JP6266135B2 - Lighting device - Google Patents

Description

The present invention relates to an illuminating device excellent in assembly workability.

  Because of energy saving and long life, LED (Light Emitting Diode) illumination has become widespread, and many illuminations using LEDs have been proposed.

  For example, Patent Document 1 describes a structure of an LED-type small light bulb using a glass epoxy substrate having a central hole or an aluminum substrate, and an LED-type light bulb having electronic components mounted on these substrates. A structure is disclosed. In the case of an aluminum substrate, it is described that wiring for component attachment is attached to the outer periphery of the upper surface of the substrate by insulating the substrate.

  In Patent Document 2, a plurality of conductor layers are laminated on the surface of a substrate formed of an insulator such as a glass epoxy substrate so that the lowermost layer is a Cu layer and the uppermost layer is an Au layer. A method for mounting an LED chip on a mounted pad through a conductive adhesive is described. According to the method of Patent Document 2, a recess having a width capable of accommodating the LED chip is formed in a portion corresponding to the LED chip of the mounting pad so that the Cu layer is exposed on the bottom surface thereof. After the LED chip is placed on the Cu layer via a conductive adhesive, the LED chip is mounted by heating and solidifying the conductive adhesive.

  Patent Document 3 describes an LED lighting device in which a plurality of LED packages, each having a light control member having a reflective surface, are disposed in an annular region having a predetermined width. In Patent Document 3, a lens unit is attached in front of the LED package. It is described that the lens unit is configured by combining a plurality of lenses, which are light control members individually provided in front corresponding to the plurality of LED packages, with a disk-shaped connecting plate.

  Further, in Patent Document 4, a large number of LEDs that are arranged radially around a bar-shaped member (bar) along the length of the circuit board and irradiate light and a circuit board on which LEDs are arranged on the outer periphery are fixed. An illumination device having a surface for the purpose is described.

JP 2010-205579 A JP 2003-174201 A JP 2013-239268 A JP 2014-32850 A

  However, in Patent Document 1 and Patent Document 2, since the LED light emitting element package is disposed on a rigid substrate such as a metal substrate or a glass epoxy substrate, there is no degree of freedom in shape. Further, it is necessary to use a separate fixing member or adhesive for fixing the substrate, and the assemblability is poor.

  In addition, LED lighting is generally a point light source with high luminance and has a high directivity due to a large difference in luminance depending on the direction from the light source. Furthermore, since there is a large difference in luminance between the light source itself and the surrounding area, it illuminates a wide range softly. It is a little weak. For example, it is difficult to obtain illumination free from shadows and uneven illuminance for ceiling lights and downlights. For this reason, although patent document 3 spreads light using a lens, since the number of parts increases and it only spreads light in a wide range, it does not produce an indirect illumination effect.

  Moreover, although patent document 4 arrange | positions a some LED light source part toward the outer periphery of the circumferential direction, and irradiates light to all directions, it only expands the irradiation range of light similarly to patent document 3. Therefore, it does not produce a soft and calm effect and does not improve glare.

The present invention has been made in view of such problems, and is excellent in assembling workability, and produces a soft and indirect lighting effect by improving the uniformity of the brightness of light emitted from the lighting device. In addition, by reducing the transmitted light from the vicinity of the LED light emitting device package that is a point light source, it is possible to reduce the difference in luminance depending on the emission position of the light emitted from the lighting device, and to achieve glare properties. It is another object of the present invention to provide a lighting device that can be improved.

  Here, the LED light source in the present invention is a small flat surface light source having a predetermined flat light emitting surface and the luminance portion of the light source does not reach the back surface of the light source. Instead, it will be described as a point flat plate surface light source.

In order to achieve the above-described object, the first invention is a frame body including a top surface portion, a cylindrical side surface portion connected to the top surface portion and surrounding an outer periphery of the top surface, and a reflector made of a micro foam resin A flexible substrate having an elastic repulsive force, in which a wiring circuit is integrally disposed on the back surface of the substrate, a top-surface reflector made of a micro foam resin disposed so as to cover the lower surface of the top-surface portion, and the flexible substrate An LED light emitting device package disposed on the frame body, covering the inner peripheral surface of the side surface portion of the frame body or contacting at least a part of the inner peripheral surface of the side surface portion of the frame body, A flexible substrate is disposed, and the LED light emitting element package is disposed such that a light emitting direction of the LED light emitting element package is directed to a substantially central axis direction of the frame body, and the LED light emitting element package is disposed on the frame body. Plural in the circumferential direction of the cylindrical shape of the side part And a projecting portion is provided on the lower surface of the top surface reflector, and the projecting portion is formed radially from a substantially center of the top surface reflector to a cylindrical outer periphery, from the center of the projecting portion. The tip in the direction toward the outer periphery is disposed between the LED light emitting device packages, the width of the protruding portion becomes narrower from the approximate center of the protruding portion toward the tip, and the height of the protruding portion is The lighting device is characterized in that a line connecting from approximately the center of the projecting portion to the tip is a ridge line and becomes lower from the approximately center of the projecting portion toward the tip .

  Here, the shape of the top surface of the present invention can be any one of a circle, an ellipse, an oval, a rectangle, and a regular polygon. The shape can be any of a cylindrical shape, an elliptical cylindrical shape, a long cylindrical shape, a rectangular cylindrical shape, a regular polygonal cylindrical shape, etc. Can raise the shape of a cylindrical frame.

  An annular lower surface reflector having a hole in the center may be provided at a position facing the top surface reflector with respect to the LED light emitting device package.

  The top plate portion and the cylindrical side surface portion connected to the top plate portion according to the present invention are all formed of a figure having a center, such as a circle, an ellipse, an oval, a rectangle, or a regular polygon, and its cylindrical body. The arrangement of the flexible substrate and the arrangement of the protrusions are easy.

  The top surface of the frame body is preferably formed from a figure having a convex shape with respect to the center of the outer periphery of the figure formed by the top surface, and the side surface of the frame body is a cylindrical body corresponding thereto. It is desirable to be formed in a shape. If the side surface of the frame is formed in a cylindrical shape from a figure having a convex shape corresponding to the top surface, the outline of the outer periphery of the top surface may be a straight line or a curved line. Since the flexible substrate is formed by rounding or bending, the flexible substrate can be brought into close contact with the side surface of the frame body by the elastic repulsive force of the flexible substrate.

  In addition, as the shape of the frame body, it is possible to exert the elastic repulsive force of the flexible substrate on the frame body, even if a part of the outer peripheral portion of the side surface has a concave shape. If the side surface has a concave shape, the light from the LED light source is blocked or reflected by the concave portion formed in the central direction of the cylindrical shape, and uniform from the light extraction surface of the lighting device. Since it is difficult to extract light, it is desirable that the side surface of the frame is formed in a cylindrical shape by a figure having a convex shape corresponding to the top surface. In other words, the cylindrical cross section of the frame has a shape that is symmetric with respect to a predetermined center line, or has a symmetry that allows the same figure to be obtained before rotation when rotated by a predetermined angle with respect to the center. It is desirable. By making the top and side surfaces of the frame body in such a shape, uniform light can be extracted from the lighting device.

  In the cross section perpendicular to the surface of the top surface portion, the shape of the flexible substrate may be formed in a shape that increases in diameter toward the top surface portion.

  A fixing portion may be provided on an inner surface side of the side surface portion of the frame body, and a circumferential end portion of the flexible substrate may be connected and fixed by the fixing portion.

  A folded portion may be provided at a lower end portion of the side surface portion of the frame body, and a lower end portion of the flexible substrate may be supported by the folded portion.

  A plurality of the LED light emitting device packages may be arranged at substantially equal intervals along the side surface portion of the frame body. In addition, when the side part of the said frame is cylindrical shape, elliptic cylinder shape, and a long cylindrical shape, it is arrange | positioned in the circumferential direction at substantially equal intervals, and the rectangular cylinder by which the side part of the said frame is formed only by a plane In the case of a polygonal cylinder, at least one may be arranged on each side across the sides so that the arrangement intervals are substantially equal.

Further, the present invention provides an elastic structure in which a substantially rectangular frame having a top surface portion and a side surface portion connected to the top surface portion, and a wiring circuit are integrally arranged on the back surface of a reflector made of a micro foam resin. A flexible substrate having a repulsive force, an LED light emitting device package disposed on the flexible substrate, a top surface reflector made of a micro foam resin covering a lower surface of the top surface portion, and the LED light emitting device package And a lower surface reflecting plate disposed at a position facing the top surface reflecting plate, and the flexible substrate is in contact with at least a part of the inner peripheral surface of the side surface portion of the frame body. The surface of the flexible substrate on which the LED light emitting device package is mounted is inclined so as to spread in the direction of the top surface portion, and the LED light emitting device package is formed on the side surface portion of the frame body. Are arranged in the longitudinal direction of A projecting portion is provided on the lower surface of the top surface reflector, and the projecting portion is formed continuously at substantially the center in the longitudinal direction of the top surface reflector and is perpendicular to the longitudinal direction of the top surface reflector. In this case, the LED light emitting device package is formed between the LED light emitting element packages at least from the center on the short side toward the end on the short side, and the width of the protrusion is in the longitudinal direction of the top surface reflector. The height of the protrusion is narrowed from the base of the protrusion to the tip with respect to the vertical direction, and the height of the protrusion is from the base of the protrusion to the tip with respect to the direction perpendicular to the longitudinal direction of the top surface reflector. as ridge lines connecting up, Rukoto may be a lighting device comprising a lower toward the tip from the approximate center of the projecting portion.

In this case, the light emitting surface of the LED light emitting device package may be disposed on the side surfaces of the frame body facing each other.

  You may fix the light diffusing plate made from glass or resin which has a light transmittance in the opening part which opposes the said top | upper surface part of the said frame.

  The flexible board | substrate may be the illuminating device which formed the said wiring circuit by copper foil or copper plating on the back surface of the micro foaming resin sheet.

The electrical connection between the LED light emitting element package and the wiring circuit formed on the back surface of the flexible substrate may be made through a through hole or an opening provided in the side surface reflector made of the micro foam resin.

  The micro-foamed resin may be any of polyethylene terephthalate resin, polycarbonate resin, and acrylic resin.

