CN107644930B - LED support, LED device with same and LED lamp - Google Patents
LED support, LED device with same and LED lamp Download PDFInfo
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- CN107644930B CN107644930B CN201610574069.4A CN201610574069A CN107644930B CN 107644930 B CN107644930 B CN 107644930B CN 201610574069 A CN201610574069 A CN 201610574069A CN 107644930 B CN107644930 B CN 107644930B
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- metal pad
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- insulating
- chip
- filling material
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Abstract
The invention provides an LED support, an LED device with the same and an LED lamp. This LED support includes insulating connecting seat, first metal pad and second metal pad inlay and establish on insulating connecting seat, first metal pad and second metal pad are used for the installation to treat the installation chip, treat the electric connection of installation chip in order to realize, it has first holding tank to open on the first metal pad, it has the second holding tank to open on the second metal pad, the both ends of first holding tank and the both ends of second holding tank all link to each other with insulating connecting seat, the area of the region that first holding tank and second holding tank enclose is close with the area of waiting to install the chip, it has insulating filling material all to fill in first holding tank and the second holding tank. The LED bracket can solve the problem that the luminous flux of the LED device is influenced by the fact that the solder paste for welding the chip is irregularly diffused and is excessively exposed outside the chip to cause the light absorption of the exposed solder paste in the prior art.
Description
Technical Field
The invention relates to the technical field of LED equipment, in particular to an LED bracket, an LED device with the same and an LED lamp with the same.
Background
At present, flip-chip SMD LED holders (SMD is an abbreviation of Surface Mounted Devices, meaning: Surface mount Devices) are generally molded from metal materials and insulating materials that conduct and conduct electricity and heat. When the flip chip is welded by the soldering paste on the metal bonding pad of the LED support, the metal bonding pad and the soldering paste have better affinity, the soldering paste after reflow soldering can be irregularly diffused on the plane of the metal bonding pad, the diffusion area of the soldering paste after soldering is too much and larger than the area of the chip, the soldering paste is exposed out of the chip, too much exposed soldering paste can absorb light, and the luminous flux of light emitted by an LED device is influenced.
Disclosure of Invention
The invention aims to provide an LED bracket, an LED device with the LED bracket and an LED lamp, and aims to solve the problem that in the prior art, soldering paste for welding a chip is irregularly diffused and excessively exposed outside the chip, so that the exposed soldering paste absorbs light to influence the luminous flux of the LED device.
In order to solve the technical problems, the technical scheme of the invention is as follows: the utility model provides a LED support, including insulating connecting seat, first metal pad and second metal pad inlay side by side and interval and establish on insulating connecting seat, first metal pad and second metal pad all are used for the welding to treat the installation chip, in order to realize the electric connection who treats the installation chip, wherein, it has first holding tank to open on the first metal pad, it has the second holding tank to open on the second metal pad, the both ends of first holding tank and the both ends of second holding tank all link to each other with the insulating connecting seat between first metal pad and the second metal pad, the area of the region that first holding tank and second holding tank enclose is less than or equal to the area of treating the installation chip, and all fill in first holding tank and the second holding tank has insulating filling material.
Optionally, the width of the first receiving groove is L1, the width of the second receiving groove is L2, and 0.02mm ≦ L1 ≦ L2 ≦ 2.0 mm.
Optionally, the bottom of the first accommodating groove is provided with first connecting through holes penetrating through the first metal pads, the number of the first connecting through holes is greater than or equal to 1, the bottom of the second accommodating groove is provided with second connecting through holes penetrating through the second metal pads, and the number of the second connecting through holes is greater than or equal to 1.
Optionally, the insulating filling material in the first connecting through hole is connected with the insulating connecting seat, and the insulating filling material in the second connecting through hole is connected with the insulating connecting seat.
Optionally, the insulating connection socket is formed with a reflective bowl, the first metal pad and the second metal pad being located at a bottom of the reflective bowl.
