CN110471242A - Light source fixed substrate, light source heat radiation mechanism and projector - Google Patents
Light source fixed substrate, light source heat radiation mechanism and projector Download PDFInfo
- Publication number
- CN110471242A CN110471242A CN201810436304.0A CN201810436304A CN110471242A CN 110471242 A CN110471242 A CN 110471242A CN 201810436304 A CN201810436304 A CN 201810436304A CN 110471242 A CN110471242 A CN 110471242A
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- Prior art keywords
- light source
- heat
- fixed substrate
- conducting piece
- hole
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/16—Cooling; Preventing overheating
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/20—Lamp housings
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Projection Apparatus (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The embodiment of the invention provides a kind of light source fixed substrate, light source heat radiation mechanism and projectors, belong to porjector technology field.The light source fixed substrate includes bottom surface, top surface and the first side being connected between bottom surface and top surface, bottom surface is opposite with top surface, light source fixed substrate is provided at least one mounting hole for grafting heat-conducting piece, and mounting hole forms the entrance being inserted into for heat-conducting piece through first side.Volume can be reduced under the premise of guaranteeing heat dissipation effect using the light source heat radiation mechanism of the light source fixed substrate, and to further reduce volume using the projector of the light source fixed substrate, conducive to the miniaturization of projector.
Description
Technical field
The present invention relates to porjector technology fields, and in particular to a kind of light source fixed substrate, light source heat radiation mechanism and throwing
Shadow instrument.
Background technique
Micro projector is also known as Portable projector, the huge projector's exquisiteness of tradition, portability, microminiaturization,
Entertainment orientation, functionization make shadow casting technique more closeness to life and amusement, are with a wide range of applications.
For the micro projector of high brightness, system total power is larger, how to design low noise, low surface temperature
Product be a big difficulty, so, the heat dissipation design of system is a major challenge.At the same time, it is limited to the size of heat radiation module,
Existing micro projector is difficult to further decrease the volume of projector under the premise of guaranteeing heat dissipation performance.
Summary of the invention
The purpose of the present invention is to provide a kind of light source fixed substrates, with excellent heat conduction structure.
Another object of the present invention is to provide a kind of light source heat radiation mechanisms, excellent and small in size with heat dissipation performance
Feature.
Another object of the present invention is to provide a kind of projectors, by the way that above-mentioned cooling mechanism is arranged, are guaranteeing to dissipate
Projector volume is greatly reduced in the case where hot property.
The embodiment of the present invention is achieved in that
A kind of projector light source fixed substrate, the light source fixed substrate include bottom surface, top surface and are connected on the bottom
First side between face and the top surface, the bottom surface is opposite with the top surface, and the light source fixed substrate is provided at least
One is used for the mounting hole of grafting heat-conducting piece, and the mounting hole forms entering for heat-conducting piece insertion through the first side
Mouthful.
In a part of the embodiments of the present invention, the mounting hole is through-hole, the axis of the mounting hole and the bottom surface
In parallel.
In a part of the embodiments of the present invention, the top surface is provided with the mounting groove for mounting circuit boards.
In a part of the embodiments of the present invention, through-hole is provided in the mounting groove, the through-hole runs through the bottom surface.
In a part of the embodiments of the present invention, the mounting hole is at least two, at least two installation pore size distributions
In the two sides of the mounting groove.
A kind of light source heat radiation mechanism, comprising: above-mentioned light source fixed substrate, heat-conducting piece and radiator, it is described thermally conductive
One end of part is plugged in the mounting hole, and the other end exposes from the entrance, the dew of the radiator and the heat-conducting piece
One end connection of the entrance out.
In a part of the embodiments of the present invention, the radiator includes muti-piece radiating fin, every piece of heat radiating fin
Piece is connect with the heat-conducting piece, has preset gap between the adjacent radiating fin.
A kind of projector, comprising: above-mentioned light source fixed substrate, light source, circuit board and radiator, the light source can
Disassembly is installed on the light source fixed substrate；The circuit board is set to the top surface and is electrically connected with the light source, described to lead
One end of warmware is plugged in the mounting hole, and the other end exposes from the entrance, the radiator and the heat-conducting piece
Expose one end connection of the entrance.
