CN205303505U - CSP packaging structure and because CSP packaging structure's lamp strip of trilateral light -emitting - Google Patents
CSP packaging structure and because CSP packaging structure's lamp strip of trilateral light -emitting Download PDFInfo
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- CN205303505U CN205303505U CN201520904004.2U CN201520904004U CN205303505U CN 205303505 U CN205303505 U CN 205303505U CN 201520904004 U CN201520904004 U CN 201520904004U CN 205303505 U CN205303505 U CN 205303505U
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Abstract
The utility model discloses a CSP packaging structure and because CSP packaging structure's lamp strip of trilateral light -emitting. The CSP packaging structure of trilateral light -emitting includes the flip chip, two opposite flanks of flip chip are packaged with the glue that is in the light, are packaged with the encapsulation on the two other opposite flanks of flip chip and the top surface and glue. Because the lamp strip of CSP encapsulation includes the CSP packaging structure of base plate and above -mentioned trilateral light -emitting. The utility model provides the high utilization ratio of light has reduced the dark space between two CSP packaging structure.
Description
Technical field
The utility model discloses a kind of CSP encapsulating structure and lamp bar.
Background technology
For side entering type light source modules such as side entering type panel light, backlight modules, it is common that the luminescent devices such as lamp bar to be fixed on the side of side entering type light source module by fixture, thus the light of luminescent device is general luminous from the side, by some optics by light-output.
For above-mentioned light source module, currently mainly adopt existing general light emitting device, such as the luminescent device being made up of the fluorescent glue on chip and encapsulation chip, the luminescent device being made up of chip, support, fluorescent glue. form light source, be usually and multiple luminescent device is set on substrate. as shown in Figure 1, for the luminescent device 100 being made up of chip and fluorescent glue, chip generally has the lighting angle of self, after above-mentioned luminescent device 100 is installed on substrate 200, owing to the lighting angle of chip is relatively little, dark space 300 can be there is between two luminescent devices, affect the uniformity of light, simultaneously because lamp bar is the side that the mode by fixture is fixed on light source module, thus luminescent device is sent light and has certain blocking by fixture, thus it is luminous to waste light source device corresponding to fixture, additionally, luminescent device goes out light to surrounding, and the light at light primarily along zig direction of utilizable light and top, other light cannot well be utilized, the utilization rate causing light is low.
Equally, if adopting the luminescent device being made up of chip, support, fluorescent glue, also can there are the problems referred to above.
Now, CSP encapsulating structure is applied in various field because of advantages such as little, lightweight, the good electrical property of volume.
Current CSP encapsulating structure mainly includes flip chip and the packaging plastic being encapsulated on flip chip, and packaging plastic is fluorescent glue. Each face of flip chip can be luminous, and as being installed on substrate by CSP encapsulating structure, all directions can go out light except the base, and for special light source, the going out light and can not utilize of some side, and the utilization rate causing light is low.
Summary of the invention
In order to improve the utilization rate of light, this utility model provides a kind of three faces and goes out the CSP encapsulating structure of light.
In order to improve the utilization rate of light, reducing the dark space between two CSP encapsulating structures, this utility model provides a kind of lamp bar based on CSP encapsulating structure.
For reaching above-mentioned purpose, a kind of three faces go out the CSP encapsulating structure of light, including flip chip; The two relative side of flip chip is packaged with the glue that is in the light, and the other two relative side of flip chip and end face are packaged with packaging plastic.
Above-mentioned encapsulating structure, owing to two relative side is provided with the glue that is in the light, therefore, the CSP encapsulating structure of this structure only has two relative side and end face three face to go out light, the rising angle of flip chip side is big, therefore, adopt structure of the present utility model, make the rising angle with the two sides of packaging plastic big, it is obviously reduced in dark space, the both sides scope with packaging plastic, add the glue that is in the light and light is had reflection, by being in the light, the luminous reflectance of wherein two relative side can be gone out by glue, three faces are made to go out light more uniform, owing to being in the light, light local for corresponding fixture is blocked by glue, thus avoiding luminescent device to send the loss of light, also improve the utilization rate of light.
Further, described packaging plastic is fluorescent glue.
Further, described flip chip two relative side and be in the light between glue and be packaged with packaging plastic, packaging plastic is coated on side and the end face of flip chip. Due to flip chip and be in the light between glue and also be provided with packaging plastic, it is thus possible to make the light that the light that flip chip side sends excites packaging plastic to produce be in the light glue reflecting light and then improving extraction efficiency.
