CN110662343B - High-reflection backlight circuit board structure and manufacturing method thereof - Google Patents
High-reflection backlight circuit board structure and manufacturing method thereof Download PDFInfo
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- CN110662343B CN110662343B CN201810817564.2A CN201810817564A CN110662343B CN 110662343 B CN110662343 B CN 110662343B CN 201810817564 A CN201810817564 A CN 201810817564A CN 110662343 B CN110662343 B CN 110662343B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 229910052751 metal Inorganic materials 0.000 claims abstract description 45
- 239000002184 metal Substances 0.000 claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 229910000679 solder Inorganic materials 0.000 claims abstract description 31
- 238000000576 coating method Methods 0.000 claims abstract description 28
- 239000011248 coating agent Substances 0.000 claims abstract description 27
- 238000007747 plating Methods 0.000 claims description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 238000002310 reflectometry Methods 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 229910052793 cadmium Inorganic materials 0.000 claims description 5
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 54
- 239000000463 material Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 239000011888 foil Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- -1 fluororesin Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Planar Illumination Modules (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides a high-reflection backlight circuit board structure and a manufacturing method thereof, wherein the high-reflection backlight circuit board structure comprises: a substrate, at least one light-emitting component, at least one metal base layer, a solder mask layer and a reflective coating. The light-emitting assembly is electrically connected with the connecting terminal on the surface of the substrate, the metal base layer is formed on the surface of the substrate, and the solder mask layer is formed on the surface of the substrate and is provided with a first opening corresponding to the position of the connecting terminal and a second opening corresponding to the position of the metal base layer. The reflecting coating is formed on the surface of the metal base layer and used for reflecting light rays generated by the light-emitting component.
Description
Technical Field
The present invention relates to a printed circuit board structure and a method for manufacturing the same, and more particularly, to a highly reflective backlight circuit board structure and a method for manufacturing the same.
Background
Light-Emitting diodes (LEDs) were first introduced in 1965, and with the improvement of LED packaging technology and Light-Emitting efficiency, LEDs with small size, low power consumption, long lifetime, and rapid operation response were also introduced. In addition, in response to the demand for energy saving and carbon reduction and the rising awareness of environmental protection, LEDs are widely used as backlight sources for signal lamps, advertisement lamps, light sources for automobiles and motorcycles, outdoor or household lighting devices, displays, and computer peripherals.
In the prior art, LEDs in electronic products are often disposed on a backlight circuit board, and in order to improve the overall brightness of the backlight circuit board, reflective materials such as aluminum foil are usually attached to a solder mask layer around the LEDs, so as to improve the overall brightness of the backlight circuit board by using the aluminum foil to reflect light. However, the aluminum foil attachment not only complicates the manufacturing process, but also increases the overall thickness of the backlight circuit board. On the other hand, other electronic components already arranged on the circuit board are easily damaged in the process of attaching the aluminum foil, so that the yield of manufacturing the backlight circuit board is reduced.
Therefore, how to simplify the manufacturing process of the backlight circuit board and reduce the overall thickness of the backlight circuit board is the technical subject to be solved by the present invention.
Disclosure of Invention
In view of the above, the present invention is directed to a high-reflection backlight circuit board structure and a method for fabricating the same.
In order to achieve the above object, the present invention provides a high-reflection backlight circuit board structure, comprising: a substrate, at least one light-emitting component, at least one metal base layer, a solder mask layer and a reflective coating. The substrate is provided with a plurality of connecting terminals, the light-emitting assembly is electrically connected with the connecting terminals, and the metal base layer is formed on the surface of the substrate. The solder mask layer is formed on the surface of the substrate and is provided with a first opening corresponding to the position of the connecting terminal and a second opening corresponding to the position of the metal base layer. The light reflecting coating is formed on the surface of the metal base layer and used for reflecting light rays generated by the light emitting assembly, and the reflectivity of the light reflecting coating to the light rays generated by the light emitting assembly is larger than 80%.
The anti-welding layer partially covers the metal base layer.
The material of the reflecting coating is as follows: nickel, silver, cadmium or alloy thereof, and the material of the metal base layer is copper.