  According to the first invention, since the substrate on which the LED light emitting element package is arranged has flexibility, it can be easily arranged along the shape of the attachment position. Further, since the flexible substrate has an elastic repulsive force, for example, when a plate-shaped flexible substrate is rolled into a cylindrical shape, it has a restoring force (a force to spread) to return to the original shape. For this reason, if it arrange | positions inside a cylindrical frame body, a flexible board | substrate can be pressed by the frame internal peripheral surface by this elastic repulsive force, and it can contact | adhere to a frame body, and assembly workability | operativity is excellent.

  Here, if the side surface of the frame of the lighting device is cylindrical, by bending the plate-shaped flexible substrate, in addition to the cylindrical shape, an elliptical cylindrical shape, a long cylindrical shape, a rectangular cylindrical shape, a regular polygonal shape The present invention can be applied to lighting having various frame shapes such as a cylindrical shape.

  In the case where the side surface of the frame body is a shape formed only by a curved surface such as a cylindrical shape or an elliptical cylindrical shape, the flexible substrate is rolled up along the shape of the side surface of the frame body, The inner surface of the body and the flexible substrate can be brought into close contact with each other. In addition, when the side surface of the frame has a curved surface portion and a flat surface portion or a flat surface portion and a flat surface portion, such as a long cylindrical shape, a rectangular tube shape, and a regular polygonal cylinder shape, and has a corner portion where each surface intersects Even if the bent portion of the flexible substrate inscribed in the corner portion of the frame of the flexible substrate is cut in a slight depth in the thickness direction from the outer peripheral portion toward the inner peripheral portion, Good. Alternatively, the elastic repulsive force of the flexible substrate can be increased to some extent by crushing the bent portion of the flexible substrate inscribed in the corner of the frame of the flexible substrate along the corner of the frame to cause plastic deformation. In a maintained state, it can be brought into close contact with the peripheral surface of the frame. As described above, in any of the above cases of the cylindrical frame lighting device, the flexible substrate is excellent in assembling workability.

  In addition, by providing an annular lower surface reflector having a hole in the center at a position facing the top surface reflector, the area where the light emitting part of the LED light emitting element package can be directly seen from below the illumination device is reduced. The glare of the lighting device can be reduced. The bottom reflector reflects the light from the light emitting part of the LED light emitting device package to the top reflector so that it can be easily extracted from the vicinity of the center, thereby reducing the difference in brightness between the vicinity of the light source and the center. It is.

  In addition, by providing a substantially radial protrusion on the lower surface of the top surface reflector, there is an effect of improving and equalizing the luminance in the vicinity of the light emitting portion of the lighting device and the intermediate luminance between the light emitting portions. Similarly, since the difference between the luminance near the center of the lighting device and the luminance near the light emitting portion of the LED light emitting device package can be reduced, the uniformity of the brightness of the lighting device can be maintained and the glare can be maintained. It can also improve sex.

  In addition, the LED light emitting device package is arranged in the direction of the central axis of the frame body, and the reflection plate made of micro foam resin is provided on the inner peripheral surface and the top surface portion, so that the light from the light source is reflected by the reflection plate and Irradiated extensively by diffusion. For this reason, illuminance unevenness and shadows hardly occur. In addition, the light source is less conspicuous as compared with the case where the LED light emitting element package is disposed downward on the top surface.

  Such an indirect illumination effect can be obtained more effectively by arranging the LED light emitting device package on a flexible substrate whose diameter increases toward the top surface. For example, a higher effect can be obtained by forming the flexible substrate with an inverted truncated cone shape or a curved surface bulging outward. In addition, the flexible substrate can have a shape such as an inverted truncated cone shape, an inverted elliptical truncated cone shape, an inverted long truncated cone shape, an inverted rectangular truncated cone shape, or an inverted regular polygonal truncated cone shape.

  In particular, by arranging a plurality of LED light emitting element packages at substantially equal intervals in the circumferential direction of the side surface portion of the frame body, it is possible to further prevent illuminance unevenness and generation of shadows. Further, as compared with the case where a plurality of LED light emitting device packages are arranged on the top surface portion, the heat conduction path length between the LED light emitting device packages can be increased to increase the heat radiation area and at the same time, the distance between the heat sources can be increased. Therefore, heat dissipation characteristics are also good.

  Moreover, light can be diffused more uniformly by fixing the light diffusing plate which has a light transmittance to the opening part which opposes the top | upper surface part of a frame.

  Further, when the flexible substrate is rolled, the shape of the flexible substrate can be held more reliably by connecting and fixing the circumferential end portions of the flexible substrate with the fixing portion.

  Further, by providing the folded portion at the lower end portion of the side surface portion of the frame body, the lower end portion of the flexible substrate can be supported by the folded portion, and the flexible substrate can be prevented from falling off. It is possible to stably hold the conductive substrate.

  Moreover, by forming a wiring board integrally with copper foil on the back surface of the micro foamed resin sheet to constitute a flexible substrate, the function of the reflector and the function as the substrate can be made compatible, and the structure is simple. Become.

  The electrical connection between the LED light-emitting element package and the wiring circuit formed on the back surface of the flexible substrate can be ensured reliably if the through-hole or opening provided in the micro-foamed resin is used. it can. Here, it is also possible to use a substrate using FPC (flexible printed circuit) instead of the sheet-like flexible substrate having elastic repulsion. When the flexible printed circuit is used, the FPC board does not have light reflection characteristics, and thus a separate light reflecting plate needs to be provided on the surface of the flexible printed circuit board.

  Moreover, if the microfoamed resin is a polyethylene terephthalate resin, a polycarbonate resin, or an acrylic resin, processability, light reflection characteristics, and the like are good.

  In the present invention, the shape of the frame can also be rectangular. In this case, for example, the LED light emitting element package may be disposed on the long side wall portion. When a rectangular frame is used, the flexible substrate, the top surface reflector and the bottom reflector can be bent and formed integrally. That is, the LED light emitting device package may be disposed on the surface connecting the top surface reflector and the bottom reflector, and connecting the two.

  Of course, the flexible substrate, the top reflector and the bottom reflector are not integrally formed, but the top reflector and the side flexible substrate, or the bottom reflector and the side reflector are flexible. Any two of the conductive substrates can be formed integrally. In addition to the above, the top surface reflecting plate, the side surface flexible substrate, and the bottom surface reflecting plate can be formed separately. As described above, when a part or all of the different reflectors are integrally formed, it is possible to make a bend by making a slight depth cut on the surface of the bent portion of the square reflector. By doing in this way, it can be bent in a suitable shape, utilizing the elastic repulsion force of a flexible substrate.

  In this case, the LED light-emitting element packages can be respectively disposed on the side surfaces facing each other. By doing in this way, the uniformity of the brightness of the light emitted from the lighting device can be improved.

  Further, in this case, by providing the above-described protrusion on the lower surface of the top surface reflector, by improving the luminance between the LED light emitting device packages relative to the luminance in the vicinity of the LED light emitting device package of the lighting device, The difference in luminance between the two can be reduced and equalized.

  Moreover, this invention can also arrange | position an LED light emitting element package only to one of the side parts which oppose, and can make the other side face curved toward the downward direction. When the size of the illumination (dimension on the short side) is small, the LED light emitting device package is disposed only on one side surface portion, and the other is to reflect the light from the LED light emitting device package downward by the curved portion. The uniformity of the brightness of the light emitted from the lighting device can be improved. For this reason, the use number of LED light emitting element packages can also be reduced.

The flexible substrate is provided with an opening penetrating the flexible substrate and a wiring circuit, and an upper surface of an electrode terminal provided in an LED light emitting device package disposed in the opening is formed by the micro substrate. You may connect to the lower surface of the wiring circuit formed in the back surface of a foamed resin sheet .
Wherein the flexible substrate, the exposed wire circuit to the edge of the hole provided on the flexible substrate, the lower surface of the electrode terminals of the deployed LED light emitting device package in said hole, of the wiring circuit It may be connected to the upper surface.

  According to the present invention, it is possible to provide an illuminating device that is excellent in assembling workability, produces a soft and calm indirect lighting effect, and can improve glare.

The disassembled perspective view of the illuminating device 1 as a typical example of an illuminating device with a cylindrical side surface. The bottom view of the illuminating device 1. FIG. The B section enlarged view of Fig.2 (a). FIG. 3 is a development view of the flexible substrate 13. Sectional drawing which shows the junction structure of a LED light emitting element package. Sectional drawing which shows the junction structure of a LED light emitting element package. FIG. 3 is a cross-sectional view of the lighting device 1. Sectional drawing of the illuminating device 1a. Sectional drawing of the illuminating device 1b. Sectional drawing of the illuminating device 1c. Sectional drawing of the illuminating device 1d. Sectional drawing of the illuminating device 1e. The expanded view of the flexible substrate 13a. The disassembled perspective view of the illuminating device 1f. Is a bottom view of the lighting device 1f. It is sectional drawing of the illuminating device 1f, Comprising: The EE sectional view taken on the line of FIG. Sectional drawing of the illuminating device 1g. Sectional drawing of the illuminating device 1h. Sectional drawing of the illuminating device 1i. Sectional drawing of the illuminating device 1j. Sectional drawing of the illuminating device 1k. The conceptual diagram which shows the irradiation direction of the light of the illuminating device 1e. The conceptual diagram which shows the irradiation direction of the light of the illuminating device 1i. The conceptual diagram which shows the irradiation direction of the light of the illuminating device 1e. The conceptual diagram which shows the irradiation direction of the light of the illuminating device 1k. The disassembled perspective view of the illuminating device 1m. Sectional drawing of the illuminating device 1m. Sectional drawing of the illuminating device 1n. The QQ line sectional view of Drawing 18 (a). Sectional drawing of the illuminating device 1p. The expansion | deployment top view of the flexible substrate 13b. The expansion | deployment bottom view of the flexible substrate 13b. Sectional drawing which shows the junction structure of a LED light emitting element package.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is an exploded perspective view showing a lighting device 1 having a cylindrical side surface as a representative example of a cylindrical lighting device, and FIG. 2A is a bottom view (a perspective view of a folded portion 9). The illuminating device 1 includes a frame 3, a top surface reflector 11, a flexible substrate 13, and the like. In the following description, illustration of wiring and heat dissipation structure is omitted.