In a part of the embodiments of the present invention, the top surface is provided with the mounting groove for mounting circuit boards, the electricity
Road plate is incorporated in the mounting groove.
In a part of the embodiments of the present invention, through-hole is provided in the mounting groove, the through-hole runs through the bottom surface,
The pin of the light source protrude into the through-hole and with the circuit board electrical connection.
The beneficial effect comprise that by the way that mounting hole is arranged in light source fixed substrate, by mounting hole be used for
The heat-conducting piece of heat dissipation is assembled, and components are on the one hand reduced, and saves volumetric spaces, is left and is further reduced volume
Space, therefore, can be applied to projector, laser and other using light source fixed substrate equipment on.When light source is fixed
After substrate is connect with heat-conducting piece, it can improve, more conducively radiate with direct heat transfer, heat transfer efficiency.
Using above-mentioned light source fixed substrate, after being assembled with heat-conducting piece and radiator, it can substantially reduce light
The volume of source heat-dissipating mechanism.Projector with the cooling mechanism has reached and has further subtracted under the premise of guaranteeing heat dissipation effect
The effect of small size.
Other features and advantages of the present invention will be illustrated in subsequent specification, also, partly be become from specification
It is clear that being understood by implementing the embodiment of the present invention.The objectives and other advantages of the invention can be by written
Specifically noted structure is achieved and obtained in specification, claims and attached drawing.
Detailed description of the invention
It, below will be to use required in embodiment in order to illustrate more clearly of the technical solution of embodiment of the present invention
Attached drawing be briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not to be seen as
It is the restriction to range, it for those of ordinary skill in the art, without creative efforts, can be with root
Other relevant attached drawings are obtained according to these attached drawings.
Fig. 1 is the structural schematic diagram of light source fixed substrate provided in an embodiment of the present invention；
Fig. 2 is the sectional view in Fig. 1 along line A-A；
Fig. 3 is structural schematic diagram of the cooling mechanism under the first visual angle in projector provided in an embodiment of the present invention；
Fig. 4 is structural schematic diagram of the cooling mechanism under the second visual angle in projector provided in an embodiment of the present invention；
Fig. 5 is structural schematic diagram of the cooling mechanism under third visual angle in projector provided in an embodiment of the present invention；
Fig. 6 is the structural schematic diagram of radiating fin in projector provided in an embodiment of the present invention；
Fig. 7 is structural schematic diagram of the projector provided in an embodiment of the present invention in assembled state.
Appended drawing reference: 10- projector；20- cooling mechanism；100- light source fixed substrate；The bottom surface 101-；The first side 102-
Face；The top surface 103-；105- entrance；110- mounting hole；120- mounting groove；130- through-hole；200- heat-conducting piece；300- radiator；
310- radiating fin；320- connecting hole；400- light source；410- pin；500- circuit board.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.The present invention being usually described and illustrated herein in the accompanying drawings is implemented
The component of example can be arranged and be designed with a variety of different configurations.
Therefore, the detailed description of the embodiment of the present invention provided in the accompanying drawings is not intended to limit below claimed
The scope of the present invention, but be merely representative of selected embodiment of the invention.Based on the embodiments of the present invention, this field is common
Technical staff's every other embodiment obtained without creative efforts belongs to the model that the present invention protects
It encloses.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need that it is further defined and explained in subsequent attached drawing.
In the description of the present invention, it should be noted that term " middle part ", "upper", "lower", "front", "rear", "vertical",
The orientation or positional relationship of the instructions such as "inner", "outside" be based on the orientation or positional relationship shown in the drawings or the invention produce
Product using when the orientation or positional relationship usually put, be merely for convenience of description of the present invention and simplification of the description, rather than indicate
Or imply that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore cannot understand
For limitation of the present invention.In addition, term " first ", " second ", " third " etc. are only used for distinguishing description, and should not be understood as referring to
Show or imply relative importance.
In addition, the terms such as term "horizontal", "vertical" are not offered as requiring component abswolute level or pendency, but can be slightly
Low dip.It is not to indicate that the structure has been had to if "horizontal" only refers to that its direction is more horizontal with respect to for "vertical"
It is complete horizontal, but can be slightly tilted.