Further, flip chip includes flip chip body and is located at the electrode of flip chip body bottom portion, the lower surface of packaging plastic on the side is higher than the lower surface of electrode, and the lower surface of the glue that is in the light is higher than the lower surface of electrode. owing to the lower surface of packaging plastic and the glue that is in the light is higher than the lower surface of electrode, it is fixed in the process on substrate at the CSP encapsulating structure that three faces are gone out light, packaging plastic and be in the light between glue lower surface and substrate and there is gap, therefore, even if packaging plastic and the glue that is in the light have downward burr, close contact without the electrode Yu substrate that affect flip chip, additionally, if packaging plastic and the glue expanded by heating that is in the light, also the space of its expansion is given below packaging plastic and the glue that is in the light, therefore, reduce three faces and go out the voidage that the CSP encapsulating structure of light is connected with substrate, solve due to packaging plastic, there is the electrode of burr and flip chip and cause between flip chip with substrate, electrically connecting insecure problem with substrate welding process is heated in the glue that is in the light cutting, make flip chip more firm with the connection of substrate.
Further, the end face of glue of being in the light is concordant with the packaging plastic of end face, it is to avoid because being in the light, glue affects rising angle higher than packaging plastic.
For reaching above-mentioned second purpose, a kind of lamp bar based on CSP encapsulating structure, including substrate, substrate is provided with three faces of more than two and goes out the CSP encapsulating structure of light, three faces go out the CSP encapsulating structure of light and include flip chip; The two relative side of flip chip is packaged with the glue that is in the light, and the other two relative side of flip chip and end face are packaged with packaging plastic.
Above-mentioned encapsulating structure, owing to two relative side is provided with the glue that is in the light, therefore, the CSP encapsulating structure of this structure only has two relative side and end face three face to go out light, the CSP encapsulating structure that three faces go out light is arranged after on substrate, the two sides with packaging plastic are vertical with the length direction of substrate, and the rising angle of flip chip side is big, the dark space scope that adjacent two or three face goes out between the CSP encapsulating structure of light is allowed to be obviously reduced, therefore, adopt structure of the present utility model, make the rising angle with the two sides of packaging plastic big, add the glue that is in the light and light is had reflection, by being in the light, the luminous reflectance of wherein two relative side can be gone out by glue, three faces are made to go out light more uniform, also improve the utilization rate of light.
Further, described flip chip two relative side and be in the light between glue and be packaged with packaging plastic, packaging plastic is coated on side and the end face of flip chip.Due to flip chip and be in the light between glue and also be provided with packaging plastic, it is thus possible to make the light that the light that flip chip side sends excites packaging plastic to produce be in the light glue reflecting light and then improving extraction efficiency.
Further, flip chip includes flip chip body and is located at the electrode of flip chip body bottom portion, the lower surface of packaging plastic on the side is higher than the lower surface of electrode, and the lower surface of the glue that is in the light is higher than the lower surface of electrode. owing to the lower surface of packaging plastic and the glue that is in the light is higher than the lower surface of electrode, it is fixed in the process on substrate at the CSP encapsulating structure that three faces are gone out light, packaging plastic and be in the light between glue lower surface and substrate and there is gap, therefore, even if packaging plastic and the glue that is in the light have downward burr, close contact without the electrode Yu substrate that affect flip chip, additionally, if packaging plastic and the glue expanded by heating that is in the light, also the space of its expansion is given below packaging plastic and the glue that is in the light, therefore, reduce three faces and go out the voidage that the CSP encapsulating structure of light is connected with substrate, solve due to packaging plastic, there is the electrode of burr and flip chip and cause between flip chip with substrate, electrically connecting insecure problem with substrate welding process is heated in the glue that is in the light cutting, make flip chip more firm with the connection of substrate.
Further, the end face of glue of being in the light is concordant with the packaging plastic of end face, it is to avoid because being in the light, glue affects rising angle higher than packaging plastic.
Further, being respectively provided on two sides with blend stop at substrate, three faces go out the CSP encapsulating structure of light and are positioned at blend stop. Shield bars has the effect being in the light, and allows the light that of lamp bar more concentrate, uniformly.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of prior art.
Fig. 2 is the sectional view that three faces go out the CSP encapsulating structure of light.
Fig. 3 is that three faces go out B-B sectional view in CSP encapsulating structure Fig. 7 of light.
Fig. 4 is the schematic diagram that three faces go out CSP another structure of encapsulating structure of light.