  The frame body 3 is connected to the top surface portion 5 and the top surface portion 5 and includes a cylindrical side surface portion 7 surrounding the outer periphery of the top surface. The top surface portion 5 is substantially circular, and a substantially circular hole 6 is formed in the central portion. A side surface portion 7 is formed at a peripheral portion of the top surface portion 5 substantially perpendicular to the top surface portion 5. That is, the side surface portion 7 has a substantially cylindrical shape, and an opening is formed on the side facing the top surface portion 5.

  A folded portion 9 is provided at the lower end (opening side) of the side surface portion 7. The folded portion 9 is formed at the lower end of the side surface portion 7 and is formed so as to protrude in the central axis direction of the frame body 3. The top surface portion 5 and the side surface portion 7 are made of resin or metal, and each portion may be formed integrally or may be formed separately and joined.

  The top surface reflecting plate 11 is a substantially circular member, and is disposed inside the frame 3 so as to cover the bottom surface of the top surface portion 5 and to contact the bottom surface. That is, the top surface reflecting plate 11 has substantially the same size as the diameter of the inner surface of the top surface portion 5.

  The flexible substrate 13 is rounded into a substantially circular shape and inserted into the frame 3 so that the substrate end portions 14, which are circumferential end portions, are abutted with each other. Cover or abut against at least a part of the inner peripheral surface of the side surface portion 7. Here, the flexible substrate 13 is a sheet-like member having flexibility and elastic repulsion. Having an elastic repulsion force means that when the flexible substrate 13 is rolled and inserted into the frame body 3, the outer surface of the flexible substrate 13 is formed on the side surface portion 7 by the shape restoring force (force to spread). It means being pressed against the inner surface.

  The top surface reflecting plate 11 and the flexible substrate 13 are formed from a micro-foamed resin sheet (a porous member having a number of fine mechanisms). The micro-foamed resin sheet used in the present invention is an insulating multilayer resin sheet having a foam layer at the center and non-foam layers on both sides. Here, the foam layer refers to a layer in which bubbles are generated by foaming.

  In the present invention, the thickness of the microfoamed resin sheet is 0.4 mm to 2.0 mm, and the thickness of the non-foamed layer is 10 to 30 μm. The thickness of the foamed layer is a value obtained by subtracting the thickness of the non-foamed layer from the thickness of the microfoamed resin sheet. That is, the thickness of the non-foamed layer becomes a substantially constant value even when the total thickness of the microfoamed resin sheet is increased. The reason for this is that the non-foamed layer is formed by outgassing in the manufacturing process of the microfoamed resin sheet, and the thickness of the layer formed thereby is determined by the distance from the surface of the microfoamed resin sheet.

  The microfoamed resin sheet of the present invention preferably has an average cell diameter in the range of 0.2 μm to 40 μm. Here, if the average bubble diameter is less than 0.2 μm, the light transmittance increases and the reflectance decreases. If the average bubble diameter is too large, the diffuse reflectance decreases, so the average bubble diameter needs to be 0.2 μm to 40 μm. Further, the average bubble diameter is preferably 0.5 μm to 20 μm.

  The micro-foamed resin sheet is made of a thermoplastic resin, and has an optical characteristic for visible light having a wavelength of 450 to 650 nm. Is in range. The total reflectance is preferably 95% or more. The micro-foamed resin sheet has a non-foamed layer having a high light reflectance on the surface, and thus is effective as a reflector.

Here, the micro-foamed resin sheet of the present invention is an insulating substrate, and its volume resistivity is 10 ¹² Ω to 10 ¹¹ Ω. If it is this range, the insulation in this invention can fully be ensured.

  In the present invention, the microfoamed resin sheet is composed of any one of PET resin (polyethylene terephthalate resin), PC resin (polycarbonate resin), flame-retardant PC resin, acrylic resin, for example, PMMA resin (polymethyl methacrylate resin). It is preferable. In addition to the above, a transparent resin obtained by imparting flame retardancy to an acrylic resin such as a cycloolefin polymer or polyacrylonitrile can also be used for the microfoamed resin sheet.

  The resin sheet applied to the present invention is not limited to the above-described micro-foamed resin sheet. For example, a porous member in which fine pores are formed by stretching a resin sheet in which an inorganic substance is dispersed is used. It may be used as it is attached to the frame as it is. Usually, such a resin sheet is in the form of a film and lacks rigidity. Therefore, it is desirable to use the resin sheet by adhering to a resin sheet having flexibility and elastic repulsion.

  FIG. 2B is an enlarged view of a portion B in FIG. A fixing portion 19 is formed on the inner surface side of the side surface portion 7 of the frame body 3 as necessary. The fixing portion 19 has claw portions in both circumferential directions of the side surface portion 7, and the substrate end portions 14, which are circumferential end portions of the flexible substrate 13, are inserted into the claw portions on both sides of the fixing portion 19. The That is, the fixing portion 19 is a portion that connects and fixes the substrate end portions 14 of the flexible substrate 13. A clearance is formed between the fixing portion 19 and the flexible substrate 13 to allow the flexible substrate 13 to expand and contract. Further, the fixing portion 19 may be formed integrally with the inner surface of the side surface portion 7 or may be a separate member.

  FIG. 3 is a development view of the flexible substrate 13. A wiring circuit 15 is formed on the back surface of the flexible substrate 13 (the surface that becomes the outer peripheral side when rolled up). That is, the flexible substrate 13 is formed by integrally arranging a wiring circuit on the back surface of a micro-foamed resin reflector. The example of FIG. 3 is an example in which three LED light emitting device packages are connected in series as a wiring circuit. The wiring circuit is folded back in a substantially U-shape, and the folded portion also plays a role of improving heat dissipation. . Of course, the width and thickness of the wiring circuit can be adjusted as needed, and the form of the wiring circuit 15 is not limited to the illustrated example.

  Here, the flexible substrate 13 of the present invention can be obtained, for example, as follows. First, the resin sheet is foamed. Next, a copper foil is bonded to the back surface of the obtained micro-foamed resin sheet. Thereafter, a circuit pattern (wiring circuit 15) is formed on the copper foil portion. For example, the part where the circuit is not formed is etched, and the part other than the circuit pattern is removed. Finally, a resist treatment is applied to the surface on which the circuit is formed as necessary. When a metal frame is used for the frame, a resist treatment is usually required on the formed circuit surface for insulation.

  The micro-foamed resin sheet of the present invention can also be obtained by bonding a copper foil or the like formed in the shape of the wiring circuit 15 after foaming the resin sheet. In this method, after a resin sheet is foamed, a copper foil formed in a circuit shape is bonded.

  Here, as described above, the non-foamed layer, which is also referred to as a skin layer, exists from the surface layer to a predetermined depth in the microfoamed resin sheet after the heat foaming treatment. This non-foamed layer is formed by the gas at the time of foaming out of the surface of the resin sheet in the foaming step, and is a layer having relatively high rigidity with respect to the foamed layer. Therefore, in any of the methods described above, the obtained flexible substrate 13 has a non-foamed layer on both surfaces in the thickness direction and has a foamed layer in the center.

  In addition, after removing a part or all of a non-foaming layer, you may perform circuit formation on the surface of the exposed foaming layer. When removing a part of the non-foamed layer, it is desirable to remove the non-foamed layer and expose the foamed layer according to the circuit pattern to form a circuit in this part. good. The non-foamed layer can be removed by drilling or laser beam irradiation.

  Further, the copper foil constituting the circuit and the microfoamed resin sheet may be bonded at room temperature, or may be heat bonded at a softening temperature of the resin or a temperature equal to or lower than Tg. When performing heat bonding using a thermosetting resin, it is desirable to perform it while applying pressure using a hot roll or a hot press. Note that, instead of bonding or heat bonding, both may be bonded by thermocompression bonding.

  In addition, as copper foil which comprises a circuit, both rolled copper foil and electrolytic copper foil can be used. Examples of the rolled copper foil include foils such as tough pitch copper, oxygen-free copper, phosphorus-deoxygenated copper, and copper alloys. Although it is preferable to use tough pitch copper or oxygen-free copper having high conductivity for the energizing wiring circuit, it is preferable to use tough pitch copper from the viewpoint of cost and the like. In the rolled copper foil, it is preferable that the rolling reduction is high. In order to improve the formability and bendability, the higher the rolling reduction, which is the plate thickness (foil thickness) ratio before and after rolling, the greater the flexibility of the foil after annealing, and the better the bendability and formability. Because.

Both tough pitch copper and oxygen-free copper have a tensile strength of 400 to 450 N / mm ² , an elongation of about 1.0 to 2.0%, and an electrical conductivity of 100% IACS. The softening temperature of tough pitch copper is 100-140 ° C, the softening temperature of oxygen-free copper is 150-180 ° C, and the softening temperature of oxygen-free copper is higher. Here, in order to improve formability and flexibility, an annealed copper foil may be used. For example, when an annealed copper foil is used, the elongation value is about 20% in the case of a copper foil having a thickness of 35 μm. improves.

  In contrast, the electrolytic copper foil was electrodeposited in contact with the polished titanium drum in order to electrodeposit copper on a titanium rotating drum and peel the electrodeposited copper on the drum upper surface to obtain a copper foil. It has a shine surface as a surface and a mat surface on which copper crystals grow by electrolytic deposition. When joining resin and copper foil in this invention, it is preferable to make a mat | matte surface into a joining interface. In order to further improve the adhesive strength, fine dendrites and nodules that are fine on the mat surface may be electrodeposited. Furthermore, in order to increase the adhesive strength, zinc plating or zinc alloy plating, which has a stronger chemical bond strength with the resin than copper, is applied, and if necessary, chemical bond strength is applied by chromate treatment or silane coupling agent. Also good.

  In addition, although the thickness of the copper foil used for this invention can be suitably set as needed, since the emitted-heat amount changes with the power consumption of LED, it is desirable to use properly considering this. For example, when the power consumption of the LED light emitting device package exceeds 1 W, the thickness of the copper foil is preferably over 100 μm and 200 μm, and when the power consumption is 1 W or less, the thickness can be 18 μm to 100 μm or less. . Moreover, since the copper foil used for this invention improves adhesiveness with the insulating microfoaming resin sheet | seat of this invention, the one where the surface roughness is coarse is preferable.