In the description of the present invention, it is also necessary to which explanation is unless specifically defined or limited otherwise, term " setting ",
" connection ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integrally connect
It connects；It can be mechanical connection, be also possible to be electrically connected；It can be directly connected, can also indirectly connected through an intermediary, it can
To be the connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood with concrete condition
Concrete meaning in the present invention.
Embodiment
Also referring to Fig. 1 and Fig. 2, the present embodiment provides a kind of light source fixed substrate 100, the light source fixed substrates 100
For plank frame, it can be applied to the equipment such as micro projector.The light source fixed substrate 100 is by metal material or metal alloy
Material is made, such as aluminium, aluminium alloy, and in the present embodiment, light source fixed substrate 100 is made of copper.
Please continue to refer to Fig. 1, light source fixed substrate 100 includes bottom surface 101, first side 102, top surface 103 and second
Side (not shown), wherein bottom surface 101 is oppositely arranged with top surface 103, and first side 102 is connected on bottom surface 101 and top surface 103
Between, first side 102 is opposite with second side.Wherein bottom surface 101 is for installing light source 400, and mounting means includes but unlimited
In welding, threaded connection, clamping etc..
It should be appreciated that " bottom surface ", " top surface " in the disclosure are only used for distinguishing explanation, it is not used in and limits its specific court
To or position, such as bottom surface 101 and top surface 103 position and be not specific to downward or upward, when light source fixed substrate 100 is overturn
When, bottom surface 101 can also be located at 103 top of top surface.
Mounting hole 110 is provided in light source fixed substrate 100, which can be through-hole or blind hole, the present embodiment
In, mounting hole 110 forms the entrance 105 being inserted into for heat-conducting piece through first side 102, while mounting hole 110 runs through second side
Face.Heat-conducting piece herein refers to: for conducting the components of heat outward, wherein, heat-conducting piece can be tubulose, it is rodlike and its
His shape, the material of heat-conducting piece can be metal and other materials.
In some embodiments, the axis of mounting hole 110 is parallel with bottom surface 101, it should be understood that institute in the disclosure
" parallel " stated is not particularly limited in two objects be absolute parastate, is substantially parallel state including two objects.Institute
Also the not specific two articles that are defined in are absolute plumbness to " vertical " stated, and are substantially vertical state including two objects.
The quantity of mounting hole 110 can be one, two or more, be configured according to specific radiating requirements
, as a preferred embodiment, when the quantity of mounting hole 110 is two or more, all mounting holes
110 axis be in the state that is parallel to each other be it is more suitable, be convenient in this way and heat-conducting piece 200 and the progress of radiator 300
Assembly connection.
In the present embodiment, mounting hole 110 is two, and the axis of two mounting holes 110 is parallel to each other, two mounting holes
110 extend through first side 102 and second side.Cross section design for mounting hole 110, cross section herein refers to
Perpendicular to the cutting plane of the axis direction of mounting hole 110.According to actual assembly demand, matched with heat-conducting piece 200.Example
Such as: when heat-conducting piece 200 is round tube or pole shape, the cross-sectional shape of mounting hole 110 can be designed as circle, i.e. mounting hole
110 be circular hole.When heat-conducting piece 200 is oval pipe, corresponding, the cross-sectional shape of mounting hole 110 can be designed as ellipse
Shape.In the present embodiment, as an example, the cross section of mounting hole 110 is oblong, i.e., mounting hole 110 is slotted hole (waist type
Hole).
In order to further make light source fixed substrate 100 in use, being adapted to other elements and and then realizing structure
Miniaturization, such as be adapted to electrical components such as circuit boards 500.
In the present embodiment, top surface 103 is additionally provided with mounting groove 120, and mounting groove 120 is used to accommodate mounting circuit boards 500, because
This, the shape of mounting groove 120 is configured as the structure being adapted to corresponding circuit board 500, wherein circuit board 500 is used to
The element of power supply and control light source.In the present embodiment, mounting groove 120 is rough strip groove, and the both ends of mounting groove 120 are divided
It Guan Chuan not first side 102 and second side.
