CN203560869U - LED and PCB (printed circuit board) combined double-face conduction radiator - Google Patents
LED and PCB (printed circuit board) combined double-face conduction radiator Download PDFInfo
- Publication number
- CN203560869U CN203560869U CN201320786421.2U CN201320786421U CN203560869U CN 203560869 U CN203560869 U CN 203560869U CN 201320786421 U CN201320786421 U CN 201320786421U CN 203560869 U CN203560869 U CN 203560869U
- Authority
- CN
- China
- Prior art keywords
- led
- heat
- lower floor
- pcb
- conducting substrate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 78
- 239000010949 copper Substances 0.000 claims abstract description 37
- 229910052802 copper Inorganic materials 0.000 claims abstract description 37
- 239000011889 copper foil Substances 0.000 claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 30
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 19
- 230000017525 heat dissipation Effects 0.000 claims description 11
- 239000004411 aluminium Substances 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- 230000004888 barrier function Effects 0.000 claims description 8
- 238000005219 brazing Methods 0.000 claims description 5
- 238000005476 soldering Methods 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 2
- 239000006071 cream Substances 0.000 description 6
- 238000003466 welding Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 101150095744 tin-9.1 gene Proteins 0.000 description 2
- 230000021615 conjugation Effects 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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Abstract
The utility model discloses an LED and PCB (printed circuit board) combined double-face conduction radiator which comprises a lower heat conducting substrate and an upper copper heat conducting face, an insulating layer is formed between the lower heat conducting substrate and the upper copper heat conducting face, an LED module is arranged on the upper copper heat conducting face, and a radiating pad of the LED module is closely connected with the lower heat conducting substrate and the upper copper heat conducting face through soldering tin and used for conducting heat. By the mode that the LED radiating pad is directly connected with upper and lower copper foils by means of tin soldering, heat conduction area can be increased, and heat conduction effect is remarkably improved. A coppering or rolled copper foil mode is adopted in the lower layer, so that combination degree of the soldering tin and a copper surface can be improved, the tin and copper can be compactly combined, and heat resistance is lowered; first soldering paste printing is used for filling tin paste to enable the lowest region under the LED radiating pad to be filled to be as high as positive and negative pads on a circuit board, and integral tin paste printing is performed for the second time to ensure soldering quality.
Description
Technical field
The utility model relates to LED and manufactures field, and specifically a kind of LED is combined two-sided heat loss through conduction device with PCB.
Background technology
For LED, heat radiation is major issue, in existing LED application, most LED chips are to be all fixed on PCB plate, between LED chip and radiator, pass through often with heat-conducting resin, heat-conducting silicone grease or silicon rubber conducting strip are as heat-conducting medium, the heat producing while making LED chip operation is transmitted to radiator by these heat-conducting mediums, and heat-conducting resin, the thermal conductivity factor of heat-conducting silicone grease or conducting strip is very low, and generally all adopt one side to dispel the heat, such radiating mode can make LED because heat conduction is bad, cause early stage light decay, affect applying of LED light source.
Utility model content
In order to solve the above-mentioned technical problem existing in prior art, the utility model provides a kind of LED to be combined two-sided heat loss through conduction device with PCB, comprise lower floor's heat-conducting substrate and upper copper thermal conductive surface, between lower floor's heat-conducting substrate and upper copper thermal conductive surface, there is insulating barrier, described upper copper thermal conductive surface is provided with LED module, and the heat dissipation bonding pad of described LED module is closely connected with lower floor heat-conducting substrate, upper copper thermal conductive surface respectively by scolding tin.
Further, described lower floor heat-conducting substrate is lower floor's copper heat-conducting substrate.
Further, described lower floor heat-conducting substrate is the lower floor's brazing junction on lower floor's aluminium heat-conducting substrate and lower floor's aluminium heat-conducting substrate.
Further, on described insulating barrier, be printed with the anodal line layer Copper Foil of LED and LED negative pole line layer Copper Foil, between the anodal line layer Copper Foil of described LED, LED negative pole line layer Copper Foil and upper copper thermal conductive surface, by groove, separated.
Further, the positive pole of described LED module and negative pole are welded on the anodal line layer Copper Foil of LED and LED negative pole line layer Copper Foil by scolding tin respectively.