  Further, as described above, the flexible substrate 13 of the present invention is used by forming a circuit on a micro-foamed resin sheet and then forming it into a cylindrical shape. In the case of using a rolled copper foil, the annealed copper foil is used to improve the elongation value and anisotropy of the copper foil, so that it can be used with improved formability and flexibility. Moreover, when the elastic repulsion force is insufficient or when the LED light emitting device package generates a small amount of heat, phosphor bronze having spring properties can be used.

  Further, the wiring circuit 15 may be formed by plating. In this case, first, the resin sheet is foamed. Next, the entire non-foamed layer on one side is removed. Thereafter, if necessary, a resist coating is applied to a portion where a circuit is not formed. Finally, a circuit is formed by plating other than the resist coating portion. The obtained flexible substrate 13 has the wiring circuit 15 on the foamed layer, and has a non-foamed layer on the surface opposite to the wiring circuit 15. As in the case of forming a circuit using copper foil, when using a plated substrate, or when using a metal frame for the frame, contact portions between the circuit and the frame, as necessary Resist processing can be performed.

  In addition, a circuit can be formed on the formed sliced surface by slicing in parallel with the surface of the microfoamed resin sheet at a substantially central portion in the thickness direction of the microfoamed resin sheet. The plating method in this case is the same as the above method. The slicing surface has a bubble diameter that is twice or more larger, has high plating adhesion, and provides a highly reflective surface on the surface of the non-foamed portion on the side opposite to the cut surface.

  In addition, since a micro foaming resin sheet does not have electroconductivity, specific plating processing performs electrolytic plating after electroless plating. Since both electroless plating and electrolytic plating may be performed by known methods, detailed description is omitted.

  As the plating layer used for circuit formation, for example, a plating layer made of copper or a copper alloy is used. As these plating layers, copper plating is preferable. The copper alloy plating is a copper alloy obtained by adding a small amount of a small amount of alloy element to copper. For example, alloy plating such as a Cu—Ni-based copper alloy such as a Cu-3% Ni alloy or a Cu—Sn-based copper alloy such as a Cu-10% Sn alloy can be performed. Although the thickness of the plating layer used for this invention can be suitably set as needed, generally a thing of 18-100 micrometers is used.

  FIG. 3 shows an example of a flexible substrate used in the present invention. A plurality of LED light emitting device packages 17 are provided at predetermined intervals on the surface of the flexible substrate 13 (the surface that is the inner peripheral side when rolled up and is the side opposite to the wiring circuit 15). That is, a plurality of LED light-emitting element packages 17 are arranged in the cylindrical circumferential direction of the side surface portion 7. For example, in the illustrated example, the LED light emitting element packages 17 are arranged at three locations along the side surface portion 7. At this time, the distance between the LED light emitting element packages 17 is P, and the distance between the LED light emitting element packages 17 on both sides and the substrate end 14 is P / 2. The LED light-emitting element packages 17 can be arranged at substantially equal intervals in the circumferential direction. The number of the LED light emitting element packages 17 may be one, but it is desirable that the number of the LED light emitting element packages 17 be plural, for example, about 2 to 8. Desirably, the number is about 3 to 6.

  FIG. 4A is a cross-sectional view taken along line D-D in part C of FIG. The LED light emitting device package 17 used in the present invention is, for example, a surface mount type (SMD) white LED light emitting device package. As shown in the figure, normally, a white LED light emitting device package has a pair of electrode terminals 29 that are an anode electrode and a cathode electrode, a frame incorporating a built-in heat dissipation plate 31 (built-in heat sink), an LED light emitting device chip 33, It is comprised by the case 28 etc. which incorporated sealing resin 25 grade | etc.,. Here, the case 28 is a container that houses the LED light emitting element chip 33, the sealing resin 25, and the like, and is an important optical component that adjusts the light emission intensity distribution of the LED light emitting element package 17. The case 28 is made of a resin or ceramic material.

  Each component is housed or placed in either the frame or the case 28. The LED light emitting element chip 33 is placed in the case 28. The LED light emitting element chip 33 is usually fixed to the case 28 with a chip adhesive. The LED light-emitting element chip 33 is sealed with a sealing resin (transparent resin) 25 in the case 28.

  The LED light emitting element chip 33 is connected (wire bonded) to one electrode terminal 29 (anode) and the other electrode terminal 29 (cathode) by a wire 27, which is typically a thin gold wire, to form a frame. Electrically connected.

  As described above, the wiring circuit 15 is formed on the back surface of the flexible substrate 13. An opening that penetrates the wiring circuit 15 is provided in a part of the flexible substrate 13 (micro-foamed resin sheet 16). The LED light emitting element package 17 is inserted from the back side of the flexible substrate 13. That is, the light emitting surface of the LED light emitting element package 17 is exposed to the surface of the flexible substrate 13 from the opening. In addition, the magnitude | size of an opening part will not be restrict | limited especially if the LED light emitting element package 17 can be accommodated in an opening part. Preferably, the size of the opening is substantially the same as that of the LED light emitting device package.

  The circuit surface of the LED light emitting device package 17 and the surface of the wiring circuit 15 exposed on the back surface side of the flexible substrate 13 are covered with a resist (not shown) as necessary. By covering with the resist, when the frame 3 is made of a metal member, the frame 3 and the wiring circuit 15 can be prevented from being short-circuited, and the wiring circuit 15 can be protected. In place of resist coating, an insulating tape may be attached.

  Here, when a resin material is used for the case 28 or the like of the LED light emitting device package 17, an LED light emitting device provided with electrodes and a built-in heat dissipation plate is formed by a transfer molding method on a number of lead frame electrodes. The housing structure of the package 17 is obtained. As the housing resin, polycarbonate resin, bismaleimide triazine resin, polyphthalamide, liquid crystal polymer, etc. having high mechanical strength and high heat resistance are used, but other resins can be used as necessary. .

  Further, as a method of sealing the LED light emitting element chip 33 with the sealing resin 25, there is a method of injecting a resin having an appropriate viscosity with a dispenser. In addition to the above, any method such as transfer molding, injection molding, printing and dipping can be selected and used in accordance with manufacturing conditions.

  Here, for example, in the case of a white LED light emitting device package, resin sealing is performed with a resin in which a phosphor is mixed with the sealing resin 25. The sealing resin 25 is required to have high light transmittance, refractive index, and light resistance in addition to adhesion and heat resistance. Epoxy resins and silicone resins are used as resins that meet such severe requirements.

  Further, a phosphor may be dispersed in the sealing resin 25. The phosphor is a crystal that absorbs light of the LED light emitting element and emits light having a longer wavelength than the absorbed light. For example, in a white LED light emitting device package, a phosphor that absorbs light of a blue LED chip and emits broad yellow light is used. For example, a phosphor can be added to the sealing resin 25 of the LED light-emitting element package 17 to adjust the color to yellow, green, blue, red, etc. to render the color.

  Alternatively, the LED light emitting device package 17 in which no phosphor is added to the sealing resin 25 can be used. In this case, a total of six LED light emitting element chips 33 each including one RGB, or two each of RGB, may be mounted, and white LED illumination may be performed by additive color mixing using the three primary colors.

  Here, the LED light emitting device package 17 and the flexible substrate 13 are connected by bringing the upper surface of the electrode terminal 29 of the LED light emitting device package 17 and the lower surface of the wiring circuit 15 into contact with each other, and in this state the wiring between the electrode terminal 29 and the flexible substrate 13 is made. This is done by connecting the circuit 15. The electrode terminal 29 and the wiring circuit 15 can be connected using a solder 35 as shown.

  4B, the lower surface of the frame portion (electrode terminal 29) of the LED light emitting device package 17 may be connected to the upper surface of the wiring circuit 15 exposed on the surface of the flexible substrate 13. Good. In this case, first, a hole is formed in the flexible substrate 13 (wiring circuit 15), and the micro foam resin sheet 16 at the edge of the hole is removed to expose the wiring circuit 15. Next, the LED light emitting element package 17 is inserted into the opening from the surface side of the flexible substrate 13, and the electrode terminal 29 and the wiring circuit 15 are connected by the solder 35.

  Examples of connection methods other than the solder 35 include conductive adhesives and nano pastes. Considering the influence on the micro-foamed resin sheet as a support, when comparing soldering with a conductive adhesive or nanopaste, a low-temperature solder or a conductive adhesive or nanopaste with a low use temperature is preferable. For example, as the conductive adhesive, a commercially available silver-epoxy adhesive is preferable.

  Although not shown, the LED light emitting element package 17 (electrode terminal 29) and the flexible substrate 13 (wiring circuit 15) may be connected by a through hole formed in the flexible substrate 13. The through hole may be penetrated through the entire thickness of the flexible substrate 13 (with the wiring circuit 15), or only the micro foam resin sheet 16 may be penetrated to expose the wiring circuit 15 in the through hole.

  In any case, first, a through hole is formed in the flexible substrate 13, and a conductor is applied to the through hole. For example, plating is formed so as to fill the entire inner surface of the through hole or the inside of the through hole, or the through hole is filled with a conductive paste or the like. Next, the electrode terminal 29 of the LED light emitting device package 17 and the wiring circuit 15 are connected by soldering to the through hole. In this case, it is necessary to provide a space immediately below the center of the LED light emitting device package 17 to cut off electrical conduction between the through holes. However, this portion may be filled with a resist.

  FIG. 5A is a cross-sectional view taken along the line AA in FIG. 2A and is a cross-sectional view perpendicular to the top surface portion 5 of the lighting device 1. The figure is a perspective view of the fixing portion 19 and illustration of wiring and the like is omitted. Further, the wiring or the like is inserted from the outside of the frame body 3 and connected to the flexible substrate 13 through a wiring hole 21 formed in the top surface portion 5, for example. The arrangement of the wiring holes 21 is not limited to the illustrated example.

  As described above, the folded portion 9 is formed at the lower end of the side surface portion 7. For this reason, the flexible substrate 13 is pressed against the frame body in addition to the elastic repulsion force of the flexible substrate 13 itself, and is supported by the folded portion 9 and does not fall off. A groove may be formed on the upper surface of the folded portion 9 and the lower end of the flexible substrate 13 may be inserted into the groove. Further, the top surface reflecting plate 11 may be fixed to the top surface portion 5 by bonding or the like, but bonding or the like is not necessarily required as long as it can be held by the upper edge portion of the flexible substrate 13.

