close to the heat dissipation pin free end is less than described be open close to the heat dissipation
The width of one end of pin fixing end, wherein the width is the length on first direction.
Wherein, the opening assumes a " convex " shape.
Wherein, the width of the opening is incremented by from the heat dissipation pin free end to the fixed extreme direction of the heat dissipation pin.
Wherein, the trapezoidal shape of opening.
Wherein, the heat dissipation pin accounts for the 80%-90% of the opening area in the frontal projected area of the opening.
Wherein, the welding compound is tin cream.
Wherein, one end depth of the opening close to the heat dissipation pin free end is less than described be open close to the heat dissipation
The depth of one end of pin fixing end.
Wherein, the depth of the opening is incremented by from the heat dissipation pin free end to the fixed extreme direction of the heat dissipation pin.
The embodiment of the present invention have the following advantages that or the utility model has the advantages that
In the embodiment of the present invention, the projection of opening of the heat dissipation pin of the linear voltage regulator on the steel mesh is contained in
The opening, and being exposed between the opening portion of the heat dissipation pin and the pad is filled in by welding compound, make
Must radiate can come into full contact between pin and pad, accelerate distributing for the heat of LDO chip, improve the encapsulation of linear voltage regulator
The heat dissipation effect of structure reaches the technical effect for promoting linear voltage regulator service life.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the encapsulating structure of prior art linear voltage regulator.
Fig. 2 is the package structure diagram for the linear voltage regulator that the first embodiment of the invention provides.
Fig. 3 is a kind of top view of embodiment of printed circuit board in Fig. 1.
Fig. 4 is the top view of printed circuit board another embodiment in Fig. 1.
Fig. 5 is the package structure diagram for the linear voltage regulator that second of embodiment of the invention provides.
Fig. 6 is printed circuit board diagrammatic cross-section in Fig. 5.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiment is only a part of the embodiments of the present invention, instead of all the embodiments.Base
Embodiment in the present invention, those of ordinary skill in the art are obtained all without making creative work
Other embodiments shall fall within the protection scope of the present invention.
In addition, the explanation of following embodiment is referred to the additional illustration, the spy that can be used to implement to illustrate the present invention
Determine embodiment.Direction terms mentioned in the present invention, for example, "upper", "lower", "front", "rear", "left", "right", "inner",
"outside", " side " etc. are only the directions with reference to annexed drawings, and therefore, the direction term used is to more preferably, more clearly say
The bright and understanding present invention, rather than indicate or imply signified device or element and must have a particular orientation, with specific square
Position construction and operation, therefore be not considered as limiting the invention.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be fixedly connected, is also possible to detachably connected, or integrally connects
It connects；It can be mechanical connection；It can be directly connected, can also can be in two elements indirectly connected through an intermediary
The connection in portion.For the ordinary skill in the art, the tool of above-mentioned term in the present invention can be understood with concrete condition
Body meaning.
In addition, in the description of the present invention, unless otherwise indicated, the meaning of " plurality " is two or more.If this
Occur the term of " process " in specification, refers not only to independent process, when can not clearly be distinguished with other process, as long as
Effect desired by the process is able to achieve then to be also included in this term.In addition, the numerical value model indicated in this specification with "~"
Enclose the range for referring to that the numerical value for recording "~" front and back is included as minimum value and maximum value.In the accompanying drawings, structure
Similar or identical is indicated by the same numeral.
Please refer to Fig. 2.Fig. 2 is the package structure diagram for the linear voltage regulator that the first embodiment of the invention provides.It should
The encapsulating structure of linear voltage regulator includes linear voltage regulator and printed circuit board 120.The linear voltage regulator mainly includes LDO core
Piece 110, connection pin 111 and heat dissipation pin 112.The LDO chip 110 is through the connection pin 111 and the heat dissipation pin
The printed circuit board 120 is connected to after 112.The printed circuit board 120 includes the steel mesh 140 and pad being cascading
121,141 (as shown in Figure 3 or Figure 4) of multiple openings are provided on the steel mesh 140, and the pad 121 is at least partly exposed to
The opening 141.The connection pin 111 and the heat dissipation pin 112 are welded after the opening 141 by welding compound 130
In the pad 121.It is understood that improvement of the invention is that opening 141 corresponding with the heat dissipation pin 112 changes
Into the corresponding opening 141 of the connection pin 111 is same as the prior art.Therefore, the opening 141 hereinafter mentioned refers to
Opening 141 corresponding with heat dissipation pin 112.Projection of the heat dissipation pin 112 in the opening 141 is contained in the opening
141, the heat dissipation pin 112 and being exposed between 141 parts of the opening for the pad 121 are welded by welding compound 130,
The welding compound 130 is filled in being exposed between 141 parts of the opening of the heat dissipation pin 112 and the pad 121.
