CN205137105U - Side income formula panel light and backlight unit based on CSP packaging structure - Google Patents
Side income formula panel light and backlight unit based on CSP packaging structure Download PDFInfo
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- CN205137105U CN205137105U CN201520904006.1U CN201520904006U CN205137105U CN 205137105 U CN205137105 U CN 205137105U CN 201520904006 U CN201520904006 U CN 201520904006U CN 205137105 U CN205137105 U CN 205137105U
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Abstract
The utility model discloses a side income formula panel light and backlight unit based on CSP packaging structure. Going into the formula panel light based on CSP packaging structure's side, including casing, lamp strip and light guide plate, installing the lamp strip on the at least inside wall of casing, the light guide plate is established in the casing, and the side of light guide plate is facing to the lamp strip, the lamp strip include the base plate, be equipped with the CSP packaging structure of the trilateral light -emitting more than two on the base plate, the CSP packaging structure of trilateral light -emitting includes the flip chip, two opposite flanks of flip chip are packaged with the glue that is in the light, are packaged with the encapsulation on the two other opposite flanks of flip chip and the top surface and glue. Based on CSP packaging structure's backlight unit, including casing, lamp strip, light guide plate and diffuser plate, install the lamp strip on the at least inside wall of casing, the light guide plate is established in the casing, and the side of light guide plate faces toward the lamp strip, and the diffuser plate is located the place ahead of light guide plate. The utility model discloses a structure can improve the utilization ratio of light, reduces the dark space, improves an uniformity of light.
Description
Technical field
The utility model relates to panel light and backlight module.
Background technology
For side entering type panel light, backlight module etc., the light of luminescent device is general luminous from the side, by some optics by light-output.
Be in the patent document of 2013.9.25, disclose a kind of side entering type LED curved slab modulated structure as be 201320169267.4 applyings date in Chinese Patent Application No. being 2013.4.7 authorized announcement date, comprise the LED of the side entering type of band aluminium folder, have bending male and fomale(M&F) and the light guide plate of salient point, aluminium folder can be compressed to 40 degree LED light bundle from 120 degree; Also disclose the relational expression of light guide plate radius of curvature and thickness, in the result that light guide plate setting salient point is according to ray tracing, and use setting up an office a long way off of low-angle light, the method that the light of wide-angle sets up an office on hand and setting, guarantee light distribution evenly and the maximum utilization of light energy.
Be 201020700753.0 applyings date be 2010.12.28 authorized announcement date in Chinese Patent Application No. be in the patent document of 2011.12.14, disclose a kind of Novel backlight module, comprise light guide plate and monochromatic source; Light guide plate comprises matrix and forms in the excitation layer that the exiting surface of ink site on matrix, matrix is made up of PMMA or PC doping fluorescent powder.This backlight source module, adopts monochromatic light to propagate in matrix, and reflection occurs also to all angles diffusion, when monochromatic light enters into excitation layer, be excited formation white light, make bright dipping evenly, light emission rate is higher, light guide plate can utilize again.
For above-mentioned light source, the existing general light emitting device of main employing at present, as the luminescent device be made up of the fluorescent glue on chip and packaged chip or the luminescent device be made up of chip, support, fluorescent glue.Form panel light and backlight module, generally need on substrate, arrange multiple luminescent device.As shown in Figure 1, for the luminescent device 100 be made up of chip and fluorescent glue, chip generally has self lighting angle, above-mentioned luminescent device 100 is installed to after on substrate 200, because the lighting angle of chip is relatively little, dark space 300 can be there is between two luminescent devices, affect the uniformity of bright dipping, in addition, luminescent device is to surrounding bright dipping, and utilizable light is mainly along the light of substrate length direction and the light at top, other light cannot well be utilized, cause the utilization rate of light low, simultaneously in the side entering type panel light passing through fixture fixed light bar or side entrance back module, due to fixture blocking luminescent device two side light, cause the utilization rate of light low.
Equally, if adopt the luminescent device be made up of chip, support, fluorescent glue, also the problems referred to above can be there are.
Now, CSP encapsulating structure is applied in various field because of advantages such as volume is little, lightweight, good electrical property.
