CN208028050U - A kind of spliced uniform-temperature plate heat dissipating device - Google Patents
A kind of spliced uniform-temperature plate heat dissipating device Download PDFInfo
- Publication number
- CN208028050U CN208028050U CN201820476961.3U CN201820476961U CN208028050U CN 208028050 U CN208028050 U CN 208028050U CN 201820476961 U CN201820476961 U CN 201820476961U CN 208028050 U CN208028050 U CN 208028050U
- Authority
- CN
- China
- Prior art keywords
- temperature
- plate
- heat
- dissipating device
- uniforming plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of spliced uniform-temperature plate heat dissipating devices, including temperature-uniforming plate, first surface, second surface, screw, heat-conducting glue, the first surface is provided with above the temperature-uniforming plate, the second surface is provided below in the temperature-uniforming plate, the first surface is provided with the screw, it is provided with the heat-conducting glue beside the second surface, the temperature-uniforming plate side is provided with binding post, heat-conducting plate is provided below in the second surface, cooling fin is provided below in the heat-conducting plate, the cooling fin side is provided with lateral heat dissipation channel, the cooling fin other side is provided with longitudinal heat dissipation channel, it is provided with metal substrate above the first surface, it is provided with electrical part above the metal substrate, it is provided with support column inside the temperature-uniforming plate.Advantageous effect is：The spliced uniform-temperature plate heat dissipating device is simple in structure, easy to use, is provided with cooling fin and cooling fluid, and heat dissipation is uniform, good heat dissipation effect, improves electrical part service life.
Description
Technical field
The utility model is related to uniform-temperature plate heat dissipating device fields, more particularly to a kind of spliced uniform-temperature plate heat dissipating device.
Background technology
Electronic product towards it is more frivolous, rapid, multi-functional with energy-saving and environment-friendly demand under, the calorific value of CPU and GPU
More and more high, high-power LED illumination also has the bottleneck that material luminous efficiency is insufficient, heat dissipation technology can not be broken through and influences LED
Service life, however common radiating mode include mainly substrate, insulating layer, conductive layer and plural number LED；The insulating layer is formed
In the surface of the substrate；The conductive layer is formed on the insulating layer, and is isolated with the electrical property of substrate, which has the first electricity
Pole and second electrode；Such LED is respectively arranged on the insulating layer, which has the first pin for being electrically connected the first electrode
And it is electrically connected the second pin of the second electrode；Whereby, to constitute this LED conductive structure.When using this LED conductive structure,
After such LED is powered via first and second electrode, such LED produces luminous energy and thermal energy, and luminous energy then irradiates, and
Thermal energy is then conducted via the insulating layer to the substrate, then with thermal energy caused by the such LED of the substrate diversion.People make at present
Radiator is primarily present complicated, heat radiation energy force difference, and heat dissipation is uneven, the shortcomings of reducing the service life.
Utility model content
The purpose of this utility model is that solve the above-mentioned problems and provides a kind of spliced uniform-temperature plate heat dissipating device.
The utility model is achieved through the following technical solutions above-mentioned purpose：
A kind of spliced uniform-temperature plate heat dissipating device, including temperature-uniforming plate, first surface, second surface, screw, heat-conducting glue, institute
It states and is provided with the first surface above temperature-uniforming plate, the second surface, the first surface is provided below in the temperature-uniforming plate
It is provided with the screw, is provided with the heat-conducting glue beside the second surface, the temperature-uniforming plate side is provided with binding post, institute
It states second surface and heat-conducting plate is provided below, cooling fin is provided below in the heat-conducting plate, and the cooling fin side is provided with cross
To heat dissipation channel, the cooling fin other side is provided with longitudinal heat dissipation channel, and metal substrate is provided with above the first surface,
It is provided with electrical part above the metal substrate, support column is provided with inside the temperature-uniforming plate, is provided with beside the support column
Container is provided with metal mesh above the container, and lower metal mesh is provided below in the container, and the container is internally provided with
Cooling fluid.