The surface of the connecting terminal is provided with a conductive coating which is made of the following materials: nickel, silver, cadmium or alloys thereof.
The invention also provides a manufacturing method of the high-reflection backlight circuit board structure, which comprises the following steps:
(a) Providing a substrate;
(b) Forming a plurality of connecting terminals and at least one metal base layer on the surface of the substrate;
(c) Forming a solder mask layer covering the connecting terminal and the metal base layer;
(d) Forming a first opening corresponding to the position of the connecting terminal and a second opening corresponding to the position of the metal base layer on the solder mask layer;
(e) Forming a conductive coating on the surface of the connecting terminal and forming a reflective coating on the surface of the metal base layer; and
(f) Electrically connecting at least one light-emitting component to the connecting terminal;
wherein, the reflectivity of the light reflecting coating to the light generated by the light-emitting component is more than 80%.
The light reflection is carried out through the light reflection coating formed on the surface of the metal base layer, and the reflectivity of the light reflection coating to the light rays generated by the light-emitting component is more than 80 percent, preferably more than 90 percent, so that the overall brightness of the high-reflection backlight circuit board structure can be effectively improved, the process of aluminum foil coating in the prior art is simplified, and the overall thickness of the high-reflection backlight circuit board structure is favorably reduced.
Other effects and embodiments of the present invention will be described in detail with reference to the accompanying drawings.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1A to fig. 1C are cross-sectional views illustrating a manufacturing process of a substrate with a solder mask layer according to an embodiment of the invention;
fig. 2A to fig. 2C are sectional views illustrating a manufacturing process of a high-reflection backlight circuit board structure according to a first embodiment of the invention;
fig. 3A to fig. 3C are cross-sectional views illustrating a manufacturing process of a high-reflection backlight circuit board structure according to a second embodiment of the invention;
fig. 4A to 4C are cross-sectional views illustrating a manufacturing process of a high-reflection backlight circuit board structure according to a third embodiment of the invention;
FIG. 5 is a cross-sectional view of a high-reflection backlight circuit board structure according to a fourth embodiment of the present invention;
FIG. 6A is a top view of a high-reflection backlight circuit board structure according to a fifth embodiment of the present invention;
fig. 6B is a top view of a high-reflection backlight circuit board structure according to a sixth embodiment of the invention.
Description of the symbols
1 high-reflection backlight circuit board structure 10 substrate
101 first surface 102 second surface
11-face copper 111 connection terminal
112 metal base layer 12 solder mask
121 first opening 122 second opening
13 metal plating 131 conductive plating
132 reflective coating 14 light-emitting component
141 led die 142P connection pad
143N pole connecting pad
Detailed Description
First, referring to fig. 1A to fig. 1C, fig. 1A to fig. 1C are cross-sectional views illustrating a manufacturing process of a substrate with a solder mask layer according to an embodiment of the invention. First, a substrate 10 is provided, the substrate 10 has a first surface 101 and a second surface 102, the substrate 10 may be a single-layer Board structure or a multi-layer composite Board structure, and the substrate 10 may be a Flexible Printed Circuit (FPC) substrate or a hard Circuit Board (PCB) substrate. In this embodiment, the first surface 101 is laminated with a thin copper foil (not shown) and can be copper-plated to form a surface copper 11 (shown in fig. 1A) on the first surface 101 of the substrate 10. Then, the surface copper 11 is patterned by a line image transfer technique to form the connection terminals 111 and the metal base layer 112 (as shown in fig. 1B) on the surface of the substrate 10, and after the patterning, gaps exist between the connection terminals 111 and the metal base layer 112. The connection terminal 111 is a portion of the circuit board structure connected to a surface-mounted device (surface-mounted device), and the metal base layer 112 is not in contact with the surface-mounted device in principle, and the material commonly used for manufacturing the connection terminal 111 and the metal base layer 112 is copper, but not limited thereto.