Current CSP encapsulating structure mainly comprises flip chip and is encapsulated in the packaging plastic on flip chip, and packaging plastic is fluorescent glue.Each face of flip chip can be luminous, and as being installed on substrate by CSP encapsulating structure, all directions can bright dipping except the base, and for special light source, the bright dipping of some side can not utilize, and causes the utilization rate of light low.
Summary of the invention
In order to improve the utilization rate of light, reduce dark space, improve the uniformity of bright dipping, the utility model provides a kind of side entering type panel light based on CSP encapsulating structure and backlight module.
For achieving the above object, a kind of side entering type panel light based on CSP encapsulating structure, comprises housing, lamp bar and light guide plate, and at least one madial wall of housing is provided with lamp bar, and light guide plate is located in housing, and the side of light guide plate is facing to lamp bar; Described lamp bar comprises substrate, and substrate is provided with the CSP encapsulating structure of three bright dippings of more than two, and the CSP encapsulating structure of three bright dippings comprises flip chip; The two relative side of flip chip is packaged with the glue that is in the light, and the other two relative side of flip chip and end face are packaged with packaging plastic.
Above-mentioned panel light, the light that the CSP encapsulating structure of three bright dippings sends is derived through light guide plate, realizes the bright dipping of panel light.Lamp bar is when bright dipping, two relative side being provided with due to the CSP encapsulating structure of three bright dippings is in the light glue, therefore, the CSP encapsulating structure of this structure only has two relative side and end face three bright dippings, the rising angle of flip chip side is large, therefore, adopt structure of the present utility model, make the rising angle of the two sides with packaging plastic large, dark space between the CSP encapsulating structure reducing adjacent three bright dippings, make the bright dipping of lamp bar more even, the light of lamp bar is when light guide plate, light guide plate serves again the effect of all light, make the bright dipping of panel light more even.The glue that is in the light has reflex to light, and by being in the light, the light of wherein two relative side can reflect away by glue, makes three bright dippings more even, also improves the utilization rate of light.Simultaneously by the side entering type panel light of fixture fixed light bar or side entrance back module, because luminescent device two sides that fixture is relative are provided with the glue that is in the light, light is reflected, thus improve the utilization rate of light further.
Further, flip chip two relative side and be in the light between glue and be packaged with packaging plastic, packaging plastic is coated on side and the end face of flip chip, due to flip chip and be in the light between glue and be also provided with packaging plastic, glue reflecting light and then improving extraction efficiency thus the light that the optical excitation packaging plastic that flip chip side can be made to send produces is in the light.
Further, flip chip comprises flip chip body and is located at the electrode of flip chip body bottom portion; Be positioned at the lower surface of lower surface higher than electrode of the packaging plastic of side, the lower surface of the glue that is in the light is higher than the lower surface of electrode.Because the lower surface of packaging plastic and the glue that is in the light is higher than the lower surface of electrode, the CSP encapsulating structure of three bright dippings is being fixed in the process on substrate, packaging plastic and be in the light between glue lower surface and substrate there is gap, therefore, even if packaging plastic and the glue that is in the light have downward burr, also the electrode of flip chip and the close contact of substrate can not be affected, in addition, if packaging plastic and the glue expanded by heating that is in the light, also its space of expanding is given below packaging plastic and the glue that is in the light, therefore, the voidage that the CSP encapsulating structure reducing three bright dippings is connected with substrate, solve due to packaging plastic, the electrode that the glue that is in the light cutting exists burr and flip chip causes being electrically connected insecure problem between flip chip with substrate with being heated in substrate welding process, make the connection of flip chip and substrate more firm.
Further, the end face of the glue that is in the light is concordant with the packaging plastic of end face, avoids because the glue that is in the light affects rising angle higher than packaging plastic.
Further, be respectively equipped with blend stop in the both sides of substrate, the CSP encapsulating structure of three bright dippings is positioned at blend stop.Shield bars has the effect of being in the light, and makes the bright dipping of lamp bar more concentrated, even.