  The LED light emitting element package 17 is disposed on the inner surface side of the side surface portion 7 of the frame body 3 and irradiates light in the direction of the central axis (F in the drawing) of the frame body 3 (the light emission direction is substantially the center of the frame body 3). Axis direction). Moreover, the flexible substrate 13 and the top surface reflector 11 are made of a micro foam resin and have a high diffuse reflectance. Therefore, the light emitted from the LED light emitting device package 17 is irradiated downward while being reflected and diffused by the inner surface of the flexible substrate 13 and the lower surface of the top surface reflecting plate 11.

  That is, in the lighting device 1, the light from the LED light emitting element package 17 is not directly irradiated downward, but is diffused and reflected downward on the inner surface of the lighting device 1. For this reason, light can be uniformly diffused downward and irradiated without using a lens or the like. As a result, it is possible to produce an indirect illumination effect that is soft and calm, with no uneven illumination or shadows.

  The heat generated in the LED light emitting device package 17 is mainly conducted along the wiring circuit 15 of the flexible substrate 13 and is radiated. For example, as shown in FIG. 3, the heat dissipation characteristics can be improved by forming the wiring circuit 15 in a folded shape.

  The LED light emitting element package 17 is disposed on the inner surface side of the side surface portion 7 of the frame 3. That is, the LED light emitting device packages 17 are arranged at a predetermined interval in the circumferential direction. For this reason, compared with the case where the LED light emitting element package 17 is arrange | positioned in the top | upper surface part 5, the space | interval of adjacent LED light emitting element packages 17 can be lengthened.

  For example, when the LED light emitting device package 17 is arranged on the top surface portion 5, the LED light emitting device packages 17 can be separated as much as possible by arranging the LED light emitting device package 17 near the edge of the top surface portion 5. is there. However, even in this case, the heat generated in each LED light emitting device package 17 is linearly conducted to the top surface portion between them.

  On the other hand, if the LED light emitting device package 17 is disposed on the side surface portion 7, not only can the linear distance between the LED light emitting device packages 17 be separated, but heat is transmitted along the arc-shaped side surface portion 7. For this reason, if the LED light emitting element package 17 is arranged on the side surface portion 7, the heat conduction distance of the heat generated in each LED light emitting element package 17 can be increased. As a result, the heat influence between the LED light emitting element packages 17 can be reduced, and the heat dissipation characteristics can be improved.

  A hole 6 is formed in the top surface portion 5. Although the hole 6 is blocked by the top surface reflecting plate 11, by forming the hole 6, the heat inside the frame 3 can be efficiently radiated to the outside. That is, the hole 6 functions as a heat radiating part.

  In addition, the hole 6 of the top surface part 5 is not necessarily required. For example, the top surface portion 5 that does not have the hole 6 can be used as in the lighting device 1a illustrated in FIG. In this case, for example, the control circuit 23 of the LED light emitting element package 17 and the like can be disposed on the top surface of the top surface portion 5.

  As described above, according to the present embodiment, since the flexible substrate 13 having flexibility and elastic repulsion is used, when the flexible substrate 13 rolled into a cylindrical shape is inserted into the frame body 3. And it can be arranged so as to be pressed so as to cover the inner surface of the side surface portion 7 by its own shape restoring force. Therefore, the assembly workability is good. Moreover, since the wiring circuit 15 is integrally formed on the back surface of the flexible substrate 13, the number of components is small, and the front surface of the flexible substrate can function as a reflector.

  Moreover, the LED light emitting element package 17 is arrange | positioned at the inner surface side of the side part 7, The heat conduction distance between LED light emitting element packages 17 can be lengthened, and heat dissipation is favorable. Further, since the LED light emitting element package 17 cannot be seen from below, the light source is not easily noticeable.

  Further, since the LED light emitting element package 17 is disposed on the inner surface side of the side surface portion 7 and the flexible substrate 13 and the top surface reflection plate 11 are made of micro foamed resin, light can be diffusely reflected with high reflectivity. . For this reason, light can be spread over a wide range using diffuse reflection of the inner peripheral surface and the top surface. At this time, since the reflected light is used, for example, even when applied to a downlight, a soft and calm indirect lighting effect can be obtained.

  Moreover, when the flexible substrate 13 expands and contracts due to heat, the light irradiation direction of the LED light emitting device package 17 may change. However, in the present invention, since the light from the LED light emitting element package 17 is diffusely reflected and irradiated downward, this influence is small, and changes in the light irradiation range and illuminance can be suppressed.

  Next, a second embodiment will be described. Fig.6 (a) is sectional drawing of the illuminating device 1b. In addition, in the following description, about the structure which show | plays the same function as the illuminating device 1 grade | etc., The code | symbol same as FIGS. 1-5 (a) is attached | subjected, and an overlapping description is saved. The lighting device 1b has substantially the same configuration as the lighting device 1, but differs in that a light diffusing plate 37 and the like are provided.

  A light diffusing plate 37 is provided at the opening facing the top surface part 5 of the frame 3 so as to close the opening. The light diffusing plate 37 is fixed to the lower end of the side surface portion 7 of the frame 3 by a cap 39. The cap 39 may be fixed by, for example, protruding a part of the lower end of the side surface portion 7 outward and engaging with a claw portion formed toward the inside of the cap 39. The light diffusing plate 37 is made of, for example, light transmissive glass or resin.

  The light diffusion plate 37 diffuses light when light is transmitted. For this reason, by using the light diffusing plate 37, the light irradiated from the LED light emitting element package 17 and diffusely reflected by the flexible substrate 13 and the top surface reflecting plate 11 can be further diffused.

  Even in this case, as shown in FIG. 6B, the lighting device 1c in which the hole 6 is not formed in the top surface portion 5 can be obtained.

  According to the second embodiment, an effect similar to that of the first embodiment can be obtained. Further, the light diffusing plate 37 can diffuse light more reliably and spread the light over a wide range.

  Next, a third embodiment will be described. Fig.7 (a) is sectional drawing of the illuminating device 1d. The lighting device 1d is substantially the same as the lighting device 1b, but the form of the flexible substrate 13a is different.

  The flexible substrate 13a of the lighting device 1d has a diameter that increases from the lower end toward the top surface portion 5 in a cross section perpendicular to the top surface portion 5. That is, the flexible substrate 13 a is formed not to be perpendicular to the top surface portion 5 but to have an acute angle. The side surface portion 7 is formed substantially perpendicular to the top surface portion 5. Therefore, the flexible substrate 13 a comes into contact with at least a part of the inner peripheral surface of the side surface portion 7. Moreover, as a form of the flexible substrate 13a, it may not be a linear inverted truncated cone shape as illustrated. For example, the shape of the flexible substrate 13a may be formed as a curved surface (dish shape) that swells outward.

  FIG. 8 is a development view of the flexible substrate 13a when the flexible substrate 13a is arranged in an inverted truncated cone shape on the frame. As shown in the drawing, in order to form an inclined surface on the flexible substrate 13a, the flexible substrate 13a has a shape in which a part of the annular ring of the annular member is cut. Even in this case, it can be easily inserted into the frame body 3 by rounding so that the substrate end portions 14 which are the circumferential end portions of the flexible substrate 13a face each other.

  Even in this case, as shown in FIG. 7B, the lighting device 1e in which the hole 6 is not formed in the top surface portion 5 can be obtained. Also in this case, the flexible substrate 13a can be inscribed in a circle by the elastic repulsive force of the flexible substrate 13a at the corner portion where the top surface portion 5 and the side surface portion 7 of the frame 3 are connected. As the entire flexible substrate, an inverted frustoconical peripheral surface can be formed.

  In the illuminating devices 1d and 1e, the LED light emitting element package 17 is disposed slightly upward according to the shape of the flexible substrate 13a. That is, the light from the LED light emitting element package 17 is emitted toward the top surface 5 slightly according to the angle of the flexible substrate 13a. For this reason, the light from the LED light-emitting element package 17 does not leak directly downward, and the light can be diffused and reflected by the top surface reflector 11 and irradiated downward.

  According to the third embodiment, the same effect as that of the first embodiment can be obtained. Moreover, the light from the LED light emitting element package 17 can be more reliably spread over a wide range.

  Here, in the third embodiment, since the side surface of the frame body is formed in a cylindrical shape, the flexible substrate 13a is arranged in an inverted truncated cone shape on the frame body. It may be arranged in a corresponding inverted cone shape. When the frame is formed in an elliptic cylinder shape or an oval shape, the flexible substrate 13a is formed in an inverted elliptic frustum shape or an inverted long truncated cone shape, and the frame shape is a rectangular column shape, When formed in a polygonal column shape, the flexible substrate 13a can be formed in an inverted rectangular frustum shape or an inverted polygon frustum shape. By forming the flexible substrate in this manner, the flexible substrate can be formed in a shape that expands in diameter toward the top surface on a surface perpendicular to the top surface portion.

  Next, a fourth embodiment will be described. 9 is an exploded perspective view showing the lighting device 1f, FIG. 10 is a bottom view (perspective view of the folded portion 9 and the lower reflector 41), and FIG. 11 (a) is a cross-sectional view taken along line EE of FIG. FIG. The lighting device 1 f is substantially the same as the lighting device 1, but is different in that the lower surface reflection plate 41 is provided and the top surface reflection plate 11 a has a protrusion 43.

  The illuminating device 1 f is provided with a lower surface reflecting plate 41 below the side surface portion 7. That is, the lower surface reflection plate 41 is disposed so as to face each other with the flexible substrate 13 (LED light emitting element package 17) interposed therebetween. In addition, the lower surface reflecting plate 41 is formed from a micro foam resin sheet, for example, similarly to the top surface reflecting plate 11a and the flexible substrate 13.

  The top surface reflection plate 11a and the bottom surface reflection plate 41 are substantially annular members having a hole formed in the center, and are supported by, for example, the turn-back portion 9. Therefore, the lower surface reflection plate 41 protrudes from the side surface portion 7 side toward the central axis (F in the drawing) of the frame body 3.