According to another aspect of the invention, an LED device is provided, which includes an LED support and a chip to be mounted, wherein the chip to be mounted is soldered on the LED support, and the LED support is the LED support.
Optionally, the insulating filling material in the first receiving groove is flush with the plane of the first metal pad of the LED support, and the insulating filling material in the second receiving groove is flush with the plane of the second metal pad of the LED support.
Optionally, the insulating filling material in the first accommodating groove is lower than the plane of the first metal pad of the LED support, and the insulating filling material in the second accommodating groove is lower than the plane of the second metal pad of the LED support.
Optionally, the insulating filling material in the first accommodating groove is higher than the plane of the first metal pad of the LED support, and the insulating filling material in the second accommodating groove is higher than the plane of the second metal pad of the LED support.
According to another aspect of the invention, an LED lamp is provided, which includes a substrate and an LED device disposed on the substrate, where the LED device is the aforementioned LED device.
In the invention, the insulating filling materials filled in the first accommodating groove and the second accommodating groove are used for preventing the solder paste layer between the chip to be installed and the two bonding pads from irregularly diffusing, so that the diffusion range of the solder paste layer is limited in a fixed area range, and the problem that the luminous flux of the LED device is influenced by the fact that the exposed solder paste absorbs light due to the fact that the solder paste is irregularly diffused and excessively exposed outside the chip to be installed is solved.
Drawings
FIG. 1 is a schematic front view of an embodiment of an LED support of the present invention;
FIG. 2 is a schematic cross-sectional view A-A of FIG. 1;
FIG. 3 is a schematic diagram of an arrangement of first and second metal pads of an embodiment of an LED support of the present invention;
FIG. 4 is a schematic cross-sectional view of B-B of FIG. 3;
FIG. 5 is a schematic front view of an embodiment of an LED device of the present invention;
fig. 6 is a schematic sectional structure view of C-C in fig. 5.
In the drawings:
10. an insulating connection seat; 11. a reflective bowl-like structure; 20. a first metal pad;
21. a first accommodating groove; 30. a second metal pad; 31. a second accommodating groove;
210. a first connecting through hole; 310. a second connecting through hole; 100. a chip to be mounted;
200. an insulating filler material; 300. and (6) welding a paste layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It should be noted that the terms of orientation such as left, right, up, down, etc. in the present embodiment are only relative concepts or reference to the normal use state of the product, and should not be considered as limiting.
As shown in fig. 1 to 4, the LED support of the present embodiment includes an insulating connection seat 10, a first metal pad 20 and a second metal pad 30, the first metal pad 20 and the second metal pad 30 are embedded on the insulating connection seat 10 side by side and at intervals, the first metal pad 20 and the second metal pad 30 are both used for soldering a chip 100 to be mounted, so as to realize electrical connection of the chip to be mounted, wherein, it has first holding tank 21 to open on the first metal pad 20, it has second holding tank 31 to open on the second metal pad 30, the both ends of first holding tank 21 and the both ends of second holding tank 31 all link to each other with the insulating connecting seat 10 between first metal pad 20 and the second metal pad 30, the area of the region that first holding tank 21 and second holding tank 31 enclose is less than or equal to the area of waiting to install chip 100, first holding tank 21 and second holding tank 31 all fill have insulating filling material 200.
The first accommodating groove 21 and the second accommodating groove 31 are respectively formed in the first metal pad 20 and the second metal pad 30, and the insulating filling material 200 filled in the first accommodating groove 21 and the second accommodating groove 31 has poor affinity with the solder paste layer 300, so that the insulating filling material 200 is used for preventing the solder paste layer 300 between the chip 100 to be mounted and the two pads from irregularly diffusing, the diffusion range of the solder paste layer 300 is limited in a fixed area range, the fixed area range is smaller than or equal to the area of the chip to be mounted, and the problem that the solder paste irregularly diffuses and is excessively exposed outside the chip 100 to be mounted to cause exposed light absorption of the solder paste, so that the luminous flux of light emitted by an LED device is influenced is solved.