In above structure, the heat-conducting plate is provided below in the temperature-uniforming plate, between the temperature-uniforming plate and the heat-conducting plate
It is provided with the heat-conducting glue, the heat-conducting plate is provided below the cooling fin, the transverse direction is provided with beside the cooling fin
Heat dissipation channel and longitudinal heat dissipation channel, good heat dissipation effect, the temperature-uniforming plate are internally provided with the support column, the support
The container inner wall beside column is provided with the upper metal mesh and the lower metal mesh, and the heat dissipation is provided in the container
Liquid greatly improves heat-sinking capability.
In order to further increase heat dissipation effect, the temperature-uniforming plate and the heat-conducting plate are described to lead by the screw connection
Hot glue is Nian Jie with the temperature-uniforming plate.
In order to further increase heat dissipation effect, the heat-conducting glue is Nian Jie with the heat-conducting plate, the screw and the samming
Plate grafting.
In order to further increase heat dissipation effect, the binding post is Nian Jie with the temperature-uniforming plate.
In order to further increase heat dissipation effect, the heat-conducting plate is Nian Jie with the cooling fin.
In order to further increase heat dissipation effect, the metal substrate is connect with the temperature-uniforming plate by inlaying.
In order to further increase heat dissipation effect, the electrical part is welded with the metal substrate, the support column with it is described
Temperature-uniforming plate welds.
In order to further increase heat dissipation effect, the container is Nian Jie with the upper metal mesh.
In order to further increase heat dissipation effect, the container is Nian Jie with the lower metal mesh.
Advantageous effect is：The spliced uniform-temperature plate heat dissipating device is simple in structure, easy to use, is provided with cooling fin and dissipates
Hydrothermal solution, heat dissipation is uniform, good heat dissipation effect, improves electrical part service life.
Description of the drawings
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
Some embodiments of the utility model, for those of ordinary skill in the art, in the premise of not making the creative labor property
Under, other drawings may also be obtained based on these drawings.
Fig. 1 is a kind of overall structure diagram of spliced uniform-temperature plate heat dissipating device described in the utility model；
Fig. 2 is a kind of temperature-uniforming plate internal structure schematic diagram of spliced uniform-temperature plate heat dissipating device described in the utility model；
Fig. 3 is a kind of electrical device structures schematic diagram of spliced uniform-temperature plate heat dissipating device described in the utility model.
The reference numerals are as follows：
1, temperature-uniforming plate；2, first surface；3, second surface；4, screw；5, heat-conducting glue；6, binding post；7, heat-conducting plate；8, it dissipates
Backing；9, lateral heat dissipation channel；10, longitudinal heat dissipation channel；11, electrical part；12, metal substrate；13, support column；14, container；
15, cooling fluid；16, upper metal mesh；17, lower metal mesh.
Specific implementation mode
The utility model is described in further detail below in conjunction with the accompanying drawings：
As shown in Figure 1-Figure 3, a kind of spliced uniform-temperature plate heat dissipating device, including temperature-uniforming plate 1, first surface 2, second surface
3, screw 4, heat-conducting glue 5, temperature-uniforming plate 1 are provided with first surface 2 above, and second surface 3, the first table is provided below in temperature-uniforming plate 1
Face 2 is provided with screw 4, and screw 4 plays fixed function, and 3 side of second surface is provided with heat-conducting glue 5, and heat-conducting glue 5 is used for heat conduction,
1 side of warm plate is provided with binding post 6, and binding post 6 plays connection function, and second surface 3 is provided below heat-conducting plate 7, under heat-conducting plate 7
Face is provided with cooling fin 8, and cooling fin 8 is used for radiating, and 8 side of cooling fin is provided with lateral heat dissipation channel 9,8 other side of cooling fin
It is provided with longitudinal heat dissipation channel 10, first surface 2 is provided with metal substrate 12 above, and metal substrate 12 is provided with electrical part above
11,1 the inside of temperature-uniforming plate is provided with support column 13, and support column 13 plays a supportive role, and 13 side of support column is provided with container 14, container
14 are provided with metal mesh 16 above, and lower metal mesh 17 is provided below in container 14, and container 14 is internally provided with cooling fluid 15, dissipate
Hydrothermal solution 15 is used for radiating.