Fig. 5 is the schematic diagram that three faces go out CSP the third structure of encapsulating structure of light.
Fig. 6 is the schematic diagram that three faces go out the 4th kind of structure of CSP encapsulating structure of light.
Fig. 7 is C-C sectional view in Fig. 2.
Three faces are gone out the schematic diagram that the CSP encapsulating structure of light is installed on substrate by Fig. 8.
Fig. 9 is the lamp bar D-D sectional view based on CSP encapsulating structure.
Figure 10 is the top view of the lamp bar based on CSP encapsulating structure.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, this utility model is further elaborated.
Embodiment 1.
As shown in Fig. 2, Fig. 3 and Fig. 7, three faces go out the CSP encapsulating structure of light and include flip chip 1, and flip chip 1 includes flip chip body 11 and is located at the electrode 12 bottom flip chip body 11.
The two relative side of flip chip body 11 is packaged with the glue 2 that is in the light, and the glue that is in the light is white glue, and this glue extinction that is in the light is few, and light is had reflection. Being packaged with packaging plastic 3 on the other two relative side of flip chip body 11 and end face, packaging plastic is fluorescent glue.
As shown in Figures 2 and 3, the lower surface of packaging plastic on the side is higher than the lower surface of electrode 12, and the lower surface of the glue 2 that is in the light is higher than the lower surface of electrode 12. as shown in Figure 8, owing to the lower surface of packaging plastic 3 and the glue 2 that is in the light is higher than the lower surface of electrode 12, it is fixed in the process on substrate 10 at the CSP encapsulating structure that three faces are gone out light, packaging plastic 3 and be in the light between glue 2 lower surface and substrate 10 and there is gap, therefore, even if packaging plastic 3 and the glue 2 that is in the light have downward burr, close contact without the electrode Yu substrate 10 that affect flip chip 1, additionally, if packaging plastic 3 and glue 2 expanded by heating that is in the light, also the space of its expansion is given below packaging plastic 3 and the glue 2 that is in the light, therefore, reduce three faces and go out the voidage that the CSP encapsulating structure of light is connected with substrate 10, solve due to packaging plastic 3, there is the electrode of burr and flip chip and cause electrically connecting between flip chip with substrate 10 insecure problem with substrate 10 welding process is heated in the glue 2 that is in the light cutting, make flip chip 1 more firm with the connection of substrate 10.
As it is shown on figure 3, be in the light, the end face of glue 2 and the packaging plastic of end face are concordant. Avoid because the glue 2 that is in the light affects rising angle higher than packaging plastic.
As shown in Figure 4, the packaging plastic of end face covers a part for the glue 2 that is in the light, reduces and gold-tinted occurs above the glue 2 that is in the light.
As it is shown in figure 5, the packaging plastic of end face can all cover flip chip and be in the light on glue 2.
As shown in Figure 6, it is provided with packaging plastic 3 being in the light between glue 2 and flip chip 1 two relative side, packaging plastic 3 is coated on side and the end face of flip chip, due to flip chip 1 and be in the light between glue 2 and also be provided with packaging plastic 3, it is thus possible to make the light that the light that flip chip side sends excites packaging plastic to produce be in the light glue reflecting light and then improving extraction efficiency.
In the present embodiment, owing to two relative side is provided with the glue 2 that is in the light, therefore, the CSP encapsulating structure of this structure only has two relative side and end face three face to go out light, the rising angle of flip chip 1 side is big, therefore, adopt structure of the present utility model, make the rising angle with the two sides of packaging plastic big, adding the glue 3 that is in the light and light is had reflection, by being in the light, the luminous reflectance of wherein two relative side can be gone out by glue 2 so that it is more uniform that three faces go out light, it is obviously reduced in dark space, the both sides scope with packaging plastic 3, also improves the utilization rate of light.
Embodiment 2.
As shown in Figure 9 and Figure 10, the lamp bar based on CSP encapsulating structure includes substrate 10, is provided with three faces of more than two on the substrate 10 and goes out the CSP encapsulating structure 100 of light. Substrate 10 be respectively provided on two sides with blend stop 101, three faces go out the CSP encapsulating structure 100 of light and are positioned at blend stop 101, allow the light that of lamp bar more concentrate, uniformly.
As shown in Fig. 2, Fig. 3 and Fig. 7, three faces go out the CSP encapsulating structure of light and include flip chip 1, and flip chip 1 includes flip chip body 11 and is located at the electrode 12 bottom flip chip body 11, and the line layer of electrode 12 and substrate is electrically connected.
