KR102111205B1 - Backlight circuit board structure with high reflectivity and method for making thereof - Google Patents

Abstract

In a kind of a backlight circuit board structure with high reflectivity and a manufacturing method thereof, the backlight circuit board structure with high reflectivity includes a substrate, at least one light emitting element, at least one metal base, a solder mask layer, and a reflective plating layer. The light emitting unit is electrically connected with a connection terminal on the surface of the substrate. The metal base is formed on the surface of the substrate. The solder mask layer is formed on the surface of the substrate and has a first opening corresponding to the connection terminal and a second opening corresponding to the metal base. The reflective plating layer is formed on the surface of the metal base for reflecting light emitted from the light emitting unit.

Description

{Backlight circuit board structure with high reflectivity and method for making thereof}

The present invention relates to a structure of a printed circuit board and a method of manufacturing the same, and particularly to a structure of a highly reflective backlight circuit board and a method of manufacturing the same.

Light-Emitting Diode (LED), which was first developed in 1965, has started to develop LEDs with small size, low power consumption, long life, and rapid operation response, with the improvement of LED packaging technology and luminous efficiency. In addition, according to the need for energy saving and carbon emission reduction and the rising awareness of eco-friendly, LEDs are widely applied to backlight sources of electronic products such as traffic lights, advertising lights, automobile or motorcycle light sources, outdoor or household lighting devices, displays or computer peripherals. Is becoming.

In the prior art, it is mostly to arrange the LEDs in the electronic products on the backlight circuit board in order to improve the overall brightness of the backlight circuit board, and generally, aluminum foil is laminated by laminating a reflective material such as aluminum foil on the solder mask layer around the LED. By using the reflected light of the to improve the overall brightness of the backlight circuit board. However, the lamination method of the aluminum foil is not only relatively complicated in the manufacturing process, but also increases the overall thickness of the backlight circuit board. In another aspect, in the process of laminating aluminum foil, other electronic components of the circuit board already disposed are liable to be damaged, thereby reducing the production yield of the backlight circuit board.

Therefore, a method of reducing the overall thickness of the backlight circuit board while simplifying the manufacturing process of the backlight circuit board is a technical problem to be solved by the present invention.

In this regard, the main object of the present invention is to provide a high-reflection backlight circuit board structure which is simple to manufacture and a method for manufacturing the same.

In order to achieve the above object, a high-reflection backlight circuit board structure provided by the present invention includes a substrate, at least one light emitting device, at least one metal base, a solder mask layer, and a reflective plating layer. Among them, the substrate has a plurality of connection terminals, the light emitting element is electrically connected to the connection terminal, and a metal base is formed on the surface of the substrate. The solder mask layer is formed on the surface of the substrate and has a first opening corresponding to a connection terminal location and a second opening corresponding to a metal base location. Among them, the reflective plating layer is formed on the surface of the metal base to reflect the light produced by the light emitting device, and the reflectance of the reflective plating layer to the light produced by the light emitting device is greater than 80%.

A portion of the solder mask layer covers the metal base.

The material of the reflective plating layer is nickel, silver, cadmium or an alloy thereof, and the material of the metal base is copper.

The surface of the connection terminal has a conductive plating layer, and the material of the conductive plating layer is nickel, silver, cadmium, or an alloy thereof.

A method of manufacturing a high-reflection backlight circuit board structure provided by the present invention also includes the following steps.

(a). Provide a substrate.

(b). A plurality of connection terminals and at least one metal base are formed on the surface of the substrate.

(c). A solder mask layer covering the connection terminal and the metal base is formed.

(d). A first opening corresponding to the position of the connection terminal and a second opening corresponding to the position of the metal base are formed in the solder mask layer.

(e). A conductive plating layer is formed on the surface of the connection terminal, and a reflective plating layer is formed on the surface of the metal base. And

(f). At least one light emitting element is electrically connected to the connection terminal.

Among them, the reflectance of the reflective plated layer with respect to the light produced by the light emitting element is greater than 80%.

The light is reflected through the reflective plating layer formed on the surface of the metal base, and since the reflectance of the reflective plating layer to the light rays produced by the light emitting element is greater than 80%, and in relatively excellent cases, is 90% or more, the overall structure of the high-reflection backlight circuit board structure It can effectively improve the brightness, simplify the conventional aluminum foil lamination process, and help reduce the overall thickness of the high-reflection backlight circuit board structure.