In above structure, heat-conducting plate 7 is provided below in temperature-uniforming plate 1, and heat-conducting glue is provided between temperature-uniforming plate 1 and heat-conducting plate 7
5, cooling fin 8 is provided below in heat-conducting plate 7, and 8 side of cooling fin is provided with lateral heat dissipation channel 9 and longitudinal heat dissipation channel 10, dissipates
Thermal effect is good, and temperature-uniforming plate 1 is internally provided with support column 13, and 14 inner wall of container on 13 side of support column is provided with 16 He of metal mesh
Lower metal mesh 17 is provided with cooling fluid 15 in container 14, greatly improves heat-sinking capability.
In order to further increase heat dissipation effect, temperature-uniforming plate 1 is connect with heat-conducting plate 7 by screw 4, heat-conducting glue 5 and temperature-uniforming plate 1
Bonding, heat-conducting glue 5 is Nian Jie with heat-conducting plate 7, screw 4 and 1 grafting of temperature-uniforming plate, and binding post 6 is Nian Jie with temperature-uniforming plate 1, heat-conducting plate 7 and scattered
Backing 8 is bonded, and metal substrate 12 connect with temperature-uniforming plate 1 by inlaying, electrical part 11 and the welding of metal substrate 12, support column 13 and
Temperature-uniforming plate 1 welds, and container 14 is Nian Jie with upper metal mesh 16, and container 14 is Nian Jie with lower metal mesh 17.
The basic principles and main features and advantage of the utility model have been shown and described above.The technical staff of the industry
It should be appreciated that the present utility model is not limited to the above embodiments, the above embodiments and description only describe this
The principle of utility model, on the premise of not departing from the spirit and scope of the utility model, the utility model also has various change
And improvement, these various changes and improvements fall within the scope of the claimed invention.
Claims (9)
1. a kind of spliced uniform-temperature plate heat dissipating device, it is characterised in that：Including temperature-uniforming plate (1), first surface (2), second surface
(3), screw (4), heat-conducting glue (5), the temperature-uniforming plate (1) are provided with the first surface (2) above, under the temperature-uniforming plate (1)
Face is provided with the second surface (3), and the first surface (2) is provided with the screw (4), second surface (3) side
It is provided with the heat-conducting glue (5), temperature-uniforming plate (1) side is provided with binding post (6), second surface (3) following settings
There are heat-conducting plate (7), the heat-conducting plate (7) that cooling fin (8) is provided below, cooling fin (8) side is provided with lateral heat dissipation
Channel (9), cooling fin (8) other side are provided with longitudinal heat dissipation channel (10), and the first surface (2) is provided with gold above
Belong to substrate (12), the metal substrate (12) is provided with electrical part (11), support column is provided with inside the temperature-uniforming plate (1) above
(13), container (14) is provided with beside the support column (13), the container (14) is provided with metal mesh (16) above, described
Lower metal mesh (17) is provided below in container (14), and the container (14) is internally provided with cooling fluid (15).
2. a kind of spliced uniform-temperature plate heat dissipating device according to claim 1, it is characterised in that：The temperature-uniforming plate (1) with
The heat-conducting plate (7) is connected by the screw (4), and the heat-conducting glue (5) is Nian Jie with the temperature-uniforming plate (1).
3. a kind of spliced uniform-temperature plate heat dissipating device according to claim 1, it is characterised in that：The heat-conducting glue (5) with
Heat-conducting plate (7) bonding, the screw (4) and the temperature-uniforming plate (1) grafting.
4. a kind of spliced uniform-temperature plate heat dissipating device according to claim 1, it is characterised in that：The binding post (6) with
Temperature-uniforming plate (1) bonding.
5. a kind of spliced uniform-temperature plate heat dissipating device according to claim 1, it is characterised in that：The heat-conducting plate (7) with
Cooling fin (8) bonding.
6. a kind of spliced uniform-temperature plate heat dissipating device according to claim 1, it is characterised in that：The metal substrate (12)
It is connect with the temperature-uniforming plate (1) by inlaying.
7. a kind of spliced uniform-temperature plate heat dissipating device according to claim 1, it is characterised in that：The electrical part (11) with
Metal substrate (12) welding, the support column (13) are welded with the temperature-uniforming plate (1).
8. a kind of spliced uniform-temperature plate heat dissipating device according to claim 1, it is characterised in that：The container (14) and institute
State metal mesh (16) bonding.
9. a kind of spliced uniform-temperature plate heat dissipating device according to claim 1, it is characterised in that：The container (14) and institute
State lower metal mesh (17) bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820476961.3U CN208028050U (en) | 2018-04-04 | 2018-04-04 | A kind of spliced uniform-temperature plate heat dissipating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820476961.3U CN208028050U (en) | 2018-04-04 | 2018-04-04 | A kind of spliced uniform-temperature plate heat dissipating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208028050U true CN208028050U (en) | 2018-10-30 |
Family
ID=63910323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820476961.3U Expired - Fee Related CN208028050U (en) | 2018-04-04 | 2018-04-04 | A kind of spliced uniform-temperature plate heat dissipating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208028050U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109673131A (en) * | 2018-12-05 | 2019-04-23 | 郑晓燕 | A kind of new energy charging unit mainboard water-cooled plate wing temperature regulating device |
-
2018
- 2018-04-04 CN CN201820476961.3U patent/CN208028050U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109673131A (en) * | 2018-12-05 | 2019-04-23 | 郑晓燕 | A kind of new energy charging unit mainboard water-cooled plate wing temperature regulating device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201796891U (en) | Radiating device for integrated LED | |
| CN207612462U (en) | A kind of high heat conduction type printed wiring board | |
| CN103702515A (en) | High-power LED (light emitting diode) lamp bead metal substrate structure and manufacturing method thereof | |
| CN208028050U (en) | A kind of spliced uniform-temperature plate heat dissipating device | |
| CN201608205U (en) | Novel LED packaging circuit board | |
| CN201715304U (en) | High-power LED light source based on liquid metal for heat radiating and threaded connection structure | |
| CN108389841A (en) | A kind of spliced uniform-temperature plate heat dissipating device | |
| CN201555083U (en) | Multi-chip high-power LED lamp and a radiator structure | |
| CN201448619U (en) | Liquid heat radiation LED lamp | |
| CN202532210U (en) | Heat pipe type LED lamp | |
| CN104501013A (en) | Led lamp | |
| CN101924178A (en) | LED heat radiating device | |
| CN101872826A (en) | Liquid metal heat radiation based high-power LED light source of threaded connection structure | |
| CN202712234U (en) | Solar cell module having heat-dissipation packaging structure | |
| CN204408745U (en) | Novel patch encapsulating structure | |
| CN204005868U (en) | LED radiator | |
| CN105764239B (en) | A kind of great-power electronic component lines plate of high heat dispersion and preparation method thereof | |
| CN202197491U (en) | Heat dissipating plate formed by aluminum material and copper material in embedded manner and used for heating module | |
| CN204441282U (en) | A kind of COB light source technical field with excellent heat dispersion performance for outdoor lighting | |
| CN202101047U (en) | High-power LED (light-emitting diode) light source module with excellent heat dissipation performance | |
| CN201732809U (en) | Encapsulating structure of LED lighting source | |
| CN205264751U (en) | Low thermal resistance LED light source | |
| CN205179511U (en) | Power electronic component circuit board of high heat dissipating ability | |
| CN201190965Y (en) | Surface type led lamp | |
| CN203560869U (en) | LED and PCB (printed circuit board) combined double-face conduction radiator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181030 Termination date: 20200404 |