In the present embodiment, the projection of opening 141 of the heat dissipation pin 112 of the linear voltage regulator on the steel mesh 140
It is contained in the opening 141, and is exposed to institute by what welding compound 130 was filled in the heat dissipation pin 112 and the pad 121
It states between 141 parts of opening, so that can come into full contact between heat dissipation pin 112 and pad 121, accelerates the heat of LDO chip 110
Distributing for amount, improves the heat dissipation effect of the encapsulating structure of linear voltage regulator, reaches the technology for promoting linear voltage regulator service life
Effect.
In a kind of possible implementation of the present invention, Fig. 3 is please referred to, Fig. 3 is a kind of implementation of printed circuit board in Fig. 1
The top view of mode.One end width of the opening 141 close to heat dissipation 112 free end of pin is less than the opening 141 and leans on
The width of one end of nearly heat dissipation 112 fixing end of pin.Wherein, the width is the length on first direction.The heat dissipation
The direction that the fixing end of the heat dissipation pin is directed toward in the free end of pin 112 is second direction, the first direction and described the
Two directions are vertical.And the first direction is parallel with the plane where the steel mesh 140.It is understood that linear steady
In the encapsulation process of depressor, the size of the opening 141 on steel mesh 140 is bigger, the welding compound 130 that can adhere in welding process
It measures also bigger.The welding compound 130 can be tin cream, and in other embodiments of the invention, the welding compound 130 can be with
For other conductive welding materials, it is not limited herein.For the pin 112 that radiates, radiate pin 112 free end with
Space between the pad 121 is small, it is therefore desirable to welding compound 130 amount it is small, it is described heat dissipation pin 112 fixing end (i.e.
The one end being fixedly connected with LDO chip 110) and the pad 121 between space it is larger, it is therefore desirable to welding compound 130 compare
The amount of the welding compound 130 of free end is big, and welding compound 130 is allowed to fill the space between full fixing end and pad 121.So
It should ensure that the opening 141 is greater than the opening 141 close to one end width of heat dissipation 112 fixing end of pin and dissipates close to described
The width of one end of hot 112 free end of pin.For example, the shape of the opening 141 can substantially " convex " shape, wherein described
Small end is arranged close to the free end of the heat dissipation pin 112.
In a kind of possible implementation of the present invention, Fig. 4 is please referred to, Fig. 4 is that printed circuit board is another real in Fig. 1
Apply the top view of mode.The width of the opening 141 is fixed from 112 free end of heat dissipation pin to the heat dissipation pin 112
Extreme direction is incremented by.For example, the shape of the opening 141 can be substantially trapezoidal, the trapezoidal big end is drawn close to the heat dissipation
The fixing end of foot 112 is arranged.Setting trapezoidal for opening 141 is advantageous in that, when carrying out reflow oven, 130 high temperature of welding compound
To 121 middle shrinkage of pad after fusing, and the space being sufficient filling between the heat dissipation pin 112 and the pad 121
It is interior.
In general, the heat dissipation pin 112 accounts for 141 areas of the opening in the frontal projected area of the opening 141
80%-90%.This is a comparatively reasonable range.Because in solder reflow process, when furnace temperature reaches recirculating zone,
The welding compound 130 printed on PCB is in a molten state, and the mobility of the tin cream of melting increases, if due to the area of opening 141
It is excessive, be printed on PCB weld naked pad 121 region welding compound 130 (tin cream) flowable range with regard to big, PCB is flowing back
In transmit process in furnace, the tin cream of melting can weld the tin for flowing in the region of naked pad 121, and leading to melting on PCB
Cream is uneven in naked 121 area distribution of pad, influences welding effect.Therefore, it is necessary to limit the heat dissipation pin 112 to open described
The frontal projected area of mouth 141 accounts for 141 areas of the opening more than or equal to 80%；But if the heat dissipation pin 112 is in institute
The frontal projected area for stating opening 141 accounts for 141 areas of the opening greater than 90%, then the amount of the welding compound 130 (tin cream) coated is difficult
With the space being sufficient filling between fixing end and pad 121, significantly improving for heat dissipation quality cannot be brought, so the heat dissipation is drawn
Foot 112 is a relatively reasonable model in the 80%-90% that the frontal projected area of the opening 141 accounts for 141 areas of the opening
It encloses.