Referring to fig. 1C, a solder mask is then applied on the first surface 101 of the substrate 10 to form a solder mask layer 12 covering the substrate 10, the connection terminal 111 and the metal base layer 112. The solder mask layer 12 is an insulating layer, and the solder mask material may be: epoxy resin, silicone resin, polyimide resin, phenol resin, fluororesin, silica, or alumina.
Please refer to fig. 2A to fig. 2C, which are sectional views illustrating a manufacturing process of a first embodiment of a high-reflection backlight circuit board structure. Referring to fig. 1C, in fig. 2A, a window may be formed on the solder mask layer 12 to form a first opening 121 corresponding to the position of the connection terminal 111, and the solder mask layer 12 does not cover the connection terminal 111; and a window is formed on the solder mask layer 12 to form a second opening 122 corresponding to the position of the metal base layer 112, and the solder mask layer 12 partially covers the connection terminal 111. Subsequently, the metal plating layer 13 may be formed on the surface of the connection terminal 111 and the surface of the metal base layer 112 by chemical plating (chemical plating) or electroplating, wherein the metal plating layer 13 includes a conductive plating layer 131 formed on the surface of the connection terminal 111 and a reflective plating layer 132 formed on the surface of the metal base layer 112 (as shown in fig. 2B), and the material of the metal plating layer 13 may be: nickel, silver, cadmium or alloys thereof.
With reference to fig. 2C, a light emitting device 14 is disposed at the position of the connection terminal 111 and electrically connected to the connection terminal 111 to form a high-reflection backlight circuit board structure 1. In fig. 2C, the light emitting device 14 includes: a light emitting diode chip 141, a P-pad 142 and an N-pad 143. The P-electrode pad 142 and the N-electrode pad 143 are disposed on the bottom surface of the led chip 141 and are electrically connected to the connection terminal 111 having the conductive plating 131 on the surface thereof, respectively. In this way, when the light emitting elements 14 of the high-reflection backlight circuit board structure 1 operate, part of the light projected onto the substrate 10 or the solder mask layer 12 can be reflected by the reflective coating 132, thereby increasing the overall brightness of the high-reflection backlight circuit board structure 1. Although the embodiment of forming the connection terminal 111, the metal base layer 112, the solder mask layer 12, the metal plating layer 13 and the light emitting element 14 on the first surface 101 of the substrate 10 is only mentioned in the present embodiment, in practical applications, the elements may be formed on the first surface 101 and the second surface 102 at the same time, and the embodiment is not limited thereto.
Referring to fig. 3A to fig. 3C, a cross-sectional view of a manufacturing process of a second embodiment of a high-reflection backlight circuit board structure is shown, which is similar to the first embodiment, and is different in that no solder mask layer 12 covers the connection terminal 111 and the metal base layer 112.
Please refer to fig. 4A to 4C, which are cross-sectional views illustrating a manufacturing process of a third embodiment of a high-reflection backlight circuit board structure, which is similar to the first embodiment, and is different in that the solder mask layer 12 partially covers the connection terminal 111 but does not cover the metal base layer 112.
Referring to fig. 5, a cross-sectional view of a fourth embodiment of the high-reflection backlight circuit board structure is similar to the third embodiment, except that two first openings 121 corresponding to the single connection terminals 111 are formed on the solder mask 12. In the present embodiment, since a portion of the solder mask layer 12 remains between the adjacent connection terminals 111, the problem of short circuit caused by too close proximity of the adjacent conductive plating layers 131 can be effectively avoided.
Referring to the top view of the fifth embodiment of the high-reflection backlight circuit board structure shown in fig. 6A, four reflective coatings 132 with arc-shaped outlines are formed around the led chip 141, so as to reflect the light projected by the led chip 141 onto the surface of the substrate 10 or the solder mask layer 12, thereby improving the overall brightness of the high-reflection backlight circuit board structure 1. Referring to fig. 6B, which is a top view of the sixth embodiment of the high-reflection backlight circuit board structure, a reflective coating 132 with a ring-shaped appearance is formed around the led chip 141, so as to reflect the light projected from a portion of the led chip 141 onto the surface of the substrate 10 or the solder mask 12, thereby improving the overall brightness of the high-reflection backlight circuit board structure 1. In other possible embodiments, the metal base layer with various shapes or heights can be manufactured by using a circuit image transfer technology according to the configuration of the light emitting assembly and the overall brightness requirement, and then the surface of the metal base layer is plated with the reflective coating.