  The lower surface reflection plate 41 reflects a part of the light emitted from the LED light emitting device package 17 to the top surface reflection plate 11a side. In other words, the lower reflector 41 suppresses light that is directly irradiated downward from the LED light emitting device package 17. Details of the effect of the lower reflector 41 will be described later.

  Next, the protrusion 43 will be described. A projecting portion 43 that projects downward is formed on the lower surface of the top surface reflecting plate 11a. The protrusions 43 are formed radially from the approximate center of the top surface reflecting plate 11a in the radial direction (toward the outer periphery of the cylindrical shape). Moreover, the front-end | tip of the direction which goes to an outer periphery from the radial center of the protrusion part 43 is arrange | positioned between LED light emitting element packages 17. FIG.

  Further, the width of the protrusion 43 gradually decreases from the center of the protrusion 43 (substantially the center and base of the top surface reflector 11a) toward the tip of the protrusion 43. That is, as shown in the figure, when the LED light emitting element packages 17 are arranged at five positions at equal intervals in the circumferential direction, the protrusions 43 substantially extend radially toward the middle portion of the LED light emitting element packages 17 in the circumferential direction. It becomes a star shape.

  The height of the protrusion 43 gradually decreases from the center of the protrusion 43 toward the tip. That is, when a line connecting the approximate center (base) of the protrusion 43 to the tip is a ridge line, the height of the ridge line decreases from the center of the protrusion 43 toward the tip. In the illustrated example, the inclined surfaces formed on both sides of the ridge line are formed at a substantially constant angle from the approximate center to the tip of the protrusion 43, but the inclined surface may be a curved surface.

  The protruding portion 43 directs reflected light downward of the lighting device by the reflecting surface formed by the protruding portion 43 when a part of the light emitted from the LED light emitting element package 17 is reflected by the top surface reflecting plate 11a. Are reflected. The effect of the protrusion 43 will be described later in detail.

  Even in the case where the lower reflector 41 and the protrusion 43 are provided as described above, the top surface portion may be formed with a hole 6 in 5 as shown in FIG. ), A lighting device 1g that does not form the hole 6 in the top surface portion 5 may be adopted.

  Moreover, in this invention, the lower surface reflecting plate 41 and the protrusion part 43 can also be combined with other embodiment. For example, FIG. 12A is a cross-sectional view showing the lighting device 1h. The illuminating device 1h is substantially the same as the illuminating device 1e, but differs in that a lower surface reflection plate 41 is provided. Thus, also when the flexible substrate 13a has an inverted truncated cone shape, it can be combined with the lower surface reflecting plate 41, and the same effect can be obtained.

  Even in this case, as shown in FIG. 12B, an illumination device 1 i that does not form the hole 6 in the top surface portion 5 may be employed.

  Moreover, Fig.13 (a) is sectional drawing which shows the illuminating device 1j. The illuminating device 1j is substantially the same as the illuminating device 1e, but differs in that a protrusion 43 is provided. Thus, also when the flexible substrate 13a has an inverted truncated cone shape, it can be combined with the protrusion 43, and the same effect can be obtained.

  Even in this case, as shown in FIG. 13B, a lighting device 1k that does not form the hole 6 in the top surface portion 5 may be employed.

  As described above, in the present invention, the lower reflector 41 and the protrusion 43 can be combined with various embodiments, and the lower reflector 41 or the protrusion 43 may be used alone, or both may be used in combination. May be.

  Next, the effect of the lower reflector 41 will be described. FIG. 14A is a cross-sectional view showing the lighting device 1e not provided with the lower surface reflection plate 41, and FIG. 14B is a cross-sectional view showing the lighting device 1i provided with the lower surface reflection plate 41. That is, the illumination device 1e and the illumination device 1i differ only in the presence or absence of the lower surface reflector 41.

  As shown to Fig.14 (a), in the illuminating device 1e which does not provide the lower surface reflecting plate 41, the light irradiated below from the LED light emitting element package 17 passes directly through the light diffusing plate 37 of the illuminating device 1e. Irradiate downward (arrow L in the figure). That is, the irradiation part of the LED light emitting element package 17 can be directly seen from below the lighting device 1e.

  On the other hand, as shown in FIG. 14B, in the lighting device 1 i provided with the lower surface reflector 41, a part of the light emitted downward from the LED light emitting element package 17 is reflected on the upper surface side of the lower surface reflector 41. Then, after being re-reflected by the top surface reflecting plate 11, it is irradiated below the lighting device 1i via the light diffusion plate 37 (arrow M in the figure). That is, the range in which the irradiation part of the LED light emitting device package 17 can be directly seen from the lower side of the lighting device 1i is narrowed.

  Thus, the glare characteristic of an illuminating device can be relieve | moderated by making the lower surface reflecting plate 41 protrude from the side part 7, and making the LED light emitting element package 17 difficult to see directly from the downward direction. In addition, since the reflectance of the flexible substrate 13 and the top surface reflection plate 11a installed in the lighting device 1f is sufficiently high, even if the number of reflections in the lighting device 1f increases, the illuminance of the lighting device 1f is There is almost no decline.

  As described above, in order to alleviate the glare of the lighting device, it is desirable to reduce the area where the light emitting part of the LED light emitting element package 17 can be directly seen from below the lighting device.

  Here, the luminance distribution of the LED light-emitting element package 17 which is a point-like surface light source has a luminance of ± 70 ° when the luminance in the light-emitting surface normal direction is 1 with respect to the light-emitting surface normal of the LED light-emitting element package. Is about 0.34 times, and the brightness at ± 80 ° is about 0.17 times, and when the angle formed with the normal surface of the light emitting surface becomes large, it decreases extremely. That is, since the luminance in the direction exceeding 80 ° is very low, the protruding length from the side surface portion 7 of the lower reflector 41 is a straight line of ± 80 ° with respect to the light emitting surface normal of the LED light emitting device package 17. It is desirable that the length be at least about the length at which the lower reflector 41 intersects. If the lower surface reflection plate 41 is arranged in this way, light directly irradiated from the LED light emitting element package 17 that is a light source without passing through the lower surface reflection plate 41 can be reduced. As a result, the glare associated with the directivity of the LED light emitting device package 17 can be reduced, and an indirect illumination effect can be more reliably generated.

  As shown in the drawing, the protruding length of the lower reflector 41 is not limited to the inverted frustoconical shape but the lighting device 1 or the like having the substantially cylindrical flexible substrate 13 has an LED projection length of LED. It is desirable that the length of the light-emitting element package 17 be at least as long as it intersects with a straight line of about ± 80 ° with respect to the normal surface of the light-emitting surface.

  Here, by increasing the angle α formed between the side surface portion 7 and the flexible substrate 13a on which the LED light emitting device package 17 is arranged, the light directly irradiated downward from the LED light emitting device package 17 is reduced, and the top surface portion. The reflected light at the reflecting plate 11 can be increased. However, if the angle α is too large, the opening area below the lighting device 1f becomes small, so that it is necessary to set the angle α to about 45 ° at the maximum. However, it is necessary to consider both the effect on the opening size and the efficiency of reflection on the top plate reflector, and the reflection between the bottom reflector and the top reflector also takes into account the thickness of the lighting device. However, the angle α is preferably 0 to 30 °, and more preferably about 10 to 30 °.

  On the other hand, by providing the lower surface reflecting plate 41, the light from the LED light emitting element package 17 can be reflected to the lower surface reflecting plate 41 even if the angle α is reduced. That is, the light from the LED light emitting element package 17 can be efficiently reflected by the top surface reflector 11. For this reason, even if the angle α is reduced, the light directly irradiated downward from the LED light emitting element package 17 can be reduced, and the opening area under the illumination device 1f can be increased.

  Next, the effect of the protrusion 43 will be described. FIG. 15A is a cross-sectional view showing the lighting device 1e not provided with the protrusion 43, and FIG. 15B is a cross-sectional view showing the lighting device 1k provided with the protrusion 43. That is, the illumination device 1e and the illumination device 1k differ only in the presence or absence of the protrusion 43.

  As shown in FIG. 15A, when the protrusion 43 is not formed, most of the light emitted from the LED light emitting element package 17 and reflected by the top reflector 11a is near the center of the lighting device 1f. Irradiation is performed in the direction of the opposing flexible substrate 13 without being irradiated downward (arrow N in the figure). For this reason, the illuminance may be uneven between the vicinity of the center of the lighting device 1f and the periphery.

  On the other hand, as shown in FIG. 15B, when the protruding portion 43 is formed, the protruding portion 43 can more absorb light from the LED light emitting device package 17 than the case where the protruding portion 43 is not provided. Reflected downward (arrow O in the figure). That is, by providing the protrusion 43, the reflection toward the flexible substrate 13 facing away from the LED light emitting element package 17 is reduced, and the reflection area of the light from the LED light emitting element package 17 is prevented from being enlarged, so that the illumination is performed. A lot of light can be collected in the center of the device. This makes it possible to reduce variations in brightness between the central portion of the lighting device 1f and the vicinity of the LED light-emitting element package 17, and illumination with a uniform brightness can be achieved as compared with the case where the protruding portion 43 is not provided in the central portion. Can be obtained.

  Thus, since the protrusion 43 can reduce the difference in luminance between the vicinity of the LED light emitting element package 17 and the center of the lighting device 1f, not only the brightness uniformity of the lighting device 1f is maintained, but also the glare property. It also has an improvement effect.

  According to the fourth embodiment, the same effect as that of the first embodiment can be obtained. Moreover, the glare feeling accompanying the directivity of the LED light emitting element package 17 can be relieved by the lower surface reflecting plate 41, and an indirect illumination effect can be more reliably produced. Moreover, since the difference in luminance between the vicinity of the LED light emitting element package 17 and the vicinity of the center of the lighting device can be reduced by the protrusion 43, the brightness uniformity of the lighting device can be maintained.

  Next, a fifth embodiment will be described. FIG. 16 is an exploded perspective view showing the lighting device 1m, and FIG. 17 is an assembled sectional view. The lighting device 1m is substantially the same as the lighting device 1, but differs in that the frame 3 and the like are formed in a substantially rectangular shape.

