CN204408745U - Novel patch encapsulating structure - Google Patents
Novel patch encapsulating structure Download PDFInfo
- Publication number
- CN204408745U CN204408745U CN201520106910.8U CN201520106910U CN204408745U CN 204408745 U CN204408745 U CN 204408745U CN 201520106910 U CN201520106910 U CN 201520106910U CN 204408745 U CN204408745 U CN 204408745U
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- CN
- China
- Prior art keywords
- heat
- wiring board
- conductive cloth
- heat conduction
- conduction boss
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004744 fabric Substances 0.000 claims abstract description 47
- 238000010438 heat treatment Methods 0.000 claims abstract description 24
- 230000005855 radiation Effects 0.000 claims description 17
- 238000003825 pressing Methods 0.000 claims description 13
- 238000003466 welding Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- 230000007812 deficiency Effects 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 8
- 239000011159 matrix material Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 239000004411 aluminium Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000009795 derivation Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000969 carrier Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007634 remodeling Methods 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The utility model relates to a kind of Novel patch encapsulating structure.Solve the deficiencies in the prior art, technical scheme is: comprise the insulating heat-conductive cloth coordinating wiring board, planar heat spreader, hold-down screw and heat conduction boss, the upper surface of described insulating heat-conductive cloth abuts with the reverse side of described wiring board, the lower surface of described insulating heat-conductive cloth abuts with the upper end of described planar heat spreader, on described wiring board and insulating heat-conductive cloth, correspondence position all offers through hole, described hold-down screw runs through wiring board successively and is connected with planar heat spreader with the through hole of relevant position on insulating heat-conductive cloth, on wiring board, corresponding heating part position offers one for filling out the connecting hole establishing heat conduction boss, the shape of described connecting hole is identical with the shape of described heat conduction boss, described heat conduction boss is filled out and is located in connecting hole, the upper surface of described heat conduction boss abuts with heating feature bottom, the lower surface of described heat conduction boss abuts with described insulating heat-conductive cloth, the height of described heat conduction boss is greater than the thickness of described wiring board.
Description
Technical field
The utility model is a kind of encapsulating structure, particularly relates to a kind of Novel patch encapsulating structure.
Background technology
The power density of existing power electronics devices is increasing, needs to solve the heat radiation of power device and the heat radiation of electrical current carriers (normally circuit board Copper Foil) simultaneously.Aluminum base circuit board can meet above-mentioned requirements under certain condition.But when circuit more complicated, because common aluminium base is single sided board, be just difficult to realizing circuit function.Multilayer circuit board (comprising two-ply) can realizing circuit function, and circuit board Copper Foil heat is conducted after also can being connected with plane heat radiation part by insulating heat-conductive cloth.Thus, the another side of the circuit board that power device must be installed, many every a layer circuit board with plane heat radiation part, and the base material conductive coefficient of circuit board is all lower usually, causes power device to dispel the heat bad.
Chinese Patent Application No.: CN201210140049.8, on August 22nd, 2012, discloses a kind of high heat radiation printed wiring board and preparation method thereof, first gong hole on circuit board substrate, and attack box thread in this gong hole; Then make identical with gong hole shape and may correspond to the heat dissipation metal matrix embedded in gong hole, and attack the male thread corresponding with above-mentioned box thread in the outside of this heat dissipation metal matrix, and make heat dissipation metal matrix be fixed on gong hole from correspondence bottom circuit board substrate, afterwards at the gong hole place welding chip on circuit board substrate top, chip bottom is contacted with heat dissipation metal matrix.The present invention needs the position gong through hole of welding chip in the circuit board, and making may correspond to the heat dissipation metal matrix be screwed in above-mentioned through hole, makes heat dissipation metal matrix be arranged in wiring board and contacts with chip to be welded, realizing good heat conduction.But this technical scheme exists processing difficulties, the work that the problem, particularly heat dissipation metal matrix work in-process of coupling difficulty exist is poor, and add the deviation of wiring board itself, easily in production reality, produce a large amount of deviations, easily occur substandard products, repair rate is higher.