Based on a backlight module for CSP encapsulating structure, comprise housing, lamp bar, light guide plate and diffuser plate, at least one madial wall of housing is provided with lamp bar, and light guide plate is located in housing, and the side of light guide plate is facing to lamp bar, and diffuser plate is positioned at the front of light guide plate; Described lamp bar comprises substrate, and substrate is provided with the CSP encapsulating structure of three bright dippings of more than two, and the CSP encapsulating structure of three bright dippings comprises flip chip; The two relative side of flip chip is packaged with the glue that is in the light, and the other two relative side of flip chip and end face are packaged with packaging plastic.
Above-mentioned backlight module, the light that the CSP encapsulating structure of three bright dippings sends is derived through light guide plate, realizes the effect of backlight after diffuser plate.Lamp bar is when bright dipping, two relative side being provided with due to the CSP encapsulating structure of three bright dippings is in the light glue, therefore, the CSP encapsulating structure of this structure only has two relative side and end face three bright dippings, the rising angle of flip chip side is large, therefore, adopt structure of the present utility model, make the rising angle of the two sides with packaging plastic large, dark space between the CSP encapsulating structure reducing adjacent three bright dippings, make the bright dipping of lamp bar more even, the light of lamp bar is when light guide plate and diffuser plate, light guide plate and diffuser plate serve again the effect of all light, make the bright dipping of backlight module more even.The glue that is in the light has reflex to light, and by being in the light, the light of wherein two relative side can reflect away by glue, makes three bright dippings more even, also improves the utilization rate of light.Simultaneously by the side entering type panel light of fixture fixed light bar or side entrance back module, because luminescent device two sides that fixture is relative are provided with the glue that is in the light, light is reflected, thus improve the utilization rate of light further.
Further, described flip chip two relative side and be in the light between glue and be packaged with packaging plastic, packaging plastic is coated on side and the end face of flip chip, due to flip chip and be in the light between glue and be also provided with packaging plastic, glue reflecting light and then improving extraction efficiency thus the light that the optical excitation packaging plastic that flip chip side can be made to send produces is in the light.
Further, flip chip comprises flip chip body and is located at the electrode of flip chip body bottom portion; Be positioned at the lower surface of lower surface higher than electrode of the packaging plastic of side, the lower surface of the glue that is in the light is higher than the lower surface of electrode.Because the lower surface of packaging plastic and the glue that is in the light is higher than the lower surface of electrode, the CSP encapsulating structure of three bright dippings is being fixed in the process on substrate, packaging plastic and be in the light between glue lower surface and substrate there is gap, therefore, even if packaging plastic and the glue that is in the light have downward burr, also the electrode of flip chip and the close contact of substrate can not be affected, in addition, if packaging plastic and the glue expanded by heating that is in the light, also its space of expanding is given below packaging plastic and the glue that is in the light, therefore, the voidage that the CSP encapsulating structure reducing three bright dippings is connected with substrate, solve due to packaging plastic, the electrode that the glue that is in the light cutting exists burr and flip chip causes being electrically connected insecure problem between flip chip with substrate with being heated in substrate welding process, make the connection of flip chip and substrate more firm.
Further, be respectively equipped with blend stop in the both sides of substrate, the CSP encapsulating structure of three bright dippings is positioned at blend stop.Shield bars has the effect of being in the light, and makes the bright dipping of lamp bar more concentrated, even.
Further, light guide plate comprises matrix and forms in the ink site on matrix; The exiting surface of matrix is provided with the excitation layer be made up of PMMA or PC doping fluorescent powder; The thickness of excitation layer is 0.1 ~ 0.5mm; The front being positioned at diffuser plate in housing is provided with brightening piece.When using backlight module, lamp bar light source is introduced in matrix, in matrix, reflection occurs and spreads to all angles, be excited when light enters into excitation layer, because excitation layer is attached on the exiting surface of matrix, like this, the loss of light is little, and therefore, the light extraction efficiency of backlight module is high; Because excitation layer is face structure, therefore, the brightness that backlight module sends is even, and bright dipping is also even; Because excitation layer is located at matrix exiting surface side, when needs utilize light guide plate again, only need excitation layer to remove, therefore, both environmental protection, can save material again.Due to the thinner thickness of excitation layer, light can not repeatedly be excited, and therefore, can ensure the uniformity of coordinate; And, the thickness of excitation layer can be controlled flexibly according to the performance of light.Owing to being provided with brightening piece, light brightness after brightening piece increases.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of prior art.