  The frame 3 has a rectangular parallelepiped shape as illustrated, for example, and includes a top surface portion 5 and four side surface portions connected to the top surface portion 5. It is desirable that a folded portion 9 is formed at the lower end of the side portion 7 on the long side and the lower end of the side portion 7 on the short side. The folded portion 9 may not be formed on the lower end of the side surface portion 7 on the short piece side.

  The flexible substrate 13 c has a substantially rectangular shape corresponding to the shape of the frame body 3. The flexible substrate 13c is formed from a microfoamed resin sheet. Here, in the flexible substrate 13c, the top surface reflection plate 11c and the lower surface reflection plate 41c are integrally formed. That is, the flexible substrate 13c is formed by bending a single micro-foamed resin sheet. For this reason, the top | upper surface part reflecting plate 11c and the lower surface reflecting plate 41c are also formed of a micro foaming resin sheet.

  The LED light emitting device package 17 is disposed on each of the opposing side portions of the flexible substrate 13c. The plurality of LED light emitting device packages 17 are arranged at substantially equal intervals along the longitudinal direction. The connection method between the LED light-emitting element package 17 and the wiring circuit 15 is as described above.

  The top surface reflecting plate 11c is continuous with the upper end of the side surface portion (arrangement surface of the LED light emitting device package 17) on the flexible substrate 13c where the LED light emitting device package 17 is disposed. Further, a lower surface reflection plate 41c is continuous with the lower end of the arrangement surface of the LED light emitting device package 17 so as to face the top surface reflection plate 11c. That is, the lower surface reflection plate 41c is arranged at a position facing the top surface reflection plate 11c with respect to the LED light emitting device package, and the arrangement surface of the LED light emitting device package 17 includes the top surface reflection plate 11c and the lower surface reflection plate 41c. Link. In addition, you may form integrally the side surface orthogonal to the arrangement | positioning surface of the LED light emitting element package 17. FIG.

  When the flexible substrate 13 c is inserted into the frame 3, the top surface reflecting plate 11 c is arranged so as to cover the top surface 5 of the frame 3. Further, a part of the rear surface side of the LED light emitting element package 17 (flexible substrate 13 c) abuts at least a part of the inner peripheral surface of the side surface portion 7 of the frame 3. Further, the light emitting surfaces of the LED light emitting element packages 17 are arranged on the inner surface sides of the side surface portions 7 facing each other of the frame body 3.

  Both side surface portions of the flexible substrate 13c on which the LED light emitting element package 17 is arranged are formed to be inclined so as to spread upward (to the top surface reflecting plate 11c side). In other words, the LED light emitting device package 17 irradiates light slightly vertically upward substantially perpendicular to the arrangement surface of the opposing LED light emitting device package 17.

  A light diffusing plate 37 is provided on the lower surface of the frame 3. As described above, the light diffusing plate 37 is fixed by a cap or the like (not shown). However, the light diffusing plate 37 may be configured to be locked by a folded portion.

  As shown in FIG. 17, in the lighting device 1m, a part of the light irradiated downward from the LED light emitting element package 17 is reflected on the upper surface side of the lower surface reflecting plate 41c and re-reflected by the top surface reflecting plate 11c. Thereafter, the light is irradiated below the lighting device 1 m through the light diffusion plate 37. That is, the range in which the irradiation part of the LED light emitting device package 17 can be directly seen from the lower side of the lighting device 1m can be narrowed.

  Moreover, the protrusion part mentioned above can also be combined with this embodiment. For example, FIG. 18A is a cross-sectional view of the lighting device 1n and corresponds to FIG. FIG. 18B is a cross-sectional view taken along the line Q-Q in FIG. 18A in a direction parallel to the top surface. The illuminating device 1n is substantially the same as the illuminating device 1m, but differs in that a protrusion 43a is provided on the lower surface of the top surface reflecting plate 11c.

  A protrusion 43a that protrudes downward is formed on the lower surface of the top surface reflecting plate 11a. The protrusion 43a is formed continuously in the longitudinal direction along the center line on the short side of the top surface reflecting plate 11a. Further, it is formed between the respective LED light emitting element packages 17 from the short side center toward the short side end direction (long side direction) with respect to the direction perpendicular to the longitudinal direction of the top surface reflecting plate 11a. Is done. That is, the tip in the short side direction of the protruding portion 43a is disposed between the LED light emitting device packages 17.

  As shown in the figure, the protrusion 43a formed in the direction perpendicular to the longitudinal direction of the top surface reflecting plate 11a and from the short side center toward the short side end direction (long side direction) is provided. In addition to the arrangement between the LED light emitting element packages 17, the outer side longer side than the outermost LED light emitting element package 17 arranged on the flexible substrate 13 c in the long side direction of the top surface reflector 11 a. The protrusion 43a can also be arranged near the end (near the short side).

  By arranging in this way, the LED light emitting device packages 17 arranged in a line on the flexible substrate 13c are arranged so that the LED light emitting device packages 17 are surrounded by the protruding portions 43a at any position. be able to. By arranging the protrusions 43a in this way, the difference in brightness in the long side direction can be reduced.

  In addition, since the light which got over the protrusion part 43a without reflecting with the protrusion part 43a formed in the both ends of the long side direction of the top | upper surface part reflection plate 11a does not return to the light irradiation direction from illumination, this part is Conversely, it may be dark. On the other hand, in the long side direction of the top surface reflecting plate 11a, the portion on the end side from the center of the projecting portion 43a parallel to the short side arranged at both ends in the longitudinal direction of the top surface reflecting plate 11a is blocked. Such a problem can be solved by forming the lower reflectors 41c at both ends.

  The protrusion 43a is provided in the vicinity of the end of the long side (near the short side) near the outermost LED light emitting device package 17 arranged on the flexible substrate 13c in the long side direction of the top surface reflector 11a. When not arranged, whether to form the lower reflector on the short side can be selected as appropriate depending on the design.

  The width of the protrusion 43a with respect to the direction perpendicular to the longitudinal direction of the top surface reflector 11a is such that the center of the protrusion 43a (substantially the center in the short side direction of the top surface reflector 11c) and the tip of the protrusion 43a (top surface reflection). It gradually becomes narrower toward the end of the short side of the plate 11c.

  The height of the protrusion 43a gradually increases from the center of the protrusion 43a (substantially the center in the short side direction of the top surface reflector 11c) toward the tip (in the direction of the edge of the short side of the top surface reflector 11c). Lower. That is, when a line connecting the approximate center of the protrusion 43a to the tip is a ridge line, the height of the ridge line decreases from the center of the protrusion 43a toward the tip.

  As described above, the protrusion 43a illuminates the reflected light by the reflection surface formed by the protrusion 43a when a part of the light emitted from the LED light emitting element package 17 is reflected by the top surface reflector 11c. It reflects towards the bottom of the device. Therefore, the difference in luminance between the vicinity of the LED light emitting element package 17 and the vicinity of the center of the lighting device 1n can be reduced by the protrusion 43c.

  According to the fifth embodiment, the same effects as those of the first embodiment can be obtained. Thus, the flexible substrate of the present invention can be a three-dimensional (three-dimensional) illumination substrate, and can be applied regardless of the shape of the frame 3. Even in this case, the protrusion 43a can be combined. In the fifth embodiment, the hole 6 may be formed in the top surface portion 5 of the frame 3.

  Next, a sixth embodiment will be described. FIG. 19 is a cross-sectional view of the lighting device 1p and corresponds to FIG. The illumination device 1p is substantially the same as the illumination device 1m, but differs in that the LED light emitting element package 17 is formed only on one side surface. Here, the side surface on which the LED light emitting device package 17 is formed is desirably a long side surface.

  In the illumination device 1p, the LED light emitting element package 17 is disposed only on the inner surface side of one side surface portion 7 of the side surface portions 7 of the frame body 3 facing each other. That is, in the flexible substrate 13 d, only one side surface on the long side becomes the arrangement surface of the LED light emitting element package 17.

  For example, the LED light emitting element package 17 is not disposed on the inner surface side of the other side surface portion 7 facing the arrangement surface of the LED light emitting element package 17 among the long side surface portions 7 facing each other of the frame 3. It curves gently downwards. A lower surface reflection plate 41c is provided below the arrangement surface of the LED light emitting device package 17. On the other hand, the lower reflector 41c is not formed below the curved surface.

  In the illuminating device 1p, a part of the light irradiated downward from the LED light emitting element package 17 is reflected on the upper surface side of the lower surface reflecting plate 41c, re-reflected by the top surface reflecting plate 11c, and then passed through the light diffusion plate 37. Through the illumination device 1p. For this reason, the range which can see the irradiation part of LED light emitting element package 17 directly from the downward direction of the illuminating device 1p can be narrowed.

  On the other hand, in the lighting device 1p, a part of the light irradiated from the LED light emitting element package 17 toward the facing surface is reflected by the curved portion of the flexible substrate 13d, and the light of the lighting device 1p is reflected via the light diffusion plate 37. Irradiated downward. For this reason, the difference in luminance between the vicinity of the LED light-emitting element package 17 and the vicinity of the side surface facing the LED light-emitting element package 17 can be reduced.

  According to the sixth embodiment, the same effect as in the fifth embodiment can be obtained. Moreover, when the width | variety (width | variety of a short side) of an illuminating device is small, by arrange | positioning the LED light emitting element package 17 only on one side surface, while ensuring uniform brightness, the LED light emitting element package 17 of The number of uses can be reduced. In the sixth embodiment, the hole 6 may be formed in the top surface portion 5 of the frame 3.

  As mentioned above, although embodiment of this invention was described referring an accompanying drawing, the technical scope of this invention is not influenced by embodiment mentioned above. It is obvious for those skilled in the art that various modifications or modifications can be conceived within the scope of the technical idea described in the claims, and these are naturally within the technical scope of the present invention. It is understood that it belongs.

  For example, although the example which formed the wiring circuit 15 directly in the micro foaming resin sheet was shown as the flexible substrate 13, this invention is not limited to this. Instead of the wiring circuit 15, a flexible printed circuit may be used, and a reflective member such as a microfoamed resin sheet or a film may be joined and integrated on the surface of the flexible printed circuit. Furthermore, various shapes other than a substantially cylindrical shape can be applied to the frame 3, and the effect of the present invention can be obtained even if it is a long cylindrical shape, a rectangular cylindrical shape, a regular polygonal shape, or the like.