Utility model content
The purpose of this utility model is poor for solving in current technical scheme the work that there is the existence of heat dissipation metal matrix work in-process, add the deviation of wiring board itself, easily in production reality, produce a large amount of deviations, easily there are substandard products, the problem that repair rate is higher, provides one to overcome the puzzlement of work difference, excellent heat radiation performance simultaneously, cost increases few, and overall processing is Novel patch encapsulating structure efficiently.
The utility model solves the technical scheme that its technical problem adopts: a kind of Novel patch encapsulating structure, for the heat radiation of part at wiring board of generating heat, comprise the insulating heat-conductive cloth coordinating wiring board, planar heat spreader, hold-down screw and heat conduction boss, the upper surface of described insulating heat-conductive cloth abuts with the reverse side of described wiring board, the lower surface of described insulating heat-conductive cloth abuts with the upper end of described planar heat spreader, on described wiring board and insulating heat-conductive cloth, correspondence position all offers through hole, described hold-down screw runs through wiring board successively and is connected with planar heat spreader with the through hole of relevant position on insulating heat-conductive cloth, on described wiring board, corresponding heating part position offers one for filling out the connecting hole establishing heat conduction boss, the shape of described connecting hole is identical with the shape of described heat conduction boss, described heat conduction boss is filled out and is located in connecting hole, the upper surface of described heat conduction boss abuts with described heating feature bottom, the lower surface of described heat conduction boss abuts with described insulating heat-conductive cloth, the height of described heat conduction boss is greater than the thickness of described wiring board.This practicality is on the basis of common plane paster power package, at the heat conduction platform that the center design one at main heat conduction position is outstanding, the height of platform is a little more than used circuit board thickness, make tube core heat by this platform directly through wiring board, thus, radiating surface and the wiring board back side of power heating part are in same plane substantially, are just easy to plane heat radiation part, heat conduction be gone out.And all the other overall dimensions of the present utility model and mounting means identical with common plane paster power package, insulating heat-conductive cloth has been set up in the utility model, the ductility of insulating heat-conductive cloth counteracts the negative effect of wiring board and heat conduction boss work difference band, the evenness at the wiring board back side is better, and the setting of insulating heat-conductive cloth, also be conducive to the derivation of even heat, reach good heat-conducting effect.
As preferably, described connecting hole is positioned at the center of described heating part pin tie point in the circuit board.
As preferably, described connecting hole area is greater than 75% of described heating part area.
As preferably, the height value of described heat conduction boss is less than 1.1 times of the one-tenth-value thickness 1/10 of described wiring board, and the range of values of thickness of described insulating heat-conductive cloth is 10% to 25% of wiring board one-tenth-value thickness 1/10.Because the impact of work difference in actual processing, therefore the height of heat conduction boss must be greater than the thickness of wiring board, guarantee heat conduction boss can abut with insulating heat-conductive cloth, and meanwhile, the maximum of the height of restriction heat conduction boss is the adjusting range in order to prevent from exceeding insulating heat-conductive cloth.
As preferably, described Novel patch encapsulating structure also comprises pressing plate, described pressing plate also offers through hole, the through hole that described hold-down screw runs through relevant position on pressing plate, wiring board and insulating heat-conductive cloth is successively connected with planar heat spreader, and the lower surface of described pressing plate abuts with the upper surface of described heating part.
As preferably, described insulating heat-conductive cloth is made for having flexible material.
As preferably, heat conduction boss abuts with the heat radiation pin of heating part.
As preferably, the hole wall of connecting hole is welding resistance hole wall.
Substantial effect of the present utility model is: this practicality is on the basis of common plane paster power package, at the heat conduction platform that the center design one at main heat conduction position is outstanding, the height of platform is a little more than used circuit board thickness, make tube core heat by this platform directly through wiring board, thus, radiating surface and the wiring board back side of power heating part are in same plane substantially, are just easy to plane heat radiation part, heat conduction be gone out.And all the other overall dimensions of the present utility model and mounting means identical with common plane paster power package, insulating heat-conductive cloth has been set up in the utility model, the ductility of insulating heat-conductive cloth counteracts the negative effect of wiring board and heat conduction boss work difference band, the evenness at the wiring board back side is better, and the setting of insulating heat-conductive cloth, also be conducive to the derivation of even heat, reach good heat-conducting effect.
Accompanying drawing explanation
Fig. 1 is the structural representation in the utility model.
In figure: 1, wiring board, 2, heating part, 3, pressing plate, 4, hold-down screw, 5, heat conduction boss, 6, insulating heat-conductive cloth, 7, planar heat spreader.
Embodiment
Below by specific embodiment, and by reference to the accompanying drawings, the technical solution of the utility model is described in further detail.
Embodiment:
A kind of Novel patch encapsulating structure (see accompanying drawing 1), for the heat radiation of part 2 at wiring board 1 of generating heat, comprise the insulating heat-conductive cloth 6 coordinating wiring board, planar heat spreader 7, hold-down screw 4 and heat conduction boss 5, the upper surface of described insulating heat-conductive cloth abuts with the reverse side of described wiring board, the lower surface of described insulating heat-conductive cloth abuts with the upper end of described planar heat spreader, on described wiring board and insulating heat-conductive cloth, correspondence position all offers through hole, described hold-down screw runs through wiring board successively and is connected with planar heat spreader with the through hole of relevant position on insulating heat-conductive cloth, on described wiring board, corresponding heating part position offers one for filling out the connecting hole establishing heat conduction boss, the shape of described connecting hole is identical with the shape of described heat conduction boss, described heat conduction boss is filled out and is located in connecting hole, the upper surface of described heat conduction boss abuts with described heating feature bottom, the lower surface of described heat conduction boss abuts with described insulating heat-conductive cloth, the height of described heat conduction boss is greater than the thickness of described wiring board.Described connecting hole is positioned at the center of described heating part pin tie point in the circuit board.Described connecting hole area is greater than 75% of described heating part area.The height value of described heat conduction boss is less than 1.1 times of the one-tenth-value thickness 1/10 of described wiring board, and the range of values of thickness of described insulating heat-conductive cloth is 10% to 25% of wiring board one-tenth-value thickness 1/10.Described Novel patch encapsulating structure also comprises pressing plate 3, described pressing plate also offers through hole, the through hole that described hold-down screw runs through relevant position on pressing plate, wiring board and insulating heat-conductive cloth is successively connected with planar heat spreader, and the lower surface of described pressing plate abuts with the upper surface of described heating part.Described insulating heat-conductive cloth is made for having flexible material.Heat conduction boss abuts with the heat radiation pin of heating part.The hole wall of described connecting hole is welding resistance hole wall.
This practicality is on the basis of common plane paster power package, at the heat conduction platform that the center design one at main heat conduction position is outstanding, the height of platform is a little more than used circuit board thickness, make tube core heat by this platform directly through wiring board, thus, radiating surface and the wiring board back side of power heating part are in same plane substantially, are just easy to plane heat radiation part, heat conduction be gone out.And all the other overall dimensions of the present embodiment and mounting means identical with common plane paster power package, insulating heat-conductive cloth has been set up in the present embodiment, the ductility of insulating heat-conductive cloth counteracts the negative effect of wiring board and heat conduction boss work difference band, the evenness at the wiring board back side is better, and the setting of insulating heat-conductive cloth, also be conducive to the derivation of even heat, reach good heat-conducting effect.
Embodiment is more specifically: electric bicycle controller: adopt 1.6mmFR4 double-sided wiring board, the metal-oxide-semiconductor of this novel encapsulated selected by power part, this encapsulation is on the basis of TO-263, and increasing an area in center, bottom heat radiation face is 7X7mm, the heat conduction boss of height 1.75mm.Wiring board offers the hole of 7.2X7.2mm at correspondence position.Big current position, simultaneously at wiring board two sides cabling, couples together with multiple through hole.Plane heat radiation part selects aluminium section bar, more bigger than wiring board area.Tapping in the plane, it covers 0.3mm heavy insulation heat conduction cloth, then is fixed on aluminium section bar by wiring board M3X6 screw.Metal-oxide-semiconductor position selects 1.8mm hot rolled plate to be pressed in the insulation position of metal-oxide-semiconductor, then is fixed on aluminium section bar with M3X10 screw, ensures the pressure that each heat outlet parts keeps certain, does not allow pressure be delivered to the welding position of metal-oxide-semiconductor simultaneously.