Fig. 2 is the schematic diagram of the side entering type panel light based on CSP encapsulating structure.
Fig. 3 is the top view of lamp bar.
Fig. 4 is D-D sectional view in lamp bar Fig. 3.
Fig. 5 is A-A sectional view in CSP encapsulating structure Figure 10 of three bright dippings.
Fig. 6 is B-B sectional view in CSP encapsulating structure Figure 10 of three bright dippings.
Fig. 7 is the schematic diagram of another structure of CSP encapsulating structure of three bright dippings.
Fig. 8 is the schematic diagram of the third structure of CSP encapsulating structure of three bright dippings.
Fig. 9 is the schematic diagram of CSP encapsulating structure the 4th kind of structure of three bright dippings.
Figure 10 is C-C sectional view in Fig. 5.
Figure 11 is the schematic diagram be installed to by the CSP encapsulating structure of three bright dippings on substrate.
Figure 12 is the stereogram of backlight module.
Figure 13 is E-E sectional view in Figure 12.
Figure 14 is F-F sectional view in Figure 12.
Figure 15 is light conducting plate structure figure.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the utility model is further elaborated.
Embodiment 1.
As shown in Figure 2, the side entering type panel light based on CSP encapsulating structure comprises housing 51, lamp bar 1000, light guide plate 52 and printing opacity cover plate 53.
At least one madial wall of housing 51 is provided with lamp bar 1000, in the present embodiment, two relative madial walls is provided with lamp bar 1000.Light guide plate 52 is located in housing 51, and the side of light guide plate 52 is facing to lamp bar 1000.Printing opacity cover plate 53 is arranged on the opening part of housing 51.
As shown in Figure 3 and Figure 4, lamp bar comprises substrate 10, is provided with the CSP encapsulating structure 100 of three bright dippings of more than two on the substrate 10.The both sides of substrate 10 are respectively equipped with blend stop 101, and the CSP encapsulating structure 100 of three bright dippings is positioned at blend stop 101, make the bright dipping of lamp bar more concentrated, even.
As shown in Fig. 5, Fig. 6 and Figure 10, the CSP encapsulating structure of three bright dippings comprises flip chip 1, the electrode 12 that flip chip 1 comprises flip chip body 11 and is located at bottom flip chip body 11, and electrode 12 is electrically connected with the line layer of substrate.
The two relative side of flip chip body 11 is packaged with the glue 2 that is in the light, and the glue that is in the light is white glue, and this glue extinction that is in the light is few, and has reflex to light.The other two relative side of flip chip body 11 and end face are packaged with packaging plastic 3, and packaging plastic is fluorescent glue.The two sides with packaging plastic are vertical with the long limit of substrate 10, are normal orientation.
As shown in Figure 5 and Figure 6, be positioned at the lower surface of lower surface higher than electrode 12 of the packaging plastic of side, the lower surface of the glue 2 that is in the light is higher than the lower surface of electrode 12.As shown in figure 11, because the lower surface of packaging plastic 3 and the glue 2 that is in the light is higher than the lower surface of electrode 12, the CSP encapsulating structure of three bright dippings is being fixed in the process on substrate 10, packaging plastic 3 and be in the light between glue 2 lower surface and substrate 10 there is gap, therefore, even if packaging plastic 3 and the glue 2 that is in the light have downward burr, also the electrode of flip chip 1 and the close contact of substrate 10 can not be affected, in addition, if packaging plastic 3 and glue 2 expanded by heating that is in the light, also its space of expanding is given below packaging plastic 3 and the glue 2 that is in the light, therefore, the voidage that the CSP encapsulating structure reducing three bright dippings is connected with substrate 10, solve due to packaging plastic 3, the electrode that the glue 2 that is in the light cutting exists burr and flip chip causes being electrically connected insecure problem between flip chip with substrate 10 with being heated in substrate 10 welding process, make flip chip 1 more firm with the connection of substrate 10.
As shown in Figure 6, the end face of glue 2 of being in the light is concordant with the packaging plastic of end face.Avoid because the glue 2 that is in the light affects rising angle higher than packaging plastic.