  20A is a plan view showing an example in which a flexible printed circuit 45 is used as the flexible substrate 13b, and FIG. 20B is a bottom view. The flexible substrate 13b is a member in which a flexible printed circuit 45 and a reflection plate 44 are laminated. The reflection plate 44 is formed of a micro foam resin sheet, for example, similarly to the top surface reflection plate 11 and the flexible substrate 13. The reflecting plate 44 is provided on the front side of the flexible substrate 13b (the light emitting surface side of the LED light emitting element package 17).

  The flexible printed circuit 45 has a shape in which a circuit conductor (for example, a circuit formed of copper foil or a circuit) is laminated with a resin (for example, PET, polyimide, or polyethylene naphthalate). At least a pair of circuit conductors are formed inside the flexible printed circuit 45 cut to a predetermined length, and a conductor member 46 for conducting these circuit conductors is provided near the end of the flexible printed circuit 45. Provided. The conductor member 46 is electrically connected to an internal circuit conductor, for example, in the same manner as the method for fixing the LED light emitting device package 17 described later. That is, the wiring circuit 15 is formed by the circuit conductor and the conductor member 46.

  FIG.20 (c) is the GG sectional view taken on the line H of Fig.20 (a). When the flexible printed circuit 45 is used, a plurality of locking claws 47 are formed on the electrode terminal 29 of the LED light emitting device package 17. By passing the locking claw 47 from the surface of the flexible substrate 13b (flexible printed circuit 45) to the internal wiring circuit 15, the internal wiring circuit 15 and the electrode terminal 29 can be made conductive.

  The locking claw 47 is bent on the back side of the flexible substrate 13b (flexible printed circuit 45). Thereby, the LED light emitting element package 17 can be fixed to the flexible substrate 13b (flexible printed circuit 45). Even in this case, a hole or the like may be formed in the lower portion of the LED light emitting device package 17 so that the circuit conductor between the pair of electrode terminals 29 is not conducted.

  In addition, when using FPC which carried out resin coating only on the single side | surface of the circuit conductor (wiring circuit 15) instead of the flexible printed circuit 45, the LED light emitting element package 17 is soldered to the exposed wiring circuit 15, etc. The wiring circuit 15 may be connected and a resist may be applied to a part of the wiring circuit 15 as necessary, or an insulating hole may be formed.

  In the case where the reflector 44 is bonded to the surface of the flexible printed circuit 45, if it is difficult to obtain a sufficient elastic repulsion force, a reinforcing member such as an insulating resin may be bonded separately. An elastic repulsion force can be applied by giving the flexible substrate 13b rigidity sufficient to ensure flexibility by the reinforcing member.

  Further, as the LED light emitting element package 17, a flip chip type can also be used. In the case of the flip chip type, the LED light emitting element package 17 can be directly mounted on the wiring circuit 15 on the substrate, and thus the size can be reduced.

  In this case, as shown in FIG. 4B, a part of the micro-foamed resin layer of the flexible substrate 13 is removed, and the wiring circuit 15 is exposed on the upper surface of the flexible substrate 13, so that the wiring circuit The LED light emitting device package 17 is disposed on the surface 15. In this state, the LED light emitting device package 17 (or the LED light emitting device chip) can be directly mounted by being connected to the anode and cathode electrodes and the wiring circuit 15 by soldering. In this case, the mounting area can be reduced because the solder connection portion of the LED light emitting element package 17 (or the LED light emitting element chip) comes directly under the element.

1, 1a, 1b, 1c, 1d, 1e, 1f, 1g, 1h, 1i, 1j, 1k, 1m, 1n, 1p ......... lighting device 3 ......... frame 5 ......... top surface portion 6 ......... Hole 7 ......... Side part 9 ... Folded parts 11, 11a, 11c ......... Top reflector 13, 13, 13b, 13c, 13d ...... Flexible substrate 14 ... Substrate end 15 ... …… Wiring circuit 16 ………… Micro foaming resin sheet 17 …… LED light emitting element package 19 ...... …… Fixing portion 21 ………… Wiring hole 23 ………… Control circuit 25 ………… Sealing resin 27 ………… Wire 28 ......... Case 29 ......... Electrode terminal 31 ......... Heat dissipation plate 33 ......... LED light emitting element chip 35 ......... Solder 37 ......... Light diffusion plate 39 ......... Caps 41, 41c ......... Lower surface reflection Plates 43, 43a, 43c ......... Projection 44 ......... Reflector 45 ...... Flexible Bull printed circuit 46 ......... conductive member 47 ......... locking claw

Claims (16)

A frame body comprising a top surface portion and a cylindrical side surface portion connected to the top surface portion and enclosing the outer periphery of the top surface;
A flexible substrate having an elastic repulsion force, in which a wiring circuit is integrally arranged on the back surface of a reflector made of a micro foam resin;
A top-surface reflector made of micro-foamed resin, which is disposed so as to cover the bottom surface of the top-surface portion;
An LED light emitting device package disposed on the flexible substrate;
Comprising
The flexible substrate is disposed so as to cover an inner peripheral surface of the side surface portion of the frame body or to be in contact with at least a part of an inner peripheral surface of the side surface portion of the frame body, and the LED light emitting device package The LED light emitting device package is disposed so that the light emitting direction is substantially in the direction of the central axis of the frame,
A plurality of the LED light emitting element packages are arranged in the circumferential direction of the cylindrical shape of the side surface portion of the frame,
A protrusion is provided on the lower surface of the top surface reflector,
The protrusions are formed radially from a substantially center of the top surface reflector to a cylindrical outer periphery, and a tip in a direction from the center of the protrusion toward the outer periphery is disposed between the LED light emitting element packages. And
The width of the projecting portion becomes narrower from the approximate center of the projecting portion toward the tip, and the height of the projecting portion is a line connecting the approximate center to the tip of the projecting portion as a ridge line. A lighting device characterized by being lowered from a substantial center toward a tip.   The lighting device according to claim 1, wherein an annular lower surface reflector having a hole in the center is provided at a position facing the top surface reflector with respect to the LED light emitting device package.   3. The lighting device according to claim 1, wherein the flexible substrate is formed so as to expand in diameter toward the top surface portion in a cross section perpendicular to the surface of the top surface portion.   The fixing portion is provided on the inner surface side of the side surface portion of the frame body, and the circumferential end of the flexible substrate is connected and fixed by the fixing portion. 4. The illumination device according to any one of 3.   The folded part is provided in the lower end part of the side part of the frame, and the lower end part of the flexible substrate is supported by the folded part. The lighting device described.   The lighting device according to any one of claims 1 to 5, wherein a plurality of the LED light emitting element packages are arranged at substantially equal intervals along the side surface portion of the frame body. A substantially rectangular frame comprising a top surface portion and a side surface portion connected to the top surface portion;
A flexible substrate having an elastic repulsion force, in which a wiring circuit is integrally arranged on the back surface of a reflector made of a micro foam resin;
An LED light emitting device package disposed on the flexible substrate;
A top-surface reflecting plate made of a micro-foamed resin that covers the bottom surface of the top-surface portion;
A lower reflector disposed at a position facing the top reflector with respect to the LED light emitting device package;
Comprising
The flexible substrate is disposed so as to contact at least a part of the inner peripheral surface of the side surface portion of the frame body, and a surface of the flexible substrate on which the LED light emitting device package is mounted is the ceiling. Inclined to spread in the direction of the surface,
A plurality of the LED light emitting device packages are arranged in the longitudinal direction of the side surface portion of the frame,
A protrusion is provided on the lower surface of the top surface reflector,
The projecting portion is formed continuously at substantially the center in the longitudinal direction of the top surface reflector, and at least from the short side center to the short side end in the direction perpendicular to the longitudinal direction of the top surface reflector. Formed between the LED light emitting device packages in the direction of the part,
The width of the projecting portion becomes narrower from the base of the projecting portion toward the tip with respect to the direction perpendicular to the longitudinal direction of the top surface reflecting plate, and the height of the projecting portion is the height of the top surface reflecting plate. An illumination device characterized in that a line connecting from the base portion to the tip end of the projecting portion is a ridge line with respect to a direction perpendicular to the longitudinal direction, and becomes lower from the approximate center of the projecting portion toward the tip end. The lighting device according to claim 7, wherein light emitting surfaces of the LED light emitting element packages are respectively disposed on the side surfaces of the frame that face each other. The lighting device according to claim 7 or 8 , wherein a light diffusing plate made of glass or resin having light permeability is fixed to an opening portion facing the top surface portion of the frame body. The lighting device according to any one of claims 7 to 9 , wherein the flexible substrate is obtained by forming the wiring circuit with a copper foil on a back surface of a micro-foamed resin sheet. The electrical connection between the LED light emitting device package and the wiring circuit formed on the back surface of the flexible substrate is made through a through hole or an opening provided in the side surface reflector made of the micro foam resin . The lighting device according to any one of claims 7 to 10 . The lighting device according to any one of claims 7 to 11 , wherein the micro foam resin is any one of polyethylene terephthalate resin, polycarbonate resin, and acrylic resin. The flexible substrate is provided with an opening penetrating the flexible substrate and a wiring circuit, and an upper surface of an electrode terminal provided in the LED light emitting device package disposed in the opening is micro-foamed. The lighting device according to claim 1 , wherein the lighting device is connected to a lower surface of the wiring circuit formed on the back surface of the resin sheet . Wherein the flexible substrate, the exposed wire circuit to the edge of the hole provided on the flexible substrate, the lower surface of the electrode terminals of the deployed LED light emitting device package in said hole, of the wiring circuit The lighting device according to any one of claims 1 to 6, wherein the lighting device is connected to an upper surface. The flexible substrate is provided with an opening penetrating the flexible substrate and a wiring circuit, and an upper surface of an electrode terminal provided in the LED light emitting device package disposed in the opening is micro-foamed. The lighting device according to claim 7, wherein the lighting device is connected to a lower surface of the wiring circuit formed on a back surface of the resin sheet. In the flexible substrate, a wiring circuit is exposed at an edge of a hole provided in the flexible substrate, and a lower surface of an electrode terminal of the LED light emitting device package disposed in the hole is connected to the wiring circuit. The lighting device according to claim 7, wherein the lighting device is connected to an upper surface.

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