Above-described embodiment is one of the present utility model preferably scheme, not does any pro forma restriction to the utility model, also has other variant and remodeling under the prerequisite not exceeding the technical scheme described in claim.
Claims (8)
1. a Novel patch encapsulating structure, for the heat radiation of part at wiring board of generating heat, it is characterized in that: comprise the insulating heat-conductive cloth coordinating wiring board, planar heat spreader, hold-down screw and heat conduction boss, the upper surface of described insulating heat-conductive cloth abuts with the reverse side of described wiring board, the lower surface of described insulating heat-conductive cloth abuts with the upper end of described planar heat spreader, on described wiring board and insulating heat-conductive cloth, correspondence position all offers through hole, described hold-down screw runs through wiring board successively and is connected with planar heat spreader with the through hole of relevant position on insulating heat-conductive cloth, on described wiring board, corresponding heating part position offers one for filling out the connecting hole establishing heat conduction boss, the shape of described connecting hole is identical with the shape of described heat conduction boss, described heat conduction boss is filled out and is located in connecting hole, the upper surface of described heat conduction boss abuts with described heating feature bottom, the lower surface of described heat conduction boss abuts with described insulating heat-conductive cloth, the height of described heat conduction boss is greater than the thickness of described wiring board.
2. Novel patch encapsulating structure according to claim 1, is characterized in that: described connecting hole is positioned at the center of described heating part pin tie point in the circuit board.
3. Novel patch encapsulating structure according to claim 1, is characterized in that: described connecting hole area is greater than 50% of described heating part area.
4. Novel patch encapsulating structure according to claim 1, is characterized in that: the height value of described heat conduction boss is less than 1.1 times of the one-tenth-value thickness 1/10 of described wiring board, and the range of values of thickness of described insulating heat-conductive cloth is 10% to 40% of wiring board one-tenth-value thickness 1/10.
5. Novel patch encapsulating structure according to claim 1, it is characterized in that: described Novel patch encapsulating structure also comprises pressing plate, described pressing plate also offers through hole, the through hole that described hold-down screw runs through relevant position on pressing plate, wiring board and insulating heat-conductive cloth is successively connected with planar heat spreader, and the lower surface of described pressing plate abuts with the upper surface of described heating part.
6. Novel patch encapsulating structure according to claim 1, is characterized in that: described insulating heat-conductive cloth is made for having flexible material.
7. Novel patch encapsulating structure according to claim 1, is characterized in that: heat conduction boss abuts with the heat radiation pin of heating part.
8. Novel patch encapsulating structure according to claim 1, is characterized in that: the hole wall of connecting hole is welding resistance hole wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520106910.8U CN204408745U (en) | 2015-02-13 | 2015-02-13 | Novel patch encapsulating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520106910.8U CN204408745U (en) | 2015-02-13 | 2015-02-13 | Novel patch encapsulating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204408745U true CN204408745U (en) | 2015-06-17 |
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ID=53432571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520106910.8U Expired - Fee Related CN204408745U (en) | 2015-02-13 | 2015-02-13 | Novel patch encapsulating structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204408745U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106298758A (en) * | 2016-08-26 | 2017-01-04 | 王文杰 | A kind of SMD power device Integrated Solution being applied to electric automobile electric control product |
| CN114641122A (en) * | 2020-12-16 | 2022-06-17 | 深南电路股份有限公司 | Circuit board and preparation method thereof |
-
2015
- 2015-02-13 CN CN201520106910.8U patent/CN204408745U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106298758A (en) * | 2016-08-26 | 2017-01-04 | 王文杰 | A kind of SMD power device Integrated Solution being applied to electric automobile electric control product |
| CN106298758B (en) * | 2016-08-26 | 2019-02-26 | 王文杰 | A SMD power device integrated structure applied to electric vehicle electronic control products |
| CN114641122A (en) * | 2020-12-16 | 2022-06-17 | 深南电路股份有限公司 | Circuit board and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150617 Termination date: 20220213 |