Further, the thickness of the anodal line layer Copper Foil of described LED and LED negative pole line layer Copper Foil is 9um-200um.
Further, the thickness of described lower floor copper heat-conducting substrate is greater than 9 um.
Further, the thickness of lower floor's aluminium heat-conducting substrate is greater than 9 um.
LED of the present utility model is combined two-sided heat loss through conduction device and is had the following advantages with PCB:
LED heat dissipation bonding pad welds by tin cream the mode being directly connected with upper and lower Copper Foil can increase heat-conducting area, significantly promotes heat-conducting effect;
Lower floor adopts the mode of copper facing or rolled copper foil can promote the conjugation on scolding tin and copper surface, makes the fine and close combination of tin copper energy, reduces thermal resistance;
Because both positive and negative polarity pad is different from the height of LED heat dissipation bonding pad on wiring board, first impression soldering paste is used for filling tin cream, make lowermost extent raising under LED heat dissipation bonding pad to wiring board on positive and negative pad equal height, carry out for the second time overall paste solder printing, guarantee welding quality.
Accompanying drawing explanation
Fig. 1 is that LED of the present utility model is combined the front schematic view of two-sided heat loss through conduction device with PCB;
Fig. 2 is that this LED is combined two-sided heat loss through conduction device embodiment profile with PCB;
Fig. 3 is that this LED is combined two-sided heat loss through conduction device embodiment profile with PCB.
The specific embodiment
Below in conjunction with accompanying drawing, the utility model is described in further detail.
Embodiment mono-
As illustrated in fig. 1 and 2, LED of the present utility model is combined two-sided heat loss through conduction device with PCB, comprise lower floor's copper heat-conducting substrate 1 and upper copper thermal conductive surface 2, between lower floor's copper heat-conducting substrate 1 and upper copper thermal conductive surface 2, there is insulating barrier 3, upper copper thermal conductive surface 2 is provided with LED module 4, on insulating barrier 3, be printed with the anodal line layer Copper Foil 5 of LED and LED negative pole line layer Copper Foil 6, the anodal line layer Copper Foil 5 of LED, between LED negative pole line layer Copper Foil 6 and upper copper thermal conductive surface 2, by groove 7, separated, the heat dissipation bonding pad 8 of LED module 4 by scolding tin 9 respectively with lower floor copper heat-conducting substrate 1, upper copper thermal conductive surface 2 is closely connected, be used for heat conduction.The positive pole of LED module 4 and negative pole are welded on the anodal line layer Copper Foil 5 of LED and LED negative pole line layer Copper Foil 6 by scolding tin respectively, are used for conducting electricity.The thickness of the anodal line layer Copper Foil 5 of LED and LED negative pole line layer Copper Foil 6 is 9um-200um, and the thickness of lower floor's copper heat-conducting substrate 1 is greater than 9 um.
Tin cream adopts SMT welding, because positive and negative pad is different from the height of heat dissipation bonding pad 8 on wiring board, first impression soldering paste is used for filling tin cream, make lowermost extent raising under heat dissipation bonding pad extremely with wiring board on positive and negative pad equal height, overall printing for the second time.
Embodiment bis-
As shown in figs. 1 and 3, LED of the present utility model is combined two-sided heat loss through conduction device with PCB, comprise lower floor's aluminium heat-conducting substrate 10, the lower floor's brazing junction 11 that adopts the mode of copper facing or rolled copper foil to generate on lower floor's aluminium heat-conducting substrate 10, with upper copper thermal conductive surface 2, between lower floor's brazing junction 11 and upper copper thermal conductive surface 2, there is insulating barrier 3, upper copper thermal conductive surface 2 is provided with LED module 4, on insulating barrier 3, be printed with the anodal line layer Copper Foil 5 of LED and LED negative pole line layer Copper Foil 6, the anodal line layer Copper Foil 5 of LED, between LED negative pole line layer Copper Foil 6 and upper copper thermal conductive surface 2, by groove 7, separated, the heat dissipation bonding pad 8 of LED module 4 by scolding tin 9 respectively with lower floor brazing junction 11, upper copper thermal conductive surface 2 is closely connected, be used for heat conduction.The positive pole of LED module 4 and negative pole are welded on the anodal line layer Copper Foil 5 of LED and LED negative pole line layer Copper Foil 6 by scolding tin respectively, are used for conducting electricity.The thickness of the anodal line layer Copper Foil 5 of LED and LED negative pole line layer Copper Foil 6 is 9um-200um, and the thickness of lower floor's aluminium heat-conducting substrate 10 is greater than 9 um.