Of course, the area range of the designed solder paste diffusion may be slightly larger than the area of the chip 100 to be mounted, and in this case, the solder paste exposed to the chip 100 to be mounted does not absorb light or absorbs light less obviously because of the smaller amount.
The first receiving groove 21 and the second receiving groove 31 of the present invention are etched on the corresponding metal pads by using an etching process. The solder paste material in the present invention is preferably a solder material.
In this embodiment, in order to reinforce the strength of the insulating filling material 200 filled in the first receiving groove 21 and the second receiving groove 31, so that the insulating filling material 200 is not easily separated from the first receiving groove 21 and the second receiving groove 31, a first connecting through hole 210 penetrating through the first metal pad 20 is formed at the bottom of the first receiving groove 21, the number of the first connecting through holes 210 is greater than or equal to 1, a second connecting through hole 310 penetrating through the second metal pad 30 is formed at the bottom of the second receiving groove 31, and the number of the second connecting through holes 310 is greater than or equal to 1. In the present embodiment, the insulating filling material 200 in the first connection through hole 210 of the first metal pad 20 of the LED support is connected to the insulating connection socket 10 of the LED support, and the insulating filling material 200 in the second connection through hole 310 of the second metal pad 30 of the LED support is connected to the insulating connection socket 10, so as to enhance the connection strength between the insulating filling material 200 and the insulating connection socket 10. After the first receiving groove 21 and the second receiving groove 31 are filled with the insulating filling material 200, the insulating filling material 200 flows into the first connecting through hole 210 and the second connecting through hole 310 and is connected with the insulating connection socket 10 after penetrating through the first metal pad 20 and the second metal pad 30, respectively, and at this time, the insulating filling material 200 in the first receiving groove 21 and the second receiving groove 31 and the insulating connection socket 10 can be formed into an integral structure, so that the filling strength of the insulating filling material 200 is improved.
As shown in fig. 4, the width of the first receiving groove 21 is L1, the width of the second receiving groove 31 is L2, and 0.02mm ≦ L1 ≦ L2 ≦ 2.0mm, and the widths L1 and L2 of the first receiving groove 21 and the second receiving groove 31 are required according to actual requirements, so that the insulating filling material 200 filled therein can effectively prevent the solder paste layer 300 from diffusing. Further, as shown in fig. 1 and 3, the outline shape of the area surrounded by the first receiving groove 21 and the second receiving groove 31 of the present embodiment is a rectangle.
As shown in fig. 1 and 2, the insulating connection holder 10 of the present embodiment is formed with a reflective bowl 11, and a first metal pad 20 and a second metal pad 30 are located at the bottom of the reflective bowl 11. Therefore, light emitted by the LED device after installation can be reflected in a concentrated manner through the reflecting bowl-shaped structure 11, so that light rays are further reflected and then irradiated out, and the illumination brightness of the LED device is improved. Of course, the insulating connection socket 10 may be configured in a flat plate structure that is horizontal to the planes of the first and second metal pads 20 and 30.
According to another aspect of the present invention, the present invention provides an LED device. As shown in fig. 5 and 6, the LED device includes an LED support and a chip 100 to be mounted, where the chip 100 to be mounted is soldered on the LED support, and the LED support is the aforementioned LED support. In the process of applying the aforementioned LED bracket to solder the chip 100 to be mounted, the worker coats the solder paste on the pads in the area surrounded by the first accommodating groove 21 of the first metal pad 20 and the second accommodating groove 31 of the second metal pad 30, respectively, and then attaches the chip 100 to be mounted on the solder paste, thereby performing reflow soldering on the solder paste. At this moment, the solder paste is diffused to form a solder paste layer 300, and the diffusion is blocked by the insulating filling material in the first accommodating groove 21, the insulating connecting seat 10, the insulating filling material 200 in the second accommodating groove 31 and the insulating connecting seat 10, so that the solder paste layer 300 after the reflow soldering is completed can not be exposed outside the chip to be mounted, and the luminous flux of the light emitted by the LED device can not be influenced by the light absorption of the exposed solder paste due to the irregular diffusion of the solder paste and the excessive exposure outside the chip 100 to be mounted, and the luminous flux of the manufactured LED device is higher.