1A to 1C are cross-sectional views of a manufacturing process of a substrate having a solder mask layer provided by an embodiment of the present invention,
2A to 2C are cross-sectional views of a manufacturing process of a high-reflection backlight circuit board structure according to the first embodiment of the present invention,
3A to 3C are cross-sectional views showing the manufacturing process of the high-reflection backlight circuit board structure of the second embodiment of the present invention,
4A to 4C are cross-sectional views showing the manufacturing process of the high-reflection backlight circuit board structure of the third embodiment of the present invention,
5 is a cross-sectional view of a high-reflection backlight circuit board structure of the fourth embodiment of the present invention,
6A is an aerial view of a high-reflection backlight circuit board structure according to a fifth embodiment of the present invention;
6B is an aerial view of a high-reflection backlight circuit board structure of the sixth embodiment of the present invention.

First, referring to FIG. 1A to FIG. 1C, FIGS. 1A to 1C are cross-sectional views of a manufacturing process of a substrate having a solder mask layer provided by an embodiment of the present invention. First, a substrate 10 is provided, the substrate 10 has a first surface 101 and a second surface 102, the substrate 10 is a single-layer board structure or a multilayer composite board structure, and the substrate 10 is a flexible printed circuit (FPC) substrate Or it is a substrate of a printed circuit board (PCB) In this embodiment, the first surface 101 layer is formed by laminating a thin copper foil capable of performing copper plating (not shown), and the first surface 101 of the substrate 10 To form the base copper 11 (shown in FIG. 1A), the base copper 11 is then formed through a circuit image transmission technique to form the connection terminal 111 and the metal base 112 on the surface of the substrate 10 (see FIG. 1B). There is a gap between the plurality of connection terminals 111 and between the connection terminal 111 and the metal base 112. Among them, the connection terminal 111 is a portion to which a circuit board structure and a surface-mounted device are connected, In the base 112 is in principle not in contact with the surface-mounted components, but the material for general manufacturing the connection terminal 111 and the metal base 112 with the copper, but is not limited to this.

Referring to FIG. 1C, a solder mask material is applied to the first surface 101 of the substrate 10 to form a solder mask layer 12 covering the substrate 10, the connection terminals 111, and the metal base 112. The solder mask layer 12 is an insulating layer, and the solder mask material is epoxy resin, silicon resin, polyimide resin, phenol resin, fluorine resin, silicon dioxide or aluminum oxide.

2A to 2C, the manufacturing process of the first embodiment of the high-reflection backlight circuit board structure is referred to. 1C, in FIG. 2A, a window may be opened on the solder mask layer 12 to form a first opening 121 corresponding to the position of the connection terminal 111, and the solder mask layer 12 does not cover the connection terminal 111. A window may be opened on the solder mask layer 12 to form a second opening 122 corresponding to the metal base 112 position, and a part of the solder mask layer 12 covers the connection terminal 111. Thereafter, a metal plating layer 13 may be formed on the surface of the connection terminal 111 and the surface of the metal base 112 through chemical plating or electroplating, among which the metal plating layer 13 is a conductive plating layer 131 formed on the surface of the connection terminal 111 and It includes a reflective plating layer 132 formed on the surface of the metal base 112 (shown in Fig. 2B), and the material of the metal plating layer 13 is nickel, silver, cadmium, or an alloy thereof.

After continuing referring to FIG. 2C, the light emitting element 14 is disposed at the position of the connection terminal 111 and electrically connected to the connection terminal 111 to form a highly reflective backlight circuit board structure 1. 2C, the light emitting device 14 includes a light emitting diode chip 141, a P pole connection pad 142, and an N pole connection pad 143. Among them, the P-pole connection pad 142 and the N-pole connection pad 143 are located on the bottom surface of the light emitting diode chip 141 and are electrically connected to the connection terminals 111 each having a conductive plating layer 131 on the surface. In this way, when the light-emitting element 14 of the high-reflection backlight circuit board structure 1 is operated, as the light beam partially projected to the substrate 10 or the solder mask layer 12 is reflected by the reflective plating layer 132, the entirety of the high-reflection backlight circuit board structure 1 is Improves brightness. In this embodiment, although only the method of forming the connection terminal 111, the metal base 112, the solder mask layer 12, the metal plating layer 13, and the light emitting element 14 on the first surface 101 of the substrate 10 is presented, in actual application, the above components are provided. It may be formed on the first surface 101 and the second surface 102 at the same time, and is not limited to the implementation method suggested by the present embodiment.

Referring to the cross-sectional view of the manufacturing process of the second embodiment of the high-reflection backlight circuit board structure of FIGS. 3A to 3C, similar to the first embodiment, the difference is that the solder mask layer 12 does not entirely cover the connection terminal 111 and the metal base 112. Is in

4A to 4C, the high-reflection backlight circuit board structure Referring to the sectional view of the manufacturing process of the third embodiment, similar to the first embodiment, the difference is that a part of the solder mask layer 12 covers the connection terminal 111 but does not cover the metal base 112 Not in place.