In the present embodiment, as an example, the extending direction of mounting groove 120 is parallel with the axis direction of mounting hole 110,
This setup is conducive to light source fixed substrate and installs light source, and especially, when light source is multiple, multiple light sources can be along peace
The axis direction arrangement for filling hole 110, is conducive to heat dissipation.It should be appreciated that in other embodiments, the extending direction of mounting groove 120
It is not required to limit, uses needs according to actual, can extend along any direction.
As a kind of more preferred embodiment, in the present embodiment, mounting groove 120 is set to light source fixed substrate 100
Middle part, two mounting holes 110 are distributed in the axis two sides of mounting groove 120, and such set-up mode has the advantage that installation
The distribution of hole 110 is more uniform, after being assembled with heat-conducting piece 200, can achieve the effect of Homogeneouslly-radiating, improves heat dissipation effect
Rate prevents 100 hot-spot of light source fixed substrate.
In some embodiments, the quantity more than two of mounting hole 110, at this point, can also by a similar method by
Multiple mounting holes 110 are uniformly distributed in the axis two sides of mounting groove 120.
In light source fixed substrate 100 in use, the needs of circuit board 500 being installed in mounting groove 120 are electrically connected with light source 400
It connects, therefore, assembles for convenience, through-hole 130 is provided in mounting groove 120, through-hole 130 is connected to mounting groove 120 and runs through bottom
Bottom surface is run through in face 101, in some embodiments, through-hole 130 in such a way that its axis is perpendicular to bottom surface.The quantity of through-hole 130
Be configured according to the quantity of light source 400, usual each light source 400 be provided with 2 for electrical connection pin 410, therefore compared with
It is the form for being arranged to cooperate with the pin 410 of light source 400 by through-hole 130 for preferred embodiment.
In the present embodiment, as an example: refering to fig. 1 and Fig. 2, through-hole 130 is round hole, and the diameter of through-hole 130
Slightly larger than the width of mounting groove 120, which can pass through for all pins 410 of light source 400 simultaneously.Wherein, mounting groove
There are two through-hole 130, two settings spaced apart of through-hole 130 for setting in 120.
The light source fixed substrate 100 provided in the present embodiment can be applied to micro projector 10 and other needs are set
In the equipment for setting light source fixed substrate 100, since the structure of the light source fixed substrate 100 can be carried out directly with heat-conducting piece 200
Assembly, and circuit board 500 is accommodated by mounting groove 120, it does not need that additional element is arranged, for carrying out with heat-conducting piece 200
Connection, therefore the volume of micro projector 10 can be further decreased, while keeping good heat dissipation performance.
Based on above-mentioned light source fixed substrate 100, the present embodiment also provides a kind of projector 10, and projector 10 includes light source
Fixed substrate 100, heat-conducting piece 200, radiator 300, light source 400 and circuit board 500.Wherein, light source fixed substrate 100,
Heat-conducting piece 200 and the connection of radiator 300 form cooling mechanism 20, and the heat generated including light source is transmitted outward.Light source
400 are mounted at the bottom surface 101 of power supply fixed substrate 100, and circuit board 500 is set to the mounting groove 120 of top surface 103
It is interior.
Also referring to Fig. 3, Fig. 4, Fig. 5, shown in Fig. 3-Fig. 5 projector 10 in the present embodiment cooling mechanism 20,
The structure of light source 400 and circuit board 500, it should be understood that projector 10 further includes the other components such as shell, due to projector 10
Other parts be not belonging to emphasis of the invention, be not shown in figure, those skilled in the art can be realized with reference to the prior art,
This will not be repeated here.
Specifically, cooling mechanism 20 includes light source fixed substrate 100, heat-conducting piece 200 and radiator 300, wherein light
The structure of source fixed substrate 100 is refering to preceding sections.One end of heat-conducting piece 200 protrudes into mounting hole 110 from entrance 105 and light source is solid
Determine the connection of substrate 100, the other end is connect with radiator 300, plays the role of heat conduction.
Heat-conducting piece 200 is used to the heat transfer in light source fixed substrate 100 in the present embodiment, lead to radiator 300
Warmware 200 is heat pipe, and shape is matched with the oblong mounting hole 110 of light source fixed substrate 100, and cross section is oblong.