As shown in Figure 7, the packaging plastic of end face covers a part for the glue 2 that is in the light, reduces to occur gold-tinted above the glue 2 that is in the light.
As shown in Figure 8, the packaging plastic of end face all can cover flip chip and be in the light on glue 2.
As shown in Figure 9, be provided with packaging plastic 3 being in the light between glue 2 and flip chip 1 two relative side, packaging plastic 3 is coated on side and the end face of flip chip, due to flip chip 1 and be in the light between glue 2 and be also provided with packaging plastic 3, glue reflecting light and then improving extraction efficiency thus the light that the optical excitation packaging plastic that flip chip side can be made to send produces is in the light.
The light that the CSP encapsulating structure 100 of three bright dippings of panel light sends is derived through light guide plate 52, then penetrates through printing opacity cover plate 53, realizes the bright dipping of panel light.Lamp bar 1000 is when bright dipping, two relative side being provided with due to the CSP encapsulating structure 100 of three bright dippings is in the light glue 2, therefore, the CSP encapsulating structure 100 of this structure only has two relative side and end face three bright dippings, the rising angle of flip chip 1 side is large, therefore, adopt structure of the present utility model, make the rising angle of the two sides with packaging plastic large, dark space between the CSP encapsulating structure reducing adjacent three bright dippings, make the bright dipping of lamp bar 1000 more even, the light of lamp bar 1000 is when light guide plate 52, light guide plate 52 serves again the effect of all light, make the bright dipping of panel light more even.The glue 2 that is in the light has reflex to light, and by being in the light, the light of wherein two relative side can reflect away by glue 2, makes three bright dippings more even, also improves the utilization rate of light.
Embodiment 2.
The backlight module based on CSP encapsulating structure as shown in Figure 12 to Figure 14, comprise housing 61, the sidewall of housing 61 is provided with lamp bar 1000, light guide plate 63 is installed in housing 61, side and the lamp bar 1000 of light guide plate 63 align, the front being positioned at light guide plate light emission side in housing 61 is provided with diffuser plate 64, when the light launched from light guide plate is through diffuser plate, the uniformity of light and the utilization rate of light are improved, the front being positioned at diffuser plate 64 in housing 61 is provided with brightening piece 65, described brightening piece 65 comprises the first brightening piece 651 and the second brightening piece 652, when light brightness after brightening piece increases.
As shown in Figure 3 and Figure 4, lamp bar comprises substrate 10, is provided with the CSP encapsulating structure 100 of three bright dippings of more than two on the substrate 10.The both sides of substrate 10 are respectively equipped with blend stop 101, and the CSP encapsulating structure 100 of three bright dippings is positioned at blend stop 101, make the bright dipping of lamp bar more concentrated, even.
As shown in Fig. 5, Fig. 6 and Figure 10, the CSP encapsulating structure of three bright dippings comprises flip chip 1, the electrode 12 that flip chip 1 comprises flip chip body 11 and is located at bottom flip chip body 11, and electrode 12 is electrically connected with the line layer of substrate.
The two relative side of flip chip body 11 is packaged with the glue 2 that is in the light, and the glue that is in the light is white glue, and this glue extinction that is in the light is few, and has reflex to light.The other two relative side of flip chip body 11 and end face are packaged with packaging plastic 3, and packaging plastic is fluorescent glue.The two sides with packaging plastic are vertical with the long limit of substrate 10, are normal orientation.
As shown in Figure 5 and Figure 6, be positioned at the lower surface of lower surface higher than electrode 12 of the packaging plastic of side, the lower surface of the glue 2 that is in the light is higher than the lower surface of electrode 12.As shown in figure 11, because the lower surface of packaging plastic 3 and the glue 2 that is in the light is higher than the lower surface of electrode 12, the CSP encapsulating structure of three bright dippings is being fixed in the process on substrate 10, packaging plastic 3 and be in the light between glue 2 lower surface and substrate 10 there is gap, therefore, even if packaging plastic 3 and the glue 2 that is in the light have downward burr, also the electrode of flip chip 1 and the close contact of substrate 10 can not be affected, in addition, if packaging plastic 3 and glue 2 expanded by heating that is in the light, also its space of expanding is given below packaging plastic 3 and the glue 2 that is in the light, therefore, the voidage that the CSP encapsulating structure reducing three bright dippings is connected with substrate 10, solve due to packaging plastic 3, the electrode that the glue 2 that is in the light cutting exists burr and flip chip causes being electrically connected insecure problem between flip chip with substrate 10 with being heated in substrate 10 welding process, make flip chip 1 more firm with the connection of substrate 10.