In the present invention, the insulating material used for the insulating connection socket 10 is the same as that used for the insulating filling material 200.
In the LED device of the present embodiment, as shown in fig. 6, the insulating filling material 200 in the first receiving groove 21 is flush with the plane of the first metal pad 20 of the LED support, and the insulating filling material 200 in the second receiving groove 31 is flush with the plane of the second metal pad 30 of the LED support. In this embodiment, by utilizing the property of poor affinity between the insulating filling material 200 and the solder paste, when the solder paste diffuses into the insulating filling material 200, the solder paste is prevented by the insulating filling material 200 and is shaped into the solder paste layer 300.
In another possible embodiment of the LED device, the insulating filling material 200 in the first receiving groove 21 is lower than the plane of the first metal pad 20 of the LED support, and the insulating filling material 200 in the second receiving groove 31 is lower than the plane of the second metal pad 30 of the LED support. In this way, the first receiving groove 21 and the second receiving groove 31 form a ravine shape, and the insulating filling material 200 in the first receiving groove 21 and the second receiving groove 31 has a poor affinity with the solder paste, and after the solder paste is diffused and flowed into the first receiving groove 21 and the second receiving groove 31, the solder paste is confined in the region surrounded by the first receiving groove 21 and the second receiving groove 31 due to the poor affinity of the insulating filling material 200 with the solder paste and the blockage of the ravine shape. The remaining structure of the LED device of this embodiment is the same as that of the LED device of the above-described example.
Of course, in another possible embodiment of the LED device, the insulating filling material 200 in the first receiving groove 21 is higher than the plane of the first metal pad 20 of the LED support, and the insulating filling material 200 in the second receiving groove 31 is higher than the plane of the second metal pad 30 of the LED support. Thus, the dam shape can be formed higher than the insulating filling material 200 to prevent the solder paste from spreading. The remaining structure of the LED device of this embodiment is the same as that of the LED device of the above-described example.
According to yet another aspect of the present invention, an LED light fixture is provided. The LED lamp comprises a substrate and an LED device arranged on the substrate, wherein the LED device is the LED device.
The present invention is not limited to the above preferred embodiments, and any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The LED bracket is characterized by comprising an insulating connecting seat (10), a first metal pad (20) and a second metal pad (30), wherein the first metal pad (20) and the second metal pad (30) are embedded on the insulating connecting seat (10) side by side at intervals, the first metal pad (20) and the second metal pad (30) are used for welding a chip (100) to be installed so as to realize the electric connection of the chip (100) to be installed, a first accommodating groove (21) is formed in the first metal pad (20), a second accommodating groove (31) is formed in the second metal pad (30), two ends of the first accommodating groove (21) and two ends of the second accommodating groove (31) are connected with the insulating connecting seat (10) between the first metal pad (20) and the second metal pad (30), the area of a region surrounded by the first accommodating groove (21) and the second accommodating groove (31) is smaller than or equal to the area of the chip (100) to be mounted, insulating filling materials (200) are filled in the first accommodating groove (21) and the second accommodating groove (31), and the insulating filling materials (200) have poor affinity with solder paste to limit the spreading range of the solder paste in the region surrounded by the first accommodating groove (21) and the second accommodating groove (31).
2. The LED support according to claim 1, wherein the width of the first receiving groove (21) is L1, and the width of the second receiving groove (31) is L2, and 0.02mm ≦ L1 ≦ L2 ≦ 2.0 mm.
3. The LED holder according to claim 1, wherein the first receiving groove (21) has a groove bottom opened with first connecting through holes (210) penetrating through the first metal pads (20), the number of the first connecting through holes (210) is 1 or more, the second receiving groove (31) has a groove bottom opened with second connecting through holes (310) penetrating through the second metal pads (30), and the number of the second connecting through holes (310) is 1 or more.