The quantity of heat-conducting piece 200 is two, two heat-conducting pieces 200 and two mounting holes 110 one-to-one correspondence, when assembly, heat-conducting piece 200 from
The entrance 105 of first side 102 protrudes into mounting hole 110 and forms fixation.It should be appreciated that heat-conducting piece 200 and mounting hole 110 are consolidated
Determining mode includes but is not limited to be threadedly coupled, be clamped, be interference fitted etc., and in the present embodiment, heat-conducting piece 200 protrudes into mounting hole 110
It is interior and be welded and fixed with light source fixed substrate 100.
Heat-conducting piece 200 can be solid and/or hollow structure, internal to go back when heat-conducting piece 200 selects hollow type structure
Other Heat Conduction Materials can be filled.
Radiator 300 includes the radiating fin 310 of muti-piece stacking, and the structure of radiating fin 310 is as shown in fig. 6, this reality
It applies in example, radiating fin 310 is rectangular plate, is made of the high material of heat conduction efficiency, such as aluminium, copper.On radiating fin 310
It is provided with connecting hole 320, connecting hole 320 for heat-conducting piece 200 for passing through, therefore the quantity of connecting hole 320 and heat-conducting piece 200
Quantity is identical, identical with the quantity of heat-conducting piece 200 in the present embodiment, and the quantity of connecting hole 320 is two, and two connecting holes
320 axis is each perpendicular to radiating fin 310.When assembly, two heat-conducting pieces 200 be respectively protruding into connecting hole 320 and with heat dissipation
Fin 310 connects, and connection type is preferably welded.
It should be appreciated that the structure of radiating fin 310 shown in Fig. 6 is only a kind of example, in other implementations,
Radiating fin 310 can be other various shapes such as circle, ellipse, oblong, the position for the connecting hole 310 being arranged thereon
It can be changed according to specific application environment.The quantity of connecting hole 310 can also carry out phase according to the quantity of heat-conducting piece 200
It should adjust.
In the present embodiment, projection of the muti-piece radiating fin 310 in the plane vertical with heat-conducting piece 200 overlaps, this
Kind set-up mode has maximally reduced the volume of radiator, is more conducive to further reduce 10 volume of projector.It should manage
It solving, the radiating fin 310 in same radiator 300 must not necessarily use identical structure, such as: in same radiator 300,
Rectangle, circular radiating fin are selected simultaneously, and overlapped way also necessarily keeps being parallel to each other or keeping identical spacing.
Every piece of radiating fin 310 connect with heat-conducting piece 200 and in the state being generally parallel to each other, adjacent radiating fin
There is gap, which is preset according to the demand that heat conducts between 310.The quantity of radiating fin 310 is according to heat dissipation
Demand is configured, such as 5 pieces, 10 pieces etc., and the clearance distance of adjacent heat radiation fin 310 for example can be 0.5mm-1cm etc..
In some embodiments, the quantity of radiator 300 can be to be multiple, such as by a part of heat-conducting piece 200
It is pierced by second side, a radiator 300 is connected in the part for being pierced by second side of heat-conducting piece 200, is preferably dissipated with reaching
Thermal effect.
Light source 400 can be glow discharge spot lamp 400, LED light source 400 or laser light source 400, in the present embodiment, light source
400 be laser light source 400, and light source 400 includes two pins 410, and pin 410 is made of conductor, for being electrically connected with circuit board 500
It connects.
Circuit board 500 is used to power for light source 400 and controls light source 400, and circuit board 500 is set in mounting groove 120, and
It is integrally contained that light source 400 is set to bottom surface 101 in mounting groove 120, the pin 410 of light source 400 protrude into through-hole 130 and with electricity
Road plate 500 is electrically connected.
In other embodiments, according to circuit board 500 and the size of light source fixed substrate 100, circuit board 500
Can also part be contained in mounting groove 120, such as: the size of circuit board 500 in the longitudinal direction fixes greater than light source
The length of the mounting groove 120 of substrate 100, at this point, a part of of circuit board 500 can stretch out mounting groove 120.