Tin cream adopts SMT welding, because positive and negative pad is different from the height of heat dissipation bonding pad 8 on wiring board, first impression soldering paste is used for filling tin cream, make lowermost extent raising under heat dissipation bonding pad extremely with wiring board on positive and negative pad equal height, overall printing for the second time.
Claims (8)
1. a LED is combined two-sided heat loss through conduction device with PCB, comprise lower floor's heat-conducting substrate and upper copper thermal conductive surface (2), between lower floor's heat-conducting substrate and upper copper thermal conductive surface (2), there is insulating barrier (3), described upper copper thermal conductive surface (2) is provided with LED module (4), it is characterized in that: the heat dissipation bonding pad (8) of described LED module (4) is closely connected with lower floor's heat-conducting substrate (1), upper copper thermal conductive surface (2) respectively by scolding tin (9).
2. LED as claimed in claim 1 is combined two-sided heat loss through conduction device with PCB, it is characterized in that: described lower floor heat-conducting substrate is lower floor's copper heat-conducting substrate (1).
3. LED as claimed in claim 1 is combined two-sided heat loss through conduction device with PCB, it is characterized in that: described lower floor heat-conducting substrate is the lower floor's brazing junction (11) on lower floor's aluminium heat-conducting substrate (10) and lower floor's aluminium heat-conducting substrate (10).
4. LED as claimed in claim 1 is combined two-sided heat loss through conduction device with PCB, it is characterized in that: on described insulating barrier (3), be printed with LED anodal line layer Copper Foil (5) and LED negative pole line layer Copper Foil (6), between the anodal line layer Copper Foil of described LED (5), LED negative pole line layer Copper Foil (6) and upper copper thermal conductive surface (2), by groove (7), separated.
5. LED as claimed in claim 4 is combined two-sided heat loss through conduction device with PCB, it is characterized in that: the positive pole of described LED module (4) and negative pole are welded on the anodal line layer Copper Foil of LED (5) and LED negative pole line layer Copper Foil (6) by scolding tin respectively.
6. LED as claimed in claim 4 is combined two-sided heat loss through conduction device with PCB, it is characterized in that: the thickness of the anodal line layer Copper Foil of described LED (5) and LED negative pole line layer Copper Foil (6) is 9um-200um.
7. LED as claimed in claim 2 is combined two-sided heat loss through conduction device with PCB, it is characterized in that: the thickness of described lower floor's copper heat-conducting substrate (1) is greater than 9 um.
8. LED as claimed in claim 3 is combined two-sided heat loss through conduction device with PCB, it is characterized in that: the thickness of lower floor's aluminium heat-conducting substrate (10) is greater than 9 um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320786421.2U CN203560869U (en) | 2013-12-04 | 2013-12-04 | LED and PCB (printed circuit board) combined double-face conduction radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320786421.2U CN203560869U (en) | 2013-12-04 | 2013-12-04 | LED and PCB (printed circuit board) combined double-face conduction radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203560869U true CN203560869U (en) | 2014-04-23 |
Family
ID=50510588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320786421.2U Expired - Fee Related CN203560869U (en) | 2013-12-04 | 2013-12-04 | LED and PCB (printed circuit board) combined double-face conduction radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203560869U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103672810A (en) * | 2013-12-04 | 2014-03-26 | 浙江欧珑电气有限公司 | LED (light-emitting diode)-PCB (printed circuit board) combined double-faced conductive radiator |
-
2013
- 2013-12-04 CN CN201320786421.2U patent/CN203560869U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103672810A (en) * | 2013-12-04 | 2014-03-26 | 浙江欧珑电气有限公司 | LED (light-emitting diode)-PCB (printed circuit board) combined double-faced conductive radiator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140423 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |