CN202532210U - Heat pipe type LED lamp - Google Patents
Heat pipe type LED lamp Download PDFInfo
- Publication number
- CN202532210U CN202532210U CN201120404201XU CN201120404201U CN202532210U CN 202532210 U CN202532210 U CN 202532210U CN 201120404201X U CN201120404201X U CN 201120404201XU CN 201120404201 U CN201120404201 U CN 201120404201U CN 202532210 U CN202532210 U CN 202532210U
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- substrate
- heat pipe
- light source
- led light
- led
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Abstract
The utility model discloses a heat pipe type LED lamp relating to an LED lamp. A high power LED lamp usually adopts a heat pipe for the heat dissipation, and an LED chip can not be attached to a heat dissipation device directly, therefore a pedestal used for carrying the LED chip is additionally disposed between the heat pipe and the LED chip. The arrangement of the pedestal increases the thermal resistance, and the heat dissipation of the LED can be affected. The utility model is characterized in that the heat dissipation device comprises the heat pipe, a substrate connected to the heat pipe, a closed cavity disposed in a middle part of the substrate; the heat pipe is communicated with the cavity; an upper end surface of the substrate is provided with an LED light source, and a contact surface between the substrate and the LED light source is a plane; the LED chip is directly disposed on the upper end surface of the substrate in a sealed manner to form the LED light source, which is integrated with the heat dissipation device into one body. The contact between the substrate and the LED light source is the contact between planes, therefore the integrity of the contact can be guaranteed, and the welding quality can be improved. The heat generated by the LED chip can be directly dissipated by the heat dissipation device, the thermal resistance coefficient is small, the thermal conduction is fast, the luminous efficiency of the LED can be improved, and the service lifetime of the LED can be prolonged.
Description
Technical field
The utility model relates to a kind of LED lamp.
Background technology
The LED light fixture has energy-conservation, efficient, long-life advantage, and in today of noting the protection energy day by day, the application of high-powered LED lamp is constantly widened, and product has related to fields such as Landscape Lighting, mine lamp, street lamp and emergency light.
Because the LED lamp can produce a large amount of heat when work, heat dissipation problem has become the bottleneck that the development of LED light fixture is promoted.The normal employing heat pipe of high-powered LED lamp dispels the heat, because the heat pipe cross section is rounded, it contacts with led light source with cambered surface; Contact-making surface is little and contact gap is many; Radiating rate is slow, influences the light efficiency and the life-span of led light source, and the solder side of heat pipe and led light source is an arc surface; Be prone to produce rosin joint, quality can not get guaranteeing; Led chip can not directly be attached on the radiator, need set up the pedestal that can carry led chip between heat pipe and the led chip, and being provided with of pedestal increased thermal resistance, influences the heat radiation of LED.
The utility model content
The technical problem that the utility model will solve and the technical assignment of proposition are that the prior art scheme is improved and improved, and a kind of heat pipe type LED lamp is provided, to reach rapid heat dissipation, light efficiency is good, the life-span is long purpose.For this reason, the utility model is taked following technical scheme.
A kind of heat pipe type LED lamp comprises led light source, the radiator that is connected with led light source, it is characterized in that: described radiator comprises heat pipe, the substrate that is connected with heat pipe, and airtight cavity is established at the middle part of substrate, and described heat pipe communicates with cavity; The upper surface of substrate is provided with described led light source, and the contact-making surface of substrate and led light source is the plane, and led chip directly is encapsulated in the upper surface formation of substrate and the led light source of radiator one.Substrate contacts with led light source and is plane and plane contact, with respect to the arc contact, guarantees the integrality of contact more easily; And smear tin cream in the plane and be used for Reflow Soldering, guarantee the uniformity of tin cream more easily, improve the quality of welding; Because led chip directly is encapsulated in the upper surface of substrate, the heat that led chip produces is directly by radiator heat-dissipation, and thermal resistivity is little; The heat conduction is fast, the light efficiency and the life-span that help improving LED.
As the further of technique scheme improved and replenish, the utility model also comprises following additional technical feature.
Middle part, described substrate upper surface is the led light source loading end; Be covered with silver coating on the led light source loading end, on silver coating, mount led chip, the periphery of led light source loading end is established and is drawn electricity district, between the chip and chip with draw electricity and be electrically connected through gold thread between distinguishing; Or the direct overlay film circuit of substrate upper end led light source loading end, led chip is mounted on the overlay film circuit board.Direct current is introduced by drawing the electricity district, and is connected with each chip through gold thread, realizes the serial or parallel connection of chip.Draw the electricity district and can be pcb board coating.Silver coating is used for reflection of light, to improve the exitance of light.
Led light source loading end indent in the substrate upper surface to form the optics cup with the substrate one; Or the substrate upper surface is the plane, and led light source loading end periphery is provided with encloses the optics cup that frame forms evagination, fills light-mixed layer in the optics cup.
The upper surface of substrate is provided with screw, and screw passes led light source lens gland and substrate and is spirally connected lens are fixed on the substrate.Realize that lens are connected with the reliable of radiator.
The substrate periphery offers a plurality of connecting holes that are communicated with cavity, and described heat pipe is communicated with the substrate cavity through connecting hole.Substrate comprises upper substrate and the infrabasal plate that is positioned at the upper substrate below, forms sealed hollow between the upper and lower substrate.
Groove is established at the middle part, lower surface of described upper substrate, and described infrabasal plate is dull and stereotyped, and upper substrate and infrabasal plate welding back form sealed hollow in the centre.
Described substrate is polygon, and a connecting hole is offered on its every limit at least, heat pipe and welding of substrate connecting hole or close-fitting.
Described substrate is square, and two connecting holes are established on every limit, and eight heat pipes and the welding of substrate connecting hole form the radiator of four sides heat radiation.
Plural pieces rectangle fin is vertically welded on the heat pipe.
The fin shape that is positioned at both sides, substrate front and back is identical; The fin shape that is positioned at the substrate left and right sides is identical; The fin width that wherein is positioned at the substrate left and right sides is greater than the fin that is positioned at both sides, substrate front and back, and the fin of both sides, front and back and the combination of the fin of the left and right sides form square or cross housing.
Beneficial effect: substrate contacts with led light source and is plane and plane contact, with respect to the arc contact, guarantees the uniformity of tin cream more easily; Improve the quality of welding; Because led chip directly is encapsulated in the upper surface of substrate, the heat that led chip produces is directly by radiator heat-dissipation, and thermal resistivity is little; The heat conduction is fast, the light efficiency and the life-span that help improving LED.
Description of drawings
Fig. 1 is a kind of structural representation of the utility model.
Fig. 2 is second kind of structural representation of the utility model.
Fig. 3 is the utility model heat spreader structures sketch map.
Fig. 4 is the horizontal sectional structure sketch map of Fig. 3.
Fig. 5 is the vertical sectional structure sketch map of Fig. 3.
Fig. 6 is the third structural representation of the utility model.
Among the figure: 1-heat pipe, 2-substrate, 3-cavity, 4-connecting hole, 5-fin, 6-chip, 7-screw, 8-optics cup, 9-draw the electricity district.
The specific embodiment
Below in conjunction with Figure of description the technical scheme of the utility model is done further detailed description.
Shown in Fig. 1-6, the utility model comprises led light source, the radiator that is connected with led light source, and radiator comprises heat pipe 1, the substrate 2 that is connected with heat pipe 1, and airtight cavity 3 is established at the middle part of substrate 2, and heat pipe 1 communicates with cavity 3; The upper surface of substrate 2 is provided with led light source, and substrate 2 is the plane with the contact-making surface of led light source, and led chip 6 directly is encapsulated in the upper surface formation of substrate 2 and the led light source of radiator one.Middle part, substrate 2 upper surfaces is the led light source loading end; Middle part, substrate 2 upper surfaces is the led light source loading end; Be covered with silver coating on the led light source loading end; On silver coating, establish led chip 6, the periphery of led light source loading end is established pcb board, and the conduction region on the pcb board is as drawing electricity district 9; Between the chip 6 and chip 6 with draw electricity and be electrically connected through gold thread between distinguishing 9; Also can be at the direct overlay film circuit of led light source loading end, led chip 6 is mounted on the overlay film circuit board, accomplishes to connect.Led light source loading end indent in the substrate upper surface to form the optics cup 8 with the substrate one, shown in Fig. 1-5; Or the substrate upper surface is the plane, and led light source loading end periphery is provided with encloses the optics cup 8 that frame forms evagination, as shown in Figure 6; Fill light-mixed layer in the optics cup 8.Substrate 2 peripheries offer a plurality of connecting holes 4 that are communicated with cavity 3, and heat pipe 1 is communicated with substrate 2 cavitys 3 through connecting hole 4.Substrate 2 comprises upper substrate and the infrabasal plate that is positioned at the upper substrate below, and groove is established at the middle part, lower surface of upper substrate, and infrabasal plate is dull and stereotyped, and upper substrate and infrabasal plate welding back form sealed hollow 3 in the centre.Substrate 2 is polygon, and a connecting hole 4 is offered on its every limit at least, heat pipe 1 and substrate 2 connecting holes 4 welding or close-fittings.In the present embodiment, substrate 2 is square, and every limit is established 4, eight heat pipes of two connecting holes 1 and formed the radiator that dispels the heat in the four sides with 4 welding of substrate 2 connecting holes.Plural pieces rectangle fin 5 is vertically welded on the heat pipe 1 side by side; Fin 5 shapes that are positioned at both sides, substrate 2 front and back are identical; Fin 5 shapes that are positioned at substrate 2 left and right sides are identical; Fin 5 width that wherein are positioned at substrate 2 left and right sides are greater than the fin 5 that is positioned at both sides, substrate 2 front and back, and the fin of both sides, front and back and the combination of the fin of the left and right sides form square radiator, and be as shown in Figure 2; Certainly also can form " ten " shape Radiator, as shown in Figure 1.
Claims (12)
1. heat pipe type LED lamp; Comprise led light source, the radiator that is connected with led light source; It is characterized in that: described radiator comprises heat pipe (1), the substrate (2) that is connected with heat pipe (1); Airtight cavity (3) is established at the middle part of substrate (2), and described heat pipe (1) communicates with cavity (3); The upper surface of substrate (2) is provided with described led light source, and substrate (2) is the plane with the contact-making surface of led light source, and led chip (6) directly is encapsulated in the upper surface formation of substrate (2) and the led light source of radiator one.
2. a kind of heat pipe type LED lamp according to claim 1 is characterized in that: middle part, described substrate (2) upper surface is the led light source loading end; Be covered with silver coating on the led light source loading end, on silver coating, mount led chip (6), the periphery of led light source loading end is established and is drawn electricity district (9), between the chip (6) and chip (6) with draw electricity and distinguish between (9) and be electrically connected through gold thread.
3. a kind of heat pipe type LED lamp according to claim 1 is characterized in that: middle part, described substrate (2) upper surface is the led light source loading end; The direct overlay film circuit of led light source loading end, led chip (6) is mounted on the overlay film circuit board.
4. according to claim 2 or 3 described a kind of heat pipe type LED lamps, it is characterized in that: led light source loading end indent in substrate (2) upper surface to form the optics cup (8) with the substrate one; Fill light-mixed layer in the optics cup (8).
5. according to claim 2 or 3 described a kind of heat pipe type LED lamps, it is characterized in that: substrate (2) upper surface is the plane, and led light source loading end periphery is provided with encloses the optics cup (8) that frame forms evagination; Fill light-mixed layer in the optics cup (8).
6. according to the described a kind of heat pipe type LED lamp of the arbitrary claim of claim 1-3, it is characterized in that: the upper surface of substrate (2) is provided with screw (7), and screw passes led light source lens gland and substrate (2) and is spirally connected lens are fixed on the substrate.
7. a kind of heat pipe type LED lamp according to claim 1 is characterized in that: substrate (2) periphery offers a plurality of connecting holes (4) that are communicated with cavity (3), and described heat pipe (1) is communicated with substrate (2) cavity (3) through connecting hole (4); Substrate (2) comprises upper substrate and the infrabasal plate that is positioned at the upper substrate below, forms sealed hollow (3) between the upper and lower substrate.
8. a kind of heat pipe type LED lamp according to claim 7 is characterized in that: groove is established at the middle part, lower surface of described upper substrate, and described infrabasal plate is dull and stereotyped, and upper substrate and infrabasal plate welding back form sealed hollow (3) in the centre.
9. a kind of heat pipe type LED lamp according to claim 8, it is characterized in that: described substrate (2) is polygon, and a connecting hole (4) is offered on its every limit at least, heat pipe (1) and substrate (2) connecting hole (4) welding or close-fitting.
10. a kind of heat pipe type LED lamp according to claim 9, it is characterized in that: described substrate (2) is square, and two connecting holes (4) are established on every limit, and eight heat pipes (1) form the radiator that dispels the heat in the four sides with substrate (2) connecting hole (4) welding.
11. a kind of heat pipe type LED lamp according to claim 10 is characterized in that: plural pieces rectangle fin (5) is vertically welded on the heat pipe (1) side by side.
12. a kind of heat pipe type LED lamp according to claim 11; It is characterized in that: fin (5) shape that is positioned at both sides, substrate (2) front and back is identical; Fin (5) shape that is positioned at substrate (2) left and right sides is identical; Fin (5) width that wherein is positioned at substrate (2) left and right sides is greater than the fin (5) that is positioned at both sides, substrate (2) front and back, and the fin of both sides, front and back and the combination of the fin of the left and right sides form square or cross radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120404201XU CN202532210U (en) | 2011-10-21 | 2011-10-21 | Heat pipe type LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120404201XU CN202532210U (en) | 2011-10-21 | 2011-10-21 | Heat pipe type LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202532210U true CN202532210U (en) | 2012-11-14 |
Family
ID=47133396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120404201XU Expired - Fee Related CN202532210U (en) | 2011-10-21 | 2011-10-21 | Heat pipe type LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202532210U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102606905A (en) * | 2011-10-21 | 2012-07-25 | 杭州临安新联电器工业有限公司 | Heat-pipe type LED (light emitting diode) lamp |
| CN105020685A (en) * | 2014-04-15 | 2015-11-04 | 英属开曼群岛纳诺有限公司 | LED heat radiation structure |
| CN110471242A (en) * | 2018-05-09 | 2019-11-19 | 深圳光峰科技股份有限公司 | Light source fixed substrate, light source heat radiation mechanism and projector |
-
2011
- 2011-10-21 CN CN201120404201XU patent/CN202532210U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102606905A (en) * | 2011-10-21 | 2012-07-25 | 杭州临安新联电器工业有限公司 | Heat-pipe type LED (light emitting diode) lamp |
| CN105020685A (en) * | 2014-04-15 | 2015-11-04 | 英属开曼群岛纳诺有限公司 | LED heat radiation structure |
| CN110471242A (en) * | 2018-05-09 | 2019-11-19 | 深圳光峰科技股份有限公司 | Light source fixed substrate, light source heat radiation mechanism and projector |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121114 Termination date: 20151021 |
|
| EXPY | Termination of patent right or utility model |