The two relative side of flip chip body 11 is packaged with the glue 2 that is in the light, and the glue that is in the light is white glue, and this glue extinction that is in the light is few, and light is had reflection. Being packaged with packaging plastic 3 on the other two relative side of flip chip body 11 and end face, packaging plastic is fluorescent glue. The two sides with packaging plastic are vertical with the long limit of substrate 10, are normal orientation.
As shown in Figures 2 and 3, the lower surface of packaging plastic on the side is higher than the lower surface of electrode 12, and the lower surface of the glue 2 that is in the light is higher than the lower surface of electrode 12. as shown in Figure 9, owing to the lower surface of packaging plastic 3 and the glue 2 that is in the light is higher than the lower surface of electrode 12, it is fixed in the process on substrate 10 at the CSP encapsulating structure that three faces are gone out light, packaging plastic 3 and be in the light between glue 2 lower surface and substrate 10 and there is gap, therefore, even if packaging plastic 3 and the glue 2 that is in the light have downward burr, close contact without the electrode Yu substrate 10 that affect flip chip 1, additionally, if packaging plastic 3 and glue 2 expanded by heating that is in the light, also the space of its expansion is given below packaging plastic 3 and the glue 2 that is in the light, therefore, reduce three faces and go out the voidage that the CSP encapsulating structure of light is connected with substrate 10, solve due to packaging plastic 3, there is the electrode of burr and flip chip and cause electrically connecting between flip chip with substrate 10 insecure problem with substrate 10 welding process is heated in the glue 2 that is in the light cutting, make flip chip 1 more firm with the connection of substrate 10.
As it is shown on figure 3, be in the light, the end face of glue 2 and the packaging plastic of end face are concordant. Avoid because the glue 2 that is in the light affects rising angle higher than packaging plastic.
As shown in Figure 4, the packaging plastic of end face covers a part for the glue 2 that is in the light, reduces and gold-tinted occurs above the glue 2 that is in the light.
As it is shown in figure 5, the packaging plastic of end face can all cover flip chip and be in the light on glue 2.
As shown in Figure 6, it is provided with packaging plastic 3 being in the light between glue 2 and flip chip 1 two relative side, packaging plastic 3 is coated on side and the end face of flip chip, due to flip chip 1 and be in the light between glue 2 and also be provided with packaging plastic 3, it is thus possible to make the light that the light that flip chip side sends excites packaging plastic to produce be in the light glue reflecting light and then improving extraction efficiency.
In the present embodiment, owing to two relative side is provided with the glue 2 that is in the light, therefore, CSP encapsulating structure 100 only two relative side and end face three face of this structure go out light, the CSP encapsulating structure 100 that three faces go out light is arranged after on substrate 10, the two sides with packaging plastic 3 are vertical with the length direction of substrate 10, and the rising angle of flip chip 1 side is big, therefore, adopt structure of the present utility model, as shown in Figure 9, make the rising angle with the two sides of packaging plastic big, add the glue 2 that is in the light and light is had reflection, by being in the light, the luminous reflectance of wherein two relative side can be gone out by glue 2, three faces are made to go out light more uniform, the dark space scope that adjacent two or three face goes out between the CSP encapsulating structure of light is allowed to be obviously reduced, allow whole lamp bar to go out light more uniform, also improve the utilization rate of light.
Claims (10)
1. three faces go out a CSP encapsulating structure for light, including flip chip; It is characterized in that: the two relative side of flip chip is packaged with the glue that is in the light, the other two relative side of flip chip and end face are packaged with packaging plastic.
2. three faces according to claim 1 go out the CSP encapsulating structure of light, it is characterised in that: described packaging plastic is fluorescent glue.
3. three faces according to claim 1 go out the CSP encapsulating structure of light, it is characterised in that: described flip chip two relative side and be in the light between glue and be packaged with packaging plastic, packaging plastic is coated on side and the end face of flip chip.
4. three faces according to claim 1 go out the CSP encapsulating structure of light, it is characterised in that: flip chip includes flip chip body and is located at the electrode of flip chip body bottom portion; The lower surface of packaging plastic on the side is higher than the lower surface of electrode, and the lower surface of the glue that is in the light is higher than the lower surface of electrode.
5. three faces according to claim 1 go out the CSP encapsulating structure of light, it is characterised in that: the end face of the glue that is in the light is concordant with the packaging plastic of end face.