As shown in Figure 6, the end face of glue 2 of being in the light is concordant with the packaging plastic of end face.Avoid because the glue 2 that is in the light affects rising angle higher than packaging plastic.
As shown in Figure 7, the packaging plastic of end face covers a part for the glue 2 that is in the light, reduces to occur gold-tinted above the glue 2 that is in the light.
As shown in Figure 8, the packaging plastic of end face all can cover flip chip and be in the light on glue 2.
As shown in Figure 9, be provided with packaging plastic 3 being in the light between glue 2 and flip chip 1 two relative side, packaging plastic 3 is coated on side and the end face of flip chip, due to flip chip 1 and be in the light between glue 2 and be also provided with packaging plastic 3, glue reflecting light and then improving extraction efficiency thus the light that the optical excitation packaging plastic that flip chip side can be made to send produces is in the light.As shown in figure 15, light guide plate comprises matrix 631 and forms in the excitation layer that the exiting surface of ink site on matrix, matrix is made up of PMMA or PC doping fluorescent powder, matrix 631 is made up of PMMA or PC material, the exiting surface of matrix 631 is provided with the excitation layer 633 be made up of PMMA doping fluorescent powder or the excitation layer be made up of PC doping fluorescent powder, the thickness of described excitation layer 633 is 0.1 ~ 0.5mm, matrix is distributed with ink site 632, ink site 632 is pit or projection, in the present embodiment, ink site 632 is protruding.
Above-mentioned backlight module, the light that the CSP encapsulating structure 100 of three bright dippings sends is derived through light guide plate 63, realizes the effect of backlight after diffuser plate 64 and brightening piece.Lamp bar 1000 is when bright dipping, two relative side being provided with due to the CSP encapsulating structure 100 of three bright dippings is in the light glue 2, therefore, the CSP encapsulating structure 100 of this structure only has two relative side and end face three bright dippings, the rising angle of flip chip 1 side is large, therefore, adopt structure of the present utility model, make the rising angle of the two sides with packaging plastic large, dark space between the CSP encapsulating structure reducing adjacent three bright dippings, make the bright dipping of lamp bar 1000 more even, the light of lamp bar 1000 is when light guide plate 63 and diffuser plate 64, light guide plate 63 and diffuser plate 64 serve again the effect of all light, make the bright dipping of backlight module more even.The glue 2 that is in the light has reflex to light, and by being in the light, the light of wherein two relative side can reflect away by glue 2, makes three bright dippings more even, also improves the utilization rate of light.
Claims (10)
1. based on a side entering type panel light for CSP encapsulating structure, comprise housing, lamp bar and light guide plate, at least one madial wall of housing is provided with lamp bar, and light guide plate is located in housing, and the side of light guide plate is facing to lamp bar; Described lamp bar comprises substrate, it is characterized in that: the CSP encapsulating structure being provided with three bright dippings of more than two on substrate, and the CSP encapsulating structure of three bright dippings comprises flip chip; The two relative side of flip chip is packaged with the glue that is in the light, and the other two relative side of flip chip and end face are packaged with packaging plastic.
2. the side entering type panel light based on CSP encapsulating structure according to claim 1, is characterized in that: described flip chip two relative side and be in the light between glue and be packaged with packaging plastic, and packaging plastic is coated on side and the end face of flip chip.
3. the side entering type panel light based on CSP encapsulating structure according to claim 1, is characterized in that: flip chip comprises flip chip body and is located at the electrode of flip chip body bottom portion; Be positioned at the lower surface of lower surface higher than electrode of the packaging plastic of side, the lower surface of the glue that is in the light is higher than the lower surface of electrode.