The present invention performs light reflection by the reflective coating 132 formed on the surface of the metal substrate 112, and the reflectivity of the reflective coating 132 to the light generated by the light emitting component 14 is greater than 80%, preferably greater than 90%, so as to effectively improve the overall brightness of the high-reflection backlight circuit board structure 1, simplify the process of aluminum foil lamination in the prior art, and contribute to reducing the overall thickness of the high-reflection backlight circuit board structure 1.
The above-described embodiments and/or implementations are only illustrative of the preferred embodiments and/or implementations for implementing the present technology, and are not intended to limit the embodiments of the present technology in any way, and those skilled in the art can make modifications or changes without departing from the scope of the technical means disclosed in the present disclosure, but should be regarded as the technical means or implementations that are substantially the same as the present invention.
Claims (6)
1. A high-reflection backlight circuit board structure, comprising:
a substrate having a plurality of connection terminals;
at least one light-emitting component electrically connected with the connecting terminal;
at least one metal base layer formed on the surface of the substrate;
a solder mask layer formed on the surface of the substrate and having a first opening corresponding to the connection terminal and a second opening corresponding to the metal base layer; and
a reflecting coating formed on the surface of the metal base layer for reflecting the light generated by the light-emitting component, wherein the reflectivity of the reflecting coating to the light generated by the light-emitting component is more than 80%,
the metal base layer is partially covered by the solder mask layer, and the height from the surface of the light-reflecting coating to the surface of the substrate is lower than the height from the surface of the substrate to the surface of the solder mask layer.
2. The structure of claim 1, wherein the reflective coating is made of: nickel, silver, cadmium or alloys thereof.
3. The structure of claim 1, wherein the metal substrate is copper.
4. The structure of claim 1, wherein the connecting terminal surface has a conductive plating layer.
5. The structure of claim 4, wherein the conductive layer is made of: nickel, silver, cadmium or alloys thereof.
6. A manufacturing method of a high-reflection backlight circuit board structure is characterized by comprising the following steps:
a, providing a substrate;
b forming a plurality of connecting terminals and at least one metal base layer on the surface of the substrate;
c forming a solder mask layer covering the connecting terminal and the metal base layer;
d forming a first opening corresponding to the position of the connecting terminal and a second opening corresponding to the position of the metal base layer on the solder mask layer;
e forming a conductive coating on the surface of the connecting terminal and forming a reflective coating on the surface of the metal base layer; and
f electrically connecting at least one light-emitting component to the connecting terminal;
the reflectivity of the reflecting coating to light rays generated by the light-emitting assembly is larger than 80%, the metal base layer is partially covered by the anti-welding layer, and the height from the surface of the reflecting coating to the surface of the substrate is lower than the height from the surface of the anti-welding layer to the surface of the substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107122698 | 2018-06-29 | ||
| TW107122698A TWI684293B (en) | 2018-06-29 | 2018-06-29 | Backlight circuit board structure with high reflectivity and method for making thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110662343A CN110662343A (en) | 2020-01-07 |
| CN110662343B true CN110662343B (en) | 2023-01-17 |
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| CN201821173038.9U Active CN208424908U (en) | 2018-06-29 | 2018-07-24 | High-reflection backlight circuit board structure |