Projector 10 provided in this embodiment at work, the heat transfer that light source 400 and circuit board 500 generate to light
In source fixed substrate 100, then pass through heat-conducting piece 200 and be transferred on the radiating fin 310 of radiator 300, passes through radiating fin
310 scatter heat outward, due to not needing in the light source fixed substrate 100 upper fixed substrates for increasing heat-conducting piece 200, simultaneously
Circuit board 500 is contained in again in light source fixed substrate 100, occupies volume without additional, therefore further reduced micro projection
The volume of instrument 10, simultaneously as the heat in light source fixed substrate 100 is directly conducted to heat-conducting piece 200, the efficiency of heat transfer also into
One step improves, and is based on above-mentioned technical effect, and the miniaturization of structure is furthermore achieved in projector 10 provided in this embodiment.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of light source fixed substrate, which is characterized in that the light source fixed substrate includes bottom surface, top surface and is connected on described
First side between bottom surface and the top surface, the bottom surface is opposite with the top surface, the light source fixed substrate be provided with to
Few one is used for the mounting hole of grafting heat-conducting piece, and the mounting hole is formed through the first side for heat-conducting piece insertion
Entrance.
2. light source fixed substrate according to claim 1, which is characterized in that the mounting hole is through-hole, the mounting hole
Axis it is parallel with the bottom surface.
3. light source fixed substrate according to claim 1, which is characterized in that the top surface is provided with for mounting circuit boards
Mounting groove.
4. light source fixed substrate according to claim 3, which is characterized in that through-hole is provided in the mounting groove, it is described
Through-hole runs through the bottom surface.
5. light source fixed substrate according to claim 3, which is characterized in that the mounting hole is at least two, at least two
A mounting hole is distributed in the two sides of the mounting groove.
6. a kind of light source heat radiation mechanism characterized by comprising
The described in any item projector light source fixed substrates of claim 1-5；
Heat-conducting piece, one end of the heat-conducting piece are plugged in the mounting hole, and the other end exposes from the entrance, and；
Radiator, the radiator are connect with one end of the exposing entrance of the heat-conducting piece.
7. light source heat radiation mechanism according to claim 6, which is characterized in that the radiator includes dissipating for muti-piece stacking
Hot fin, every piece of radiating fin are connect with the heat-conducting piece, have preset gap between the adjacent radiating fin.
8. a kind of projector characterized by comprising
Projector light source fixed substrate described in claim 1；
Light source, the light source are removably mounted to the bottom surface of the light source fixed substrate；
Circuit board, the circuit board are set to the top surface and are electrically connected with the light source；
Heat-conducting piece, one end of the heat-conducting piece are plugged in the mounting hole, and the other end exposes from the entrance, and；
Radiator, the radiator are connect with one end of the exposing entrance of the heat-conducting piece.
9. projector according to claim 8, which is characterized in that the top surface is provided with the installation for mounting circuit boards
Slot, the circuit board are incorporated in the mounting groove.
10. projector according to claim 9, which is characterized in that be provided with through-hole in the mounting groove, the through-hole passes through
Wear the bottom surface, the pin of the light source protrude into the through-hole and with the circuit board electrical connection.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810436304.0A CN110471242A (en) | 2018-05-09 | 2018-05-09 | Light source fixed substrate, light source heat radiation mechanism and projector |
| PCT/CN2019/070533 WO2019214277A1 (en) | 2018-05-09 | 2019-01-05 | Light source fixing substrate, light source heat dissipating mechanism, and projector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810436304.0A CN110471242A (en) | 2018-05-09 | 2018-05-09 | Light source fixed substrate, light source heat radiation mechanism and projector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110471242A true CN110471242A (en) | 2019-11-19 |
Family
ID=68467172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810436304.0A Pending CN110471242A (en) | 2018-05-09 | 2018-05-09 | Light source fixed substrate, light source heat radiation mechanism and projector |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110471242A (en) |
| WO (1) | WO2019214277A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113311651A (en) * | 2021-06-17 | 2021-08-27 | 广州瑞格尔电子有限公司 | Energy-saving projector |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113311651A (en) * | 2021-06-17 | 2021-08-27 | 广州瑞格尔电子有限公司 | Energy-saving projector |
| CN113311651B (en) * | 2021-06-17 | 2022-01-25 | 广州瑞格尔电子有限公司 | Energy-saving projector |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019214277A1 (en) | 2019-11-14 |
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