6. based on a lamp bar for CSP encapsulating structure, including substrate, it is characterised in that: being provided with three faces of more than two on substrate and go out the CSP encapsulating structure of light, three faces go out the CSP encapsulating structure of light and include flip chip; The two relative side of flip chip is packaged with the glue that is in the light, and the other two relative side of flip chip and end face are packaged with packaging plastic.
7. the lamp bar based on CSP encapsulating structure according to claim 6, it is characterised in that: described flip chip two relative side and be in the light between glue and be packaged with packaging plastic, packaging plastic is coated on side and the end face of flip chip.
8. the lamp bar based on CSP encapsulating structure according to claim 6, it is characterised in that: flip chip includes flip chip body and is located at the electrode of flip chip body bottom portion; The lower surface of packaging plastic on the side is higher than the lower surface of electrode, and the lower surface of the glue that is in the light is higher than the lower surface of electrode.
9. the lamp bar based on CSP encapsulating structure according to claim 6, it is characterised in that: the end face of the glue that is in the light is concordant with the packaging plastic of end face.
10. the lamp bar based on CSP encapsulating structure according to claim 6, it is characterised in that: being respectively provided on two sides with blend stop at substrate, three faces go out the CSP encapsulating structure of light and are positioned at blend stop.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520904004.2U CN205303505U (en) | 2015-11-13 | 2015-11-13 | CSP packaging structure and because CSP packaging structure's lamp strip of trilateral light -emitting |
| US15/535,709 US10573794B2 (en) | 2015-05-29 | 2016-03-31 | Method of packaging CSP LED and CSP LED |
| PCT/CN2016/077939 WO2016192452A1 (en) | 2015-05-29 | 2016-03-31 | Encapsulation method of csp led and csp led |
| EP16802375.2A EP3217442B1 (en) | 2015-05-29 | 2016-03-31 | Encapsulation method of csp led and csp led |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520904004.2U CN205303505U (en) | 2015-11-13 | 2015-11-13 | CSP packaging structure and because CSP packaging structure's lamp strip of trilateral light -emitting |
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| Publication Number | Publication Date |
|---|---|
| CN205303505U true CN205303505U (en) | 2016-06-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520904004.2U Active CN205303505U (en) | 2015-05-29 | 2015-11-13 | CSP packaging structure and because CSP packaging structure's lamp strip of trilateral light -emitting |
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|---|---|
| CN (1) | CN205303505U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106058020A (en) * | 2016-07-08 | 2016-10-26 | 深圳市兆驰节能照明股份有限公司 | Bowl-shaped structure chip-scale package luminescence apparatus and manufacturing method thereof |
| CN106252475A (en) * | 2016-09-21 | 2016-12-21 | 深圳市兆驰节能照明股份有限公司 | CSP light source and manufacture method thereof |
| CN108447963A (en) * | 2018-04-28 | 2018-08-24 | 中国人民大学 | A kind of the CSP light-source structures and preparation method of crystallo-luminescence |
| CN110767639A (en) * | 2019-11-05 | 2020-02-07 | 鸿利智汇集团股份有限公司 | Method for manufacturing car lamp light source |
-
2015
- 2015-11-13 CN CN201520904004.2U patent/CN205303505U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106058020A (en) * | 2016-07-08 | 2016-10-26 | 深圳市兆驰节能照明股份有限公司 | Bowl-shaped structure chip-scale package luminescence apparatus and manufacturing method thereof |
| CN106252475A (en) * | 2016-09-21 | 2016-12-21 | 深圳市兆驰节能照明股份有限公司 | CSP light source and manufacture method thereof |
| CN108447963A (en) * | 2018-04-28 | 2018-08-24 | 中国人民大学 | A kind of the CSP light-source structures and preparation method of crystallo-luminescence |
| CN110767639A (en) * | 2019-11-05 | 2020-02-07 | 鸿利智汇集团股份有限公司 | Method for manufacturing car lamp light source |
| CN110767639B (en) * | 2019-11-05 | 2021-11-30 | 鸿利智汇集团股份有限公司 | Method for manufacturing car lamp light source |
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Address after: 510890 Huadu District, Guangdong, Guangzhou Flower Town, SAST Road, No. 1, No. 1 Patentee after: Hongli Newell group Limited by Share Ltd Address before: 510890 Huadu District, Guangdong, Guangzhou Flower Town, SAST Road, No. 1, No. 1 Patentee before: Guangzhou Hongli Tronic Co., Ltd. |