4. The LED holder according to claim 3, wherein the insulating filling material (200) in the first connecting through hole (210) is connected to the insulating connection socket (10), and the insulating filling material (200) in the second connecting through hole (310) is connected to the insulating connection socket (10).
5. The LED support according to any of the claims 1 to 4, characterized in that the insulating connection socket (10) is formed with a reflective bowl (11), the first metal pad (20) and the second metal pad (30) being located at the bottom of the reflective bowl (11).
6. An LED device, comprising an LED support and a chip (100) to be mounted, wherein the chip (100) to be mounted is soldered on the LED support, and the LED support is the LED support of any one of claims 1 to 5.
7. The LED device according to claim 6, wherein the insulating filling material (200) in the first receiving groove (21) is flush with the plane of the first metal pad (20) of the LED support, and the insulating filling material (200) in the second receiving groove (31) is flush with the plane of the second metal pad (30) of the LED support.
8. The LED device of claim 6, wherein the insulating filling material (200) in the first receiving groove (21) is lower than the plane of the first metal pad (20) of the LED support, and the insulating filling material (200) in the second receiving groove (31) is lower than the plane of the second metal pad (30) of the LED support.
9. The LED device according to claim 6, wherein the insulating filling material (200) in the first receiving groove (21) is higher than the plane of the first metal pad (20) of the LED support, and the insulating filling material (200) in the second receiving groove (31) is higher than the plane of the second metal pad (30) of the LED support.
10. An LED lamp comprising a substrate and an LED device disposed on the substrate, wherein the LED device is the LED device according to any one of claims 6 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610574069.4A CN107644930B (en) | 2016-07-20 | 2016-07-20 | LED support, LED device with same and LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610574069.4A CN107644930B (en) | 2016-07-20 | 2016-07-20 | LED support, LED device with same and LED lamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107644930A CN107644930A (en) | 2018-01-30 |
| CN107644930B true CN107644930B (en) | 2019-12-27 |
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| CN201610574069.4A Active CN107644930B (en) | 2016-07-20 | 2016-07-20 | LED support, LED device with same and LED lamp |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108682731A (en) * | 2018-07-18 | 2018-10-19 | 易美芯光（北京）科技有限公司 | A kind of LED encapsulation structure with upside-down mounting SMD |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104347553A (en) * | 2013-07-23 | 2015-02-11 | 西安永电电气有限责任公司 | Trenching resistance welding type IGBT module base plate |
| WO2015181072A1 (en) * | 2014-05-27 | 2015-12-03 | Osram Opto Semiconductors Gmbh | Semiconductor component and illumination device |
| CN105679817A (en) * | 2016-02-24 | 2016-06-15 | 江苏捷捷微电子股份有限公司 | Unidirectional silicon controlled rectifier chip with coplanar gate and anode and manufacturing method of unidirectional silicon controlled rectifier chip |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4778444B2 (en) * | 2004-11-25 | 2011-09-21 | 日本電気株式会社 | Semiconductor device and manufacturing method thereof, wiring board and manufacturing method thereof, semiconductor package and electronic device |
| CN104456152A (en) * | 2013-09-13 | 2015-03-25 | 海洋王（东莞）照明科技有限公司 | LED (light-emitting diode) lamp |
| CN203589042U (en) * | 2013-11-22 | 2014-05-07 | 常州银河电器有限公司 | Axial diode |
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2016
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104347553A (en) * | 2013-07-23 | 2015-02-11 | 西安永电电气有限责任公司 | Trenching resistance welding type IGBT module base plate |
| WO2015181072A1 (en) * | 2014-05-27 | 2015-12-03 | Osram Opto Semiconductors Gmbh | Semiconductor component and illumination device |
| CN105679817A (en) * | 2016-02-24 | 2016-06-15 | 江苏捷捷微电子股份有限公司 | Unidirectional silicon controlled rectifier chip with coplanar gate and anode and manufacturing method of unidirectional silicon controlled rectifier chip |
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| CN107644930A (en) | 2018-01-30 |
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