Referring to the cross-sectional view of the fourth embodiment of the high-reflection backlight circuit board structure of FIG. 5, similar to the third embodiment, the difference is that two first openings 121 corresponding to a single connection terminal 111 are formed in the solder mask layer 12, respectively. Is in point. In this embodiment, since some solder mask layers 12 still remain between the connection terminals 111 adjacent to each other, it is possible to effectively prevent the short circuit problem caused by the conductive plating layers 131 adjacent to each other being too close.

Referring to the bird's-eye view of the fifth embodiment of the high-reflection backlight circuit board structure of FIG. 6A, four curved-shaped reflective plating layers 132 are formed around the light-emitting diode chip 141, and part of the light-emitting diode chip 141 is a substrate 10 or a solder mask layer. 12 By reflecting the light beam projected onto the surface, the overall brightness of the highly reflective backlight circuit board structure 1 is improved. Referring to the bird's-eye view of the sixth embodiment of the high-reflection backlight circuit board structure of FIG. 6B, a reflective plating layer 132 having an annular appearance is formed around the light emitting diode chip 141, and a part of the light emitting diode chip 141 is transferred to the surface of the substrate 10 or the solder mask layer 12 By reflecting the projected light beam, the overall brightness of the high-reflection backlight circuit board structure 1 is improved. Among other possible implementation methods, depending on the arrangement of the light emitting elements and the need for overall brightness, after manufacturing a metal base of various shapes or heights using circuit image transmission technology, a reflective plating layer may be plated on the surface of the metal base.

In the present invention, the reflection proceeds through the reflective plating layer 132 formed on the surface of the metal base 112, and since the reflectance of the reflective plating layer 132 for the light produced by the light emitting device 14 is greater than 90%, and relatively excellent, it is greater than 90%. It is possible to efficiently improve the overall brightness of the high-reflection backlight circuit board structure 1, simplify the conventional aluminum foil lamination process, and is beneficial in reducing the overall thickness of the high-reflection backlight circuit board structure 1.

High reflective backlight circuit board structure 1 Substrate 10
First surface 101 Second surface 102
Base copper 11 connection terminal 111
Metal Base 112 Solder Mask Layer 12
First opening 121 Second opening 122
Metal plating layer 13 Conductive plating layer 131
Reflective plating layer 132 Light-emitting element 14
Light emitting diode chip 141 P-pole connecting pad 142
N-pole connection pad 143

Claims (7)

A substrate having a first surface and a second surface;
At least one pair of connection terminals and at least one metal base formed on the first surface;
A solder mask layer formed on the first surface and having a first opening corresponding to the position of the connection terminal and a second opening corresponding to the position of the metal base, and a part of the solder mask layer remaining between the connection terminals;
A metal plating layer including a conductive plating layer formed on the surface of the connection terminal and a reflective plating layer formed on the surface of the metal base to emit light produced by the light emitting device;
Includes a light emitting diode chip and a light emitting device having a P-pole connection pad and an N-pole connection pad respectively located on the bottom surface of the light-emitting diode chip and electrically connected to the connection terminal having the conductive plating layer.
The reflective plated layer is a reflective plated layer having a reflectance of greater than 80% of the reflective plated layer with respect to the light produced by the light emitting device,
When the light emitting device is operated, a highly reflective backlight circuit board structure characterized in that light partially transmitted to the substrate or solder mask layer is reflected by the reflective plating layer.

According to claim 1,
A high-reflection backlight circuit board structure, characterized in that a portion of the solder mask layer covers the metal base.
According to claim 1,
High reflective backlight circuit board structure, characterized in that the material of the reflective plating layer is chromium, silver, cadmium, or an alloy thereof.
According to claim 1,
High-reflection backlight circuit board structure, characterized in that the material of the metal base is copper.
delete According to claim 1,
Highly reflective backlight circuit board structure, characterized in that the material of the conductive plating layer is chromium, silver, cadmium, or an alloy thereof.
Providing a substrate;
Forming a plurality of connection terminals and at least one metal base on the substrate surface;
Forming a solder mask layer so as to cover the connection terminal and the metal base, and to partially remain between the connection terminal;
Forming a first opening corresponding to the connection terminal position and a second opening corresponding to the metal base position on the solder mask layer;
Forming a conductive plating layer on the surface of the connection terminal and forming a reflective plating layer on the surface of the metal base:
And electrically connecting the P-pole connection pad and the N-pole connection pad located on the bottom surface of the light emitting diode chip to the connection terminals, respectively.
The reflectance of the reflective plated layer with respect to the light produced by the light emitting element is greater than 80%,
When the light emitting device is operated, a method for manufacturing a high-reflection backlight circuit board, characterized in that light partially transmitted to the substrate or the solder mask layer is reflected by the reflective plating layer.

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