4. the side entering type panel light based on CSP encapsulating structure according to claim 1, is characterized in that: the end face of the glue that is in the light is concordant with the packaging plastic of end face.
5. the side entering type panel light based on CSP encapsulating structure according to claim 1, is characterized in that: be respectively equipped with blend stop in the both sides of substrate, and the CSP encapsulating structure of three bright dippings is positioned at blend stop.
6. based on a backlight module for CSP encapsulating structure, comprise housing, lamp bar, light guide plate and diffuser plate, at least one madial wall of housing is provided with lamp bar, and light guide plate is located in housing, and the side of light guide plate is facing to lamp bar, and diffuser plate is positioned at the front of light guide plate; Described lamp bar comprises substrate, it is characterized in that: the CSP encapsulating structure being provided with three bright dippings of more than two on substrate, and the CSP encapsulating structure of three bright dippings comprises flip chip; The two relative side of flip chip is packaged with the glue that is in the light, and the other two relative side of flip chip and end face are packaged with packaging plastic.
7. the backlight module based on CSP encapsulating structure according to claim 6, is characterized in that: described flip chip two relative side and be in the light between glue and be packaged with packaging plastic, and packaging plastic is coated on side and the end face of flip chip.
8. the backlight module based on CSP encapsulating structure according to claim 6, is characterized in that: flip chip comprises flip chip body and is located at the electrode of flip chip body bottom portion; Be positioned at the lower surface of lower surface higher than electrode of the packaging plastic of side, the lower surface of the glue that is in the light is higher than the lower surface of electrode.
9. the backlight module based on CSP encapsulating structure according to claim 6, is characterized in that: be respectively equipped with blend stop in the both sides of substrate, the CSP encapsulating structure of three bright dippings is positioned at blend stop.
10. the backlight module based on CSP encapsulating structure according to claim 6, is characterized in that: light guide plate comprises matrix and forms in the ink site on matrix; The exiting surface of matrix is provided with the excitation layer be made up of PMMA or PC doping fluorescent powder; The thickness of excitation layer is 0.1 ~ 0.5mm; The front being positioned at diffuser plate in housing is provided with brightening piece.
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| CN107247366A (en) * | 2017-08-01 | 2017-10-13 | 武汉天马微电子有限公司 | Backlight module and display device |
| CN107448830A (en) * | 2017-09-08 | 2017-12-08 | 广东晶科电子股份有限公司 | A kind of CSP lamp bars of light leakage |
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| CN107731799A (en) * | 2016-08-11 | 2018-02-23 | 三星电子株式会社 | Light source module, the method and back light unit for manufacturing light source module |
| CN106229312A (en) * | 2016-08-30 | 2016-12-14 | 厦门华联电子有限公司 | A kind of full spectrum CSP packaged light source and manufacture method thereof |
| CN107247366A (en) * | 2017-08-01 | 2017-10-13 | 武汉天马微电子有限公司 | Backlight module and display device |
| CN107247366B (en) * | 2017-08-01 | 2020-04-24 | 武汉天马微电子有限公司 | Backlight module and display device |
| CN107448830A (en) * | 2017-09-08 | 2017-12-08 | 广东晶科电子股份有限公司 | A kind of CSP lamp bars of light leakage |
| CN109950379A (en) * | 2017-12-20 | 2019-06-28 | 深圳市聚飞光电股份有限公司 | Wafer-level package LED of multifaceted light-emitting and preparation method thereof, backlight module |
| CN108511586A (en) * | 2018-02-09 | 2018-09-07 | 中山市立体光电科技有限公司 | A kind of LED light bar |
| CN108511586B (en) * | 2018-02-09 | 2023-12-05 | 中山市木林森电子有限公司 | LED lamp strip |
| TWI701485B (en) * | 2018-06-06 | 2020-08-11 | 友達光電股份有限公司 | Backlight module and display device using the same |
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Address after: 510890 Huadu District, Guangdong, Guangzhou Flower Town, SAST Road, No. 1, No. 1 Patentee after: Hongli Newell group Limited by Share Ltd Address before: 510890 Huadu District, Guangdong, Guangzhou Flower Town, SAST Road, No. 1, No. 1 Patentee before: Guangzhou Hongli Tronic Co., Ltd. |