In second embodiment of the invention, Fig. 5 and Fig. 6 are please referred to, Fig. 5 is second embodiment of the invention
Steel mesh schematic cross-section.Fig. 6 is printed circuit board diagrammatic cross-section in Fig. 5.The encapsulating structure of the linear voltage regulator includes linear
Voltage-stablizer and printed circuit board 220.The linear voltage regulator mainly includes LDO chip 210, connection pin 211 and heat dissipation pin
212.Projection of the heat dissipation pin 212 in the opening 241 is contained in the opening 241, the heat dissipation pin 212 and institute
It states being exposed between 241 parts of the opening for pad 221 to weld by welding compound 230, the welding compound 230 is filled in described
Heat dissipation pin 212 and the pad 221 are exposed between 241 parts of the opening.Wherein, the opening 241 is close to described
One end depth of heat dissipation 212 free end of pin is less than the opening 241 close to the depth of one end of heat dissipation 212 fixing end of pin
Degree.Depth described here refers to the length on 221 surface of vertical pad pitch.The depth of opening 241 on steel mesh 240 is deeper, weldering
The amount for the welding compound 230 that can adhere in termination process is also bigger.The welding compound 230 can be tin cream, of the invention other
In embodiment, the welding compound 230 can also be other conductive welding materials, be not limited herein.Heat dissipation is drawn
For foot 212, the space between the free end and the pad 221 of pin 212 of radiating is small, it is therefore desirable to welding compound 230
Measure it is small, it is described heat dissipation pin 212 fixing end (one end being fixedly connected with LDO chip 210) and the pad 221 between
Space is larger, it is therefore desirable to welding compound 230 it is bigger than the amount of the welding compound 230 of free end, welding compound 230 is filled full
Space between fixing end and pad 221.So should ensure that the opening 241 close to the one of heat dissipation 212 fixing end of pin
Depth is held to be greater than the opening 241 close to the depth of one end of heat dissipation 212 free end of pin.Preferably, the steel mesh 240
On the depth of opening 241 be incremented by from 212 free end of heat dissipation pin to the fixed extreme direction of the heat dissipation pin 212.
In the present embodiment, it is less than described open by the way that one end depth of the opening close to the heat dissipation pin free end is arranged
Mouthful close to one end of the heat dissipation pin fixing end depth, allow the welding compound in welding process fill full fixing end with
Space between pad, radiating can come into full contact between pin and pad, accelerate distributing for the heat of LDO chip, improve line
Property voltage-stablizer encapsulating structure heat dissipation effect, reach promoted linear voltage regulator service life technical effect.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means particular features, structures, materials, or characteristics described in conjunction with this embodiment or example
It is included at least one embodiment or example of the invention.In the present specification, schematic expression of the above terms are different
Surely identical embodiment or example is referred to.Moreover, the particular features, structures, materials, or characteristics of description can be any one
It can be combined in any suitable manner in a or multiple embodiment or examples.
Embodiments described above does not constitute the restriction to the technical solution protection scope.It is any in above-mentioned implementation
Made modifications, equivalent substitutions and improvements etc., should be included in the protection model of the technical solution within the spirit and principle of mode
Within enclosing.
Claims (9)
1. a kind of encapsulating structure of linear voltage regulator, which is characterized in that including linear voltage regulator and printed circuit board, the printing
Circuit board includes the steel mesh and pad being cascading, and opening is provided on the steel mesh, the opening is on the pad
Projection be contained in the pad, the linear voltage regulator includes heat dissipation pin, the throwing of the heat dissipation pin over said opening
Shadow is contained in the opening, and the heat dissipation pin and being exposed between the opening portion for the pad are welded by welding compound
It connects, the welding compound is filled in being exposed between the opening portion of the heat dissipation pin and the pad.
2. the encapsulating structure of linear voltage regulator as described in claim 1, which is characterized in that the heat dissipation pin includes fixing end
And free end, the fixing end are connected with the linear voltage regulator, the vertical range between the free end and the pad is small
Vertical range between the fixing end and the pad, one end width being open close to the free end are less than described
It is open close to the width of one end of the fixing end, wherein the width is the length on first direction, and the free end is directed toward
The direction of the fixing end is second direction, and the first direction is vertical with the second direction.