| CN201810817564.2A Active CN110662343B (en) | 2018-06-29 | 2018-07-24 | High-reflection backlight circuit board structure and manufacturing method thereof |
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| CN201821173038.9U Active CN208424908U (en) | 2018-06-29 | 2018-07-24 | High-reflection backlight circuit board structure |
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| JP (1) | JP6595059B1 (en) |
| KR (1) | KR102111205B1 (en) |
| CN (2) | CN208424908U (en) |
| TW (1) | TWI684293B (en) |
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| WO2020237593A1 (en) * | 2019-05-30 | 2020-12-03 | 宏恒胜电子科技（淮安）有限公司 | Circuit board, preparation method and backlight plate |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005031882A1 (en) * | 2003-09-30 | 2005-04-07 | Kabushiki Kaisha Toshiba | Light emitting device |
| CN101005733A (en) * | 2006-12-29 | 2007-07-25 | 上海芯光科技有限公司 | Method for producing thin semiconductor lighting plane integrated optic source module |
| CN103108492A (en) * | 2013-01-17 | 2013-05-15 | 中国科学院苏州纳米技术与纳米仿生研究所 | Manufacturing method and manufacturing device of flexible printed circuit |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54132772A (en) * | 1978-04-05 | 1979-10-16 | Matsushita Electric Ind Co Ltd | Method of producing printed circuit board |
| JP2005210056A (en) * | 2003-12-25 | 2005-08-04 | Ngk Spark Plug Co Ltd | Led ceramic package |
| JP5323371B2 (en) * | 2008-03-17 | 2013-10-23 | シチズンホールディングス株式会社 | LED device manufacturing method |
| JPWO2011007874A1 (en) * | 2009-07-17 | 2012-12-27 | 電気化学工業株式会社 | LED chip assembly, LED package, and manufacturing method of LED package |
| JP5940775B2 (en) * | 2010-08-27 | 2016-06-29 | ローム株式会社 | LED light source device for liquid crystal display backlight and liquid crystal display device |
| TWI445465B (en) * | 2010-10-29 | 2014-07-11 | Toshiba Lighting & Technology | Light emitting module and lighting equipment |
| JP6293995B2 (en) * | 2012-03-23 | 2018-03-14 | 新光電気工業株式会社 | Light emitting element mounting package, method for manufacturing the same, and light emitting element package |
| CN102786909B (en) * | 2012-04-28 | 2014-01-29 | 何忠亮 | Organic silicon light-cured packaging glue used for LED packaging and application |
| KR101922528B1 (en) * | 2012-07-06 | 2018-11-28 | 엘지이노텍 주식회사 | Light emitting device package |
| DE102013106858A1 (en) * | 2012-07-19 | 2014-01-23 | Samsung Electro-Mechanics Co., Ltd. | Substrate for an LED module and method for its production |
| JP2014130916A (en) * | 2012-12-28 | 2014-07-10 | Toshiba Lighting & Technology Corp | Substrate for light-emitting module and method of manufacturing substrate for light-emitting module |
| TWM474255U (en) * | 2013-10-23 | 2014-03-11 | Apcb Inc | Circuit board and LED device |
| CN104812166B (en) * | 2015-05-15 | 2017-12-22 | 深圳市环基实业有限公司 | A kind of reflective heat conduction metal-based pcb board manufacture method |
-
2018
- 2018-06-29 TW TW107122698A patent/TWI684293B/en active
- 2018-07-24 CN CN201821173038.9U patent/CN208424908U/en active Active
- 2018-07-24 CN CN201810817564.2A patent/CN110662343B/en active Active
- 2018-08-21 KR KR1020180097256A patent/KR102111205B1/en active IP Right Grant
- 2018-08-24 JP JP2018157125A patent/JP6595059B1/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005031882A1 (en) * | 2003-09-30 | 2005-04-07 | Kabushiki Kaisha Toshiba | Light emitting device |
| CN101005733A (en) * | 2006-12-29 | 2007-07-25 | 上海芯光科技有限公司 | Method for producing thin semiconductor lighting plane integrated optic source module |
| CN103108492A (en) * | 2013-01-17 | 2013-05-15 | 中国科学院苏州纳米技术与纳米仿生研究所 | Manufacturing method and manufacturing device of flexible printed circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6595059B1 (en) | 2019-10-23 |
| CN110662343A (en) | 2020-01-07 |
| CN208424908U (en) | 2019-01-22 |
| TWI684293B (en) | 2020-02-01 |
| TW202002333A (en) | 2020-01-01 |
| KR102111205B1 (en) | 2020-05-15 |
| JP2020004938A (en) | 2020-01-09 |
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