3. the encapsulating structure of linear voltage regulator as claimed in claim 2, which is characterized in that the opening assumes a " convex " shape.
4. the encapsulating structure of linear voltage regulator as described in claim 1, which is characterized in that the heat dissipation pin includes fixing end
And free end, the fixing end are connected with the linear voltage regulator, the vertical range between the free end and the pad is small
Vertical range between the fixing end and the pad, the width of the opening is from the free end to the fixing end side
To be incremented by.
5. the encapsulating structure of linear voltage regulator as claimed in claim 2, which is characterized in that the trapezoidal shape of opening.
6. the encapsulating structure of linear voltage regulator as described in claim 1, which is characterized in that the heat dissipation pin is in the opening
Frontal projected area account for the 80%-90% of the opening area.
7. the encapsulating structure of linear voltage regulator as described in claim 1, which is characterized in that the welding compound is tin cream.
8. the encapsulating structure of linear voltage regulator as described in claim 1, which is characterized in that the heat dissipation pin includes fixing end
And free end, the fixing end are connected with the linear voltage regulator, the vertical range between the free end and the pad is small
Vertical range between the fixing end and the pad, one end depth being open close to the free end are less than described
It is open close to the depth of one end of the fixing end.
9. the encapsulating structure of linear voltage regulator as claimed in claim 8, which is characterized in that the depth of the opening by it is described from
It is incremented by from end to the fixed extreme direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710100560.8A CN106851962B (en) | 2017-02-23 | 2017-02-23 | A kind of encapsulating structure of linear voltage regulator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710100560.8A CN106851962B (en) | 2017-02-23 | 2017-02-23 | A kind of encapsulating structure of linear voltage regulator |
Publications (2)
| Publication Number | Publication Date |
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| CN106851962A CN106851962A (en) | 2017-06-13 |
| CN106851962B true CN106851962B (en) | 2019-04-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710100560.8A Active CN106851962B (en) | 2017-02-23 | 2017-02-23 | A kind of encapsulating structure of linear voltage regulator |
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| CN (1) | CN106851962B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110856338B (en) * | 2019-10-22 | 2021-03-23 | Tcl华星光电技术有限公司 | Circuit board assembly and electronic equipment |
| WO2024069768A1 (en) * | 2022-09-27 | 2024-04-04 | 三菱電機株式会社 | Drive device and air conditioning device |
| CN116741711B (en) * | 2023-07-03 | 2024-01-12 | 杭州池昊科技有限公司 | Integrated circuit package |
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|---|---|---|---|---|
| US5877937A (en) * | 1995-12-28 | 1999-03-02 | Rohm Co., Ltd. | Encapsulated semiconductor device and electronic circuit board mounting same |
| CN201550366U (en) * | 2009-08-31 | 2010-08-11 | 华为终端有限公司 | Steel mesh |
| CN202076314U (en) * | 2011-01-24 | 2011-12-14 | 佛山市蓝箭电子有限公司 | Surface mounting-type LED packaging body |
| CN204011475U (en) * | 2014-08-04 | 2014-12-10 | 深圳市宇亮光电技术有限公司 | LED paster |
| CN106409805A (en) * | 2016-12-06 | 2017-02-15 | 四川富美达微电子有限公司 | Five-pin IC structure |
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2017
- 2017-02-23 CN CN201710100560.8A patent/CN106851962B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5877937A (en) * | 1995-12-28 | 1999-03-02 | Rohm Co., Ltd. | Encapsulated semiconductor device and electronic circuit board mounting same |
| CN201550366U (en) * | 2009-08-31 | 2010-08-11 | 华为终端有限公司 | Steel mesh |
| CN202076314U (en) * | 2011-01-24 | 2011-12-14 | 佛山市蓝箭电子有限公司 | Surface mounting-type LED packaging body |
| CN204011475U (en) * | 2014-08-04 | 2014-12-10 | 深圳市宇亮光电技术有限公司 | LED paster |
| CN106409805A (en) * | 2016-12-06 | 2017-02-15 | 四川富美达微电子有限公司 | Five-pin IC structure |
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| CN106851962A (en) | 2017-06-13 |
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Address after: 9-2 Tangming Avenue, Guangming New District, Shenzhen City, Guangdong Province Patentee after: TCL Huaxing Photoelectric Technology Co.,Ltd. Address before: 9-2 Tangming Avenue, Guangming New District, Shenzhen City, Guangdong Province Patentee before: Shenzhen China Star Optoelectronics Technology Co.,Ltd. |
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